CN110379835B - Display panel, display device and preparation method of display panel - Google Patents

Display panel, display device and preparation method of display panel Download PDF

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Publication number
CN110379835B
CN110379835B CN201910646384.7A CN201910646384A CN110379835B CN 110379835 B CN110379835 B CN 110379835B CN 201910646384 A CN201910646384 A CN 201910646384A CN 110379835 B CN110379835 B CN 110379835B
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pixel
sub
substrate
display panel
emitting diode
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CN110379835A (en
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刘孟宇
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • H10K59/1315Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate and a plurality of pixels positioned on one side of the substrate, wherein each pixel comprises a red sub-pixel, a green sub-pixel and a blue sub-pixel; at least one of the red sub-pixel, the green sub-pixel and the blue sub-pixel is a point light source and at least one is a surface light source. The invention improves mura phenomenon and/or color cast phenomenon, and improves display effect.

Description

Display panel, display device and preparation method of display panel
Technical Field
The embodiment of the invention relates to a display technology, in particular to a display panel, a display device and a preparation method of the display panel.
Background
With the development of display technology, the display panel is applied more and more widely in life of people, and the requirement of people on the display effect of the display panel is higher and higher.
However, the color shift of the conventional display panel occurs along with the increase of the viewing angle, and the display panel may have a mura phenomenon, which causes uneven display and seriously affects the display effect of the display panel.
Disclosure of Invention
The invention provides a display panel, a display device and a preparation method of the display panel, and aims to improve the display effect of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, where the display panel includes a substrate and a plurality of pixels located on one side of the substrate, where each of the pixels includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel; at least one of the red sub-pixel, the green sub-pixel and the blue sub-pixel is a point light source and at least one is a surface light source. The light intensity attenuation of each sub-pixel is consistent along with the change of the visual angle, so that the color mura phenomenon and/or the deflection phenomenon are/is improved, and the display effect is improved.
Optionally, the point light source is a micro light emitting diode, and the surface light source is an organic light emitting diode. The micro light-emitting diode and the organic light-emitting diode have the advantages of self luminescence, high light-emitting efficiency, large visual angle and the like, and the preparation process is mature, thereby being beneficial to reducing the cost.
Optionally, the red sub-pixel is a micro light emitting diode, and the green sub-pixel and the blue sub-pixel are both organic light emitting diodes. The color cast phenomenon is improved, the display effect is improved, and meanwhile, the yield of the display panel can be improved, so that the cost is reduced.
Optionally, the display panel further comprises a pixel defining layer for defining openings of the red, green and blue sub-pixels.
Optionally, the micro light emitting diode includes a first anode, an epitaxial layer structure, and a first cathode, which are stacked, and the first anode is bonded to the substrate through a first bonding metal layer; the organic light emitting diode comprises a second anode, a light emitting functional layer and a second cathode which are laminated; the second cathode is located at the same layer as the first cathode and is interconnected. The color cast phenomenon is improved, and meanwhile, one process is saved, and the cost is reduced.
Optionally, a pixel driving circuit is disposed on the substrate, and the pixel driving circuit includes a first pixel driving circuit and a second pixel driving circuit, the first pixel driving circuit is electrically connected to the micro light emitting diode, and the second pixel driving circuit is electrically connected to the organic light emitting diode; and the corresponding film layers of the first pixel driving circuit and the second pixel driving circuit are positioned on the same layer.
In a second aspect, an embodiment of the present invention further provides a display device, including the display panel according to the first aspect.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a display panel, including:
providing a substrate;
forming a plurality of pixels on the substrate, wherein each of the pixels includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel is a point light source and at least one is a surface light source.
Optionally, forming a plurality of pixels on the substrate comprises:
and a point light source is formed in the area of the red sub-pixel on the substrate, and a surface light source is formed in the area of the green sub-pixel and the area of the blue sub-pixel.
Optionally, the point light source is a micro light emitting diode, the surface light source is an organic light emitting diode, and forming a plurality of pixels on the substrate includes:
forming a stacked structure of a plurality of micro light emitting diodes on a substrate, wherein the stacked structure comprises a stacked epitaxial layer structure and a first anode;
forming a second anode layer on the substrate and patterning to form a second anode electrode in the region of the green sub-pixel and the region of the blue sub-pixel;
forming a pixel defining layer on the substrate to define openings of the red, green, and blue sub-pixels;
forming a light emitting functional layer on the second anode;
transferring the laminated structure and bonding the laminated structure on the substrate through the opening of the red sub-pixel by bonding metal;
forming a cathode layer on the whole surface.
The invention adopts a display panel comprising a plurality of pixels, wherein each pixel comprises a red sub-pixel, a green sub-pixel and a blue sub-pixel; at least one of the red sub-pixel, the blue sub-pixel and the green sub-pixel is a point light source, and at least one is a surface light source. Because the light field distribution of the point light source is different from that of the surface light source, the sub-pixels with fast light intensity attenuation along with the change of the visual angle are set as the point light source, and the sub-pixels with slow light intensity attenuation along with the change of the visual angle are set as the surface light source, so that the light intensity attenuation of each sub-pixel along with the change of the visual angle tends to be consistent, namely, the difference of the light intensity of each sub-pixel at the same visual angle is reduced, thereby improving the mura phenomenon and/or the large-visual angle color cast phenomenon and improving the display effect.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a micro light emitting diode according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another micro light emitting diode according to an embodiment of the present invention;
fig. 8 is a schematic circuit structure diagram of a pixel driving circuit according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 11 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 12 to 20 are schematic structural diagrams of a display panel corresponding to a main flow in a method for manufacturing a display panel according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
As mentioned in the background art, the color shift phenomenon or mura phenomenon of the display panel exists, the inventor has found that the color shift phenomenon is caused by the fact that the light intensity (brightness) of red, green and blue is inconsistent with the change of the viewing angle, and the mura phenomenon is caused by the fact that the film thickness of the whole display panel is uneven due to the difference of the manufacturing process of the display panel, so that the light intensity of red, green and blue is inconsistent with the change of the viewing angle. These phenomena are related to the optical field distribution of the light emitted from the display panel, and the display effect of the display panel is seriously affected.
Based on the above technical problem, the present embodiment provides the following solutions:
fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and referring to fig. 1, a display panel 19 includes a substrate 101 and a plurality of pixels 102 disposed on one side of the substrate 101, where each pixel 102 includes a red sub-pixel 1021, a green sub-pixel 1022, and a blue sub-pixel 1023; at least one of the red sub-pixel 1021, the green sub-pixel 1022, and the blue sub-pixel 1023 is a point light source and at least one is a surface light source.
Specifically, the light field distribution of the surface light source decreases with the luminous intensity of the viewing angle according to the Lambertian light source, and the relational expression is Iθ=I0cos θ; wherein θ is the angle of view, I0The light intensity in the forward direction (θ ═ 0). As can be seen from the distribution characteristics of the surface light source, the light intensity attenuation increases with the increase of the viewing angle; for red, green and blue lights, the color cast phenomenon occurs under the condition of a large viewing angle due to inconsistent light intensity attenuation trends; by replacing the area light source with the point light source with the fast light intensity attenuation, for example, the red subpixel 1021 is set as the point light source, and the green subpixel 1022 and the blue subpixel 1023 are set as the area light source, because the light intensities emitted by the point light sources to the periphery are consistent, the area light source of the red subpixel 1021 is replaced with the point light source, the light intensity of the subpixel 1021 at a specific viewing angle can be increased, the light intensity difference between the red subpixel 1021 and the green subpixel 1022 and the blue subpixel 1023 is not great, the phenomenon that the large viewing angle is cyan is avoided, the color cast phenomenon is also improved, and the display effect is improved. It should be noted that under some large viewing angles, there may be red or other color-biased conditions, and only the sub-pixels with fast attenuation of light intensity along with the change of the viewing angle need to be set as point light sources, and the rest of the sub-pixels are set as surface light sources, so that the attenuation of light intensity of each sub-pixel along with the change of the viewing angle tends to be consistent, thereby improving the color cast phenomenon and improving the display effect.
Meanwhile, in the process of manufacturing the display panel 19, due to the difference of manufacturing processes, the whole film thickness of the display panel 19 is uneven, and the light intensity attenuation of each sub-pixel is inconsistent along with the change of the visual angle, so that the mura phenomenon is caused. It should be noted that the region in which the mura phenomenon easily occurs may be obtained by simulation of a device for manufacturing the display panel, or obtained from an empirical value of the existing display panel, so that the sub-pixels in the region, which have a relatively fast attenuation with a change in viewing angle, may be directly set as point light sources when the display panel is manufactured, and thus it is not necessary to replace part of the sub-pixels with point light sources after the display panel is manufactured according to the manufacturing process of the surface light source, which reduces the process flow and saves the cost.
In the technical solution of this embodiment, a display panel including a plurality of pixels is adopted, and each pixel includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel; at least one of the red sub-pixel, the blue sub-pixel and the green sub-pixel is a point light source, and at least one is a surface light source. Because the light field distribution of the point light source is different from that of the surface light source, the sub-pixels with fast light intensity attenuation along with the change of the visual angle are set as the point light source, and the sub-pixels with slow light intensity attenuation along with the change of the visual angle are set as the surface light source, so that the light intensity attenuation of the light emitted by each sub-pixel along with the change of the visual angle tends to be consistent, the color cast phenomenon is improved, and the display effect is improved.
Optionally, fig. 2 is a schematic structural diagram of another display panel provided in an embodiment of the present invention, and fig. 3 is a schematic structural diagram of another display panel provided in an embodiment of the present invention, referring to fig. 2 and fig. 3, the display panel 19 includes a display area 201, the display area 201 includes an edge display area 202 and/or a bending area 203, and the target pixel is located in the entire display area 201, or the target pixel is located in the edge display area 202 and/or the bending area 203.
Specifically, corresponding to the edge display area 202 or the bending area 203, under the condition of a large viewing angle, the phenomenon that the brightness attenuation of red, green and blue sub-pixels is inconsistent along with the change of the viewing angle is serious, namely, the color cast phenomenon is serious, the sub-pixels which change along with the viewing angle in the edge display area 202 or the bending area 203 are set as point light sources, and the sub-pixels which change along with the viewing angle are set as surface light sources, so that the light intensity attenuation of the light emitted by each sub-pixel along with the change of the viewing angle tends to be consistent, the color cast phenomenon is improved, and the display effect is improved. Or, the display panel 19 has a mura phenomenon due to the difference of the manufacturing processes, and the mura phenomenon may exist in any area of the display area 201, so that the target pixels may be disposed in the entire display area 201 to reduce the mura phenomenon, thereby improving the display effect.
Optionally, the point light source is a micro light emitting diode, and the surface light source is an organic light emitting diode.
Specifically, the micro light emitting diode and the organic light emitting diode have the advantages of self luminescence, high light emitting efficiency, large viewing angle and the like, the preparation process is mature, the organic light emitting diode can be prepared in an evaporation mode, then the micro light emitting diode is prepared in a transfer printing mode, the micro light emitting diode can be equivalent to a point light source, the light intensity of the micro light emitting diode is slowly attenuated along with the angle, the organic light emitting diode can be equivalent to a surface light source, the light intensity of the organic light emitting diode is more gradually attenuated along with the angle, in the case of the greenish color of the display panel, the red light is more quickly attenuated compared with the light intensity of green light and blue light, and the red sub-pixel 1021 is set to be the point light source, so that the light intensity attenuation of each sub-pixel tends to be consistent along with the change of the viewing angle, the color cast phenomenon is improved, and the display effect is improved.
Illustratively, with continued reference to FIG. 1, the red subpixel 1021 is a micro-LED and the green subpixel 1022 and the blue subpixel 1023 are both organic LEDs.
Specifically, as the visual angle increases, the light intensity attenuation of red light is faster, the light intensity attenuation of green light and blue light is slower, and the light intensity attenuation trends of the green light and the blue light are closer; therefore, the red sub-pixel 1021 is arranged in the micro light-emitting diode structure, so that the light intensity of the red light emitted by the red sub-pixel 1021 changes slowly along with the visual angle, and the light intensity attenuation of the light emitted by each sub-pixel tends to be consistent along with the change of the visual angle, thereby improving the color cast phenomenon and improving the display effect. Meanwhile, because the brightness attenuation trends of the green light and the blue light are relatively close along with the change of the visual angle, the red sub-pixel 1021 only needs to be set as the micro light-emitting diode, so that the number of the micro light-emitting diodes and the batch transfer frequency of the micro light-emitting diodes are reduced on the basis of improving the color cast, the yield of the display panel is improved, and the cost of the display panel is reduced. Optionally, fig. 4 is a schematic structural diagram of another display panel according to an embodiment of the present invention, and referring to fig. 4, the display panel further includes a pixel defining layer 403 for defining openings of a red sub-pixel 1021, a green sub-pixel 1022, and a blue sub-pixel 1023.
Specifically, a bonding metal located in a red subpixel 1021 region and a second anode located in a green subpixel and a blue subpixel region may be fabricated on the substrate 101, after the pixel defining layer 403 is fabricated on the substrate 101, openings of the red subpixel 1021, the green subpixel 1022 and the blue subpixel 1023 are defined, the bonding metal and the second anode are exposed, fabrication of the organic light emitting diode is completed on the second anode in the green subpixel and blue subpixel regions, and then the fabricated micro light emitting diode is bonded to the bonding metal in the red subpixel region; alternatively, the micro light emitting diode may be bonded to the red sub-pixel defined by the pixel defining layer 403, and then the organic light emitting diodes may be formed in the green sub-pixel and the blue sub-pixel. In this embodiment, the gap between the micro light emitting diode and the pixel defining layer 403 may be filled with an insulating layer 405 to fix the micro light emitting diode. Through the technical scheme, the micro light-emitting diode and the organic light-emitting diode are manufactured on the same substrate 101, namely the point light source and the surface light source are arranged on the same substrate 101, so that the light intensity attenuation of each sub-pixel tends to be consistent along with the change of a visual angle, the color cast phenomenon is improved, and the display effect is improved. Optionally, fig. 5 is a schematic structural diagram of a micro light emitting diode according to an embodiment of the present invention, and referring to fig. 4 and fig. 5, a micro light emitting diode 406 includes a first anode 302, an epitaxial layer structure 303, and a first cathode 502, which are stacked in sequence, where the first anode 302 is bonded on the substrate 101 through a first bonding metal layer 404; the organic light emitting diode includes a second anode 401, a light emitting functional layer 402, and a second cathode which are sequentially stacked; the second cathode is in the same layer as the first cathode and interconnected to form a cathode layer 501. In this embodiment, the first cathode and the second cathode are the entire cathode layer 501, which can reduce the process flow and save the cost.
Illustratively, the first anode 302 may be a metal, the epitaxial layer structure 303 includes a p-type GaN layer 3033, an outer multi-quantum well layer or single quantum well layer 3032 and an n-type GaN layer 3031, and the first bonding metal layer 301 may be aluminum or titanium, etc., the micro light emitting diode 406 may be formed by sequentially depositing the n-type GaN layer 3031, the multi-quantum well layer or single quantum well layer 3032, the p-type GaN layer 3033 and the first anode 302 on a substrate, then peeling off the substrate, and then transferring the fabricated structure onto the substrate 101 by a transfer technique, and a metal structure, i.e., the first bonding metal layer 404, may be previously deposited on a region of the substrate 101 corresponding to the micro light emitting diode, so that the micro light emitting diode is bonded to the substrate 101; furthermore, the micro light-emitting diode and the organic light-emitting diode are manufactured on the same substrate 101, that is, the point light source and the surface light source are arranged on the same substrate 101, so that the light intensity attenuation of the light emitted by each sub-pixel tends to be consistent along with the change of the visual angle, thereby improving the color cast phenomenon and improving the display effect.
Optionally, fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention, and fig. 7 is a schematic structural diagram of another micro light emitting diode according to an embodiment of the present invention, and referring to fig. 6 and fig. 7, the micro light emitting diode includes an epitaxial layer structure 303, and a first anode 302 and a first cathode 305 that are located on the same side of the epitaxial layer structure 303, the first anode 302 is bonded on the substrate 101 through a first bonding metal layer 404, and the first cathode 305 is bonded on the substrate 101 through a second bonding metal layer 4041.
Specifically, the first anode 302 and the first cathode 305 of the micro light emitting diode are disposed on the same side of the epitaxial layer structure 303, the first cathode 305 is connected to the n-type GaN layer 3031 through the via hole, after the micro light emitting diode is manufactured, the first anode 302 and the first cathode 305 can be directly electrically connected to the corresponding first bonding metal layer 401 and the second bonding metal layer 4041 on the substrate 101 during transfer printing, and the first cathode 305 of the micro light emitting diode is not required to be electrically connected to the substrate 101 through an additional process.
Optionally, a quantum dot layer is formed on a side of the micro light emitting diode away from the substrate.
Specifically, a quantum dot layer is manufactured at a position of the cathode layer 501 corresponding to the micro light emitting diode, so that light emitted by the micro light emitting diode is changed into red light through the quantum dot layer, and thus, the micro light emitting diode and the organic light emitting diode are manufactured on the same substrate 101, that is, the point light source and the surface light source are arranged on the same substrate 101, and light intensity attenuation of light emitted by each sub-pixel tends to be consistent along with the change of a visual angle, so that the color cast phenomenon is improved, and the display effect is improved. It is understood that when the epitaxial layer structure in the micro light emitting diode uses the red light emitting material, it is not necessary to fabricate the quantum dot material at the position of the cathode layer corresponding to the micro light emitting diode, thereby reducing the thickness of the display panel.
Optionally, fig. 8 is a schematic circuit structure diagram of a pixel driving circuit according to an embodiment of the present invention, and fig. 9 is a schematic structure diagram of another display panel according to an embodiment of the present invention, and referring to fig. 8 and fig. 9, a pixel driving circuit is disposed on a substrate 101, and the pixel driving circuit includes a first pixel driving circuit and a second pixel driving circuit, the first pixel driving circuit is electrically connected to a micro light emitting diode, and the second pixel driving circuit is electrically connected to an organic light emitting diode; the corresponding film layers of the first pixel driving circuit and the second pixel driving circuit are positioned on the same layer. For example, the first pixel driving circuit and the second pixel driving circuit may each include transistors, in which gates are located at the same layer, active layers are located at the same layer, and source and drain electrodes are located at the same layer.
Specifically, the first pixel driving circuit and the second pixel driving circuit may have the structure shown in fig. 8, and the specific operating principle of the circuit is well known to those skilled in the art, it should be noted that fig. 9 only shows one transistor 408 structure of the pixel driving circuit, and the first pixel driving circuit and the second pixel driving circuit may be simultaneously manufactured in the same substrate by using the same process, thereby being beneficial to reducing the overall thickness and the process difficulty of the display panel and improving the use effect.
Optionally, the first pixel driving circuit is a digital driving circuit or an analog driving circuit.
Specifically, the first pixel driving circuit simulates a driving circuit to provide a more gradually changing driving current for the micro light emitting diode; the first driving circuit can also be a digital driving circuit, so that the problem that the display effect is poor due to current change caused by transistor threshold drift in the analog driving circuit is avoided.
Fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present invention, and referring to fig. 10, a display device 20 includes a display panel 19 according to any embodiment of the present invention, and the display device according to any embodiment of the present invention may be a display device with a display function, such as a mobile phone, a computer, and an intelligent wearable device, which is not limited in the embodiments of the present invention.
The display device provided by the embodiment of the invention comprises the display panel provided by the embodiment of the invention, has the same functions and effects, and is not described again here.
Fig. 11 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention, and referring to fig. 11, the method for manufacturing a display panel includes:
step S801, providing a substrate;
for example, referring to fig. 12, a substrate 101 is provided first, and a material of the substrate 101 may be a silicon material.
In step S802, a plurality of pixels are formed on a substrate, wherein each pixel includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel is a point light source and at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel is a surface light source.
For example, a point light source may be formed in a region of the substrate located in the red sub-pixel, and a surface light source may be formed in a region of the substrate located in the green sub-pixel and a region of the substrate located in the blue sub-pixel.
Specifically, the point light source is a micro light emitting diode, the surface light source is an organic light emitting diode, and forming a plurality of pixels on the substrate includes:
forming a laminated structure of a plurality of micro light emitting diodes on a substrate, wherein the laminated structure comprises an epitaxial layer structure and a first anode which are laminated;
referring to fig. 13, a stacked structure is formed by sequentially depositing an n-type GaN layer 3031, a multi-quantum well layer or single quantum well layer 3032, and a p-type GaN layer 3033 on a substrate 601, the n-type GaN layer 3031, the multi-quantum well layer or single quantum well layer 3032, and the p-type GaN layer 3033 constituting an epitaxial layer structure 303. It should be noted that the stacked structure may be formed before being transferred onto the substrate, and the order of the stacked structure and other manufacturing steps of the display panel is not particularly limited in the embodiments of the present invention.
Forming a second anode layer on the substrate and patterning to form a second anode in the region of the green sub-pixel and the region of the blue sub-pixel;
for example, referring to fig. 14 and 15, a first anode layer 41 is formed on a substrate, and then a second anode 401 located in a region of a green sub-pixel and a region of a blue sub-pixel is formed by etching or the like; meanwhile, in order to facilitate the subsequent bonding of the micro led and the substrate 101, a first bonding metal layer 404 may be formed on the substrate 101.
Forming a pixel defining layer on the substrate to define openings of the red, green and blue sub-pixels;
illustratively, referring to fig. 16 and 17, a pixel defining structure 43 is formed on the substrate 101, and then a pixel defining layer 403 is formed by etching or the like, so as to define the regions of the red sub-pixel, the green sub-pixel and the blue sub-pixel, which facilitates the subsequent fabrication of the organic light emitting diode and the micro light emitting diode.
Forming a light emitting functional layer on the second anode; and transferring the laminated structure and bonding the laminated structure on the substrate through the opening of the red sub-pixel by the bonding metal.
For example, referring to fig. 18 to 20, firstly, the light emitting function layer is evaporated on the second anode 401, the light emitting function layer 402 corresponding to the green sub-pixel 1022 may be evaporated in the region of the green sub-pixel 1022, and then the light emitting function layer 402 corresponding to the blue sub-pixel 1023 may be evaporated in the region of the blue sub-pixel 1023; the stacked structure, i.e., epitaxial layer structure 303 and first anode 302 shown in fig. 13, is then transferred onto substrate 101, and bonded to substrate 101 by first bonding metal layer 404; note that, the stacked structure may be transferred onto the substrate 101, and then the light-emitting function layer 402 may be deposited in the regions corresponding to the green sub-pixel 1022 and the blue sub-pixel 1023. Finally, a passivation layer 405 is formed in the gap between the stacked structure and the pixel defining layer 403, so as to prevent the gap from occurring inside the display panel, and further, the display effect is not affected.
Forming a cathode layer on the whole surface.
For example, as shown in fig. 4, the manufactured display panel has a cathode layer 501 including a first cathode and a second cathode, and the micro light emitting diode and the organic light emitting diode are manufactured on the same substrate while reducing the process flow and saving the cost, so that the color shift phenomenon is improved, and the display effect is improved.
According to the technical scheme of the embodiment, a preparation method of the display panel is provided; in the prepared display panel, at least one of the red sub-pixel, the blue sub-pixel and the green sub-pixel is a point light source, and at least one is a surface light source. Because the light field distribution of the point light source is different from that of the surface light source, the sub-pixels with fast light intensity attenuation along with the change of the visual angle are set as the point light source, and the sub-pixels with slow light intensity attenuation along with the change of the visual angle are set as the surface light source, so that the light intensity attenuation of each sub-pixel along with the change of the visual angle tends to be consistent, the color cast phenomenon is improved, and the display effect is improved.
It should be noted that the present embodiment is described by taking a micro light emitting diode with a vertical structure as an example, and the micro light emitting diode of the present embodiment may also include other structures, such as a micro light emitting diode with a flip-chip structure or a front-mounted structure.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (6)

1. A display panel, comprising a substrate and a plurality of pixels located at one side of the substrate, each of the pixels comprising a red sub-pixel, a green sub-pixel and a blue sub-pixel; at least one of the red sub-pixel, the green sub-pixel and the blue sub-pixel is a point light source and at least one is a surface light source; the sub-pixels with the fast light intensity attenuation along with the change of the visual angle are set as point light sources, and the sub-pixels with the slow light intensity attenuation along with the change of the visual angle are set as surface light sources;
the red sub-pixel is a micro light-emitting diode, and the green sub-pixel and the blue sub-pixel are both organic light-emitting diodes; the display panel further includes a pixel defining layer for defining openings of the red, green, and blue sub-pixels; a gap filling insulating layer between the micro light emitting diode and the pixel defining layer;
the micro light-emitting diode comprises an epitaxial layer structure, a first anode and a first cathode, wherein the first anode and the first cathode are located on the same side of the epitaxial layer structure, the first anode is bound on the substrate through a first binding metal layer, and the first cathode is bound on the substrate through a second binding metal layer.
2. The display panel according to claim 1, wherein the point light source is a micro light emitting diode and the surface light source is an organic light emitting diode.
3. The display panel according to claim 2, wherein a pixel driving circuit is disposed on the substrate, the pixel driving circuit includes a first pixel driving circuit and a second pixel driving circuit, the first pixel driving circuit is electrically connected to the micro light emitting diode, and the second pixel driving circuit is electrically connected to the organic light emitting diode; and the corresponding film layers of the first pixel driving circuit and the second pixel driving circuit are positioned on the same layer.
4. A display device characterized by comprising the display panel according to any one of claims 1 to 3.
5. A method for manufacturing a display panel, comprising:
providing a substrate;
forming a plurality of pixels on the substrate, wherein each of the pixels includes a red sub-pixel, a green sub-pixel, and a blue sub-pixel, at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel is a point light source and at least one is a surface light source; the sub-pixels with the fast light intensity attenuation along with the change of the visual angle are set as point light sources, and the sub-pixels with the slow light intensity attenuation along with the change of the visual angle are set as surface light sources;
the red sub-pixel is a micro light-emitting diode, and the green sub-pixel and the blue sub-pixel are both organic light-emitting diodes; the display panel further includes a pixel defining layer for defining openings of the red, green, and blue sub-pixels; a gap filling insulating layer between the micro light emitting diode and the pixel defining layer;
the micro light-emitting diode comprises an epitaxial layer structure, a first anode and a first cathode, wherein the first anode and the first cathode are located on the same side of the epitaxial layer structure, the first anode is bound on the substrate through a first binding metal layer, and the first cathode is bound on the substrate through a second binding metal layer.
6. The method according to claim 5, wherein forming a plurality of pixels on the substrate comprises:
and a point light source is formed in the area of the red sub-pixel on the substrate, and a surface light source is formed in the area of the green sub-pixel and the area of the blue sub-pixel.
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CN111524912B (en) * 2020-04-30 2022-07-22 京东方科技集团股份有限公司 Array substrate, manufacturing method of array substrate and display device
CN115867090A (en) * 2023-03-02 2023-03-28 季华实验室 Display panel and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241553A (en) * 2014-10-13 2014-12-24 深圳市华星光电技术有限公司 OLED (organic light emitting diode) production method and OLED produced by same
CN106960913A (en) * 2017-03-31 2017-07-18 武汉华星光电技术有限公司 Light emitting diode with quantum dots display panel and preparation method thereof
CN109085717A (en) * 2018-09-25 2018-12-25 上海中航光电子有限公司 Display panel and display device
CN109473560A (en) * 2018-11-19 2019-03-15 京东方科技集团股份有限公司 Display panel and its manufacturing method, display device for mounting on vehicle
CN109545094A (en) * 2018-09-27 2019-03-29 友达光电股份有限公司 Display device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI320125B (en) * 2006-08-03 2010-02-01 Side type backlight module
CN104048222B (en) * 2014-07-05 2017-01-11 福州大学 Area light source packaging LED and 3D-LED display system with same
US20160163940A1 (en) * 2014-12-05 2016-06-09 Industrial Technology Research Institute Package structure for light emitting device
CN104779333B (en) * 2015-04-15 2018-04-27 上海大学 Large area quantum dot light emitting device
KR102422386B1 (en) * 2017-04-21 2022-07-20 주식회사 루멘스 Micro led display apparatus and method for fabricating the same
CN107919414A (en) * 2017-12-04 2018-04-17 歌尔股份有限公司 Method, manufacture method, device and the electronic equipment of micro- light emitting diode transfer
CN109950271B (en) * 2017-12-20 2022-03-25 上海和辉光电股份有限公司 Display device
CN109256455B (en) * 2018-09-19 2020-06-12 福州大学 Full-color Micro-LED display structure with light effect extraction and no pixel interference and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241553A (en) * 2014-10-13 2014-12-24 深圳市华星光电技术有限公司 OLED (organic light emitting diode) production method and OLED produced by same
CN106960913A (en) * 2017-03-31 2017-07-18 武汉华星光电技术有限公司 Light emitting diode with quantum dots display panel and preparation method thereof
CN109085717A (en) * 2018-09-25 2018-12-25 上海中航光电子有限公司 Display panel and display device
CN109545094A (en) * 2018-09-27 2019-03-29 友达光电股份有限公司 Display device
CN109473560A (en) * 2018-11-19 2019-03-15 京东方科技集团股份有限公司 Display panel and its manufacturing method, display device for mounting on vehicle

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