CN217411716U - Multi-frequency vacuum cleaning machine - Google Patents
Multi-frequency vacuum cleaning machine Download PDFInfo
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- CN217411716U CN217411716U CN202221325381.7U CN202221325381U CN217411716U CN 217411716 U CN217411716 U CN 217411716U CN 202221325381 U CN202221325381 U CN 202221325381U CN 217411716 U CN217411716 U CN 217411716U
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- 238000010407 vacuum cleaning Methods 0.000 title description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 65
- 239000002244 precipitate Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 22
- 238000000034 method Methods 0.000 description 12
- 239000000356 contaminant Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 239000013618 particulate matter Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The utility model discloses a multifrequency vacuum cleaner, including the cleaning machine body, the multifrequency oscillator is installed to the bottom of cleaning machine body, and the cleaning machine body is cylindricly, installs the work piece in the cleaning machine body and puts the structure, and the work piece is put the structure and is included that the symmetry sets up at this internal first backup pad and the backup pad is put to the second of putting of wash rack, and the first backup pad of putting and the second of putting is the curved surface to keeping away from the surperficial sunken of cleaning machine body center, the beneficial effects of the utility model are that: according to the technical scheme, through intelligent switching of ultrasonic waves with various frequencies, the air-talk effect and micro-flow are combined, damage of the cavitation effect is reduced, particles with different sizes on the workpiece are effectively removed, the cleaning purpose is achieved, the equipment space is saved, the cleaning efficiency is improved, the surface of the workpiece cannot be damaged, cleaning is achieved through different exchange frequencies through mixed ultrasonic, and damage to the workpiece is reduced through cavitation implosion force.
Description
Technical Field
The utility model relates to a cleaning machine technical field especially relates to a multifrequency vacuum cleaner.
Background
With the rapid development of semiconductor integrated circuit manufacturing technology, the pattern feature size of integrated circuit chips has entered the deep submicron stage, and the feature size of critical contaminants (e.g., particles) causing the failure or damage of ultra-fine circuits on the chips has been greatly reduced. During the integrated circuit manufacturing process, semiconductor wafers are typically subjected to a number of processing steps, such as film deposition, etching, polishing, etc. These process steps become important sites for contamination generation. In order to maintain the surface of the wafer clean and remove contaminants deposited on the surface of the wafer during the various process steps, the wafer after each process step must be cleaned. Therefore, the cleaning process becomes the most common process step in the integrated circuit fabrication process, and aims to effectively control the contamination level of each step to achieve the goal of each process step.
In order to effectively remove contaminants from the surface of the wafer, when a single wafer wet cleaning process is performed, the wafer is placed on a rotating platform (e.g., a rotating chuck) of a cleaning apparatus and rotated at a certain speed; and simultaneously spraying chemical liquid medicine with a certain flow rate to the surface of the wafer to clean the surface of the wafer. While the aim of removing contaminants by cleaning is achieved, it is most important to ensure non-destructive cleaning of the wafer, especially of the pattern on the surface of the patterned wafer. As the feature size of the integrated circuit pattern is reduced, the difficulty of removing contaminants with smaller sizes from the surface of the wafer is also increased. Many new cleaning techniques have been applied to cleaning equipment. Among them, the most important one is ultrasonic/megasonic cleaning technology. However, the ultrasonic/megasonic cleaning technique improves the efficiency of removing contaminants and inevitably causes damage to the patterned wafer. This is mainly due to the fact that the ultrasonic/megasonic energy, whose propagation direction is not perpendicular to the wafer surface, exerts a force on the patterned wafer surface pattern in a lateral direction that is greater than the adhesion force of the surface pattern to the wafer, resulting in damage to the surface pattern during ultrasonic/megasonic cleaning. Meanwhile, in the conventional ultrasonic/megasonic cleaning technology, an electric signal with a single frequency is introduced into a piezoelectric material to generate high-speed telescopic vibration, so that ultrasonic/megasonic oscillation energy is generated to clean a wafer. In the ultrasonic/megasonic cleaning process, the sonic energy can be refracted and emitted on the upper surface and the lower surface of the wafer and the contact surfaces of different media, and the interference of the refracted and reflected sonic and the single-frequency sonic emitted from the piezoelectric crystal oscillator can cause the energy in local areas to be too strong, so that the fine pattern structure on the surface of the wafer is damaged. On the other hand, cavitation erosion and direct current generated by ultrasonic waves/megasonic waves in a cleaning medium can accelerate the detachment process of particle pollutants from the surface of the wafer, and the cleaning efficiency is improved. However, from practical experience in the industry, bubbles generated by cavitation grow, and the amount of physical energy caused by final rupture is difficult to control, which is likely to cause damage to the fine pattern structure on the wafer surface. Therefore, technicians in the industry would prefer to use the direct current effect to clean the wafer without damage.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a multifrequency vacuum cleaning machine, solves one or more among the above-mentioned prior art problem.
In order to solve the technical problem, the utility model discloses a technical scheme be: a multi-frequency vacuum cleaning machine is characterized in that: including the cleaning machine body, the multifrequency oscillator is installed to the bottom of cleaning machine body, the cleaning machine body is cylindricly, install the work piece in the cleaning machine body and put the structure, the work piece is put the structure and is put the backup pad and put the backup pad including symmetry setting at this internal first backup pad of putting of wash rack and second, first backup pad of putting and second put the surface that is close to the cleaning machine body center and be the curved surface to keeping away from the sunken surface at cleaning machine body center, first backup pad of putting and second put the arc radius at the top of backup pad all are greater than the first arc radius of putting the bottom of backup pad and second put the backup pad, first the first arc board of putting that is close to the cleaning machine body center that all is equipped with at least one level setting on the surface of first backup pad of putting, and upper and lower adjacent first the arc board of putting is located the first most forward position of arc board with the first last edge of putting the arc board is not in the last edge of arc board On the same vertical curved surface, the arc board is put to the second that the backup pad was put to the second that is close to the cleaning machine body center all is equipped with at least one level setting on the surface, and adjacent from top to bottom the arc board is put to the second is located the top the second is put the most forward position of arc board and is located the below the last edge that the arc board was put to the second is not on same vertical curved surface, the work piece is put the structure and is still included that at least one can support and put the work piece platform of putting on first putting the arc board and the second is put the arc board, the surface of work piece platform of putting is equipped with evenly distributed's through-hole.
Furthermore, a plurality of precipitate leakage holes are uniformly distributed on the surfaces of the first placing support plate and the second placing support plate.
Further, the first top of putting the backup pad is equipped with one and first puts the arc board, the second is put the top of backup pad and is equipped with one and second and puts the arc board, first arc board and the second of putting puts the arc board symmetry setting, the structure is put to the work piece still includes a work piece and puts the platform, the platform is put to the work piece includes that a plurality of sets up from top to bottom puts the mesa and a plurality of spliced pole that is used for connecting fixed each and puts the mesa, the top put the border of mesa can support and put on the arc board is put to first arc board and second, it reduces gradually by its diameter under by last to put the mesa.
Further, the cleaning machine body includes first and lower half, the lower half is the round platform form that the top diameter is greater than the bottom diameter, first be cylindric and first diameter unanimous with the diameter at lower half top, first inner wall symmetry with the linking department of lower half is equipped with first put arc board and second and puts the arc board, the work piece is put the structure and is still put the platform including can putting the work piece on first put arc board and second put the arc board.
The utility model has the advantages that: this technical scheme combines air speech effect and miniflow through multiple frequency ultrasonic wave intelligence switching, reduces the harm of cavitation effect, effectively removes the particulate matter of equidimension not on the work piece, reaches the washing purpose, has practiced thrift equipment space and has improved cleaning efficiency to can not harm the work piece surface, through mixing the supersound, in spreading into the liquid to the energy of different frequencies simultaneously, realize the washing through the exchange frequency of difference, come the harm of reduction degree work piece through cavitation implosion power.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a cross-sectional view of an embodiment 1 of the multi-frequency vacuum cleaner of the present invention.
Fig. 2 is a front view of the first placing support plate and the second placing support plate of embodiment 1 of the multi-frequency vacuum cleaning machine of the present invention.
Fig. 3 is a cross-sectional view of an embodiment 2 of the multi-frequency vacuum cleaner of the present invention.
Fig. 4 is a cross-sectional view of an embodiment 3 of the multi-frequency vacuum cleaner of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1
As shown in fig. 1 and fig. 2, the embodiment of the present invention includes:
a multifrequency vacuum cleaning machine comprises a cleaning machine body 1, a multifrequency vibrator 11 is installed at the bottom of the cleaning machine body 1, the cleaning machine body 1 is cylindrical, a workpiece placing structure is installed in the cleaning machine body 1, the workpiece placing structure comprises a first placing support plate 21 and a second placing support plate 31 which are symmetrically arranged in a cleaning frame body, the surfaces, close to the center of the cleaning machine body 1, of the first placing support plate 21 and the second placing support plate 31 are curved surfaces which are sunken towards the surface far away from the center of the cleaning machine body 1, the arc radiuses at the tops of the first placing support plate 21 and the second placing support plate 31 are both larger than the arc radiuses at the bottoms of the first placing support plate 21 and the second placing support plate 31, at least one first placing arc plate 22 which is horizontally arranged is arranged on the surface, close to the center of the cleaning machine body 1, of the first placing support plate 21, the foremost edge of the first placing arc plate 22 positioned above and the rearmost edge of the first placing arc plate 22 positioned below are not on the same vertical curved surface, the surface of the second placing support plate 31 close to the center of the cleaning machine body 1 is provided with at least one horizontally arranged second placing arc plate 32, the foremost edge of the second placing arc plate 32 positioned above and the rearmost edge of the second placing arc plate 32 positioned below are not on the same vertical curved surface, the workpiece placing structure further comprises at least one workpiece placing table 4 capable of being supported and placed on the first placing arc plate 22 and the second placing arc plate 32, and the surface of the workpiece placing table 4 is provided with through holes which are uniformly distributed; a plurality of sediment leakage holes are uniformly distributed on the surfaces of the first placing support plate 21 and the second placing support plate 31.
The workpiece placing structure of the technical scheme can be multi-layered at present, placing space is improved, cleaning efficiency can be improved, meanwhile, the upper cleaning space and the lower cleaning space are independently arranged, and different workpieces can be rotated to clean positions and cleaning time.
Example 2
As shown in fig. 3, the embodiment of the present invention includes:
a multi-frequency vacuum cleaning machine comprises a cleaning machine body 1, a multi-frequency vibrator 11 is installed at the bottom of the cleaning machine body 1, the cleaning machine body 1 is cylindrical, a workpiece placing structure is installed in the cleaning machine body 1 and comprises a first placing support plate 21 and a second placing support plate 31 which are symmetrically arranged in a cleaning frame body, the surfaces, close to the center of the cleaning machine body 1, of the first placing support plate 21 and the second placing support plate 31 are curved surfaces which are sunken towards the surfaces far away from the center of the cleaning machine body 1, the arc radiuses of the tops of the first placing support plate 21 and the second placing support plate 31 are both larger than the arc radiuses of the bottoms of the first placing support plate 21 and the second placing support plate 31, a first placing arc plate 22 is arranged at the top of the first placing support plate 21, and a second placing arc plate 32 is arranged at the top of the second placing support plate 31, first put arc plate 22 and the second and put arc plate 32 symmetry setting, the structure is put to the work piece still includes a work piece and puts platform 4, work piece puts platform 4 includes that a plurality of sets up from top to bottom puts mesa 41 and a plurality of spliced pole 42 that are used for connecting fixed each and put mesa 41, the top put the border of mesa 41 and can support on first putting arc plate 22 and the second puts arc plate 32, put mesa 41 by its diameter reduces gradually under the top.
The workpiece placing table 4 of the workpiece placing structure in the technical scheme is integrally designed, and can be conveniently and quickly taken out and maintained.
Example 3
As shown in fig. 4, the embodiment of the present invention includes:
a multifrequency vacuum cleaning machine comprises a cleaning machine body 1, wherein a multifrequency vibrator 11 is installed at the bottom of the cleaning machine body 1, the cleaning machine body 1 comprises an upper half part and a lower half part, the lower half part is in a circular table shape, the diameter of the top of the lower half part is larger than that of the bottom of the lower half part, the upper half part is cylindrical, the diameter of the upper half part is consistent with that of the top of the lower half part, a first placing arc plate 22 and a second placing arc plate 32 are symmetrically arranged on the inner wall of the joint of the upper half part and the lower half part, and the workpiece placing structure further comprises a workpiece placing table 4 capable of placing the first placing arc plate 22 and the second placing arc plate 32; the workpiece placing table 4 comprises a plurality of placing table boards 41 arranged up and down and a plurality of connecting columns 42 used for connecting and fixing the placing table boards 41, the top edge of the placing table board 41 can be supported on the first placing arc plate 22 and the second placing arc plate 32, and the diameter of the placing table board 41 is gradually reduced from top to bottom.
The workpiece placing table 4 of the workpiece placing structure in the technical scheme is integrally designed, can be conveniently and quickly taken out and maintained, and saves the installation space and the equipment cost.
The utility model has the advantages that: this technical scheme combines air-talk effect and miniflow through multiple frequency ultrasonic wave intelligence switching, reduces the harm of cavitation effect, effectively removes the particulate matter of equidimension not on the work piece, reaches the washing purpose, has practiced thrift equipment space and has improved the cleaning efficiency to can not harm the workpiece surface, through mixing the supersound, in spreading into the liquid to the energy of different frequencies simultaneously, realize wasing through the exchange frequency of difference, come the harm of reduction degree work piece through cavitation implosion power.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (4)
1. A multifrequency vacuum cleaner, its characterized in that: including cleaning machine body (1), multifrequency oscillator (11) are installed to the bottom of cleaning machine body (1), cleaning machine body (1) is cylindricly, install the work piece in cleaning machine body (1) and put the structure, the work piece is put the structure and is set up at this internal first backup pad (21) of putting of wash rack and second and puts backup pad (31) including the symmetry, first backup pad (21) of putting and second put backup pad (31) be to keeping away from the surperficial sunken curved surface at cleaning machine body (1) center, first arc radius of putting the top of backup pad (31) is all greater than first arc radius of putting backup pad (21) and second and putting the bottom of backup pad (31), first arc of putting that is close to cleaning machine body (1) center of backup pad (21) all is equipped with the first arc of putting that at least one level set up on the surface and puts the arc board (22) The foremost edge of the first placing arc plate (22) positioned above and the rearmost edge of the first placing arc plate (22) positioned below are not on the same vertical curved surface, the surfaces of the second placing support plates (31) close to the center of the cleaning machine body (1) are respectively provided with at least one second placing arc plate (32) which is horizontally arranged, the foremost edges of the second placing arc plates (32) which are positioned above the second placing arc plates (32) which are vertically adjacent and the rearmost edges of the second placing arc plates (32) which are positioned below are not on the same vertical curved surface, the workpiece placing structure further comprises at least one workpiece placing table (4) capable of being supported and placed on the first placing arc plate (22) and the second placing arc plate (32), and through holes are uniformly distributed on the surface of the workpiece placing table (4).
2. The multi-frequency vacuum cleaner of claim 1, wherein: and a plurality of precipitate leakage holes are uniformly distributed on the surfaces of the first placing support plate (21) and the second placing support plate (31).
3. The multi-frequency vacuum cleaner of claim 1, wherein: the first top of putting backup pad (21) is equipped with one and first puts arc board (22), the second is put the top of backup pad (31) and is equipped with a second and puts arc board (32), first put arc board (22) and second and put arc board (32) symmetry setting, the structure is put to the work piece still includes a work piece and puts platform (4), the work piece is put platform (4) and is included putting mesa (41) and a plurality of spliced pole (42) that are used for connecting fixed each and put mesa (41) of setting from top to bottom setting up, the top put the border of mesa (41) and can support and put arc board (32) at first putting arc board (22) and second on, it reduces gradually from top to bottom its diameter to put mesa (41).
4. The multi-frequency vacuum cleaner of claim 1, wherein: cleaning machine body (1) includes first and lower half, the lower half is the round platform form that the top diameter is greater than the bottom diameter, first be cylindric and first diameter unanimous with the diameter at lower half top, first inner wall symmetry of linking department with the lower half is equipped with first putting arc board (22) and second and puts arc board (32), the work piece is put the structure and still is put platform (4) including putting the work piece that arc board (22) and second were put on arc board (32) first.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221325381.7U CN217411716U (en) | 2022-05-30 | 2022-05-30 | Multi-frequency vacuum cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221325381.7U CN217411716U (en) | 2022-05-30 | 2022-05-30 | Multi-frequency vacuum cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217411716U true CN217411716U (en) | 2022-09-13 |
Family
ID=83191586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221325381.7U Expired - Fee Related CN217411716U (en) | 2022-05-30 | 2022-05-30 | Multi-frequency vacuum cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217411716U (en) |
-
2022
- 2022-05-30 CN CN202221325381.7U patent/CN217411716U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220913 |
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| CF01 | Termination of patent right due to non-payment of annual fee |