CN217933725U

CN217933725U - Novel wafer overflow trough

Info

Publication number: CN217933725U
Application number: CN202221931773.8U
Authority: CN
Inventors: 李民; 王文彬; 洪庆福; 任殿胜; 赵波; 高伟
Original assignee: Baoding Tongmei Crystal Manufacturing Co ltd
Current assignee: Baoding Tongmei Crystal Manufacturing Co ltd
Priority date: 2022-07-26
Filing date: 2022-07-26
Publication date: 2022-11-29
Anticipated expiration: 2032-07-26

Abstract

The utility model discloses a novel wafer overflow launder relates to wafer processing technology field. A tank body with an opening at the upper part; a water inlet is arranged at the bottom of one side of the tank body; a plurality of fixing devices for fixing the 1 inch flower basket are arranged at intervals at the bottom of the inner side of the tank body along the length direction of the tank body; the fixing device comprises a supporting plate which is vertically fixed at the bottom of the inner side of the tank body; the top of the supporting plate is provided with a clamping plate protruding towards the outside of the supporting plate; the 1 inch flower basket is clamped between the supporting plates; the clamping plate is used for limiting the edge of the 1 inch flower basket; the height of the clamping plate is lower than that of the overflow liquid level of the tank body. The utility model discloses a set up fixing device in the overflow launder, carry on spacingly to 1 cun basket of flowers, prevent that 1 cun basket of flowers from floating out the overflow liquid level, effectively carry out the overflow to the wafer in 1 cun basket of flowers and wash, avoid the watermark defect.

Description

Novel wafer overflow trough

Technical Field

The utility model relates to a wafer processing technology field, in particular to novel wafer overflow launder.

Background

In the wafer processing process, the wafer needs to be cleaned after being polished, the polished wafer is firstly placed into a flower basket, and the flower basket is placed into a wafer overflow groove after being filled with the polished wafer; the water flow enters from the bottom of the overflow groove and finally overflows from the edge of the wafer overflow groove, so that the flowing water cleans the wafer in a submerged state. The existing water tank is not suitable for 1 inch wafers, and because the size of the 1 inch wafer is small and the weight of the 1 inch flower basket is light, the flower basket can be flushed and floated by water flow when being placed in the water tank, the wafer cannot be submerged, and the partial position of the wafer is positioned above the overflow liquid level, so that the water mark defect can be generated, and the water tank needs to be reworked; the reworking is repeated for many times, the thickness of the wafer is consumed, and the productivity of a polishing workshop is delayed.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a novel wafer overflow trough to solve the above problems.

In order to achieve the above object, the present invention provides a novel wafer overflow trough, which comprises a trough body with an opening at the upper part; a water inlet is formed in the bottom of one side of the tank body; a plurality of fixing devices for fixing the 1-inch flower basket are arranged at the bottom of the inner side of the tank body at intervals along the length direction of the tank body; the fixing device comprises a supporting plate which is vertically fixed at the bottom of the inner side of the tank body; the top of the support plate is provided with a clamping plate protruding towards the outside of the support plate; the 1 inch flower basket is clamped between the supporting plates; the clamping plate is used for limiting the edge of the 1-inch flower basket; the height of the clamping plate is lower than that of the overflow liquid level of the tank body.

Furthermore, a plurality of overflow openings are uniformly arranged on the edge of the opening of the groove body.

Furthermore, the overflow gap is trapezoidal, triangular or arc-shaped.

Furthermore, the inner part of the tank body is positioned at two sides of the fixing device and is provided with inclined plates; the inclined plate and the groove body form a triangular prism cavity; the water inlet is communicated with the triangular prism cavity; a plurality of water outlet holes are formed in the inclined plate at intervals along the length direction.

Further, the axis of the water outlet hole is perpendicular to the inclined plate.

The utility model discloses following beneficial effect has:

the utility model discloses a set up fixing device in the overflow launder, carry on spacingly to 1 cun basket of flowers, prevent that 1 cun basket of flowers from floating out the overflow liquid level, effectively carry out the overflow cleaning to the wafer in 1 cun basket of flowers, avoid the watermark defect.

Drawings

Fig. 1 is a perspective view of a novel wafer overflow trough according to the present invention;

FIG. 2 is a front view of a novel wafer overflow trough in accordance with the present invention;

fig. 3 is a left side view of the novel wafer overflow trough according to the present invention.

In the figure: 1-a groove body; 2-a fixing device; 3-sloping plate; 11-an overflow gap; 12-a water inlet; 21-a support plate; 22-a clamping plate; 31-water outlet.

Detailed Description

To achieve the above objects and advantages, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in the accompanying fig. 1-3, the present invention provides a novel wafer overflow trough, which comprises a trough body 1 with an upper opening; a water inlet 12 is formed in the bottom of one side of the tank body 1; a plurality of fixing devices 2 for fixing a 1-inch flower basket are arranged at the bottom of the inner side of the tank body 1 at intervals along the length direction of the tank body 1; the fixing device 2 comprises a supporting plate 21 which is vertically fixed at the bottom of the inner side of the tank body 1; the top of the supporting plate 21 is provided with a clamping plate 22 protruding towards the outside of the supporting plate 21; the 1 inch flower basket is clamped between the support plate 21 and the support plate 21; the clamping plate 22 is used for limiting the edge of the 1-inch flower basket; the height of the clamping plate 22 is lower than that of the overflow liquid level of the tank body 1, and a 1-inch flower basket can be placed right.

When the clamping plate is used, a 1-inch flower basket is inserted between the two fixing devices 2 from one side of the fixing devices 2 and placed at the bottom of the groove body 1, and the edge of the 1-inch flower basket is located below the clamping plate 22. And deionized water is introduced into the water inlet 12, and then overflow cleaning can be performed.

In another embodiment, a plurality of overflow notches 11 are uniformly arranged on the edge of the opening of the tank body 1, so that water can flow down conveniently.

In another embodiment, the overflow notch 11 has a trapezoid shape, a triangular shape or an arc shape, and in this embodiment, has a trapezoid shape.

In another embodiment, the tank body 1 is internally provided with sloping plates 3 at two sides of the fixing device 2; the inclined plate 3 and the tank body 1 enclose a triangular prism cavity; the water inlet 12 is communicated with the triangular prism cavity; a plurality of water outlet holes 31 are formed in the inclined plate 3 at intervals along the length direction. The water flow of the water inlet 12 is buffered through the triangular prism cavity, so that the water outlet hole 31 is more uniform, and the wafer cleaning consistency in the 1-inch flower basket is ensured.

In another embodiment, the axis of the outlet hole 31 is perpendicular to the inclined plate 3, so that the outlet holes 31 collect water flow in all directions, and the outlet water is more uniform.

The above description is only a preferred embodiment of the present invention, and not all embodiments, and any person should learn the structural changes made under the teaching of the present invention, and all the technical solutions identical or similar to the present invention all belong to the protection scope of the present invention.

Claims

1. A novel wafer overflow groove is characterized by comprising a groove body with an opening at the upper part; a water inlet is formed in the bottom of one side of the tank body; a plurality of fixing devices for fixing the 1-inch flower basket are arranged at intervals at the bottom of the inner side of the groove body along the length direction of the groove body; the fixing device comprises a supporting plate which is vertically fixed at the bottom of the inner side of the groove body; the top of the supporting plate is provided with a clamping plate protruding towards the outside of the supporting plate; the 1 inch flower basket is clamped between the supporting plates; the clamping plate is used for limiting the edge of the 1-inch flower basket; the height of the clamping plate is lower than that of the overflow liquid level of the tank body.

2. A novel wafer overflow launder as claimed in claim 1 wherein the open edge of said launder is uniformly provided with a plurality of overflow notches.

3. The novel wafer overflow launder of claim 2 wherein said overflow notch is trapezoidal or triangular or arcuate in shape.

4. A novel wafer overflow chute as claimed in claim 1, 2 or 3 wherein the interior of said chute is positioned on both sides of said fixture and is provided with sloping plates; the inclined plate and the tank body form a triangular prism cavity; the water inlet is communicated with the triangular prism cavity; a plurality of water outlet holes are formed in the inclined plate at intervals along the length direction.

5. The novel wafer overflow launder of claim 4, wherein the axis of said outlet opening is perpendicular to the sloping plate.