CN217946879U

CN217946879U - Wafer separating mechanism

Info

Publication number: CN217946879U
Application number: CN202220235512.6U
Authority: CN
Inventors: 李迁; 童灿钊; 赵冬冬; 刘航; 刘佳鑫; 刘盛; 巫礼杰; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd
Current assignee: Han s Laser Technology Industry Group Co Ltd
Priority date: 2022-01-27
Filing date: 2022-01-27
Publication date: 2022-12-02
Anticipated expiration: 2032-01-27

Abstract

The utility model relates to a wafer separating mechanism, which comprises a driving device, a connecting frame, a suction assembly and a control device; the suction assembly comprises a suction device and a sensing device, one end of the sensing device is connected with the connecting frame, and the other end of the sensing device is connected with the suction device; the driving device is used for driving the connecting frame to move up and down so as to enable the suction device to suck the bearing wafer and separate the bearing wafer from the device wafer fixed on the bearing platform; the driving device, the sensing device and the control device are electrically connected; the sensing device is used for detecting the tension in the separation process of the bearing wafer and the device wafer and feeding the tension back to the control device; the control device is used for controlling the driving device to stop working when the pulling force fed back by the sensing device exceeds a pulling force preset value. Compared with the prior art, the automatic separation of the bearing wafer and the device wafer is realized, the sensing device can detect the tension in the separation process of the bearing wafer and the device wafer, the damage caused by forced separation is avoided, and the protection of the bearing wafer and the device wafer is facilitated.

Description

Wafer separating mechanism

Technical Field

The utility model belongs to the technical field of wafer processing, especially, relate to a wafer separating mechanism.

Background

In the semiconductor industry, existing device wafers are being developed towards thinner and thinner wafers. However, the thinned device wafer itself becomes softer and more brittle, so that in some processing procedures, a layer of carrier wafer is temporarily bonded on the device wafer to provide sufficient mechanical supporting force, thereby avoiding the device wafer being damaged in the processing procedure; and after the processing is finished, separating the device wafer from the bearing wafer.

At present, when separating a device wafer from a carrier wafer, generally, a bonding glue between the device wafer and the carrier wafer is debonded by laser, and then the device wafer is separated from the carrier wafer manually. However, after some device wafers and the carrier wafer are debonded, adhesive force still remains between the device wafers and the carrier wafer, or the debonding effect is poor due to the bonding glue denaturation before the debonding process, so that the device wafers and the carrier wafer cannot be separated at all; the device wafer and the carrier wafer with the process abnormality cannot be distinguished manually, the device wafer and the carrier wafer are torn or damaged due to forced separation, the yield of products is low, and the production cost is increased.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the wafer separating mechanism is provided for solving the problem that the conventional manual separation device wafer and the bearing wafer are easy to damage.

In order to solve the above technical problem, an embodiment of the present invention provides a wafer separating mechanism, which includes a driving device, a connecting frame, a suction assembly and a control device;

the suction assembly comprises a suction device and a sensing device, one end of the sensing device is connected with the connecting frame, and the other end of the sensing device is connected with the suction device;

the driving device is used for driving the connecting frame to move downwards so that the suction device moves downwards to suck the bearing wafer, and is used for driving the connecting frame to move upwards so that the suction device sucks the bearing wafer to move upwards together to separate the bearing wafer from the device wafer fixed on the bearing platform;

the driving device, the sensing device and the control device are electrically connected; the sensing device is used for detecting the tensile force in the separation process of the bearing wafer and the device wafer and feeding the tensile force back to the control device; and the control device is used for controlling the driving device to stop working according to the condition that the pulling force fed back by the sensing device exceeds a pulling force preset value.

Optionally, the sensing device is further configured to detect a pressure between the suction device and the carrier wafer during the downward movement of the suction device and feed the pressure back to the control device; and the control device is used for controlling the driving device to stop driving the connecting frame to move downwards when the pressure fed back by the sensing device exceeds a preset pressure value.

Optionally, the suction means includes a rotation-preventing buffer chuck, a chuck fixing member and a vacuum pumping device, one end of the chuck fixing member is connected to the sensing device, the other end of the chuck fixing member is connected to the rotation-preventing buffer chuck, and the vacuum pumping device is connected to the rotation-preventing buffer chuck.

Optionally, the sucking component is provided with a plurality of sucking components which are uniformly distributed on the connecting frame along the circumferential direction.

Optionally, the connecting frame comprises an adapter and a circular fixing plate fixed on the adapter; the driving device is used for driving the adaptor to move up and down; the plurality of suction assemblies are positioned on the circular fixing plate, and the induction device is connected with the circular fixing plate.

Optionally, be provided with a plurality of bar holes on the circular fixed plate, the bar hole is followed the diameter direction of circular fixed plate extends, the bar hole with absorb the subassembly one-to-one setting, induction system passes through the fastener and fixes in the bar hole.

Optionally, the adaptor includes a first adaptor plate and a second adaptor plate, the first adaptor plate is vertically fixed to one end of the top surface of the second adaptor plate, a side surface of the first adaptor plate, which is away from the second adaptor plate, is connected to the driving device, and the bottom surface of the second adaptor plate is connected to the circular fixing plate.

Optionally, the wafer separating mechanism further comprises a mounting member; the driving device comprises a driving motor and a ball screw mechanism which are arranged on the mounting piece; a nut of the ball screw mechanism is connected with the connecting frame, and a screw of the ball screw mechanism is connected with the output end of the driving motor; the driving motor is used for driving the screw rod to rotate so as to enable the nut to move up and down along the screw rod.

Optionally, the wafer separating mechanism further comprises a guiding device, the guiding device is arranged on the mounting member, and the guiding device is used for guiding the movement of the connecting frame.

Optionally, the guiding device includes a guide rail and a slider, the guide rail is fixed on the mounting member, and the slider connects the connecting frame and the nut of the ball screw mechanism.

Compared with the prior art, the wafer separating mechanism provided by the embodiment of the utility model is provided with the driving mechanism to drive the connecting frame to move up and down so as to drive the suction device to suck the bearing wafer and separate the bearing wafer and the device wafer, thereby realizing the automatic separation of the bearing wafer and the device wafer and improving the automation degree and the processing efficiency of the device wafer production; the induction device is arranged to detect and feed back the tension acted on the bearing wafer by the suction device in the separation process of the bearing wafer and the device wafer, one end of the induction device is connected with the connecting frame, the other end of the induction device is connected with the suction device, and the assembly structure of the connecting frame, the induction device and the suction device is reasonably planned, so that the induction device can stably detect tension information, the induction device can accurately detect the tension information, and the accuracy of collecting and feeding back the tension information by the induction device is improved; meanwhile, the control device can control the driving device to stop working when the pulling force fed back by the sensing device is larger than a pulling force preset value, so that the bearing wafer and the device wafer which cannot be separated due to abnormal process can be picked out, the bearing wafer and the device wafer are prevented from being separated and damaged by force, the bearing wafer and the device wafer which are normal in process can be completely separated, the bearing wafer and the device wafer which are abnormal in process can be recycled, the bearing wafer and the device wafer are protected, the yield of products is improved, and the loss rate of the products is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a wafer separating mechanism according to an embodiment of the present invention;

FIG. 2 is a first view of the wafer separating mechanism of FIG. 1;

FIG. 3 is a reference diagram illustrating a second usage state of the wafer separating mechanism in FIG. 1;

fig. 4 is a schematic structural view of the suction assembly of fig. 1.

The reference numerals in the specification are as follows:

1. a mounting member; 2. a drive device; 3. a connecting frame; 31. an adapter; 311. a first transfer plate; 312. A second adapter plate; 313. a reinforcing plate; 32. a circular fixing plate; 321. a strip-shaped hole; 322. an arc-shaped hole; 4. a suction assembly; 41. a suction device; 411. the anti-rotation buffer sucker; 412. a suction cup fixing member; 42. An induction device; 421. a pull pressure detection sensor; 422. a sensor mount; 5. a guide device; 51. A guide rail; 52. a slider;

6. carrying a wafer; 7. a device wafer; 8. and (7) carrying a platform.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects of the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be constructed in operation, and are not to be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1 to fig. 3, a wafer separating mechanism according to an embodiment of the present invention includes a driving device 2, a connecting frame 3, a suction assembly 4, and a control device (not shown in the drawings);

the suction assembly 4 comprises a suction device 41 and a sensing device 42, one end of the sensing device 42 is connected with the connecting frame 3, and the other end of the sensing device 42 is connected with the suction device 41;

the driving device 2 is used for driving the connecting frame 3 to move downwards so that the suction device 41 moves downwards to suck the carrier wafer 6, and is used for driving the connecting frame 3 to move upwards so that the suction device 41 sucks the carrier wafer 6 to move upwards together to separate the carrier wafer from the device wafer 7 fixed on the carrier 8;

the driving device 2, the sensing device 42 and the control device are electrically connected; the sensing device 42 is used for detecting the tension force in the process of separating the carrier wafer 6 and the device wafer 7 and feeding the tension force back to the control device; the control device is used for controlling the driving device 2 to stop working when the pulling force fed back by the sensing device 42 exceeds a pulling force preset value.

When the bonded device wafer 7 and the carrier wafer 6 are separated, the device wafer 7 is fixed on the carrier 8, the driving device 2 drives the connecting frame 3 to move downwards, the suction device 41 moves downwards along with the connecting frame 3 until the suction device 41 is abutted against the carrier wafer 6, and at the moment, the suction device 41 sucks the carrier wafer 6; then the driving device 2 drives the connecting frame 3 to move upwards, the connecting frame 3 drives the suction device 41 and the carrier wafer 6 to move upwards together, at the moment, the sensing device 42 detects the tension of the suction device 41 acting on the carrier wafer 6 in the process of separating the carrier wafer 6 and the device wafer 7 and feeds back the tension information to the control device, and when the tension detected by the sensing device 42 is not more than the preset tension value and is more than the bonding force between the carrier wafer 6 and the device wafer 7, the carrier wafer 6 moves upwards to be separated from the device wafer 7 under the driving of the suction device 41; when the pulling force detected by the sensing device 42 is greater than the preset pulling force value, the control device controls the driving device 2 to stop driving the link frame 3 to move upward, so as to recycle the carrier wafer 6 and the device wafer 7 which are not separated.

Compared with the prior art, the wafer separating mechanism provided by the embodiment of the utility model is provided with the driving mechanism to drive the connecting frame 3 to move up and down so as to drive the suction device 41 to suck the bearing wafer 6 and separate the bearing wafer 6 and the device wafer 7, thereby realizing the automatic separation of the bearing wafer 6 and the device wafer 7, and improving the automation degree and the processing efficiency of the device wafer 7 production; the induction device 42 is arranged to detect and feed back the tension acted on the bearing wafer 6 by the suction device 41 in the separation process of the bearing wafer 6 and the device wafer 7, one end of the induction device 42 is connected with the connecting frame 3, the other end of the induction device 42 is connected with the suction device 41, and the assembly structure of the connecting frame 3, the induction device 42 and the suction device 41 is reasonably planned, so that the induction device 42 can stably detect tension information, the induction device 42 can accurately detect the tension information, and the accuracy of collecting and feeding back the tension information by the induction device 42 is improved; meanwhile, the control device can control the driving device 2 to stop working when the pulling force fed back by the sensing device 42 is larger than a preset pulling force value, so that the bearing wafer 6 and the device wafer 7 which cannot be separated due to abnormal process can be picked out, the bearing wafer 6 and the device wafer 7 are prevented from being damaged by forced separation, the bearing wafer 6 and the device wafer 7 which are normal in process are completely separated, the bearing wafer 6 and the device wafer 7 which are abnormal in process can be recycled, the bearing wafer 6 and the device wafer 7 are protected, the yield of products is improved, and the loss rate of the products is reduced.

In one embodiment, as shown in fig. 2, the sensing device 42 is further configured to detect a pressure between the carrier wafer 6 and the suction device 41 during the downward movement and feed the pressure back to the control device; the control device is used for controlling the driving device 2 to stop driving the connecting frame 3 to move downwards when the pressure fed back by the sensing device 42 exceeds a preset pressure value. The pressure acting on the carrier wafer 6 when the suction device 41 is pressed down is detected by the sensing device 42, and when the sensing device 42 detects that the pressure exerted on the carrier wafer 6 by the suction device 41 exceeds a preset pressure value, the control device controls the driving device 2 to stop driving the connecting frame 3 to move downwards, so that the suction device 41 stops moving downwards; not only can the contact area between the suction device 41 and the bearing wafer 6 be increased as much as possible after the suction device 41 is pressed down to a proper position, so that the stability of the bearing wafer 6 sucked by the suction device 41 is ensured, but also the bearing wafer 6 and the device wafer 7 are prevented from being fractured due to the fact that the suction device 41 is pressed down excessively, the bearing wafer 6 and the device wafer 7 are protected, and the yield of products is improved.

In one embodiment, as shown in fig. 1 and 4, the suction device 41 includes a rotation prevention buffer suction cup 411, a suction cup fixing member 412, and a vacuum pumping device (not shown in the drawings), one end of the suction cup fixing member 412 is connected to the sensing device 42, the other end of the suction cup fixing member 412 is connected to the rotation prevention buffer suction cup 411, and the vacuum pumping device is connected to the rotation prevention buffer suction cup 411. Prevent gyration buffering sucking disc 411 and have and prevent gyration effect and cushioning effect, can prevent to prevent that gyration buffering sucking disc 411 from rotating to influence adsorption efficiency and disengaging process, also can play the cushioning effect when preventing gyration buffering sucking disc 411 from pushing down, avoid preventing gyration buffering sucking disc 411 from pushing down excessive fracturing and bear wafer 6 and device wafer 7, be favorable to protecting and bear wafer 6 and device wafer 7.

Preferably, the anti-rotation buffer suction cup 411 is a suction cup with folds, and the anti-rotation function and the buffer function are realized through the folds.

In one embodiment, as shown in fig. 1, the suction assembly 4 is provided in plurality, and the plurality of suction assemblies 4 are uniformly distributed on the connecting frame 3 along the circumferential direction. The quantity of subassembly 4 is absorb in the increase, and the reinforcing is absorb subassembly 4 and to bearing the weight of the adsorption effect of wafer 6, has improved and has absorbed subassembly 4 to bearing the weight of the adsorbed steadiness of wafer 6. Preferably, the extraction assembly 4 is provided with four.

In one embodiment, as shown in fig. 1, the connecting frame 3 includes an adaptor 31 and a circular fixing plate 32 fixed on the adaptor 31; the driving device 2 is used for driving the adaptor 31 to move up and down; a plurality of suction assemblies 4 are positioned on the circular fixing plate 32, and a sensing device 42 is connected with the circular fixing plate 32. The circular fixing plate 32 is more suitable for the plurality of sucking components 4 to be distributed and installed along the circumference, so that the circular fixing plate 32 is fully utilized; the connection of the drive device 2 to the circular fixing plate 32 is facilitated by means of an adapter piece 31.

In one embodiment, as shown in fig. 1, the adapter 31 includes a first adapter plate 311 and a second adapter plate 312, the first adapter plate 311 is perpendicularly fixed at one end of the top surface of the second adapter plate 312, a side surface of the first adapter plate 311 facing away from the second adapter plate 312 is connected to the driving device 2, and a bottom surface of the second adapter plate 312 is connected to the circular fixing plate 32. The adapter 31 is the setting of L type, has increased the area of being connected of adapter 31 and drive arrangement 2 and the area of being connected of adapter 31 and circular fixed plate 32, improves the steadiness that drive arrangement 2, circular fixed plate 32 and adapter 31 are connected, has improved the stationarity that the adapter 31 removed.

In one embodiment, as shown in fig. 1, the adaptor 31 further includes a reinforcing plate 313, and the reinforcing plate 313 is connected to the first adaptor plate 311 and the second adaptor plate 312 respectively. The reinforcing plate 313 reinforces the connection between the first interposer 311 and the second interposer 312, and prevents the connection between the first interposer 311 and the second interposer 312 from being broken.

In an embodiment, as shown in fig. 1, a plurality of strip holes 321 are formed in the circular fixing plate 32, the strip holes 321 extend along a diameter direction of the circular fixing plate 32, the strip holes 321 are disposed in one-to-one correspondence with the suction assemblies 4, and the sensing device 42 is fixed in the strip holes 321 by a fastening member. Loosening the fastener, enabling the sensing device 42 to move along the strip-shaped hole 321, and tightening the fastener to fix the sensing device 42 on the circular fixing plate 32 after the sensing device 42 is adjusted to a required position; thereby being suitable for absorbing the bearing wafers 6 with different specifications.

Preferably, as shown in fig. 1, the circular fixing plate 32 is provided with a plurality of arc-shaped holes 322; the weight of the circular fixing plate 32 is reduced, so that the driving device 2 can drive the connecting frame 3 to move conveniently.

In an embodiment, as shown in fig. 1 and 4, the sensing device 42 includes a pulling/pressing force detecting sensor 421 and a sensor fixing member 422, one end of the sensor fixing member 422 is fixed in the strip-shaped hole 321 by a fastener, the other end of the sensor fixing member 422 is connected to the pulling/pressing force detecting sensor 421, and one end of the pulling/pressing force detecting sensor 421, which is away from the sensor fixing member 422, is connected to the suction cup fixing member 412.

In one embodiment, as shown in fig. 1, the wafer separating mechanism further includes a mounting member 1; the driving device 2 includes a driving motor (not shown in the drawings) and a ball screw mechanism (not shown in the drawings) provided on the mount 1; a nut of the ball screw mechanism is connected with the connecting frame 3, and a screw of the ball screw mechanism is connected with the output end of the driving motor; the driving motor is used for driving the screw rod to rotate so as to enable the nut to move up and down along the screw rod. The ball screw mechanism is arranged to accurately control the up-and-down movement precision of the suction device 41, so that the bearing wafer 6 and the device wafer 7 can be protected.

In one embodiment, as shown in fig. 1, the wafer separating mechanism further includes a guide device 5, the guide device 5 is disposed on the mounting member 1, and the guide device 5 is used for guiding the movement of the link frame 3. The guiding device 5 plays a guiding role in the up-down movement of the connecting frame 3, the connecting frame 3 is prevented from shaking, the sucking device 41 is favorable for stably separating the bearing wafer 6 and the device wafer 7, and the sensing device 42 collects and feeds back information more accurately and stably.

In one embodiment, as shown in fig. 1, the guide device 5 includes a guide rail 51 and a slider 52, the guide rail 51 is fixed to the mounting member 1, and the slider 52 connects the link frame 3 and the nut of the ball screw mechanism. The guide rail 51 and the slide block 52 are matched to realize the guide function, so that the movement is stable and reliable, the structure is simple, and the operation is convenient.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.

Claims

1. A wafer separating mechanism is characterized by comprising a driving device, a connecting frame, a suction assembly and a control device;

the driving device, the sensing device and the control device are electrically connected; the sensing device is used for detecting the tension in the process of separating the bearing wafer and the device wafer and feeding the tension back to the control device; and the control device is used for controlling the driving device to stop working according to the condition that the pulling force fed back by the sensing device exceeds a pulling force preset value.

2. The wafer separating mechanism as claimed in claim 1, wherein the sensing device is further configured to detect a pressure between the carrier wafer and the suction device during the downward movement of the suction device and feed the pressure back to the control device; and the control device is used for controlling the driving device to stop driving the connecting frame to move downwards when the pressure fed back by the sensing device exceeds a preset pressure value.

3. The wafer separating mechanism as claimed in claim 2, wherein the suction device comprises a rotation-preventing buffer chuck, a chuck fixing member and a vacuum device, one end of the chuck fixing member is connected to the sensing device, the other end of the chuck fixing member is connected to the rotation-preventing buffer chuck, and the vacuum device is connected to the rotation-preventing buffer chuck.

4. The wafer separating mechanism according to claim 3, wherein the plurality of sucking assemblies are arranged, and the plurality of sucking assemblies are uniformly distributed on the connecting frame along the circumferential direction.

5. The wafer separating mechanism according to claim 4, wherein the connecting frame comprises an adapter and a circular fixing plate fixed on the adapter; the driving device is used for driving the adaptor to move up and down; the plurality of suction assemblies are positioned on the circular fixing plate, and the induction device is connected with the circular fixing plate.

6. The wafer separating mechanism as claimed in claim 5, wherein the circular fixing plate is provided with a plurality of strip-shaped holes, the strip-shaped holes extend along a diameter direction of the circular fixing plate, the strip-shaped holes and the suction assemblies are arranged in a one-to-one correspondence manner, and the sensing device is fixed in the strip-shaped holes through fasteners.

7. The wafer separating mechanism as claimed in claim 5, wherein the adaptor includes a first adaptor plate and a second adaptor plate, the first adaptor plate is vertically fixed at one end of the top surface of the second adaptor plate, one side surface of the first adaptor plate facing away from the second adaptor plate is connected to the driving device, and the bottom surface of the second adaptor plate is connected to the circular fixing plate.

8. The wafer separation mechanism of claim 1, further comprising a mount; the driving device comprises a driving motor and a ball screw mechanism which are arranged on the mounting piece; a nut of the ball screw mechanism is connected with the connecting frame, and a screw of the ball screw mechanism is connected with the output end of the driving motor; the driving motor is used for driving the screw rod to rotate so as to enable the nut to move up and down along the screw rod.

9. The wafer separating mechanism according to claim 8, further comprising a guide device disposed on the mounting member, the guide device being configured to guide movement of the connecting frame.

10. The wafer separating mechanism as claimed in claim 9, wherein the guiding device includes a guiding rail and a sliding block, the guiding rail is fixed on the mounting member, and the sliding block connects the connecting frame and the nut of the ball screw mechanism.