CN217880190U - Edge calculating box - Google Patents

Abstract

The present application relates to an edge computing box that can have a smaller overall size without reducing the heat dissipation capability. Meanwhile, when the fan is used for heat dissipation, dust is prevented from entering the main board and the fan, the main board and the fan are protected from being corroded by the dust, and the service lives of the main board and the fan are prolonged. The edge calculation box includes: a housing having an interior space; a partition plate disposed within the case to partition the internal space into a mounting chamber and a heat dissipation chamber that are independent of each other; a main board disposed in the mounting chamber and heat-conductively connected to the partition, the partition being configured to conduct heat generated by the main board to the heat dissipation chamber; and the heat dissipation device is arranged in the heat dissipation chamber and used for dissipating heat of the heat conducted by the partition plate.

Description

Edge calculating box

Technical Field

The application relates to the technical field of computing boxes, in particular to an edge computing box.

Background

Under the large trend of economic development of 'number-real integration', the intelligent Internet of things industry develops rapidly, and an edge computing box capable of running local computing, message communication and data caching on equipment is widely applied and plays an important role in various scenes. Along with the development of science and technology, the computing power of the edge computing box is gradually strong, but the power consumption of the edge computing box is indirectly increased, and the heat dissipation of the edge computing box becomes a problem which is difficult to solve. At present, two main technical schemes for solving the problem are provided: the scheme is that heat is conducted by means of metal parts of the edge computing box, when the power consumption of the main board is high, the heat dissipation area of the metal parts needed by the edge computing box needs to be increased, the whole size is increased, and the edge computing box is not beneficial to miniaturization and popularization; in the second method, the fan is arranged in the edge calculation box, the heat of the mainboard is dissipated by utilizing the air convection heat exchange of the fan, but after the mainboard is used for a long time, not only dust is accumulated in the mainboard to corrode mainboard devices, but also the dust is fed into the fan to damage the fan, so that the mainboard is not beneficial to long-term use.

SUMMERY OF THE UTILITY MODEL

An advantage of the present invention is that it provides an edge computing box, which can have a smaller overall size without reducing the heat dissipation capability.

Another advantage of the present invention is to provide an edge computing box, which can prevent dust from entering a motherboard and a fan while using a fan to dissipate heat, protect the motherboard and the fan from being corroded by the dust, and prolong the service life of the motherboard and the fan.

Another advantage of the present invention is to provide an edge computing box, wherein to achieve the above advantages, the structure inside the edge computing box is optimized to fan and mainboard split level design, the mainboard is installed in the installation chamber, the whole air duct is totally concentrated in the heat dissipation chamber, and the dust does not enter the installation chamber; meanwhile, the dust screen can be installed in a drawing mode, the heat dissipation cavity is divided into an air inlet area and an air outlet area, the fan is protected from dust corrosion, and meanwhile the dust screen can be conveniently installed and detached when cleaned.

In view of the above, to achieve at least one of the above and other advantages and in accordance with the purpose of the present invention, the present invention provides an edge calculating box, comprising;

a housing having an interior space;

a partition plate disposed within the case to partition the internal space into a mounting chamber and a heat dissipation chamber that are independent of each other;

a main board disposed in the mounting chamber and thermally connected to the partition for conducting heat generated by the main board to the heat dissipation chamber; and

a heat sink disposed in the heat dissipation chamber for dissipating heat conducted via the partition.

According to an embodiment of the present application, the housing further has an air inlet communicating with the heat dissipation chamber and an air outlet communicating with the heat dissipation chamber, and the heat dissipation device includes a fan for driving air flowing in from the air inlet to flow in the heat dissipation chamber and flowing out from the air outlet to take away heat conducted through the partition; the fan is mounted on the housing, corresponds to the air outlet, and is used for driving air to flow out of the heat dissipation chamber through the air outlet.

According to one embodiment of the present application, the housing includes a top cover, a front panel, a rear panel, and a base; the upper cover is detachably arranged on the base, and the front panel and the rear panel are respectively arranged on the front side and the rear side of the base; the air outlet is located on the side wall of the base, and the air inlet is located on the front panel and/or the rear panel.

According to an embodiment of the present application, the partition is integrally connected to the base to form the heat dissipation chamber between a lower surface of the partition and the base, and to form the mounting chamber between an upper surface of the partition and the upper cover.

According to an embodiment of the present application, the heat dissipating device further includes a heat dissipating member that is provided to be protruded to the lower surface of the partition plate.

According to an embodiment of the present application, the heat radiating member integrally extends downward from the lower surface of the partition plate to form a wave-scale-shaped heat radiating surface.

According to an embodiment of the present application, the heat dissipating device further includes a heat conductive member disposed between the main board and the upper surface of the partition for conducting heat generated via the main board to the partition.

According to an embodiment of the present application, the heat-conducting member is a heat-conducting pad attached to the upper surface of the partition plate.

According to one embodiment of the present application, the heat dissipation device includes a dust-proof member disposed on the housing to divide the heat dissipation chamber into an air inlet region adjacent to the air inlet and an air outlet region adjacent to the air outlet, for filtering air flowing from the air inlet region into the air outlet region; the fan is located in the air outlet area.

According to one embodiment of the application, the dust-proof piece is a dust-proof net which is arranged on the base in a drawing mode.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a perspective view of an edge computing box provided in one embodiment of the present application;

FIG. 2 shows an exploded view of an edge computing box according to the above-described embodiment of the present application;

FIG. 3 shows a schematic perspective view of the edge computing box with the front panel removed according to the above-described embodiment of the present application;

FIG. 4 shows a schematic front view of the edge computing box with the front panel removed according to the above-described embodiment of the present application;

FIG. 5 shows a schematic top cover view of an edge computing box according to the above-described embodiments of the present application;

FIG. 6 shows a schematic view of a base of an edge computing box according to the above-described embodiment of the present application;

FIG. 7 shows a schematic front view of an edge computing box according to the above-described embodiment of the present application;

FIG. 8 shows a schematic rear view of an edge computing box according to the above-described embodiments of the present application;

FIG. 9 shows a left-side schematic view of an edge calculation box according to the above-described embodiment of the present application;

FIG. 10 shows a fan schematic of an edge computing box according to the above-described embodiment of the present application;

FIG. 11 shows a schematic dust screen of the edge computing box according to the above-described embodiment of the present application;

FIG. 12 shows an enlarged schematic view of portion A of the edge calculation box of FIG. 3 according to the present application;

FIG. 13 shows a partial B enlarged schematic view of the edge calculation box of FIG. 6 according to the present application.

Reference numerals are as follows: 10. a housing; 11. installing a chamber; 12. a heat dissipation chamber; 121. an air inlet area; 122. an air outlet area; 123. a positioning device; 1231. an upper guide groove; 1232. a lower guide groove; 1233. fixing a column; 13. An air inlet; 14. an air outlet; 15. an upper cover; 151. mounting grooves; 152. mounting a boss; 153. an upper positioning bulge; 16. a base; 161. a lower positioning boss; 17. a front panel; 171. a forward air inlet; 18. a rear panel; 181. a rear air inlet; 20. a partition plate; 30. a main board; 40. a heat sink; 41. a fan; 411. a fan bracket; 42. a heat sink; 421. a heat dissipating surface; 43. a heat conductive member; 430. a thermally conductive pad; 44. a dust-proof member; 440. a dust screen; 441. a support plate; 4411. bending sections; 442. a fixing plate; 443. and (5) a mesh surface.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "secured to" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used in the description of the present application are for illustrative purposes only and do not represent the only embodiments.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact via an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of the present application, the term "and/or" includes any and all combinations of one or more of the associated listed items.

On one hand, the heat conduction is carried out by depending on the metal piece of the edge computing box, but when the power consumption of the main board is high, the heat dissipation area of the metal piece required by the edge computing box needs to be increased, so that the whole size is increased, and the miniaturization and popularization are not facilitated; on the other hand calculates box internally mounted fan at the edge, utilizes the gaseous convection heat transfer of fan to dispel the heat to the mainboard, nevertheless uses the long time after, and the mainboard is inside to accumulate the dust so that the mainboard device corrodes, also can be the inside dust that advances of fan moreover, so that the fan damages, is unfavorable for long-term use. In order to solve the problem, the application provides an edge computing box which can provide heat dissipation for a main board and has the functions of dust prevention and corrosion prevention.

Specifically, referring to fig. 1 to 4, the present application provides an edge calculating box, which may include: a housing 10, the housing 10 having an inner space; a partition plate 20, the partition plate 20 being disposed within the case 10 to divide an inner space of the case 10 into a mounting chamber 11 and a heat dissipation chamber 12 which are independent of each other; a main board 30, wherein the main board 30 is disposed in the mounting chamber 11 and is thermally connected to the partition board 20, and the partition board 20 is used for conducting heat generated by the operation of the main board 30 to the heat dissipation chamber 12; and a heat sink 40, the heat sink 40 being disposed in the heat dissipation chamber 12 for dissipating heat conducted through the partition 20.

More specifically, as shown in fig. 2 to 4, the housing 10 is further provided with an air inlet 13 communicating with the heat dissipation chamber 12 and an air outlet 14 communicating with the heat dissipation chamber 12, and the heat dissipation device 40 includes a fan 41, where the fan 41 is used for driving air flowing in from the air inlet 13 to flow in the heat dissipation chamber 12 and flow out from the air outlet 14 to take away heat conducted through the partition plate 20.

More specifically, as shown in fig. 2 to 4, the fan 41 is mounted on the housing 10, and the fan 41 corresponds to the air outlet 14 for driving air to flow out of the heat dissipation chamber 12 through the air outlet 14. It should be noted that the fan 41 can also be installed at the air inlet 13 of the housing 10 for driving air into the heat dissipation chamber 12 through the air inlet 13.

Alternatively, as shown in fig. 2, the housing 10 includes an upper cover 15, a base 16, a front panel 17 and a rear panel 18; the upper cover 15 is detachably mounted on the base 16, and the front panel 17 and the rear panel 18 are respectively arranged at the front side and the rear side of the base 16; the air outlet is located on the base 16, and the air inlet 13 is located on the front panel and/or the rear panel 18.

Preferably, as shown in fig. 5 and 6, in the embodiment of the present application, the upper cover 15 and the base 16 have a U-shaped structure, the lower end of the upper cover 15 is provided with a mounting groove 151 and a mounting protrusion 152, and correspondingly, the base is also provided with a mounting groove 151 and a mounting protrusion 152, and the upper cover 15 and the base 16 are assembled together by fitting the mounting protrusion 152 into the mounting groove 151. It should be noted that the lower ends of the upper covers 15 may be provided with mounting grooves 151, and the corresponding bases 16 are provided with mounting protrusions 152; in other words, the lower ends of the upper covers 15 may be provided with mounting protrusions 152, and the corresponding bases 16 are provided with mounting grooves 151. The upper cover 15 and the base 16 are provided with an upper positioning projection 153 and a lower positioning projection 161 protruding outwards on both sides; the front panel 17 and the rear panel 18 are respectively located on the front and rear sides of the upper cover 15 and the base 16, and the upper positioning protrusion 153 and the lower positioning protrusion 161 are overlapped with the four sides of the front panel 17 and the rear panel 18 and fixed to the upper cover 15 and the base 16 by screws. Therefore, the shell structure is firmer and more stable, dust is difficult to enter the edge computing box from the fit clearance of each accessory, and the sealing performance is better.

Preferably, as shown in fig. 7 to 9, the front panel 17 is provided with a front air inlet 171, the rear panel 18 is provided with a rear air inlet 181, the front air inlet 171 is located at a position below the front panel 17, and the rear air inlet 181 is located at a position below the rear panel 18; the base 16 is provided with an air outlet 14, and the air outlet 14 is positioned on the side wall of the base 16; the front air inlet 171, the rear air inlet 181 and the air outlet 14 are distributed on 3 different surfaces, so that the whole air duct inside the heat dissipation chamber 12 is in a mode of air inlet by the front panel 17 and the rear panel 18 and air outlet by the side wall of the base 16. Therefore, the air inlet 13 and the air outlet 14 are not interfered with each other, and the air inlet speed is increased by the two air inlets, so that the heat dissipation efficiency is enhanced.

It should be noted that, as shown in fig. 6, the partition plate 20 is integrally connected to the base 16 to form the heat dissipation chamber 12 between the lower surface of the partition plate 20 and the base 16, and to form the mounting chamber 11 between the upper surface of the partition plate 20 and the upper cover 15. In this way, the mounting chamber 11 and the heat dissipation chamber 12 are separated by the partition plate 20, and since the partition plate 20 and the base 16 are integrated, dust cannot enter the mounting chamber 11 through the fit clearance between the partition plate 20 and the base 16, thereby protecting the main board 30 mounted in the mounting chamber 11 from dust.

Optionally, as shown in fig. 10, according to an embodiment of the present application, the fan further includes a fan bracket 411, the fan bracket 411 is bent in an L shape, and the fan 41 is fixedly disposed on a bottom surface of the fan bracket 411, corresponding to a side wall of the fan bracket 411; the size of the sidewall of the fan bracket 411 corresponds to the size of the air outlet 14 on the sidewall of the base 16, so that the fan bracket 411 can be assembled on the air outlet 14. In this way, the fan bracket 411 can facilitate the fan 41 to be disassembled and assembled, and facilitate subsequent cleaning, maintenance and replacement.

Optionally, as shown in fig. 6, the heat dissipating device 40 further includes a heat dissipating member 42, and the heat dissipating member 42 is protruded from the lower surface of the partition plate 20 for increasing a heat dissipating area.

It is noted that, as shown in fig. 5, according to an embodiment of the present application, the heat dissipation member 42 integrally extends downward from the lower surface of the partition plate 20 to form a wave-scale-shaped heat dissipation surface 421; the heat dissipation member 42 is integrated with the lower surface of the partition plate 20, and the wave-shaped scale-shaped heat dissipation surface 421 can increase the heat dissipation area. Therefore, the heat dissipation area of the lower surface of the partition plate is increased and the heat dissipation capability of the lower surface of the partition plate 20 is enhanced without changing the overall size of the partition plate 20.

Optionally, as shown in fig. 6, the heat dissipation device further includes a heat conduction member 43, and the heat conduction member 43 is disposed between the main board 30 and the upper surface of the partition board 20, and is used for conducting heat generated by the main board 30 to the partition board 20, so as to improve heat conduction efficiency.

Preferably, as shown in fig. 6, according to an embodiment of the present application, the thermal conductive member 43 is a thermal conductive pad 430 attached to the upper surface of the partition plate 20, and the thermal conductive pad 430 has viscosity, softness, good compression property, and good thermal conductivity; one surface of the heat conducting pad is attached to the high power consumption chip of the main board 30, and the other surface is attached to the upper surface of the partition board 20; the main board 30 can be fully contacted with the partition board 20, and heat generated by the main board 30 is more quickly transferred to the partition board 20 through the heat conducting pad, so that the heat conducting capacity is improved.

In particular, as shown in fig. 3, the heat dissipation device further includes a dust-proof member 44, the dust-proof member 44 is disposed on the housing 10 to divide the heat dissipation chamber 12 into an air inlet area 121 adjacent to the air inlet 13 and an air outlet area 122 adjacent to the air outlet 14; the fan 41 is disposed in the air outlet area 122; when air flows into the air inlet area 121 from the air inlet 13 and passes through the dustproof piece 44, dust in the air can be filtered by the dustproof piece 44, the dust is left in the air inlet area 121, and the filtered air enters the air outlet area 122; in this way, the air contacted by the fan 41 is the air filtered by the dust-proof member 44, so that the contact of the fan 41 with dust during the operation process is reduced, the fan 41 is protected from being corroded by dust, and the service life of the fan is prolonged.

Preferably, as shown in fig. 11, the dust-proof member 44 is a dust-proof net 440 that is drawably disposed on the base, and includes a supporting plate 441, a fixing plate 442 and a net surface 443, wherein the supporting plate 441 is flat and has dust-proof holes uniformly distributed in the middle; the four sides of the fixing plate 442 are bent, and dust-proof holes are uniformly distributed in the middle of the fixing plate, so that the mesh 443 can be wrapped in the fixing plate; the supporting plate 441 and the fixing plate 442 are fixedly connected together by screws to form the dust screen 440. Therefore, the mesh surface 443 can be detached and replaced in the subsequent cleaning process, and the cleaning is more convenient.

More preferably, as shown in fig. 12 and 13, the dust screen 440 is drawably installed at the base 16 according to an embodiment of the present application. To achieve this function, the heat dissipation chamber 12 is provided with a positioning device 123 for installing the dust screen 440, and the positioning device 123 includes: an upper guide groove 1231, a lower guide groove 1232, and a fixing post 1233, the upper guide groove 1231 being located on the lower surface of the partition plate 20, the lower guide groove 1232 being located on the bottom surface of the base 16, the upper guide groove 1231 and the lower guide groove 1232 being on the same plumb surface, the fixing post 1233 being located on the bottom surface of the base 16, adjacent to the lower guide groove 1232; the bent sections 4411 at the sides of the supporting plate 441 can be inserted into the upper guide groove 1231 and the lower guide groove 1232 and can be moved therein in a pulling manner; one end of the supporting plate 441 is provided with a bending segment 4411, and when the bending segment 4411 is fixed on the fixing column 1233, the dust-proof component 44 is fixed on the positioning device 123. Therefore, when dust on the dust screen 440 needs to be cleaned, the dust screen 440 can be drawn out only by releasing the fixed relationship between the bending section 4411 and the fixing column 1233; so that the dust screen 440 can be cleaned more simply and quickly.

In summary, the housing 10 is divided into the mounting chamber 11 and the heat dissipation chamber 12 by the partition 20; the main board 30 is installed in the installation chamber 11, the heat dissipation device 40 is installed in the heat dissipation chamber 12, dust entering the heat dissipation chamber is blocked by the partition plate 20 and cannot enter the installation chamber 11, and the main board 30 is protected from being corroded by the dust; thus, when the main board 30 generates heat, the heat is conducted to the partition board 20 through the heat conducting member 43, then the partition board 20 conducts the heat to the heat dissipation chamber 12 through the lower surface of the wave-shaped scaly heat dissipation surface 421, and finally, the heat is conducted out of the heat dissipation chamber through air convection generated by the fan 41, so as to complete heat dissipation; meanwhile, the dust-proof member 44 divides the heat dissipation chamber 12 into the air inlet area 121 and the air outlet area 122, and the fan 41 is disposed in the air outlet area 122; dust in the air entering the air inlet area 121 is filtered by the dust-proof member 44 in the air inlet area 121, and the fan 41 in the air outlet area 122 is protected from being corroded by the dust.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. An edge computing box, comprising:

a housing having an interior space;

a partition plate disposed within the case to partition the internal space into a mounting chamber and a heat dissipation chamber that are independent of each other;

a main board disposed in the mounting chamber and thermally connected to the partition for conducting heat generated by the main board to the heat dissipation chamber; and

a heat sink disposed in the heat dissipation chamber for dissipating heat conducted via the partition.

2. The edge computing cartridge of claim 1, wherein the housing has an air inlet in communication with the heat dissipation chamber and an air outlet in communication with the heat dissipation chamber, and the heat dissipation device includes a fan for driving air flowing in from the air inlet to flow within the heat dissipation chamber and out from the air outlet to carry away heat conducted via the partition; the fan is mounted on the housing, corresponds to the air outlet, and is used for driving air to flow out of the heat dissipation chamber through the air outlet.

3. The edge computing box of claim 2, wherein the housing comprises a top cover, a front panel, a back panel, and a base; the upper cover is detachably arranged on the base, and the front panel and the rear panel are respectively arranged on the front side and the rear side of the base; the air outlet is located the lateral wall of base, the air intake is located the front panel and/or the rear panel.

4. The edge computing cartridge of claim 3, wherein the partition is integrally connected to the base to form the heat dissipation chamber between a lower surface of the partition and the base and to form the mounting chamber between an upper surface of the partition and the upper cover.

5. The edge computing cartridge of claim 4, wherein the heat sink further comprises a heat sink that is raised to the lower surface of the partition.

6. The edge computing box of claim 5, wherein the heat sink has a wave-scale heat sink surface.

7. The edge computing box of claim 4, wherein the heat sink further comprises a thermal conductor disposed between the motherboard and the upper surface of the partition for conducting heat generated via the motherboard to the partition.

8. The edge computing box of claim 7, wherein the thermal conduction member is a thermal pad attached to the upper surface of the spacer.

9. The edge computing cartridge of claim 3, wherein the heat dissipation device further comprises a dust seal disposed in the housing to separate the heat dissipation chamber into an intake area adjacent the intake opening and an exhaust area adjacent the exhaust opening for filtering air flowing from the intake area into the exhaust area; the fan is located in the air outlet area.

10. The edge computing box of claim 9, wherein the dust shield is a dust mesh that is removably disposed to the base.

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