CN217965325U - Rotating table and silicon wafer laser engraving system - Google Patents

Abstract

The embodiment of the application provides a rotating table and a silicon wafer laser engraving system, and relates to the technical field of photovoltaic cell manufacturing. The rotating platform comprises a rotating bracket and a supporting platform connected to the rotating bracket, and the rotating bracket can drive the supporting platform to rotate so as to enable the supporting platform to move among a plurality of stations; the supporting table is provided with a table top for supporting the silicon wafer, and the supporting table is rotatably connected to the rotating support through a rotating shaft, so that the table top inclines or overturns after the supporting table rotates for a preset angle along the rotating shaft.

Description

Rotating table and silicon wafer laser engraving system

Technical Field

The embodiment of the application relates to the technical field of photovoltaic cell manufacturing, in particular to a rotating table and a silicon wafer laser engraving system.

Background

In the field of photovoltaic cell manufacturing, when a silicon wafer is processed, the silicon wafer is usually placed on a rotary table, and the rotation of the rotary table causes the silicon wafer to sequentially pass through each processing station. Since the thickness of the silicon wafer is small and the rotation speed of the turntable is high, the silicon wafer is likely to be chipped on the turntable.

In the related art, a compressed air blowing nozzle is generally provided, and compressed air is blown toward the rotary table through the blowing nozzle to purge debris on the rotary table. However, the purged spin stand often has residual debris.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a rotating table and a silicon wafer laser engraving system, which are used for solving the problem that the rotating table often has residual fragments.

On one hand, the embodiment of the application provides a rotating platform which is used for processing a silicon wafer and comprises a rotating support and a supporting platform connected to the rotating support, wherein the rotating support can drive the supporting platform to rotate so as to enable the supporting platform to move among a plurality of stations; the supporting table is provided with a table top for supporting the silicon wafer, and the supporting table is rotatably connected to the rotating support through a rotating shaft, so that the table top inclines or overturns after the supporting table rotates for a preset angle along the rotating shaft.

Optionally, the table top is turned over after the supporting table rotates by a preset angle, and the table top includes a first table top located on one side of the supporting table and a second table top located on the other side of the supporting table opposite to the supporting table.

Optionally, the rotating shaft coincides with a center line of the supporting table, and the rotating table further includes a driving device, and the driving device is in transmission connection with the rotating shaft to drive the supporting table to rotate.

Optionally, the rotating bracket comprises a table frame, and the support table is located in the table frame; the rotating shaft comprises a first half shaft connected to one side of the supporting platform and a second half shaft connected to the other side of the supporting platform, and the first half shaft and the second half shaft are rotatably connected to the platform frame.

Optionally, the rotating table further comprises a limiting component, and when the supporting table is in a non-rotating state, the limiting component is connected with the rotating bracket and the supporting table to limit the rotation of the supporting table.

Optionally, the limiting assembly comprises a first limiting assembly and a second limiting assembly, and a distance between the first limiting assembly and the rotating shaft is smaller than a distance between the second limiting assembly and the rotating shaft.

Optionally, the first limiting component is located on one side of the rotating shaft, and the second limiting component is located on the other side of the rotating shaft.

Optionally, the limiting assembly comprises a limiting hole and a limiting pin; the limiting hole and/or the limiting pin are/is provided with a guide structure.

Optionally, a plurality of adsorption holes are formed in the table top at intervals, and the adsorption holes are communicated with the vacuum generating device so that the silicon wafer is adsorbed on the table top through the adsorption holes.

In another aspect, an embodiment of the present application provides a silicon wafer laser engraving system, including the rotating table.

The revolving stage and silicon chip laser engraving system that this application embodiment provided, the brace table passes through the axis of rotation and rotationally connects on runing rest, and the brace table rotates and predetermines the angle after, the mesa can incline or overturn to make the piece on the mesa drop from the mesa under the effect of gravity, play the effect of clearance mesa piece. And, compared with the mode of blowing through the blow gun, the consumption of compressed air has been practiced thrift.

The revolving stage and silicon chip laser engraving system that this application embodiment provided, the brace table passes through the axis of rotation and rotationally connects on runing rest, and the brace table rotates and predetermines the angle after, the mesa can incline or overturn to make the piece on the mesa drop from the mesa under the effect of gravity, play the effect of clearance mesa piece. And, for the mode that sweeps through the blow gun, the piece clearance is more thorough, and has practiced thrift compressed air's quantity.

Drawings

FIG. 1 is a top view of a laser engraving system for silicon wafers according to an embodiment of the present disclosure;

FIG. 2 is a top view of a laser engraving system for silicon wafers in the related art;

fig. 3 is an assembly view of a support table and a table frame in a silicon wafer laser engraving system according to an embodiment of the present application;

FIG. 4 is a rotated view of the left side view of FIG. 3;

FIG. 5 is a schematic view of a support table in a laser engraving system for silicon wafers according to an embodiment of the present application;

fig. 6 is a rotated view of the left side view of fig. 5.

Reference numerals:

10-a silicon wafer to be processed; 20-processing the silicon wafer;

100-a feed conveyor;

200-a robotic arm; 210-a first robot arm; 220-a second robotic arm;

300-a rotating table; 300 a-a feed station (outfeed station); 300 b-a photographing station; 300 c-laser engraving station; 300 d-redundant stations; 310-a rotating holder; 311-a table frame; 320-a support table; 321-a rotating shaft; 322-adsorption holes; 323-vacuum generating device interface; 324-a limiting hole; 330-a drive device; 340-a stop assembly; 341-compressed air interface.

400-discharge conveyor.

Detailed Description

Selective Emitter (SE) laser engraving is one of the key processes in the manufacturing process of crystalline silicon solar cells. The principle of SE laser engraving is as follows: a layer of phosphorus-rich phosphosilicate Glass (PSG) is formed on the surface of the diffused P-type silicon wafer, a SE laser emitter emits high-frequency laser pulses to the silicon wafer to enable the surface layer of the silicon wafer to be in a molten state, so that phosphorus atoms in the PSG layer are diffused to the surface layer of the silicon wafer, the phosphorus atoms entering the surface layer of the silicon wafer can replace the positions of the silicon atoms after the silicon wafer is solidified, and the purpose of doping the phosphorus atoms in the silicon wafer is achieved.

The embodiment of the application provides a silicon wafer laser engraving system which can be applied to the SE laser engraving process. The silicon wafer laser engraving system can comprise a rotating table and an SE laser emitting device, wherein the rotating table is used for supporting a silicon wafer and driving the silicon wafer to move among a plurality of stations, for example, the silicon wafer laser engraving system comprises a feeding station and a laser engraving station, and the rotating table can convey the silicon wafer from the feeding station to the laser engraving station. And the SE laser emitting device is positioned at the laser engraving station and used for emitting laser to the silicon wafer so as to carry out SE laser engraving on the silicon wafer.

Illustratively, as shown in fig. 1, the silicon wafer laser engraving system may include an in-feed conveyor 100, a robot arm 200, a rotary table 300, an out-feed conveyor 400, a vision recognition device (not shown), and an SE laser emitting device (not shown). During operation, the feeding conveyor 100 conveys the silicon wafer 10 to be processed to the grabbing position of the mechanical arm 200 along the left direction of the drawing, the mechanical arm 200 grabs the silicon wafer 10 to be processed and places the silicon wafer 10 to the feeding station 300a of the rotary table 300, the rotary table 300 rotates so that the silicon wafer 10 to be processed enters the photographing station 300b, the vision recognition device located at the photographing station 300b obtains parameter information for SE laser engraving, such as the shape and the position of the silicon wafer, through the image information of the silicon wafer, the rotary table 300 drives the silicon wafer 10 to be processed to rotate to the laser engraving station 300c after obtaining the parameter information, the SE laser emission device located at the laser engraving station 300c carries out SE laser engraving on the silicon wafer 10 to be processed according to the parameter information, the rotary table 300 drives the processed silicon wafer 20 to rotate to the discharging station 300a after the engraving is completed, the mechanical arm 200 grabs the processed silicon wafer 20 and places the processed silicon wafer 20 on the discharging conveyor 400, and the discharging conveyor 400 conveys the processed silicon wafer 20 along the right direction of the drawing.

In order to improve efficiency, the feeding station 300a and the discharging station 300a of the rotary table 300 may be the same station, the robot arm 200 includes a first robot arm 210 for grasping the silicon wafer 10 to be processed and a second robot arm 220 for grasping the processed silicon wafer 20, and the first robot arm 210 and the second robot arm 220 form a certain included angle along a horizontal plane, so that the robot arm 200 places the processed silicon wafer 20 on the discharging conveyor 400 and places the silicon wafer 10 to be processed on the feeding station 300a.

In addition, in the example shown in fig. 1, a redundant station 300d is provided in addition to the feeding and discharging station 300a, the photographing station 300b, and the laser engraving station 300 c. When silicon chip laser engraving system includes three station, the contained angle between the three station is 360 °/3=120 °, consequently revolving stage 300 drives the silicon chip and need rotate 120 ° when rotatory to another station from a station. When including four stations, the contained angle between four stations is 360 °/4=90 °, therefore revolving stage 300 drives the silicon chip and only need rotate 90 ° when revolving to another station from a station, improved efficiency under the certain circumstances of angular velocity of rotation of revolving stage 300. Of course, the number of the redundant stations 300d can be flexibly set according to actual conditions, and can also be two, three, and the like.

The turntable 300 may include a rotary support 310 and a support stage 320 coupled to the rotary support 310, the support stage 320 being configured to support a silicon wafer, the rotary support 310 being configured to rotate the support stage 320 so that the support stage 320 moves between a plurality of stations.

The rotating bracket 310 may include a rotating shaft 312 and a rotating arm 311 rotatably coupled to the rotating shaft 312, and the supporting stage 320 is coupled to the rotating arm 311 such that the supporting stage 320 can rotate about the rotating shaft 312. Illustratively, the rotating bracket 310 includes four rotating arms 311 disposed at intervals circumferentially around the rotating shaft, and one supporting stage 320 is connected to each rotating arm 311. Each support stage 320 can carry a silicon wafer, so that the rotary table 300 can carry four silicon wafers at the same time, thereby improving the production efficiency. Of course, the number of the rotating arms 311 may also be one, two, three, five, etc., and the application does not limit the number of the rotating arms 311 and the supporting table 320.

The supporting table 320 is provided with a table top for supporting a silicon wafer, and the silicon wafer is attached to the table top after being placed on the supporting table 320. The shape and size of the support stage 320 may be determined according to the shape and size of the silicon wafer. For example, the silicon wafer may have a quadrilateral shape as a whole, and the support stage 320 may have a quadrilateral shape matching the silicon wafer. In order to reduce the weight of the support stage 320, the support stage 320 may have a rectangular structure with a part of the area hollowed out.

For preventing that the silicon chip from droing from the mesa, can be equipped with the absorption hole 322 that a plurality of intervals set up on the mesa, adsorb hole 322 and vacuum generating device intercommunication, the atmospheric pressure in absorption hole 322 can be reduced to the during operation vacuum generating device to make the silicon chip laminate under the effect of atmospheric pressure on the mesa, the silicon chip passes through absorption hole 322 and adsorbs on the mesa promptly.

Illustratively, when the support stage 320 has a grid-shaped structure, a plurality of suction holes 322 are uniformly disposed on each side of the grid-shaped structure.

In the application process, it is found that because the silicon wafer is thin and the rotating speed of the rotating table 300 is high, fragments are easily generated on the table top by the silicon wafer, and the generated fragments cause partial areas of the silicon wafer on the table top to be lifted, so that the parameter information acquired by the visual recognition device generates deviation, and the precision of the SE laser engraving process is further influenced.

FIG. 2 is a top view of a laser engraving system for silicon wafers in the related art, as shown in FIG. 2, in which a support table 320 is fixedly connected to a rotary support 310, and a table is purged by a compressed air nozzle when the table is broken. However, part of fragments of the table top after the purging still remain, and especially after the table top is provided with the adsorption holes 322, part of the fragments may be blocked on the adsorption holes 322 and are not easy to be blown off.

In view of this, in the embodiment of the present application, the supporting platform 320 is rotatably connected to the rotating bracket 310 through the rotating shaft 321, so that the supporting platform 320 tilts or overturns after rotating along the rotating shaft 321 by a predetermined angle.

The table top is inclined, that is, the table top is not parallel to the ground. Such as 90 degrees, 30 degrees, 120 degrees, etc., from the floor. Flipping means that the playing surface faces the ground and is parallel to the ground. When the table top is inclined or turned over, the fragments on the table top can fall off from the table top under the action of gravity. The preset angle is an angle for inclining or turning over the table top, and may be any angle not including 0 °, 360 ° and an integral multiple of 360 °.

Exemplarily, in the example shown in fig. 1, the support table 320 may be rotated at the feeding station (discharging station) 300a by a preset angle. For example, the rotation is completed in the time between the time when the robot arm 200 picks up the processed silicon wafer 20 and the time when the robot arm 200 places the silicon wafer 10 to be processed at the feed station 300a, so that the time is saved and the efficiency is improved.

The revolving stage 300 and silicon chip laser engraving system that this application embodiment provided, the brace table 320 rotationally connects on runing rest 310 through axis of rotation 321, and after the brace table 320 rotated and preset the angle, the mesa can incline or overturn to make the piece on the mesa drop from the mesa under the effect of gravity, play the effect of clearance mesa piece. And, for the mode that sweeps through the blow gun, the piece clearance is more thorough, and has practiced thrift compressed air's quantity.

In order to improve the cleaning effect of the fragments, the preset angle may be 180 °, that is, the supporting platform 320 rotates by the preset angle to turn over the back surface. After the table top is turned over, the fragments on the table top are completely unsupported, and the fragments are more easily fallen off from the table top when the table top is inclined relative to the table top.

When the preset angle is 180 °, to reduce the waiting time of the robot arm 200 during the rotation of the supporting stage 320, the table top may include a first table top located on one side of the supporting stage 320 and a second table top located on the other side of the supporting stage 320 opposite to the first table top, that is, the first table top and the second table top are disposed opposite to each other.

In the working process, assuming that the first table-board faces upwards and supports the processed silicon wafer 20, after the mechanical arm 200 grabs the processed silicon wafer 20, the supporting table 320 rotates 180 degrees, so that the first table-board faces the ground and the second table-board faces upwards, and the second table-board can support the silicon wafer 10 to be processed. When only one table surface is arranged, the support table 320 needs to rotate 180 degrees to clean the fragments, and then rotates 180 degrees to enable the table surface to face upwards again. Therefore, the arrangement of the first table top and the second table top which are opposite to each other can reduce the waiting time of the mechanical arm 200 and improve the production efficiency.

When the first table top and the second table top are arranged, the adsorption holes 322 can be arranged on the first table top and the second table top to adsorb the silicon wafer. For example, the adsorption holes 322 on the first table top can be connected with the first air channel, and correspondingly the adsorption holes 322 on the second table top are connected with the second air channel, when the first table top is used for supporting a silicon wafer, the first air channel is communicated with the vacuum generating device, and when the second table top is used for supporting a silicon wafer, the second air channel is communicated with the vacuum generating device, so that the power consumption of the vacuum generating device can be reduced, and the adsorption force of the adsorption holes 322 is improved. Of course, the adsorption hole 322 on the first table top and the adsorption hole 322 on the second table top can also share one air path to communicate with the vacuum generating device.

The rotating shaft 321 may be a hollow structure, and the space inside the rotating shaft 321 is communicated with the suction hole 322, and one end of the rotating shaft 321 is provided with a vacuum generating device interface 323 to communicate with a vacuum generating device through the vacuum generating device interface 323. This prevents the bypass pipe from being entangled during the rotation of the support table 320.

The rotating table 300 may further include a driving device 330, and the driving device 330 is in transmission connection with the rotating shaft 321 to drive the supporting table 320 to rotate. Illustratively, the driving device 330 includes a motor, and an output shaft of the motor is drivingly connected to the rotating shaft 321 to drive the rotating shaft 321 to rotate.

The rotation shaft 321 may coincide with a center line of the support base 320 to reduce an eccentricity amount when the support base 320 rotates. And when the rotation shaft 321 coincides with the center line of the support stage 320, the support stage 320 occupies a small space when rotating. For example, when the support base 320 has a structure of a shape of a Chinese character 'tian', the rotation axis 321 may coincide with a center line perpendicular to a side of the Chinese character 'tian', or may coincide with a diagonal line of the Chinese character 'tian'.

To prevent collision with other objects or operators during rotation of the support base 320, the rotating bracket 310 may include a table frame 311, and the support base 320 is located within the table frame 311. The rotation shaft 321 includes a first half shaft connected to one side of the support stage 320 and a second half shaft connected to the opposite side of the support stage 320, and the first half shaft and the second half shaft are rotatably connected to the deck frame 311.

Illustratively, when the support stage 320 has a quadrangular shape, the table frame 311 has a quadrangular shape, and the side length of the table frame 311 is greater than that of the support stage 320. The first half shaft is rotatably connected to one side of the table frame 311, and the second half shaft is rotatably connected to the opposite side of the table frame 311. The driving device 330 may be located outside the table frame 311.

Of course, the table frame 311 may have a U-shape, and the rotation shafts 321 are connected to two sides of the U-shape.

In order to prevent the silicon wafer from colliding with the mesa frame 311, the size of the mesa frame 311 may be larger than that of the silicon wafer, so that the silicon wafer is located in a space surrounded by the mesa frame 311.

The supporting platform 320 rotates at the feeding station (discharging station) 300a, and is in a non-rotating state, i.e., a fixed state, at the stations such as the photographing station 300b and the laser engraving station 300 c. To improve the stability of the support stage 320, the turntable 300 may further include a limiting assembly 340, wherein the limiting assembly 340 connects the rotating bracket 310 and the support stage 320 to limit the rotation of the support stage 320 when the support stage 320 is in a non-rotating state.

The stop assembly 340 may comprise a variety of configurations. Illustratively, the limiting component 340 includes a limiting pin and a limiting hole 324, the limiting pin is telescopically mounted on the table frame 311, and the limiting hole 324 is disposed on a sidewall of the table 320. When the supporting platform 320 is in a non-rotating state, the limit pin extends out of the platform frame 311 and is inserted into the limit hole 324, and when the supporting platform 320 is in a rotating state, the limit pin retracts from the limit hole 324. For example, the limit pin is a pneumatic pin, and the pneumatic pin is driven to extend or retract by compressed air. When the limiting pin is a pneumatic pin, a compressed air interface 341 may be disposed on the outer wall of the table frame 311 to communicate with a compressed air source.

Of course, the limiting component 340 may also be of other structures, for example, the limiting component 340 includes a limiting ball elastically and telescopically mounted on the table frame 311 through a spring, the supporting table 320 is provided with a limiting hole 324, when the supporting table 320 is in a non-rotating state, the limiting ball extends into the limiting hole 324 under the elastic force of the spring, and when the supporting table 320 is in a rotating state, the limiting ball is disengaged from the limiting hole 324.

In addition, the limit pin and the limit ball may be mounted on the support base 320, and the limit hole 324 may be formed in the table frame 311 or the rotation bracket 310.

The actual rotation angle of the supporting stage 320 may be different from the predetermined angle, which may cause the stage to tilt and affect the processing precision of the silicon wafer. For example, the preset angle is 180 °, and the support table 320 is rotated 181 ° to tilt the table top by 1 ° due to the precision of the driving device 330. It is therefore necessary to correct the position of the support stage 320 after the support stage 320 rotates.

In order to reduce the number of parts, the position-limiting component 340 can also have a guiding function. Illustratively, in embodiments where the restraint assembly 340 includes a restraint pin and a restraint aperture 324, the restraint aperture 324 and the restraint pin may be provided with a guide structure. For example, a chamfered structure is provided at the end of the stopper pin and the stopper hole 324. Of course, a limit structure may be provided in one of the limit pin and the limit hole 324. For example, the limit pin may be chamfered or tapered only at the end thereof, or the limit hole 324 may be chamfered only at the end thereof.

When the actual rotation angle of the support stage 320 does not coincide with the preset angle, since the difference between the actual rotation angle and the preset angle is constant (i.e., the angle is constant), the positional deviation increases as the distance from the rotation axis 321 increases, and the positional deviation decreases as the distance from the rotation axis 321 decreases. For example, in the embodiment in which the limiting assembly 340 includes the limiting pin and the limiting hole 324, when the actual rotation angle of the supporting stage 320 does not coincide with the preset angle, the farther the distance between the limiting assembly 340 and the rotation shaft 321 is, the more the relative positions of the limiting pin and the limiting hole 324 are deviated, the less easily the limiting pin is inserted into the limiting hole 324. Therefore, when the position limiting assembly 340 is disposed at a position closer to the rotation axis 321, the position limiting assembly 340 is more easily coupled to and guides the relative positions of the support table 320 and the rotating bracket 310.

And the closer the position limiting assembly 340 is to the rotation axis 321, the poorer the force-bearing capacity of the position limiting assembly 340. Therefore, in order to make the structure of the supporting base 320 more stable, the position limiting assembly 340 needs to be disposed at a position far from the rotation axis 321.

To solve this discrepancy, the limiting member 340 may include a first limiting member and a second limiting member, and the first limiting member is spaced from the rotation axis 321 by a smaller distance than the second limiting member is spaced from the rotation axis 321. The first spacing subassembly realizes leading of brace table 320 position more easily, and the ability of the spacing subassembly bearing capacity of second is stronger, can make the structure of brace table 320 more firm.

Further, in order to balance the forces applied to the supporting platform 320 along the two sides of the rotating shaft 321, the first limiting component is located on one side of the rotating shaft 321, and the second limiting component is located on the other side of the rotating shaft 321. Illustratively, two first limiting assemblies are arranged on one side of the rotating shaft 321, and are symmetrical about a central line of the support table 320 perpendicular to the rotating shaft; two second limiting components are arranged on the other side of the rotating shaft 321, and are symmetrical about a center line of the support platform 320 perpendicular to the rotating shaft.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrases "comprising one of \ 8230; \8230;" does not exclude the presence of additional like elements in a process, method, article, or terminal device that comprises the element.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The rotating table is used for processing silicon wafers and is characterized by comprising a rotating support and a supporting table connected to the rotating support, wherein the rotating support can drive the supporting table to rotate so as to enable the supporting table to move among a plurality of stations;

the supporting table is provided with a table top for supporting the silicon wafer, and the supporting table is rotatably connected to the rotating support through a rotating shaft, so that the table top inclines or overturns after the supporting table rotates for a preset angle along the rotating shaft.

2. A turntable as claimed in claim 1, wherein the table top is adapted to be inverted after rotation of the table top through a predetermined angle, the table top comprising a first table top on one side of the table top and a second table top on an opposite side of the table top.

3. A turntable as claimed in claim 2, wherein the axis of rotation coincides with a centre line of the support table, the turntable further comprising drive means drivingly connected to the axis of rotation for driving the support table in rotation.

4. A rotary table as set forth in claim 3 wherein said rotary support includes a table frame, said support table being located within said table frame; the rotating shaft comprises a first half shaft connected to one side of the supporting platform and a second half shaft connected to the other side of the supporting platform, and the first half shaft and the second half shaft are rotatably connected to the platform frame.

5. A turntable as claimed in any one of claims 1 to 4, further comprising a stop assembly, the stop assembly being connected to the rotatable support and the support table to limit rotation of the support table when the support table is in the non-rotatable state.

6. A turntable as claimed in claim 5, wherein the stop assembly comprises a first stop assembly and a second stop assembly, the first stop assembly being spaced from the axis of rotation by a distance less than the second stop assembly.

7. A turntable as claimed in claim 6, wherein the first stop assembly is located on one side of the rotational axis and the second stop assembly is located on the other side of the rotational axis.

8. A rotary table according to claim 5, wherein the limit assembly comprises a limit hole and a limit pin; the limiting hole and/or the limiting pin are/is provided with a guide structure.

9. A turntable as claimed in claim 1 or 2, wherein the table top is provided with a plurality of suction holes spaced apart from each other, the suction holes being in communication with a vacuum generating device for sucking the silicon wafer onto the table top through the suction holes.

10. A silicon wafer laser engraving system, comprising the rotary table according to any one of claims 1 to 9.

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