CN217955883U - Light-emitting chip and display panel - Google Patents

Abstract

The utility model discloses a luminous chip, including a luminous granule that sends monochromatic light, locate the colour conversion layer of luminous granule play plain noodles, the colour conversion layer includes the substrate, coloured conversion material and isolation portion are established to the first face of substrate, the substrate includes that L single light is regional, and L more than or equal to 2, the isolation portion sets up between L single light region and to adjacent carry out light shielding, at least part between the single light region be equipped with monochromatic light converts the colour conversion material of target photochromic into, and is same for having the same colour conversion material in the single light region, and is adjacent the photochromic of single light region output is different. The utility model also discloses a display panel has a plurality of luminous chips. The utility model discloses can make single grain luminous chip send the light of multiple colour, photochromic is concentrated, display effect is good.

Description

Light-emitting chip and display panel

Technical Field

The utility model relates to a show the field, especially relate to a light-emitting chip and display panel.

Background

At present, a Mini/Micro Display screen is usually realized in a mode of taking RGB as a group of pixel points. In the prior art, a group of pixels usually includes a red light emitting device, a green light emitting device, and a blue light emitting device, where a plurality of light emitting devices are mounted on a PCB at small intervals to form a display panel, and the display panel can provide full-color display, but one pixel needs light emitting devices of multiple colors, for example, a red light emitting device, a green light emitting device, and a blue light emitting device form one pixel, and light emitting devices of different colors need to be separated and then bonded into one pixel, so that not only one pixel needs to be bonded multiple times, but also the concentration of multiple colors in one pixel is poor, the colors in one pixel easily affect the colors of other pixels, and the contrast and sharpness of the whole display panel during display are low.

Therefore, there is a need for an LED display panel and a light emitting chip that can solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a luminous chip and display panel can make the single grain luminous chip send out the light of multiple colour, and photochromic is concentrated, display effect is good.

In order to realize the above-mentioned purpose, the utility model discloses a light-emitting chip, including emitting monochromatic light a luminous granule, locating the colour conversion layer on luminous granule play plain noodles, colour conversion layer includes the substrate, coloured conversion material and isolation portion are established to the first face of substrate, the substrate includes L single light region, and L more than or equal to 2, isolation portion sets up between L single light region and to adjacent carry out light shielding, at least part between the single light region be equipped with monochromatic light converts the photochromic conversion material of target photochromic into, and is same in the single light region for the same colour conversion material, adjacent the photochromic of single light region output is different.

Specifically, the isolation part comprises a shielding groove concavely arranged on the first surface of the substrate, and a black shielding layer filled or coated in the shielding groove, wherein the black shielding layer shields the side wall and the bottom wall of the shielding groove. The utility model discloses a light shielding is carried out to the recess of adjacent single light zone spare, simple structure, and processing is convenient with low costs. Moreover, the light emitting areas with different colors are separated from the cross section of the emergent light by the isolating part, so that the confusion of different light colors is prevented, and the sharpness and the contrast of the display panel are effectively increased. Furthermore, the black shielding layer of the present invention is further coated on the bottom wall of the shielding groove, so as to effectively reduce the amount of light reflected from the adjacent color conversion layer to the adjacent single light region after being reflected to the light emitting particles.

Preferably, at least one of the single light regions is provided with a plurality of nano-filled holes, the color conversion material is a quantum dot material, and the quantum dot material is filled in the nano-filled holes.

Preferably, the light emitting particles include L sub-light emitting regions corresponding to the L single light regions, and the L sub-light emitting regions can emit the monochromatic light into the corresponding L single light regions, respectively, so that the L single light regions output a plurality of light colors. This scheme makes a luminescent particle have a plurality of independent sub-luminescent areas, make a luminescent particle can control the light of the multiple different colours of output, also can constitute a pixel according to setting up, the concentration of the luminescent area (single light region) of multiple colours is higher in same pixel, the area of a pixel concentrates on a luminescent particle, the area that a pixel shared is little, when luminous, the influence to other pixels on every side is littleer, the place that does not have the pixel on every side can blacken as far as possible, bottom black area of taking up has promoted display panel in by a wide margin. On the other hand, the utility model discloses make a pixel only need carry out solid brilliant once, need not many times solid brilliant, with low costs, can effectively reduce the cost of manufacture who sends a pixel.

Specifically, the light-emitting particles comprise a buffer layer arranged above the substrate, an N-type semiconductor layer arranged above the buffer layer, an active layer arranged above the N-type semiconductor layer, and a P-type semiconductor layer arranged above the active layer; the backlight surface of the light-emitting particles is divided to a preset position along the isolation part so as to divide the light-emitting particles into L sub-light-emitting regions corresponding to the L single-light regions; the preset position is a position below the active layer to the N-type semiconductor layer (excluding the active layer and including the N-type semiconductor layer, the scheme being such that the active layer is divided and the N-type semiconductor layer is not divided), or a position below the N-type semiconductor layer to the substrate (excluding the N-type semiconductor layer and including the substrate, the scheme being such that the N-type semiconductor layer is divided and the substrate is not divided).

Preferably, the light emitting chip further includes electrodes disposed on the light emitting particles, and the electrodes are electrically connected to the L sub-light emitting regions, respectively.

Specifically, when the preset position is a position from the lower side of the active layer to the N-type semiconductor layer, the electrode includes L negative electrodes and a positive electrode, the L negative electrodes are electrically connected with the P-type semiconductor layers of the L sub-light emitting regions respectively, and the N-type semiconductor layer which is not divided by the positive electrode is electrically connected.

Specifically, when the preset position is a position from the lower side of the N-type semiconductor layer to the substrate, the electrode includes L negative electrodes and L positive electrodes, the L negative electrodes are electrically connected with the L P-type semiconductor layers in the sub-light emitting areas respectively, and the L positive electrodes are electrically connected with the L N-type semiconductor layers in the sub-light emitting areas respectively.

Preferably, the substrate is a growth substrate of the light-emitting particles. The growth substrate of the luminous particles is used as the substrate of the color conversion layer, so that materials are saved.

Preferably, the first surface of the substrate and the light-emitting surface of the light-emitting particles have mutually corresponding stripping textures, and the first surface of the substrate and the light-emitting surface of the light-emitting particles are directly bonded or are spaced from each other by a heat-insulating layer. The substrate is a growth substrate stripped from the luminescent particles, the first surface of the substrate is a stripping surface and is bonded with the light-emitting surface of the luminescent particles, the scheme ensures that the bonding effect of the first surface of the substrate and the light-emitting surface of the luminescent particles is good, and the heat-insulating layer can prevent the color conversion material of the first surface of the substrate from being influenced when the luminescent particles generate heat.

Preferably, the first surface of the substrate is bonded with the light-emitting surface of the luminescent particles, so that the second surface of the substrate, which is far away from the color conversion material, is located on the outermost side of the light-emitting surface of the luminescent chip, and the color conversion material can be protected.

Preferably, a second surface opposite to the first surface of the substrate is bonded to the light emitting surface of the light emitting particle, so that at least the substrate is spaced between the color conversion material and the light emitting particle, and the color conversion material is prevented from being affected by heat generated by the light emitting particle.

Preferably, the substrate is a growth substrate for growing the light emitting particles, and the light emitting surface of the light emitting particles is formed on the second surface of the substrate, and the color conversion layer is formed by directly providing the substrate with the isolation portion and the color conversion material without peeling the growth substrate from the light emitting particles, thereby saving the process steps.

The utility model also discloses a display panel, including the base plate with install in a plurality of luminous chips on the base plate, luminous chip is last luminous chip.

Compared with the prior art, the utility model discloses set up the look conversion layer and form the single light region of exporting a plurality of different colours outside the light-emitting surface of a luminescent particle for a luminescent particle can send the light of multiple colour, and photochromic concentrates, makes display panel after, and display effect is good. On the other hand, the light shielding isolation part is arranged between the adjacent single light areas, and the isolation part can not only effectively prevent the color conversion materials in different single light areas from being mixed when the color conversion materials are arranged, but also prevent light interference when the adjacent single light areas emit light, so that the light in one single light area can not be transmitted to the other single light area through the light-transmitting substrate. In another aspect, the utility model discloses the luminous region of a plurality of colours is located a luminescent particle for the luminous region of a plurality of colours only needs to carry out solid brilliant once, need not solid brilliant many times, and is with low costs.

Drawings

Fig. 1 is a structural diagram of a light emitting chip according to a first embodiment of the present invention.

Fig. 2 is a structural diagram of a light emitting surface of a light emitting chip according to a first embodiment of the present invention.

Fig. 3 is a structural diagram of a backlight surface of a light emitting chip according to a first embodiment of the present invention.

Fig. 4 is a structural diagram of a light emitting chip according to a second embodiment of the present invention.

Fig. 5 is a structural diagram of a backlight surface of a light emitting chip according to a second embodiment of the present invention.

Fig. 6 is a structural diagram of a light emitting surface of a light emitting chip according to a third embodiment of the present invention.

Fig. 7 is a structural diagram of a light emitting chip according to a fourth embodiment of the present invention.

Fig. 8 is a structural diagram of the display panel of the present invention shown in fig. 1.

Fig. 9 is a structural diagram of a light emitting chip in a fifth embodiment of the present invention.

Fig. 10 is a structural view of a light emitting chip in a sixth embodiment of the present invention.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following description is given in conjunction with the embodiments and the accompanying drawings.

Referring to fig. 1 to 3, in a first embodiment of the present invention, a light emitting chip 100 is disclosed, including a light emitting particle 10 emitting monochromatic light, a color conversion layer 20 disposed on a light emitting surface of the light emitting particle 10, the color conversion layer 20 includes a substrate 21, a first surface of the substrate 21 is provided with a color conversion material and an isolation portion 22, the substrate 21 includes L single light regions, L is greater than or equal to 2, the isolation portion 22 is disposed between the L single light regions and is adjacent to the light regions for shielding light therebetween. And at least part of the single light areas are provided with color conversion materials for converting the monochromatic light into target light, the same single light area is provided with the same color conversion materials, and the light colors output by the adjacent single light areas are different.

In this embodiment, the isolation portion 22 is black, not only can be shielded from light but also can absorb the light that sets up the isolation portion, carry out adjacent light shielding that works as the single light region, make to form black light shielding area between the adjacent single light region, make light restrict the scope in the single light region as far as possible, the acutance and the contrast that effectively increase the luminescence chip and show, after making display panel, the area that luminous pixel takes up is littleer, the place that does not have the pixel can be as black as far as, bottom black area of taking up has promoted display panel in by a wide margin. Of course, the partition may be made of a material shielded from light by another color, such as silver or white.

Specifically, the light emitting particle 10 has a first surface (light emitting surface) emitting monochromatic light and a second surface (backlight surface) opposite to the light emitting surface, and the color conversion layer 20 is disposed on the first surface of the light emitting particle 10 and converts the monochromatic light into a target color for output.

Wherein the color conversion material is a quantum dot. Quantum dots are arranged in at least part of the single light regions, the quantum dots in the same single light region are same-color quantum dots, monochromatic light emitted by the light-emitting particles 10 passes through the single light region to be output, the quantum dots convert the monochromatic light into target light color to be output, and the light colors output by the adjacent single light regions are different.

With reference to fig. 1, the light emitting particle 10 is divided from the second surface to the substrate 21 along the separating portion 22, so that the light emitting particle 10 includes L sub-light emitting regions (the sub-light emitting regions are not separately labeled and can refer to the labels of the single light regions), and the L sub-light emitting regions can respectively emit the monochromatic light into the corresponding L single light regions, so that the L single light regions output a plurality of light colors.

Referring to fig. 1 and 2, the light emitting chip 100 further includes a plurality of electrodes 31 and 32, and the plurality of electrodes 31 and 32 are electrically connected to the L sub-light emitting regions.

The L sub-light emitting areas can be divided or cut by laser or by etching.

Wherein the partition 22 equally divides the substrate 21 into L single light areas, which makes the area of each single light area equal. Of course, the areas of the L single light regions may also be different, and then, the technician may adjust the areas of the single light regions with different colors according to the actual needs and the color cast requirements of the display screen.

Referring to fig. 2, in the present embodiment, L is equal to 4, the monochromatic light is blue light, quantum dots are disposed in three single light regions 201, 202, and 203, a red quantum dot 231 is disposed in the single light region 201, and the blue light emitted from the light emitting particle 10 is converted into red light to be output. The green quantum dots 232 are arranged in the single light area 202, the yellow quantum dots 233 are arranged in the single light area 203, and the quantum dots are not arranged in the single light area 204 to emit blue light. Of course, the number of L is not limited to 4,l but may be other numbers, such as 2, 3, 5, 6, etc., and the number of L and the color of the emitted light may be set according to actual needs, and is not limited to the embodiment. Of course, the monochromatic light may be violet light or other light, and is not limited to blue light.

In this embodiment, one of the 4 single light regions does not have a quantum dot and does not perform light color conversion, and directly outputs blue light, and the corresponding colors of quantum dots in adjacent single light regions in other single light regions are different, so that the adjacent single light regions output light with different colors. Of course, quantum dots may be provided to all the single-light regions.

In this embodiment, the 4 single light regions are distributed in a shape like a Chinese character tian, but of course, the four single light regions may be arranged in parallel. When the number of L is 3, the three single light regions may be arranged in parallel or in a delta shape.

Referring to fig. 2, l of said single light areas form a group of pixel units, each group of said pixel units having M single light areas emitting light of different colors, M being equal to or greater than 2. In this embodiment, L is equal to 4, M is equal to 4, and L is a blue light region 204, a green light region 202, a white light region 203, and a red light region 201. Of course, L of said single light areas form a plurality of groups of pixel units, for example L equals 8, and form two groups of pixel units, each group of pixel units emitting light of four colors; or L equals 6 and forms two groups of pixel cells, each group of pixel cells emitting light of three colors (blue, red and green).

Referring to fig. 1, the single light regions 201 to 203 where the quantum dots are arranged have quantum dot filling holes 211, and the quantum dots 231, 232, 233 are filled in the quantum dot filling holes 211. For convenience of processing, the single light region 204 may also be provided with quantum dot filling holes 211.

In this embodiment, the ratio of the holes of the quantum dot filling holes 211 to the surface area of the entire substrate 21 is up to 70%, the diameter of the holes is 500 nm-1.5 um, the depth of the holes is 8-10um, and light can be continuously reflected in the holes, so as to achieve a better light color conversion effect.

In this embodiment, the quantum dot filling holes 211 are holes etched on the substrate 21 by laser, electrochemical etching, or photolithography.

Of course, the light emitting particles 10 may not be divided into a plurality of sub-light emitting regions, and in this case, a plurality of single light regions of the light emitting particles 10 may emit light or not at the same time, so that the light emitting chip 100 emits white light or not, and a black-and-white display panel may be manufactured.

Referring to fig. 1, in the present embodiment, the light emitting particle 10 includes a buffer layer 11 disposed on the substrate 21 and an epitaxial wafer disposed on the buffer layer 11, and the epitaxial wafer includes an N-type semiconductor layer 12 disposed on the buffer layer 11, an active layer 13 disposed on the N-type semiconductor layer 12, and a P-type semiconductor layer 14 disposed on the active layer 13. Of course, the structure of the light emitting particle 10 is not limited thereto, and the light emitting particle 10 of the present invention is an LED light emitting particle, and the specific structure thereof is common knowledge in the art and will not be described in detail herein.

With continued reference to fig. 1, in the light emitting chip 100 of the present embodiment, a transparent ITO layer 15 is disposed on the P-type semiconductor layer 14, an insulating DBR layer 16 is disposed on the ITO layer 15, and electrodes 31 and 32 are disposed on the DBR layer 16.

Referring to fig. 1 and 3, in the present embodiment, the light emitting particle 10 is divided from the second surface to the substrate 21 along the partition 22 to divide the light emitting particle 10 into L sub-light emitting regions. The electrodes comprise L positive electrodes 31 and L negative electrodes 32, the L positive electrodes 31 are respectively and electrically connected with the N-type semiconductor layers of the L sub-luminous areas, and the L negative electrodes 32 are respectively and electrically connected with the P-type semiconductor layers of the L sub-luminous areas. The P-type semiconductor layer 14 and the N-type semiconductor layer 12 of the present embodiment are semiconductor layers provided with the active layer 13 on opposite sides, respectively. Of course, in the present embodiment, the light emitting particles 10 may also be divided from the second surface to the positions above the substrate 21 and below the N-type semiconductor layer 12 (excluding the substrate 21 and the N-type semiconductor layer 12), for example, at the buffer layer 11, along the isolation portion 22. In this embodiment, a total of 2L electrodes are formed.

The light emitting particles 10 are divided from the second surface to the N-type semiconductor layer 12 along the isolation portion 22 to form an isolation trench 101 between adjacent sub-light emitting regions, and the isolation trench 101 is filled with an insulating medium (not shown).

Referring to fig. 1, the isolation portion 22 includes a shielding groove 221 recessed in the first surface of the substrate 21 and a black shielding layer 222 coated on the shielding groove 221. The black material of the black shielding layer 222 is colloidal graphite diffusion liquid, resin type glue, or metal material. The shielding groove 221 is a groove formed on the first surface of the substrate 21 by laser etching, electrochemical etching or photolithography.

In this embodiment, the depth of the shielding groove 221 is greater than the depth of the quantum dot filling hole 211, and the width is greater than the width of the quantum dot filling hole 211. Of course, the depth of the shielding groove 221 may also be equal to the depth of the quantum dot filling hole 211.

In this embodiment, the substrate 21 is a growth substrate of the light emitting particle 10. Wherein the growth substrate is a sapphire substrate or a silicon carbide substrate.

The utility model discloses during the preparation of light-emitting particle, light-emitting particle 10 grows in the first face of substrate 21, has grown earlier that light-emitting particle 10 peels off from substrate 21 earlier, and the first face of substrate 21 and the play plain noodles of light-emitting particle 10 form the texture of peeling off that corresponds each other respectively this moment, should peel off the texture and be anomalous unsmooth rough surface or gully or stripe. The spacers 22 and quantum dots are then processed on the first side of the substrate 21 to make the color conversion layer 20, and then the second side of the substrate is bonded to the first side of the luminescent particles 10. At this time, the substrate 21 is spaced between the light emitting surface of the light emitting particle 10 and the quantum dot, so that the quantum dot is reduced when the light emitting particle 10 generates heat.

In another embodiment, the light emitting particles 10 may also be grown on the second surface of the substrate 21, and after the light emitting particles 10 are peeled off from the substrate 21, the second surface of the substrate 21 and the light emitting surface of the light emitting particles 10 respectively form corresponding peeling textures. And finally, bonding the second surface of the substrate with the luminescent particles 10, and stripping the texture to ensure that the bonding effect is good.

In another embodiment, the luminescent particles 10 may be grown on the second side of the substrate 21 without peeling the luminescent particles 10 off the second side of the substrate 21, and the color conversion layer 20 may be made by directly providing the spacer 22 and the color conversion material on the first side of the substrate 21 without bonding the substrate 21 and the luminescent particles 10.

In order to control the distance between the light emitting surface of the light emitting particle 10 and the quantum dot, the substrate 21 may be thinned before the spacer 22 and the quantum dot are processed. The thickness of the substrate 21 is 35-100um.

Of course, the substrate 21 may not be a growth substrate for the luminescent particles 10.

For example, in another embodiment, the luminescent particle of the present invention is manufactured by growing the luminescent particle 10 on a first surface of a growth substrate, thinning the growth substrate to 35-100um, and bonding the first surface of the substrate 21 to a second surface of the growth substrate opposite to the luminescent particle 10.

In another embodiment, the light-emitting particle 10 of the present invention is grown on a growth substrate, the light-emitting particle 10 is firstly peeled off from the substrate 21, and then the second surface of the substrate 21 is bonded to the first surface of the light-emitting particle 10.

Referring to fig. 8, the present invention discloses a display panel 200, which includes a substrate 300 and a plurality of light emitting chips 100 mounted on the substrate 300, wherein the substrate may be a PCB substrate, an FPC substrate or a glass substrate. The white area can be changed into green area, that is, the red, blue, white and green in fig. 8 can be changed into red, green, blue, green and blue.

Referring to fig. 4 and 5, a second embodiment of the present invention is different from the first embodiment in that the light emitting particle 10 is divided from the second surface to the N-type semiconductor layer 12 along the partition 22 to divide the light emitting particle 10 into L sub-light emitting regions. The electrodes comprise 1 positive electrode 31 and L negative electrodes 32, wherein the 1 positive electrode 31 is respectively electrically connected with the common N-type semiconductor layer 12, and the L negative electrodes are respectively electrically connected with the P-type semiconductor layers 14 of the L sub-light emitting areas. The embodiment forms the number of the electrodes of N +1, and effectively reduces the number of the electrodes of one pixel unit.

Referring to fig. 6, in order to provide a third embodiment of the present invention, different from the above-mentioned embodiment, in this embodiment, L is equal to 3, the partition 22a divides the first surface of the substrate 21 into 3 single light regions 201a, 202a, 203a arranged side by side, wherein two of the single light regions 201a, 202a are distributed with red quantum dots and green quantum dots to convert blue light into red light and green light to be emitted, respectively, and the third single light region 203a is not provided with quantum dots to output blue light. The 3 single light regions constitute a group of pixel cells.

Referring to fig. 7, in a fourth embodiment of the present invention, different from the first embodiment, in this embodiment, the isolation portion 22a includes a shielding recess 221 recessed in the first surface of the substrate 21 and a black shielding layer 222a filled on the shielding recess 221. The black material of the black shielding layer 222a is colloidal graphite diffusion liquid, resin type glue, or metal material. The shielding groove 221 is a groove formed on the first surface of the substrate 21 by laser etching, electrochemical etching or photolithography.

In the above embodiment, the substrate with a certain thickness is spaced between the light emitting particles and the quantum dots, and referring to fig. 9, in a fifth embodiment, the light emitting surface of the light emitting particle 10 is directly bonded to the first surface of the substrate 21, unlike the above embodiment. A bonding adhesive is disposed between the light emitting surface of the light emitting particle 10 and the first surface of the substrate 21, and the bonding adhesive 60 may be a thermal curing adhesive, a UV curing adhesive, or the like.

In this embodiment, the substrate 21 is a growth substrate of the light emitting particle 10. Wherein the growth substrate is a sapphire substrate or a silicon carbide substrate.

The utility model discloses during the luminescent particle preparation, luminescent particle 10 grows in the first face of substrate 21, and earlier it has luminescent particle 10 to peel off from substrate 21 to grow earlier, and the first face of substrate 21 and luminescent particle 10's play plain noodles form the texture of peeling off that corresponds each other respectively this moment, should peel off the texture and be anomalous unsmooth mat surface or gully or stripe. The spacers 22 and quantum dots are then processed on the first side of the substrate 21 to make the color conversion layer 20, and then the first side of the substrate is bonded to the first side of the luminescent particles 10.

Referring to fig. 10, a sixth embodiment of the present invention is different from the fifth embodiment, in which the light emitting surface of the luminescent particle 10 is bonded to the first surface of the substrate 21 through a thermal insulation layer 40, wherein the thermal insulation layer 40 may be disposed on the light emitting surface of the luminescent particle 10, and then the thermal insulation layer 40 is bonded to the first surface of the substrate 21. The heat insulating layer 40 may be sputtered, deposited, coated or bonded on the light emitting surface of the light emitting particle 10.

Of course, the heat insulating layer 40 may be disposed on the first surface of the substrate 21, and then the heat insulating layer 40 and the light emitting surface of the light emitting particle 10 may be bonded together. Wherein a thermal barrier layer 40 may be coated or bonded on the first side of the substrate 21.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, therefore, the invention is not limited thereto.

Claims (10)

1. A light emitting chip, characterized in that: including a luminous granule that sends monochromatic light, locate the look conversion layer on luminous granule plain noodles, the look conversion layer includes the substrate, coloured conversion material and isolation portion are established to the first side of substrate, the substrate includes L single light region, and L more than or equal to 2, the isolation portion sets up between L single light region and to adjacent carry out light shielding, at least part between the single light region be equipped with monochromatic light converts the photochromic conversion material of target photochromic into, and is same for the photochromic conversion material in the single light region, and is adjacent the photochromic of single light region output is different.

2. The light emitting chip of claim 1, wherein: the isolation part comprises a shielding groove concavely arranged on the first surface of the substrate and a black shielding layer filled or coated in the shielding groove, and the black shielding layer shields the side wall and the bottom wall of the shielding groove.

3. The light emitting chip of claim 1, wherein: at least one single light region is provided with a plurality of nano filling holes, the color conversion material is a quantum dot material, and the quantum dot material is filled in the nano filling holes.

4. The light-emitting chip of claim 1, wherein the light-emitting particles comprise L sub-light-emitting regions corresponding to the L single light regions, and the L sub-light-emitting regions can emit the monochromatic light into the corresponding L single light regions respectively, so that the L single light regions output a plurality of colors of light.

5. The light emitting chip of claim 4, wherein:

the light-emitting particles comprise a buffer layer arranged above the substrate, an N-type semiconductor layer arranged above the buffer layer, an active layer arranged above the N-type semiconductor layer and a P-type semiconductor layer arranged above the active layer;

dividing the backlight surface of the light-emitting particles to a preset position so as to divide the light-emitting particles into L sub-light-emitting regions corresponding to the L single light regions; the preset position is a position from the lower part of the active layer to the N-type semiconductor layer or a position from the lower part of the N-type semiconductor layer to the substrate.

6. The light emitting chip of claim 5, wherein: the light-emitting device also comprises electrodes arranged on the light-emitting particles;

when the preset position is the position from the lower part of the active layer to the N-type semiconductor layer, the electrode comprises L negative electrodes and a positive electrode, the L negative electrodes are respectively and electrically connected with the P-type semiconductor layers of the L sub-luminous areas, and the N-type semiconductor layer which is not divided by the positive electrode is electrically connected;

when the preset position is the position from the lower part of the N-type semiconductor layer to the substrate, the electrode comprises L negative electrodes and L positive electrodes, the L negative electrodes are respectively and electrically connected with the L P-type semiconductor layers of the sub-light-emitting areas, and the L positive electrodes are respectively and electrically connected with the L N-type semiconductor layers of the sub-light-emitting areas.

7. The light emitting chip of claim 1, wherein: the substrate is a growth substrate of the luminescent particles.

8. The light emitting chip of claim 7, wherein: the first surface of the substrate and the light-emitting surface of the luminescent particles are provided with mutually corresponding stripping textures, and the first surface of the substrate and the light-emitting surface of the luminescent particles are directly bonded or are separated by a heat-insulating layer.

9. The light emitting chip of claim 1, wherein: the first surface of the substrate is bonded with the light-emitting surface of the light-emitting particles or the second surface opposite to the first surface of the substrate is bonded with the light-emitting surface of the light-emitting particles or the substrate is a growth substrate for growing the light-emitting particles and the light-emitting surface of the light-emitting particles is formed on the second surface of the substrate.

10. A display panel, characterized in that: comprising a substrate and a plurality of light emitting chips mounted on the substrate, wherein the light emitting chips are as set forth in any one of claims 1-9.

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