CN217995973U - Paper-covered silicon wafer blanking mechanism of silicon wafer paper-separating plate-separating machine - Google Patents
Paper-covered silicon wafer blanking mechanism of silicon wafer paper-separating plate-separating machine Download PDFInfo
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- CN217995973U CN217995973U CN202221186125.4U CN202221186125U CN217995973U CN 217995973 U CN217995973 U CN 217995973U CN 202221186125 U CN202221186125 U CN 202221186125U CN 217995973 U CN217995973 U CN 217995973U
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Abstract
The utility model discloses a silicon chip separates paper silicon chip unloading mechanism that covers of board separator, including one by motor drive's plastic sheet transmission band, the fixed subassembly of silicon chip magazine, cover paper silicon chip unloading walking arm module, cover paper silicon chip and absorb subassembly and silicon chip magazine, it selects separately the station to have at least one silicon chip to set up along its direction of delivery on the plastic sheet transmission band, the left and right sides that every silicon chip selected separately the station all is provided with the fixed subassembly of silicon chip magazine, all be provided with at least one silicon chip magazine that is used for piling up the paper silicon chip that covers on the fixed subassembly of every silicon chip magazine, every silicon chip selects separately the top of station and all has erect and cover paper silicon chip unloading walking arm module, it is equipped with to cover paper silicon chip and absorbs the subassembly all to hang on every paper silicon chip unloading walking arm module. The utility model discloses can accomplish automatic unloading process to covering paper silicon chip on the assembly line, compact structure, transfer speed is fast, and inhales and puts accurately, and is efficient, has realized covering the automatic separation of paper silicon chip and has stacked, has alleviateed intensity of labour, has reduced the human cost.
Description
Technical Field
The utility model belongs to photovoltaic solar cell silicon chip automation equipment field relates to a silicon chip separates paper silicon chip unloading mechanism that covers of board separator.
Background
After the silicon wafer is tested, a silicon wafer sorting machine is used for sorting and receiving materials. Under the original technical conditions, almost no protective measures are taken for the silicon wafers during sorting, so that the surfaces of the tested silicon wafers are scratched inevitably, and the silicon wafers have defects or damages, so that the actual yield is reduced. At present, the applicant is developing a silicon wafer separating and plate-separating machine which can cover a separating paper on the surface of a silicon wafer before the silicon wafer is separated, so that a paper-covered silicon wafer blanking mechanism which can be matched with the silicon wafer separating and plate-separating machine is needed.
SUMMERY OF THE UTILITY MODEL
In order to satisfy above-mentioned demand, the utility model provides a silicon chip separates paper silicon chip unloading mechanism that covers of board separator to the realization will cover the silicon chip of separating paper and absorb and transfer to the silicon chip magazine that corresponds from the transmission band in, thereby accomplish the unloading that covers the paper silicon chip.
For solving the technical problem, realize above-mentioned technological effect, the utility model discloses a following technical scheme realizes:
a paper-covered silicon wafer blanking mechanism of a silicon wafer separation and plate separation machine comprises a plastic sheet transmission belt driven by a motor, a silicon wafer magazine fixing assembly, a paper-covered silicon wafer blanking walking arm module, a paper-covered silicon wafer suction assembly and a silicon wafer magazine, wherein the plastic sheet transmission belt is provided with at least one silicon wafer sorting station along the conveying direction of the plastic sheet transmission belt, the left side and the right side of each silicon wafer sorting station are respectively provided with the silicon wafer magazine fixing assembly, each silicon wafer magazine fixing assembly is provided with at least one silicon wafer magazine for stacking paper-covered silicon wafers, the paper-covered silicon wafer blanking walking arm module is erected above each silicon wafer sorting station, each paper-covered silicon wafer suction assembly is hung on each paper-covered silicon wafer blanking walking arm module, and each paper-covered silicon wafer suction assembly realizes the movement between the corresponding silicon wafer sorting station and the silicon wafer magazines on the left side and the right side of the corresponding silicon wafer sorting station through the paper-covered silicon wafer blanking walking arm module, and is responsible for transferring the paper-covered silicon wafers positioned on the plastic sheet transmission belt into the corresponding silicon wafers; cover paper silicon chip and absorb subassembly and include sucking disc lift cylinder, sucking disc mounting panel, cover paper silicon chip sucking disc and cover paper silicon chip and absorb pneumatic subassembly, sucking disc lift cylinder sets up cover the lower extreme of the sliding block of paper silicon chip unloading walking arm module, the sucking disc mounting panel sets up on the telescopic link of sucking disc lift cylinder, cover paper silicon chip sucking disc and set up uniformly on the sucking disc mounting panel, cover paper silicon chip and absorb pneumatic subassembly and set up cover the left and right sides of the sliding block of paper silicon chip unloading walking arm module, cover paper silicon chip absorb pneumatic subassembly pass through the trachea respectively with sucking disc lift cylinder with it connects to cover paper silicon chip sucking disc.
Further, be provided with 8 on the sucking disc mounting panel cover paper silicon chip sucking disc, and 8 cover paper silicon chip sucking disc and be in position on the sucking disc mounting panel is octagon distribution mode, and corresponding with the distribution position of the sucking disc via hole on the paper that separates, so that 8 cover paper silicon chip sucking disc and can hold the silicon chip after passing the corresponding sucking disc via hole on the paper respectively.
Further, the paper-covered silicon wafer sucking pneumatic assembly comprises a vacuum generator, a sucker pressure regulating valve, a sucker electromagnetic valve, a vacuumizing pressure gauge and a sucker lifting cylinder electromagnetic valve, the sucker lifting cylinder electromagnetic valve is arranged on the front side surface of the lower part of a sliding block of the paper-covered silicon wafer blanking walking arm module through a paper-covered silicon wafer sucking pneumatic assembly mounting plate, and the sucker lifting cylinder electromagnetic valve is connected with the sucker lifting cylinder through an air pipe; vacuum generator sucking disc solenoid valve evacuation manometer absorbs the setting of pneumatic subassembly mounting panel through covering paper silicon chip and is in cover the lower part trailing flank of the sliding block of paper silicon chip unloading walking arm module, the sucking disc air-vent valve sets up through the air-vent valve installing support cover the lower part leading flank of the sliding block of paper silicon chip unloading walking arm module, the sucking disc air-vent valve pass through the trachea with the sucking disc solenoid valve is connected, the sucking disc solenoid valve pass through the trachea with vacuum generator connects, vacuum generator pass through the trachea respectively with evacuation manometer and every cover paper silicon chip sucking disc and connect.
Furthermore, a paper-covering silicon wafer adsorption in-place sensor for detecting whether the paper-covering silicon wafer sucker adsorbs a paper-covering silicon wafer is arranged on the sucker mounting plate.
Further, one side of the sucker mounting plate is provided with a sensor for detecting whether the paper-covered silicon wafer sucker moves to a silicon wafer magazine above the silicon wafer magazine in place, and the silicon wafer magazine in place sensor is connected with the sucker lifting cylinder through a silicon wafer magazine in place sensor mounting support.
Further, the paper-coated silicon wafer blanking walking arm module comprises a paper-coated silicon wafer blanking walking arm module fixing side plate, a paper-coated silicon wafer blanking walking arm module connecting plate fixedly connected with a rack is arranged on the front side surface of the paper-coated silicon wafer blanking walking arm module fixing side plate, a driving belt pulley is arranged at one end of the rear side surface of the paper-coated silicon wafer blanking walking arm module fixing side plate through a belt driving motor, a driven belt pulley is arranged at one end of the rear side surface of the paper-coated silicon wafer blanking walking arm module fixing side plate through a driven belt pulley fixing plate, the belt driving motor and the driven belt pulley fixing plate are both fixedly connected with the front side surface of the paper-coated silicon wafer blanking walking arm module fixing side plate, and a circle of transmission belt is wound between the driving belt pulley and the driven belt pulley; a hanging block moving slide rail parallel to the transmission belt is arranged on the rear side face of the fixed side plate of the paper-coated silicon wafer blanking walking arm module, the hanging block moving slide rail is positioned between an upper flat belt and a lower flat belt of the transmission belt, a hanging block used for connecting the paper-coated silicon wafer suction assembly is arranged on a slide block of the hanging block moving slide rail through a hanging block connecting plate, and the hanging block connecting plate is fixedly connected with one belt of the transmission belt through a transmission belt connecting block; the rear side of the fixed side plate of the paper-covered silicon wafer blanking walking arm module is provided with a rear cover through sealing plates at the left end and the right end, and the upper edge and the lower edge of the rear cover are respectively convenient for a gap for sliding the hanging block left and right between the upper edge and the lower edge of the fixed side plate of the paper-covered silicon wafer blanking walking arm module.
Furthermore, a horizontal left and right adjusting waist-shaped hole of the driven pulley fixing plate is respectively arranged at four vertex angles of the driven pulley fixing plate, a driven pulley fixing plate positioning screw used for abutting against the side end face of the driven pulley fixing plate is arranged on the front side face of the paper-coated silicon wafer blanking walking arm module fixing side plate through a positioning screw seat, four driven pulley fixing plate locking screws corresponding to the left and right adjusting waist-shaped holes of the driven pulley fixing plate are arranged on the front side face of the paper-coated silicon wafer blanking walking arm module fixing side plate, and the four driven pulley fixing plate locking screws are respectively arranged in the corresponding left and right adjusting waist-shaped holes of the driven pulley fixing plate in a penetrating manner; the driven pulley fixing plate realizes left-right fine adjustment on the front side surface of the paper-coated silicon wafer blanking walking arm module fixing side plate through the extending length of the driven pulley fixing plate positioning screw, and realizes locking and fixing on the front side surface of the paper-coated silicon wafer blanking walking arm module fixing side plate through the screwing and matching of a driven pulley fixing plate locking screw and a driven pulley fixing plate left-right adjusting waist-shaped hole; and simultaneously, be located cover driven pulley connecting axle via hole on the fixed curb plate of paper silicon chip unloading walking arm module, the satisfying of its horizontal trompil length the requirement of fine setting distance about driven pulley's the connecting axle, driven pulley passes through fine setting about the driven pulley fixed plate is realized drive belt's tensioning is adjusted.
Furthermore, a plurality of hanging block moving in-place sensors are arranged at the bottom of the fixed side plate of the paper-covered silicon wafer blanking travelling arm module, all the hanging block moving in-place sensors are respectively positioned right above the silicon wafer sorting station and the silicon wafer material boxes on two sides, and a shading sheet matched with all the hanging block moving in-place sensors is arranged on each hanging block.
Further, the silicon chip magazine fixing assembly comprises two magazine support bars arranged in parallel along the Y direction, and the inner sides of the two magazine support bars are respectively provided with a plurality of limiting clamping blocks for supporting and fixing the silicon chip magazine.
Furthermore, the lateral wall bottom of silicon chip magazine is provided with ability and the left and right sides spacing fixture block complex circular arc draw-in groove, the silicon chip magazine passes through spacing fixture block with the cooperation of circular arc draw-in groove is fixed two between the magazine support bar.
The beneficial effects of the utility model are that:
the utility model discloses can accomplish automatic unloading process to covering paper silicon chip on the assembly line, compact structure, transfer speed is fast, and inhales and puts accurately, and is efficient, has realized covering the automatic separation of paper silicon chip and has stacked, has alleviateed intensity of labour, has reduced the human cost.
The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The following examples and the accompanying drawings illustrate specific embodiments of the present invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
FIG. 1 is a perspective view of the whole structure of the silicon wafer separating and separating machine of the present invention;
fig. 2 is a front assembly view of the feeding walking arm module and the paper-covered silicon wafer sucking assembly of the paper-covered silicon wafer of the present invention;
fig. 3 is a back assembly view of the paper-covered silicon wafer blanking walking arm module and the paper-covered silicon wafer suction assembly of the present invention;
FIG. 4 is a front side perspective view of the paper-covered silicon wafer sucking assembly of the present invention;
FIG. 5 is a rear side perspective view of the paper-covered silicon wafer sucking assembly of the present invention;
fig. 6 is a front side perspective view of the paper separating feeding walking arm module of the present invention;
fig. 7 is a rear side perspective view of the paper separation feeding traveling arm module of the present invention;
FIG. 8 is a rear perspective view of the paper separation loading traveling arm module of the present invention after the cover is removed;
FIG. 9 is an assembly view of the fixed plate of the driven pulley on the fixed side plate of the paper separating feeding walking arm module of the present invention;
fig. 10 is a bottom perspective view of the paper separation feeding walking arm module of the present invention;
FIG. 11 is an assembly view of the multiple silicon wafer magazine fixing assemblies and the silicon wafer magazine of the present invention;
fig. 12 is an enlarged view of the assembly of the silicon wafer magazine fixing assembly and the silicon wafer magazine of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. The description as set forth herein is intended to provide a further understanding of the invention and forms a part of this application and the exemplary embodiments and descriptions thereof are presented for purposes of illustration and description and are not intended to limit the invention in any way.
Referring to fig. 1-3, a paper-covered silicon wafer blanking mechanism of a silicon wafer separation plate separator comprises a plastic sheet transmission belt 1, a silicon wafer magazine fixing component 2, a paper-covered silicon wafer blanking walking arm module 3, a paper-covered silicon wafer suction component 4 and a silicon wafer magazine 5, wherein the plastic sheet transmission belt 1 is provided with at least one silicon wafer sorting station along the conveying direction, the left side and the right side of each silicon wafer sorting station are respectively provided with the silicon wafer magazine fixing component 2, the silicon wafer magazine fixing component 2 is provided with at least one silicon wafer magazine 5 for stacking paper-covered silicon wafers 6, the paper-covered silicon wafer blanking walking arm module 3 is erected above each silicon wafer sorting station, the paper-covered silicon wafer suction component 4 is hung on each paper-covered silicon wafer blanking walking arm module 3, and each paper-covered silicon wafer suction component 4 is used for moving between the corresponding silicon wafer sorting station and the silicon wafer magazine 5 through the paper-covered silicon wafer walking arm module 3, so as to transfer the paper-covered silicon wafers 6 on the silicon wafer transmission belt 1 to the corresponding plastic sheets 5.
Further, as shown in fig. 4-5, the paper-covered silicon wafer suction assembly 4 comprises a suction cup lifting cylinder 7, a suction cup mounting plate 8, a paper-covered silicon wafer suction cup 9 and a paper-covered silicon wafer suction pneumatic assembly, wherein the suction cup lifting cylinder 7 is arranged at the lower end of a sliding block of the paper-covered silicon wafer blanking walking arm module 3, the suction cup mounting plate 8 is arranged on a telescopic rod of the suction cup lifting cylinder 7, the paper-covered silicon wafer suction cup 9 is uniformly arranged on the suction cup mounting plate 8, the paper-covered silicon wafer suction pneumatic assembly is arranged at the left side and the right side of the sliding block of the paper-covered silicon wafer blanking walking arm module 3, and the paper-covered silicon wafer suction pneumatic assembly is respectively connected with the suction cup lifting cylinder 7 and the paper-covered silicon wafer suction cup 9 through air pipes.
Further, as shown in fig. 4-5, 8 paper-covering silicon wafer suckers 9 are arranged on the sucker mounting plate 8, and 8 paper-covering silicon wafer suckers 9 are arranged on the sucker mounting plate 8 in an octagonal distribution mode and correspond to the distribution positions of the sucker through holes on the partition paper, so that 8 paper-covering silicon wafer suckers 9 can suck the silicon wafer after respectively penetrating the corresponding sucker through holes on the partition paper.
Further, as shown in fig. 4-5, the paper-coated silicon wafer sucking pneumatic assembly comprises a vacuum generator 10, a suction cup pressure regulating valve 11, a suction cup electromagnetic valve 12, a vacuum pressure gauge 13 and a suction cup lifting cylinder electromagnetic valve 14, the suction cup lifting cylinder electromagnetic valve 14 is arranged on the front side surface of the lower part of the sliding block of the paper-coated silicon wafer blanking walking arm module 3 through a paper-coated silicon wafer sucking pneumatic assembly mounting plate 15, and the suction cup lifting cylinder electromagnetic valve 14 is connected with the suction cup lifting cylinder 7 through an air pipe; vacuum generator 10 sucking disc solenoid valve 12 evacuation manometer 13 absorbs pneumatic assembly mounting panel through covering paper silicon chip and sets up cover the lower part trailing flank of paper silicon chip unloading walking arm module 3's sliding block, sucking disc air-vent valve 11 sets up through air-vent valve installing support 16 cover the lower part leading flank of paper silicon chip unloading walking arm module 3's sliding block, sucking disc air-vent valve 11 pass through the trachea with sucking disc solenoid valve 12 is connected, sucking disc solenoid valve 12 pass through the trachea with vacuum generator 10 is connected, vacuum generator 10 pass through the trachea respectively with evacuation manometer 13 and every cover paper silicon chip sucking disc 9 and connect.
Further, as shown in fig. 4-5, a paper-covered silicon wafer in-place adsorption sensor 17 for detecting whether the paper-covered silicon wafer sucker 9 sucks the paper-covered silicon wafer 6 is arranged on the sucker mounting plate 8.
Further, the paper-covered silicon wafer adsorption in-place sensor 17 adopts a capacitive proximity switch.
Further, as shown in fig. 4-5, a silicon wafer magazine in-place sensor 18 for detecting whether the paper-covered silicon wafer chuck 9 moves to a position above the silicon wafer magazine 5 is arranged on one side of the chuck mounting plate 8, and the silicon wafer magazine in-place sensor 18 is connected with the body of the chuck lifting cylinder 7 through a silicon wafer magazine in-place sensor mounting bracket 19.
Further, the silicon wafer magazine in-place sensor 18 adopts a photoelectric proximity switch.
Further, as shown in fig. 6-8, the paper-coated silicon wafer blanking traveling arm module 3 includes a paper-coated silicon wafer blanking traveling arm module fixing side plate 20, a paper-coated silicon wafer blanking traveling arm module connecting plate 21 for fixedly connecting with a rack is disposed on a front side surface of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20, a driving pulley 23 is disposed at one end of a rear side surface of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20 through a belt driving motor 22, a driven pulley 25 is disposed at one end of the rear side surface of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20 through a driven pulley fixing plate 24, the belt driving motor 22 and the driven pulley fixing plate 24 are both fixedly connected with the front side surface of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20, and a circle of driving belt 26 is wound between the driving pulley 23 and the driven pulley 25; a hanging block moving slide rail 27 parallel to the transmission belt 26 is arranged on the rear side surface of the paper-covered silicon wafer blanking walking arm module fixed side plate 20, the hanging block moving slide rail 27 is positioned between the upper flat belt and the lower flat belt of the transmission belt 26, a hanging block 29 used for connecting the paper-covered silicon wafer suction assembly 4 is arranged on a slide block of the hanging block moving slide rail 27 through a hanging block connecting plate 28, and the hanging block connecting plate 28 is fixedly connected with one layer of belt in the transmission belt 26 through a transmission belt connecting block 30; the rear side of the paper-covered silicon wafer blanking walking arm module fixing side plate 20 is provided with a rear cover 32 through sealing plates 31 at the left end and the right end, and gaps which are convenient for the hanging blocks 29 to slide left and right are reserved between the upper edge and the lower edge of the rear cover 32 and the upper edge and the lower edge of the paper-covered silicon wafer blanking walking arm module fixing side plate 20 respectively.
Further, as shown in fig. 9, a horizontal driven pulley fixing plate left-right adjusting waist-shaped hole 33 is respectively disposed at four vertex angles of the driven pulley fixing plate 24, a driven pulley fixing plate positioning screw 35 for abutting against a side end face of the driven pulley fixing plate 24 is disposed on a front side face of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20 through a positioning screw seat 34, four driven pulley fixing plate locking screws 36 corresponding to the left-right adjusting waist-shaped hole 33 of the driven pulley fixing plate are disposed on the front side face of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20, and the four driven pulley fixing plate locking screws 36 are respectively inserted into the corresponding left-right adjusting waist-shaped holes 33 of the driven pulley fixing plate; the driven pulley fixing plate 24 realizes the left-right fine adjustment on the front side surface of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20 through the extending length of the driven pulley fixing plate positioning screw 35, and realizes the locking fixation on the front side surface of the paper-coated silicon wafer blanking traveling arm module fixing side plate 20 through the screwing matching of a driven pulley fixing plate locking screw 36 and the driven pulley fixing plate left-right adjustment waist-shaped hole 33; meanwhile, the connecting shaft of the driven pulley on the fixed side plate 20 of the paper-covered silicon wafer blanking walking arm module is in a through hole, the horizontal opening length of the connecting shaft of the driven pulley 25 meets the requirement of fine adjustment distance left and right of the connecting shaft of the driven pulley 25, and the driven pulley 25 is fine adjusted left and right of the driven pulley fixing plate 24 to achieve tensioning adjustment of the transmission belt 26.
Further, referring to fig. 10, a plurality of hanging block in-place moving sensors 37 are arranged at the bottom of the fixed side plate 20 of the paper-coated silicon wafer blanking traveling arm module, all the hanging block in-place moving sensors 37 are respectively located right above the silicon wafer sorting station and the silicon wafer material boxes 5 on both sides, and a shading sheet 38 used for matching with all the hanging block in-place moving sensors 37 is arranged on the hanging block 29.
Further, the hanging block moving in-place sensor 37 is a U-shaped photoelectric switch.
Further, referring to fig. 11, the silicon wafer magazine fixing assembly 2 includes two magazine support bars 39 arranged in parallel along the Y direction, and a plurality of limiting fixture blocks 40 for supporting and fixing the silicon wafer magazine 5 are respectively disposed on the inner sides of the two magazine support bars 39.
Further, referring to fig. 12, an arc clamping groove 41 capable of being matched with the limiting clamping blocks 40 on the left and right sides is formed in the bottom of the outer side wall of the silicon wafer magazine 5, and the silicon wafer magazine 5 is fixed between the two magazine support bars 39 through the matching of the limiting clamping blocks 40 and the arc clamping grooves 41.
The working process of the utility model is as follows:
when the silicon wafer 6 covered with the partition paper is transmitted and moved to a corresponding silicon wafer sorting station through the plastic sheet transmission belt 1, the paper-covered silicon wafer blanking walking arm module 3 immediately moves the paper-covered silicon wafer suction component 4 to the position above the silicon wafer sorting station, then the paper-covered silicon wafer suction component 4 moves downwards, the silicon wafer 6 covered with the partition paper is sucked and reset on the silicon wafer sorting station, then the paper-covered silicon wafer blanking walking arm module 3 moves the paper-covered silicon wafer suction component 4 sucked to the position above the silicon wafer box 5 on the left side or the right side of the paper-covered silicon wafer suction component 4, finally the paper-covered silicon wafer suction component 4 moves downwards, the paper-covered silicon wafer 6 is placed into the corresponding silicon wafer box 5 and reset, blanking of the paper-covered silicon wafer 6 is completed once, and automatic assembly line sorting operation of the paper-covered silicon wafer can be realized by circulating the operations.
The working process of the paper-covered silicon wafer blanking walking arm module is as follows:
when the paper-covered silicon wafer suction assembly 4 needs to move, the belt driving motor 22 drives the transmission belt 26 to rotate through the driving belt pulley 23 and the driven belt pulley 25, the transmission belt 26 drives the hanging block 29 to horizontally slide on the hanging block moving slide rail 27 through the transmission belt connecting block 30 and the hanging block connecting plate 28, and the hanging block 29 drives the paper-covered silicon wafer suction assembly 4 to horizontally move above the silicon wafer sorting station and the silicon wafer material boxes 5 on the two sides of the silicon wafer sorting station.
In the moving process of the hanging block 29, the shading sheet 38 at the bottom of the hanging block can sequentially trigger the hanging block at the bottom of the fixed side plate 20 of the paper-covered silicon wafer blanking walking arm module to move to the in-place sensor 37, when the shading sheet 38 triggers the hanging block above the silicon wafer sorting station to move to the in-place sensor 37, the hanging block 29 drives the paper-covered silicon wafer suction assembly 4 to move to the silicon wafer sorting station, when the paper-covered silicon wafer suction assembly 4 needs to move to the upper part of a certain silicon wafer material box 5, the hanging block above the silicon wafer material box 5 is triggered by the shading sheet 38 to move to the in-place sensor 37, and the belt driving motor 22 stops rotating instantly.
The working process of the paper-covered silicon wafer suction assembly is as follows:
when the paper-covered silicon wafer suction assembly 4 moves to a position above the silicon wafer sorting station, the sucker lifting cylinder 7 drives the sucker mounting plate 8 to descend, and the 8 paper-covered silicon wafer suckers 9 on the sucker mounting plate 8 are in contact with the surface of the silicon wafer after penetrating through the paper partition because the position distribution of the 8 paper-covered silicon wafer suckers 9 on the sucker mounting plate 8 corresponds to the position distribution of the sucker through holes on the paper partition; when the paper-covered silicon wafer in-place adsorption sensor 17 senses a silicon wafer, the paper-covered silicon wafer sucker 9 starts to vacuumize so as to suck one paper-covered silicon wafer, and then the sucker lifting cylinder 7 drives the sucker mounting plate 8 to ascend and reset; when the paper-covered silicon wafer sucking assembly 4 moves to the position above a certain silicon wafer material box 5 and the silicon wafer material box in-place sensor 18 on the sucker mounting plate 8 senses that a material box is arranged below the sucker mounting plate 8, the sucker lifting cylinder 7 drives the sucker mounting plate 8 to descend, the paper-covered silicon wafers are stacked in the silicon wafer material box 5, then the paper-covered silicon wafer sucker 9 stops vacuumizing, the sucker lifting cylinder 7 drives the sucker mounting plate 8 to ascend and reset, and therefore the paper-covered silicon wafer is discharged once.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a silicon chip separates paper board separator's paper silicon chip unloading mechanism that covers which characterized in that: the silicon wafer feeding device comprises a plastic sheet conveying belt (1) driven by a motor, a silicon wafer box fixing component (2), a paper-covered silicon wafer feeding walking arm module (3), a paper-covered silicon wafer suction component (4) and a silicon wafer box (5), wherein at least one silicon wafer sorting station is arranged on the plastic sheet conveying belt (1) along the conveying direction of the plastic sheet conveying belt, the left side and the right side of each silicon wafer sorting station are respectively provided with the silicon wafer box fixing component (2), at least one silicon wafer box (5) used for stacking paper-covered silicon wafers (6) is arranged on each silicon wafer box fixing component (2), the paper-covered silicon wafer feeding walking arm module (3) is erected above each silicon wafer sorting station, the paper-covered silicon wafer suction component (4) is hung on each paper-covered silicon wafer feeding walking arm module (3), and each paper-covered silicon wafer suction component (4) realizes the movement between the corresponding silicon wafer sorting station and the silicon wafer boxes on the left side and the right side through the paper-covered silicon wafer feeding walking arm module (3) to which the paper-covered silicon wafer feeding walking arm module (3) belongs to; cover paper silicon chip and absorb subassembly (4) including sucking disc lift cylinder (7), sucking disc mounting panel (8), cover paper silicon chip sucking disc (9) and cover paper silicon chip and absorb pneumatic subassembly, sucking disc lift cylinder (7) set up cover the lower extreme of the sliding block of paper silicon chip unloading walking arm module (3), sucking disc mounting panel (8) set up on the telescopic link of sucking disc lift cylinder (7), it sets up uniformly to cover paper silicon chip sucking disc (9) on sucking disc mounting panel (8), it absorbs pneumatic subassembly setting to be in to cover paper silicon chip cover the left and right sides of the sliding block of paper silicon chip unloading walking arm module (3), cover paper silicon chip absorb pneumatic subassembly pass through the trachea respectively with sucking disc lift cylinder (7) with cover paper silicon chip sucking disc (9) and connect.
2. The paper-covered silicon wafer blanking mechanism of the silicon wafer separating and plate-splitting machine according to claim 1, characterized in that: be provided with 8 on sucking disc mounting panel (8) cover paper silicon chip sucking disc (9), and 8 cover paper silicon chip sucking disc (9) and be in position on sucking disc mounting panel (8) is octagon distribution mode, and corresponding with the distribution position who separates the sucking disc via hole on the paper, so that 8 cover paper silicon chip sucking disc (9) and can hold the silicon chip after passing the corresponding sucking disc via hole on the paper respectively.
3. The paper-coated silicon wafer blanking mechanism of the silicon wafer paper-separating plate-separating machine according to claim 1, characterized in that: the paper-coated silicon wafer sucking pneumatic assembly comprises a vacuum generator (10), a sucker pressure regulating valve (11), a sucker electromagnetic valve (12), a vacuumizing pressure gauge (13) and a sucker lifting cylinder electromagnetic valve (14), wherein the sucker lifting cylinder electromagnetic valve (14) is arranged on the front side surface of the lower part of a sliding block of the paper-coated silicon wafer blanking walking arm module (3) through a paper-coated silicon wafer sucking pneumatic assembly mounting plate (15), and the sucker lifting cylinder electromagnetic valve (14) is connected with a sucker lifting cylinder (7) through an air pipe; vacuum generator (10), sucking disc solenoid valve (12), evacuation manometer (13) absorb pneumatic subassembly mounting panel (15) through covering paper silicon chip and set up cover the lower part trailing flank of the sliding block of paper silicon chip unloading walking arm module (3), sucking disc air-vent valve (11) set up through air-vent valve installing support (16) cover the lower part leading flank of the sliding block of paper silicon chip unloading walking arm module (3), sucking disc air-vent valve (11) through the trachea with sucking disc solenoid valve (12) are connected, sucking disc solenoid valve (12) through the trachea with vacuum generator (10) are connected, vacuum generator (10) through the trachea respectively with evacuation manometer (13) and every cover paper silicon chip sucking disc (9) and connect.
4. The paper-coated silicon wafer blanking mechanism of the silicon wafer paper-separating plate-separating machine according to claim 1, characterized in that: the sucker mounting plate (8) is provided with a paper covering silicon wafer adsorption in-place sensor (17) for detecting whether the paper covering silicon wafer sucker (9) sucks the paper covering silicon wafer (6).
5. The paper-covered silicon wafer blanking mechanism of the silicon wafer separating and plate-splitting machine according to claim 1, characterized in that: one side of sucking disc mounting panel (8) is provided with the detection cover paper silicon chip sucking disc (9) and whether move extremely silicon chip magazine above silicon chip magazine (5) sensor (18) that targets in place, silicon chip magazine sensor (18) that targets in place through the silicon chip magazine target in place sensor installing support (19) with this body coupling of sucking disc lift cylinder (7).
6. The paper-coated silicon wafer blanking mechanism of the silicon wafer paper-separating plate-separating machine according to claim 1, characterized in that: the paper-covered silicon wafer blanking walking arm module (3) comprises a paper-covered silicon wafer blanking walking arm module fixing side plate (20), a paper-covered silicon wafer blanking walking arm module connecting plate (21) fixedly connected with a rack is arranged on the front side face of the paper-covered silicon wafer blanking walking arm module fixing side plate (20), a driving belt pulley (23) is arranged at one end of the rear side face of the paper-covered silicon wafer blanking walking arm module fixing side plate (20) through a belt driving motor (22), a driven belt pulley (25) is arranged at one end of the rear side face of the paper-covered silicon wafer blanking walking arm module fixing side plate (20) through a driven belt pulley fixing plate (24), the belt driving motor (22) and the driven belt pulley fixing plate (24) are both fixedly connected with the front side face of the paper-covered silicon wafer blanking walking arm module fixing side plate (20), and a circle of transmission belt (26) is wound between the driving belt pulley (23) and the driven belt pulley (25); a hanging block moving slide rail (27) parallel to the transmission belt (26) is arranged on the rear side face of the fixed side plate (20) of the paper-covered silicon wafer blanking walking arm module, the hanging block moving slide rail (27) is positioned between an upper flat belt and a lower flat belt of the transmission belt (26), a hanging block (29) used for being connected with the paper-covered silicon wafer suction assembly (4) is arranged on a slide block of the hanging block moving slide rail (27) through a hanging block connecting plate (28), and the hanging block connecting plate (28) is fixedly connected with one layer of belt in the transmission belt (26) through a transmission belt connecting block (30); the rear side of the paper-covered silicon wafer blanking walking arm module fixing side plate (20) is provided with a rear cover (32) through sealing plates (31) at the left end and the right end, and gaps which are convenient for the hanging blocks (29) to slide left and right are reserved between the upper edge and the lower edge of the rear cover (32) and the upper edge and the lower edge of the paper-covered silicon wafer blanking walking arm module fixing side plate (20).
7. The silicon wafer blanking mechanism of the silicon wafer separating and plate separating machine of claim 6, wherein: four vertex angles of the driven pulley fixing plate (24) are respectively provided with a horizontal driven pulley fixing plate left and right adjusting waist-shaped hole (33), a driven pulley fixing plate positioning screw (35) used for abutting against the side end face of the driven pulley fixing plate (24) is arranged on the front side face of the paper-coated silicon wafer blanking walking arm module fixing side plate (20) through a positioning screw seat (34), four driven pulley fixing plate locking screws (36) corresponding to the left and right adjusting waist-shaped holes (33) of the driven pulley fixing plate are arranged on the front side face of the paper-coated silicon wafer blanking walking arm module fixing side plate (20), and the four driven pulley fixing plate locking screws (36) are respectively arranged in the corresponding left and right adjusting waist-shaped holes (33) of the driven pulley fixing plate in a penetrating manner; the driven pulley fixing plate (24) achieves left-right fine adjustment on the front side face of the paper-covered silicon wafer blanking walking arm module fixing side plate (20) through the extending length of a driven pulley fixing plate positioning screw (35), and achieves locking and fixing on the front side face of the paper-covered silicon wafer blanking walking arm module fixing side plate (20) through screwing and matching of a driven pulley fixing plate locking screw (36) and a driven pulley fixing plate left-right adjusting waist-shaped hole (33); simultaneously, be located cover driven pulley connecting axle via hole on paper silicon chip unloading walking arm module fixed curb plate (20), the satisfying of its horizontal trompil length the requirement of fine setting distance about driven pulley's (25) connecting axle, driven pulley (25) pass through fine setting about driven pulley fixed plate (24) is realized the tensioning of driving belt (26) is adjusted.
8. The silicon wafer blanking mechanism of the silicon wafer separating and plate separating machine of claim 6, wherein: the bottom of the fixed side plate (20) of the paper-covered silicon wafer blanking walking arm module is provided with a plurality of hanging block in-place moving sensors (37), all the hanging block in-place moving sensors (37) are respectively positioned right above the silicon wafer sorting station and the silicon wafer material boxes (5) on two sides, and the hanging block (29) is provided with a shading sheet (38) matched with all the hanging block in-place moving sensors (37).
9. The paper-covered silicon wafer blanking mechanism of the silicon wafer separating and plate-splitting machine according to claim 1, characterized in that: the silicon wafer magazine fixing assembly (2) comprises two magazine support bars (39) which are arranged in parallel along the Y direction, and the inner sides of the two magazine support bars (39) are respectively provided with a plurality of limiting clamping blocks (40) which are used for supporting and fixing the silicon wafer magazine (5).
10. The silicon wafer blanking mechanism of the silicon wafer separating and plate separating machine of claim 9, wherein: the silicon wafer box is characterized in that an arc clamping groove (41) capable of being matched with the limiting clamping blocks (40) is formed in the bottom of the outer side wall of the silicon wafer box (5), and the silicon wafer box (5) is fixed between the two box supporting strips (39) through the matching of the limiting clamping blocks (40) and the arc clamping grooves (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221186125.4U CN217995973U (en) | 2022-05-18 | 2022-05-18 | Paper-covered silicon wafer blanking mechanism of silicon wafer paper-separating plate-separating machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221186125.4U CN217995973U (en) | 2022-05-18 | 2022-05-18 | Paper-covered silicon wafer blanking mechanism of silicon wafer paper-separating plate-separating machine |
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| CN217995973U true CN217995973U (en) | 2022-12-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116487309A (en) * | 2023-06-26 | 2023-07-25 | 中国电子科技集团公司第二十九研究所 | Multi-chip assembly multi-station automatic production line of multi-layer track and control method |
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2022
- 2022-05-18 CN CN202221186125.4U patent/CN217995973U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116487309A (en) * | 2023-06-26 | 2023-07-25 | 中国电子科技集团公司第二十九研究所 | Multi-chip assembly multi-station automatic production line of multi-layer track and control method |
| CN116487309B (en) * | 2023-06-26 | 2023-08-22 | 中国电子科技集团公司第二十九研究所 | Multi-chip assembly multi-station automatic production line of multi-layer track and control method |
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