CN217884265U - Heat transfer assembly and electronic device - Google Patents

Abstract

The application provides a heat transfer subassembly and electronic equipment relates to the electronic equipment field. The heat transfer component comprises a graphene layer and a heating layer which are arranged in an overlapping mode, wherein the heating layer comprises a graphene line used for electrifying and heating, and the graphene line is electrically isolated from the graphene layer. Due to the fact that the graphene has excellent heat conducting performance, when the graphene is attached to a heating device of electronic equipment, soaking can be achieved, and hot spots can be eliminated. The heat of the heating device is easily transmitted to a heating surface (such as a shell, radiating fins and the like) through the heat transmission assembly, so that the radiating effect is good. In addition, the graphene has better conductivity and high electrothermal conversion efficiency, so that the graphene circuit is utilized to be electrified and heated, and the heating efficiency and the effect are high. Therefore, the heat transfer assembly provided by the embodiment of the application can better give consideration to the heat dissipation function and the heating function. The electronic equipment provided by the application comprises the heat transfer component.

Description

Heat transfer assembly and electronic device

Technical Field

The application relates to the field of electronic equipment, in particular to a heat transfer assembly and electronic equipment.

Background

In the existing electronic devices, two requirements may be faced: firstly, heat on the surface of a heating device in the electronic equipment is transferred, namely, heat dissipation is carried out; and secondly, heating an area needing heat, such as defrosting the surface of a product. It is difficult for existing electronic devices or related components to better address both heat dissipation and heating requirements.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a heat transfer component and electronic equipment, it can compromise the demand of electronic equipment to heat dissipation and heating better.

The embodiment of the application is realized as follows:

in a first aspect, the present application provides a heat transfer assembly comprising a graphene layer and a heating layer arranged in an overlapping arrangement;

the heating layer comprises a graphene circuit used for electrifying and heating, and the graphene circuit is electrically isolated from the graphene layer.

In an alternative embodiment, the heat transfer assembly further comprises an insulating layer disposed between the graphene layer and the heating layer.

In an alternative embodiment, the heat transfer assembly further comprises a first contact layer arranged on a side of the heating layer facing away from the graphene layer.

In an alternative embodiment, the first contact layer is made of an insulating material.

In an alternative embodiment, the first contact layer is a double-sided tape.

In an alternative embodiment, the heat transfer assembly further comprises a second contact layer, which is arranged on a side of the graphene layer facing away from the heating layer.

In an alternative embodiment, the second contact layer is made of an insulating material.

In an alternative embodiment, the second contact layer is a double-sided tape.

In an alternative embodiment, the graphene wires are laid around within the heating layer.

In an alternative embodiment, the heat transfer assembly further comprises a power source arranged to supply power to the graphene lines.

In a second aspect, the present application provides an electronic device comprising the heat transfer assembly of any of the preceding embodiments.

In an alternative embodiment, the electronic device has a heated surface, the heat transfer assembly is attached to the heated surface, and the heating layer is closer to the heated surface than the graphene layer.

In an optional embodiment, the electronic device further includes a heat generating device, the heat transfer assembly is disposed between the heat receiving surface and the heat generating device, and the heat transfer assembly is configured to transfer heat emitted by the heat generating device to the heat receiving surface.

In an optional embodiment, a filling layer is arranged between the heat generating device and the heat transfer component, and the filling layer is attached to the heat generating device and the heat transfer component.

In an alternative embodiment, the filling layer includes at least one of a thermal pad, a thermal gel, a thermal silicone grease, and a double-sided adhesive tape.

In an alternative embodiment, the electronic device includes a housing, and the heated surface is an inner surface of the housing.

In an alternative embodiment, the inner surface of the housing includes a first surface and a second surface that are angled with respect to each other, with a portion of the heat transfer assembly engaging the first surface and another portion engaging the second surface.

In an alternative embodiment, the electronic device is a lidar.

The beneficial effects of the embodiment of the application are that:

the heat transfer assembly that this application embodiment provided, including overlapping the graphite alkene layer and the zone of heating that set up, wherein, the zone of heating is including the graphite alkene circuit that is used for circular telegram to generate heat, and the electrical property is kept apart between graphite alkene circuit and the graphite alkene layer. Due to the fact that the graphene has excellent heat conducting performance, the graphene layer can be uniformly heated and hot spots can be eliminated when the graphene layer is attached to a heating device of electronic equipment. The heat of the heating device is easily transmitted to the heating surface (such as a shell, a radiating fin and the like) through the heat transmission assembly of the embodiment of the application, so that the radiating effect is good. In addition, the graphene has better conductivity and high electrothermal conversion efficiency, so that the graphene circuit is utilized to be electrified and heated, and the heating efficiency and the effect are high. Therefore, the heat transfer assembly provided by the embodiment of the application can better give consideration to the heat dissipation function and the heating function.

The electronic equipment provided by the embodiment of the application comprises the heat transfer component, and the heat transfer component can play a good heating or heat dissipation role in the electronic equipment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

FIG. 1 is a schematic view of an embodiment of a heat transfer assembly according to the present disclosure;

FIG. 2 is a schematic view of a heat transfer assembly according to one embodiment of the present application;

FIG. 3 is a schematic view of a heat transfer assembly according to another embodiment of the present application;

FIG. 4 is a schematic view of an application scenario of a heat transfer assembly according to another embodiment of the present application;

FIG. 5 is a schematic view of an application scenario of a heat transfer assembly according to still another embodiment of the present application.

100-Heat transfer Assembly; 110-a graphene layer; 120-a heating layer; 121-graphene lines; 130-an insulating layer; 140-first contact layer; 150-a second contact layer; 200-a heat generating device; 300-a housing; 301-a heated surface; 302-a first surface; 303-a second surface; 400-a filling layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed when used, and are only used for convenience of description and simplification of description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Many electronic devices are often required to function properly under severe conditions of sudden changes in various weather conditions. For example, when a laser radar starts a vehicle in cold winter, the surfaces of a window sheet and a body of the radar are prone to frosting, condensation and the like, and even extremely low ambient temperature poses challenges to the starting of the laser radar. Conversely, lidar devices can be out of specification, degraded, and shifted in wavelength at high temperatures. In response to these problems, the problems may affect the transmission and reception of the light of the lidar, and even cause the lidar not to sense the surrounding environment normally and thus not to work normally. In view of the above problems encountered by electronic devices at low and high temperatures, the current solutions are all implemented by separate measures, such as using a separate heating component and a separate heat dissipation component to respectively satisfy the requirements for heating and heat dissipation. None of the existing electronic devices has a component that can better compromise heat dissipation and heating functions.

In order to improve the problem that exists among the above-mentioned prior art, this application embodiment provides a heat transfer assembly, through setting up graphite alkene layer and the zone of heating that contains the graphite alkene circuit for heat transfer assembly can have better heating effect when the circular telegram, has better heat conduction, radiating effect when not circular telegram.

FIG. 1 is a schematic view of an embodiment of a heat transfer assembly 100; FIG. 2 is a schematic view of a heat transfer assembly 100 according to one embodiment of the present application. As shown in fig. 1 and fig. 2, the heat transfer assembly 100 provided in the embodiment of the present application is applied to an electronic device, the electronic device includes a housing 300 and a heat generating device 200, the heat transfer assembly 100 is disposed between the housing 300 and the heat generating device 200, and is capable of conducting heat generated by the heat generating device 200 to the housing 300, so as to help the heat generating device 200 to dissipate heat, and an inner surface of the housing 300 is a heat receiving surface 301. When the shell 300 needs to be heated, the heat transfer assembly 100 can actively generate heat to raise the temperature of the shell 300, so as to achieve the functions of defrosting the surface of the shell 300, removing condensation and the like. The electronic device provided by the embodiment of the application comprises the heat transfer component 100, and the electronic device can be a laser radar, and can also be other devices needing heat dissipation and/or heating.

In the present embodiment, the heat transfer assembly 100 includes a graphene layer 110 and a heating layer 120 disposed to overlap; the heating layer 120 includes a graphene line 121 for heating by electricity, and the graphene line 121 is electrically isolated from the graphene layer 110. The graphene layer 110 has excellent thermal conductivity, and the thermal conductivity is as high as 5300W/mK. When heat transfer assembly 100 volatilize the heat dissipation effect, even if device 200 surface that generates heat has inhomogeneous the point that generates heat, nevertheless the heat is when transmitting graphite alkene layer 110, because of the heat conductivility that graphite alkene layer 110 is excellent, graphite alkene layer 110 can play the soaking effect, and the heat that graphite alkene layer 110 exported is relatively even promptly. In addition, the graphene has good conductivity, and the electrothermal conversion efficiency is as high as 99.4%, which is higher than that of a conventional resistance wire, so that the graphene circuit 121 in the heating layer 120 can realize a good heating effect. Since the graphene lines 121 are heated by being energized, the graphene lines 121 and the graphene layer 110 should be electrically isolated from each other to avoid short circuit.

Optionally, as shown in fig. 2, the heat transfer assembly 100 further includes an insulating layer 130 disposed between the graphene layer 110 and the heating layer 120. The graphene lines 121 are separated from the graphene layer 110 by the provision of the insulating layer 130. In this embodiment, the heating layer 120 may only include the graphene line 121, and the graphene line 121 is attached to the insulating layer 130. In other optional embodiments, the heating layer 120 may further include a layered dielectric material in addition to the graphene wires 121, and the graphene wires 121 are embedded in the dielectric material; in this case, although the heating layer 120 is in contact with the graphene layer 110, the graphene wires 121 are still electrically isolated from the graphene layer 110, and thus the insulating layer 130 may be omitted. The dielectric material and the insulating layer 130 in this embodiment can be selected from materials with better thermal conductivity, such as thermal pads, thermal gel, thermal silicone grease, etc.

In this embodiment, the graphene wires 121 are arranged in the heating layer 120 in a winding manner, so that the length of the graphene wires 121 is increased, and the distribution of the graphene wires 121 is more uniform, thereby achieving a better heating effect. The direction and the distribution density of the graphene lines 121 can be set according to actual needs. In this embodiment, the end of the graphene wire 121 may be exposed from the side of the heat transfer assembly 100, so as to facilitate a power supply (not shown) to supply power to the graphene wire 121.

As shown in fig. 2, the heat transfer assembly 100 further comprises a first contact layer 140, the first contact layer 140 being arranged on a side of the heating layer facing away from the graphene layer 110 for contacting the heated surface 301 and transferring heat to the heated surface 301. Further, the first contact layer 140 is made of an insulating material, so that short circuit caused by contact with the graphene line 121 can be avoided. Optionally, the first contact layer 140 is a double-sided adhesive tape, and the double-sided adhesive tape can integrally adhere the heat transfer assembly 100 to the heat receiving surface 301, so as to fix the heat transfer assembly 100. Of course, the material of the first contact layer 140 is preferably a material with better thermal conductivity.

Fig. 3 is a schematic view of a heat transfer assembly 100 according to another embodiment of the present application. As shown in fig. 3, optionally, the heat transfer assembly 100 further includes a second contact layer 150, and the second contact layer 150 is disposed on a side of the graphene layer 110 facing away from the heating layer. Further, the second contact layer 150 is made of an insulating material, so as to avoid a short circuit problem that may be caused by electrical connection between the graphene layer 110 and the heat generating device 200. Optionally, the second contact layer 150 is a double-sided tape. The double-sided tape can integrally attach the heat transfer member 100 to the heat generating member, thereby fixing the heat transfer member 100.

On the basis of the above embodiment, the heat transfer assembly 100 may further include a power supply (not shown in the figure) configured to supply power to the graphene wires 121. Of course, in alternative embodiments, the heat transfer assembly 100 may not contain a power source and the electronic device contains a power source for supplying power to the heat transfer assembly 100.

Fig. 1 shows a usage scenario of the heat transfer assembly 100, that is, in an electronic device of an alternative embodiment, a heat receiving surface 301 of the electronic device is an inner surface of a housing 300, a heat generating device 200 is disposed in the housing 300, the heat transfer assembly 100 is disposed between the heat receiving surface 301 and the heat generating device 200, and the heat transfer assembly 100 transfers heat between the heat generating device 200 and the housing 300. Specifically, the heat transfer assembly 100 is attached to the heated surface 301, and the heating layer 120 is closer to the heated surface 301 than the graphene layer 110. When the heat transfer assembly 100 is powered on to generate heat, the heat emitted by the heating layer 120 can reach the housing 300 after passing through the first contact layer 140, so that the housing 300 is heated, and functions of defrosting, removing condensation and the like are further realized. When the heat transfer assembly 100 is not powered on, the heat transfer assembly 100 transfers the heat emitted by the heat generating device 200 to the heated surface 301 by using the good heat conduction performance of the heat transfer assembly 100, that is, the heat of the heat generating device 200 is transferred to the housing 300, so that heat dissipation is realized.

Further, a filling layer 400 is disposed between the heat generating device 200 and the heat transfer assembly 100, and the filling layer 400 is attached to the heat generating device 200 and the heat transfer assembly 100. The purpose of the filling layer 400 is to reduce the thermal resistance between the heat transfer assembly 100 and the heat generating device 200, so that the heat generating device 200 and the heat transfer device are bonded more tightly, and the influence on heat transfer due to air gaps and the like is avoided. Optionally, the filling layer 400 includes at least one of a thermal pad, a thermal gel, a thermal silicone grease, and a double-sided tape. The heat conducting pad and the heat conducting gel can be used for filling the gap under the condition that the distance between the shell 300 and the heating device 200 is larger, and the heat conducting pad has the buffering and vibration damping effects; the heat conductive silicone grease can be used in a scene where a gap between the housing 300 and the heat generating device 200 is small and no vibration reduction is required. The filling layer 400 can be used according to the actual shape of the product and the heat dissipation requirement.

Fig. 4 is a schematic view of an application scenario of a heat transfer assembly 100 according to another embodiment of the present application. As shown in fig. 4, optionally, the inner surface (i.e., the heated surface 301) of the housing 300 includes a first surface 302 and a second surface 303 which are angled with respect to each other, a portion of the heat transfer assembly 100 is attached to the first surface 302, another portion is attached to the second surface 303, and the portion of the heat transfer assembly 100 attached to the first surface 302 is connected to the heat generating device 200. In the embodiment of fig. 4, the first surface 302 and the second surface 303 are perpendicular to each other. The graphene has a stable molecular structure, the connection between the internal carbon atoms is flexible, and when an external force is applied to the graphene, the carbon atoms can be bent and deformed, so that the carbon atoms do not need to be rearranged to adapt to the external force, and the stability of the structure is kept. Therefore, the heat transfer member 100 can be curved according to the surface shape of the structure to be attached. Due to the good bending property of the graphene, the heat transfer component 100 can be bent and extended to the second surface 303, so that the heat of the heat generating device 200 can be transferred to the other side of the housing 300 to the maximum extent, and the heat dissipation area of the housing 300 is increased. It can be seen that the heat transfer assembly 100 with good flexibility can be flexibly applied to different scenes. Fig. 5 is a schematic view of an application scenario of a heat transfer assembly 100 according to still another embodiment of the present application. As shown in fig. 5, in the present embodiment, one heat transfer assembly 100 achieves heat transfer of two heat generating devices 200 with a case 300. In the embodiment of the present application, the heat generating device 200 may be a chip or other power module with heat generating capability, or may be a circuit board or a support structure member requiring heat dissipation.

It should be understood that the application manner of the heat transfer assembly 100 provided by the embodiment of the present application is not limited to the application manner described above, for example, in alternative embodiments, the heat transfer assembly 100 may be only attached to the heated surface 301 without being attached to the heat generating device 200, in which case, the heat transfer assembly 100 mainly performs a heating function to raise the temperature of the housing 300. In some embodiments, the heat receiving surface 301 of the electronic device may not be the inner surface of the housing 300, but may be the surface of other structures capable of receiving heat, such as the surface of a heat dissipating fin to which the heat transferring assembly 100 transfers the heat of the heat generating device 200. In this usage scenario, the heat transfer assembly 100 primarily performs a heat dissipation function.

In summary, the heat transfer assembly 100 provided by the embodiment of the present application includes the graphene layer 110 and the heating layer 120 that are disposed in an overlapping manner, wherein the heating layer 120 includes the graphene line 121 for generating heat by energization, and the graphene line 121 is electrically isolated from the graphene layer 110. Since graphene has excellent thermal conductivity, the graphene layer 110 can be uniformly heated and hot spots can be eliminated when the graphene layer is attached to the heat generating device 200 of the electronic device. The heat of the heat generating device 200 is easily transferred to the heat receiving surface 301 (such as a housing, a heat dissipating fin, etc.) through the heat transfer assembly 100 of the embodiment of the present application, so that the heat dissipation effect is good. In addition, the graphene has better conductivity and high electrothermal conversion efficiency, so that the graphene circuit 121 is utilized for conducting power-on heating, and the heating efficiency and the effect are high. It can be seen that the heat transfer assembly 100 provided in the embodiment of the present application can better give consideration to both the heat dissipation function and the heating function.

The electronic device provided by the embodiment of the present application includes the heat transfer assembly 100 described above, and the heat transfer assembly 100 can perform a good heating or heat dissipation function in the electronic device.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (18)

1. A heat transfer assembly comprises a graphene layer and a heating layer which are arranged in an overlapping mode;

the heating layer comprises a graphene circuit used for being electrified and heating, and the graphene circuit is electrically isolated from the graphene layer.

2. A heat transfer assembly as recited in claim 1 further comprising an insulating layer disposed between said graphene layer and said heating layer.

3. A heat transfer assembly as claimed in claim 1, further comprising a first contact layer disposed on a side of the heating layer facing away from the graphene layer.

4. A heat transfer assembly as recited in claim 3 wherein said first contact layer is of an insulating material.

5. A heat transfer assembly as recited in claim 3 wherein said first contact layer is double sided tape.

6. A heat transfer assembly as claimed in claim 1, further comprising a second contact layer provided on a side of the graphene layer facing away from the heating layer.

7. A heat transfer assembly as recited in claim 6 wherein said second contact layer is an insulating material.

8. A heat transfer assembly as recited in claim 6 wherein said second contact layer is double sided tape.

9. A heat transfer assembly as recited in any of claims 1-8 wherein said graphene lines are laid out in a serpentine configuration within said heating layer.

10. The heat transfer assembly of any of claims 1-8, further comprising a power source configured to supply power to the graphene wires.

11. An electronic device comprising the heat transfer assembly of any of claims 1-10.

12. The electronic device of claim 11, wherein the electronic device has a heated surface, wherein the heat transfer assembly is attached to the heated surface, and wherein the heating layer is closer to the heated surface than the graphene layer.

13. The electronic device of claim 12, further comprising a heat generating device, wherein the heat transfer assembly is disposed between the heat receiving surface and the heat generating device, and wherein the heat transfer assembly is configured to transfer heat dissipated by the heat generating device to the heat receiving surface.

14. The electronic device of claim 13, wherein a filling layer is disposed between the heat generating device and the heat transfer component, and the filling layer is bonded to the heat generating device and the heat transfer component.

15. The electronic device of claim 14, wherein the filling layer comprises at least one of a thermal pad, a thermal gel, a thermal silicone grease, and a double-sided adhesive tape.

16. The electronic device of any of claims 12-15, wherein the electronic device includes a housing, and the heated surface is an inner surface of the housing.

17. The electronic device of claim 16, wherein the inner surface of the housing includes a first surface and a second surface that are angled with respect to each other, and wherein a portion of the heat transfer component is attached to the first surface and another portion is attached to the second surface.

18. An electronic device according to any of claims 12-15, characterized in that the electronic device is a lidar.

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