CN217936157U

CN217936157U - Heat dissipation shell and heat dissipation system

Info

Publication number: CN217936157U
Application number: CN202121993471.9U
Authority: CN
Inventors: 覃大形
Original assignee: SF Technology Co Ltd
Current assignee: SF Technology Co Ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-11-29
Anticipated expiration: 2031-08-23

Abstract

The application discloses heat dissipation shell and cooling system. The heat dissipation housing includes a carrier plate, a heat dissipation upper housing, and a heat dissipation fan. The heat dissipation epitheca is connected with the loading board, and the chamber that holds that is used for holding the control mainboard is injectd with the loading board to the heat dissipation epitheca, and one side that the chamber was kept away from to the heat dissipation epitheca is equipped with the holding tank, and the bottom surface and the chip butt of holding tank, radiator fan are arranged in the holding tank and are connected with the heat dissipation epitheca. Because the control mainboard is located and holds the chamber, and radiator fan is located and holds the chamber outside, consequently, the dust is difficult to get into and holds the chamber to the bottom surface and the chip butt of holding tank, therefore the heat of chip can transmit for the heat dissipation epitheca, and the heat of heat dissipation epitheca is taken away to rethread radiator fan, with dispel the heat to the heat dissipation epitheca, thereby dispel the heat to the chip, and then can satisfy simultaneously and dispel the heat and dustproof.

Description

Heat dissipation shell and heat dissipation system

Technical Field

The utility model relates to a shell heat dissipation technical field, concretely relates to heat dissipation shell and cooling system.

Background

In electronic product or electrical system, the control mainboard of installing the chip is along with the operational capability and the power of chip constantly promote, and calorific capacity is also bigger and bigger, consequently, the control mainboard can be installed in the heat dissipation shell, dispels the heat to the control mainboard through the heat dissipation shell, however prior art's heat dissipation shell is installed the fan on the control mainboard usually, can't satisfy heat dissipation and dirt-proof demand simultaneously.

SUMMERY OF THE UTILITY MODEL

The application provides a heat dissipation shell and cooling system to solve the problem that the heat dissipation shell of prior art can't satisfy heat dissipation and dirt-proof demand simultaneously.

On the one hand, this application provides a heat dissipation shell for hold the control mainboard, be equipped with the chip on the control mainboard, the heat dissipation shell includes: a bearing plate, a heat dissipation upper shell and a heat dissipation fan;

the heat dissipation upper shell is connected with the bearing plate, and an accommodating cavity for accommodating the control mainboard is defined by the heat dissipation upper shell and the bearing plate;

an accommodating groove is formed in one side, away from the accommodating cavity, of the heat dissipation upper shell, and the bottom surface of the accommodating groove is abutted to the chip;

the heat dissipation fan is located in the accommodating groove and connected with the heat dissipation upper shell.

In some possible implementations, the bottom surface of the accommodating groove is attached to a surface of the chip close to the accommodating groove.

In some possible implementations, a plurality of heat dissipation fins are disposed on the heat dissipation upper shell at intervals.

In some possible implementations, the plurality of heat dissipation fins are integrally formed with the heat dissipation upper case.

In some possible implementations, the receiving groove is located in a plurality of the heat dissipating fins.

In some possible implementations, the heat dissipation housing further includes a dust cover connected to the heat dissipation fan.

In some possible implementations, the dust cover includes a cover body and a shielding portion, the cover body is provided with an opening for exposing the blades of the cooling fan, and the shielding portion is connected to the cover body and used for shielding part of the opening.

In some possible implementation manners, a wire passing hole communicated with the accommodating cavity is formed in the heat dissipation upper shell, and a wire of the heat dissipation fan penetrates through the wire passing hole to be connected with the control main board.

In some possible implementation manners, the bearing plate comprises a bottom plate and at least one side plate, the bottom of the heat dissipation upper shell is connected with the bottom plate, and the side surface of the heat dissipation upper shell is connected with the side plate;

the side plate is provided with a plurality of interface holes, and the interface holes are used for exposing the interfaces on the control main board.

In another aspect, the present application further provides a heat dissipation system, including: the heat dissipation shell and the control mainboard are arranged on the shell;

the control mainboard is located in the heat dissipation shell, the control mainboard is provided with a chip, and the chip is abutted to the heat dissipation upper shell.

The application provides a heat dissipation shell includes loading board, heat dissipation epitheca and radiator fan. The heat dissipation epitheca is connected with the loading board, and the chamber that holds that is used for holding the control mainboard is injectd with the loading board to the heat dissipation epitheca, and one side that the chamber was kept away from to the heat dissipation epitheca is equipped with the holding tank, and the bottom surface and the chip butt of holding tank, radiator fan are arranged in the holding tank and are connected with the heat dissipation epitheca. Because the control mainboard is located and holds the chamber, and radiator fan is located and holds the chamber outside, consequently, the dust is difficult to get into and holds the chamber to the bottom surface and the chip butt of holding tank, therefore the heat of chip can transmit for the heat dissipation epitheca, and the heat of heat dissipation epitheca is taken away to rethread radiator fan, with dispel the heat to the heat dissipation epitheca, thereby dispel the heat to the chip, and then can satisfy simultaneously and dispel the heat and dustproof.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is an exploded view of a heat dissipation housing and a heat dissipation system according to an embodiment of the present application;

fig. 2 is a first perspective view of a heat dissipation housing according to an embodiment of the present application;

fig. 3 is a second perspective view of a heat dissipation housing according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The heat dissipation shell of the application can be used for containing the control mainboard to dissipate heat of a chip of the control mainboard. Because the control mainboard is arranged in holding the chamber, radiator fan is arranged in holding the outside in chamber, consequently, the dust is difficult to get into and holds in the chamber to the bottom surface and the chip butt of holding tank, therefore the heat of chip can transmit for the heat dissipation epitheca, and the heat of heat dissipation epitheca is taken away to rethread radiator fan, with dispel the heat to the heat dissipation epitheca, thereby dispel the heat to the chip, and then can satisfy simultaneously and dispel the heat and dustproof.

Referring to fig. 1 to fig. 3, in an embodiment of the present invention, a heat dissipation housing is provided for accommodating a control motherboard 100, a chip 110 is disposed on the control motherboard 100, and the heat dissipation housing includes: a bearing plate 1, a heat dissipation upper shell 2 and a heat dissipation fan 3;

the radiating upper shell 2 is connected with the bearing plate 1, and the radiating upper shell 2 and the bearing plate 1 define an accommodating cavity 101 for accommodating the control mainboard 100;

an accommodating groove 102 is formed in one side of the heat dissipation upper shell 2, which is far away from the accommodating cavity 101, and the bottom surface of the accommodating groove 102 is abutted to the chip 110;

the heat dissipation fan 3 is located in the receiving groove 102 and connected to the heat dissipation upper case 2.

It should be noted that, the heat dissipation upper case 2 and the bearing plate 1 define the containing cavity 101, the control main board 100 is located in the containing cavity 101, the heat dissipation fan 3 is located outside the containing cavity 101, is located in the containing groove 102 and is connected with the heat dissipation upper case 2, and is not connected with the control main board 100, therefore, the heat dissipation upper case 2 does not need to be provided with an air outlet for air outlet of the heat dissipation fan 3, so that dust is not easy to enter the containing cavity 101, thereby achieving the dustproof effect. And the bottom surface and the chip 110 butt of holding tank 102, heat dissipation epitheca 2 and chip 110 butt promptly, therefore the heat of chip 110 can transmit for heat dissipation epitheca 2, rethread radiator fan 3 bloies towards holding tank 102 outside, takes away the heat of heat dissipation epitheca 2 to dispel the heat to heat dissipation epitheca 2, thereby dispel the heat to chip 110, and then can satisfy simultaneously and dispel the heat and prevent dust.

In some embodiments, the heat dissipating upper case 2 is a metal material, such as copper, aluminum, a copper alloy or an aluminum alloy, to improve the heat conduction effect.

In some embodiments, the control main board 100 may be detachably connected to the bottom board 11, for example, the control main board 100 may be connected to the bottom board 11 by screws, so as to facilitate maintenance and replacement.

In some embodiments, since the chip 110 is close to one side of the receiving groove 102, that is, the top surface of the chip 110 is a generally flat plane, the bottom surface of the receiving groove 102 is attached to one side of the chip 110 close to the receiving groove 102, so as to increase the contact area between the heat dissipation upper shell 2 and the chip 110, which is beneficial for the chip 110 to transfer more heat to the heat dissipation upper shell 2, thereby improving the heat dissipation effect.

In some embodiments, referring to fig. 1 to fig. 3, a plurality of heat dissipation fins 4 are disposed on the heat dissipation upper casing 2 at intervals. The heat of the chip 110 can be transferred to the heat dissipation upper case 2, and the heat is transferred to the plurality of heat dissipation fins 4, the heat dissipation fins 4 are thin sheets with long lengths and thin thicknesses, and the plurality of heat dissipation fins 4 can increase the heat dissipation surface area, thereby further improving the heat dissipation effect.

In this embodiment, a plurality of heat radiating fins 4 are integrally formed with the heat radiating upper case 2. Namely, the upper heat dissipation casing 2 is provided with a plurality of through grooves, and the sheet between two adjacent through grooves is the heat dissipation fins 4, so that a plurality of heat dissipation fins 4 are formed, the heat dissipation surface area can be increased, and the heat dissipation effect is further improved. In addition, the thickness of the heat dissipation fins 4 can be very thin, for example, between 0.5mm and 5mm, so that the number of the heat dissipation fins 4 is larger, and the heat dissipation surface area is further increased.

In other embodiments, the plurality of heat dissipation fins 4 and the heat dissipation upper case 2 may not be integrally formed, but the plurality of heat dissipation fins 4 are directly mounted on the heat dissipation upper case 2.

In this embodiment, referring to fig. 1, the receiving groove 102 is located in the plurality of heat dissipating fins 4, so that the heat dissipating fan 3 is also located in the plurality of heat dissipating fins 4, so that the heat dissipating fan 3 blows away the heat of the plurality of heat dissipating fins 4, and since the heat of the heat dissipating upper housing 2 is concentrated in the plurality of heat dissipating fins 4, the heat of the plurality of heat dissipating fins 4 is taken away by the heat dissipating fan 3, thereby further improving the heat dissipating effect.

In this embodiment, the cross-sectional shape of a part of the plurality of heat dissipating fins 4 may be "U", that is, the part of the heat dissipating fins 4 includes a bottom and two protrusions connected to the bottom, the protrusions extend away from the receiving cavity 101, and the U-shaped part of the heat dissipating fins 4 defines the receiving cavity 102.

In some embodiments, referring to fig. 1 to 3, the heat dissipation housing further includes a dust cover 5 connected to the heat dissipation fan 3. The dust cover 5 can shield part of the blades of the heat radiation fan 3, and is used for shielding dust, reducing the amount of dust directly entering the heat radiation fan 3, and further improving the dust-proof effect of the heat radiation shell.

In this embodiment, the dust cover 5 may be detachably attached to the radiator fan 3, and for example, the dust cover 5 may be attached to the radiator fan 3 by screws for maintenance and replacement.

In this embodiment, referring to fig. 2 and 3, the dust cover 5 includes a cover body 51 and a shielding portion 52, the cover body 51 is provided with an opening for exposing the blades of the heat dissipation fan 3, the shielding portion 52 is connected to the cover body 51 and is used for separating the shielding portion 52 from the opening, so that part of the blades of the heat dissipation fan 3 can be shielded without affecting the air outlet of the heat dissipation fan 3, and the shielding portions 52 can shield dust, thereby reducing the amount of dust directly entering the heat dissipation fan 3 and further improving the dust-proof effect of the heat dissipation housing.

In this embodiment, the shielding portion 52 may include a trunk 521 and a plurality of branches 522, the trunk 521 is located in the opening and connected to the cover 51, and the plurality of branches 522 are connected to the trunk 521. The trunk 521 may have a cross shape, and the branches 522 may have the same shape as the opening, for example, if the opening has a circular shape, the branches 522 may also have a circular shape, and a plurality of circular branches 522 are arranged in order from the center position to the edge position of the opening, and the size of the branches gradually increases.

In some embodiments, referring to fig. 1, a wire passing hole communicated with the accommodating cavity 101 is formed in the heat dissipating upper casing 2, the wire 31 of the heat dissipating fan 3 passes through the wire passing hole to be connected to the control main board 100, the control main board 100 supplies power to the heat dissipating fan 3, and the wire passing hole communicated with the accommodating cavity 101 is formed, so that the wire 31 of the heat dissipating fan 3 is prevented from being exposed outside the accommodating cavity 102, and the dustproof effect of the heat dissipating casing is further improved.

In some embodiments, referring to fig. 1 to 3, the carrier board 1 includes a bottom board 11 and at least one side board 12, the bottom of the heat dissipation upper housing 2 is connected to the bottom board 11, the side surface of the heat dissipation upper housing 2 is connected to the side board 12, the side board 12 is provided with a plurality of interface holes 121, the interface holes 121 are used for exposing the interface on the control motherboard 100, so that the interface of the control motherboard 100 is connected to an external structure, and the interface holes 121 are only arranged on the side board 12 to expose the interface, but not other structures exposing the accommodating cavity 101, so that the dustproof effect of the heat dissipation housing is not affected.

In this embodiment, the heat dissipation upper shell 2 may include a first shell 21 and two second shells 22 respectively connected to two ends of the first shell 21, the second shells 22 extend toward a direction close to the bottom plate 11, that is, the overall shape of the first shell 21 and the two second shells 22 may be similar to a "U" shape, the receiving groove 102 is located in the first shell 21, the bottom of the heat dissipation upper shell 2 refers to one end of the two second shells 22 far away from the first shell 21, and the side of the heat dissipation upper shell 2 refers to the side of the first shell 21 and the two second shells 22. Because first casing 21 and two second casings 22 are "U" font of type, can expose partly and hold chamber 101, consequently can set up two curb plates 12 and connect the both sides of heat dissipation epitheca 2 respectively, shelter from and hold chamber 101 to improve the dustproof effect of heat dissipation shell, and set up interface hole 121 on curb plate 12, under the dustproof effect's of not influencing the heat dissipation shell the condition, so that the interface and the exterior structure of control mainboard 100 are connected.

In this embodiment, the bottom plate 11 and the side plate 12 may be detachably connected to the heat dissipation upper case 2, and for example, the bottom plate 11 and the side plate 12 may be connected to the heat dissipation upper case 2 by screws for maintenance and replacement.

Referring to fig. 1, based on the heat dissipation housing, an embodiment of the present invention further provides a heat dissipation system, including: the heat dissipation housing and the control main board 100;

the control main board 100 is located in the heat dissipation housing, the chip 110 is disposed on the control main board 100, and the chip 110 is abutted to the heat dissipation upper housing 2.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.

In a specific implementation, each component or structure may be implemented as an independent entity, or may be combined arbitrarily and implemented as one or several entities, and the specific implementation of each component or structure may refer to the foregoing embodiments, which are not described herein again.

The above detailed description is given to the heat dissipation housing and the heat dissipation system provided by the embodiments of the present invention, and the specific examples are applied herein to explain the principle and the implementation of the present invention, and the description of the above embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be some changes in the specific implementation and application scope, and to sum up, the content of the present specification should not be understood as a limitation to the present invention.

Claims

1. The utility model provides a heat dissipation shell for hold the control mainboard, be equipped with the chip on the control mainboard, its characterized in that includes: a bearing plate, a heat dissipation upper shell and a heat dissipation fan;

the heat dissipation upper shell is connected with the bearing plate, and the heat dissipation upper shell and the bearing plate define an accommodating cavity for accommodating the control mainboard;

an accommodating groove is formed in one side, far away from the accommodating cavity, of the radiating upper shell, and the bottom surface of the accommodating groove is abutted to the chip;

2. The heat dissipating housing of claim 1, wherein the bottom surface of the receiving cavity abuts a surface of the chip adjacent to the receiving cavity.

3. The heat dissipating housing of claim 1, wherein the heat dissipating upper housing has a plurality of spaced apart heat dissipating fins.

4. The heat dissipating housing of claim 3, wherein a plurality of the heat dissipating fins are integrally formed with the heat dissipating upper shell.

5. The heat dissipating housing of claim 3, wherein said receiving slot is located in a plurality of said heat dissipating fins.

6. The heat dissipating housing of claim 1, further comprising a dust cover coupled to the heat dissipating fan.

7. The heat dissipating housing of claim 6, wherein the dust cover comprises a cover body and a shielding portion, the cover body is provided with an opening for exposing the blades of the heat dissipating fan, and the shielding portion is connected to the cover body for shielding a portion of the opening.

8. The heat dissipation housing as recited in any one of claims 1 to 7, wherein a wire through hole communicating with the accommodating cavity is provided on the heat dissipation upper housing, and a wire of the heat dissipation fan passes through the wire through hole to be connected with the control motherboard.

9. The heat dissipating housing of any one of claims 1 to 7, wherein the carrier plate comprises a bottom plate and at least one side plate, the bottom of the heat dissipating upper housing is connected to the bottom plate, and the side of the heat dissipating upper housing is connected to the side plate;

the side plate is provided with a plurality of interface holes, and the interface holes are used for exposing the interfaces on the control main plate.

10. A heat dissipation system, comprising: the heat dissipation housing of any one of claims 1-9, and a control motherboard;