CN217849760U - Controller - Google Patents

Abstract

The application relates to a controller, which comprises a circuit board, a radiator, a bracket and a power device, wherein the bracket is fixed between the radiator and the circuit board so as to keep an interval between the radiator and the circuit board; the power device is arranged on the side surface of the radiator through a screw or a pressing sheet, or is arranged on one side of the bracket facing the radiator and is in heat conduction contact with the radiator, and the pin of the power device is electrically connected with the circuit board. The controller that this application provided can realize effectively dispelling the heat through power device and radiator heat conduction contact.

Description

Controller

Technical Field

The application relates to the technical field of electrical equipment, in particular to a controller.

Background

The controller comprises a power device and other heating devices, and how to effectively dissipate heat of the heating devices is a technical problem to be solved urgently. For a temperature adjusting system, especially for a temperature adjusting system of a high-power unit, such as an air conditioner, a power device of an outdoor controller of the temperature adjusting system generates heat particularly seriously, and how to dissipate heat of the power device is a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

An object of the present application is to provide a controller to solve the above-mentioned problem of heat dissipation of the power device in the prior art.

The application provides a controller, wherein, include:

a circuit board;

a heat sink;

a bracket fixed between the heat sink and the circuit board to maintain a space between the heat sink and the circuit board;

and the power device is arranged on the surface of the heat radiator through a screw or a pressing sheet.

In one possible implementation, the power device is mounted on a side surface of the heat sink, which is a side surface of the heat sink in the width direction, by a screw or a pressing sheet.

In a possible implementation manner, the power device is mounted on a side of the bracket facing the heat sink and is in heat-conducting contact with the heat sink, and the pins of the power device are electrically connected with the circuit board.

In a possible implementation manner, the heat sink includes a cover plate and a bottom plate, the cover plate is fastened to the bottom plate, a space for installing a refrigerant pipe is formed between the cover plate and the bottom plate, and a first fixing hole is formed in the bottom plate;

the controller also comprises an elastic pressing sheet and a screw, the elastic pressing sheet is arranged on the bracket, the bottom surface of the power device is abutted against the elastic pressing sheet, and the top surface of the power device is abutted against the bottom plate through the elastic pressing sheet; the elastic pressing sheet is provided with a second fixing hole, a stud of the screw is fastened in the first fixing hole and the second fixing hole, and a nut of the screw is tightly pressed on one side, facing the cover plate, of the bottom plate.

In a possible implementation manner, the elastic pressing sheet includes a fixed portion and an elastic portion, the fixed portion is mounted on the bracket, two ends of the fixed portion are respectively connected with one of the elastic portions, and each of the elastic portions is respectively abutted against one of the power devices;

the second fixing hole is arranged on the fixing part, and a buffer space is arranged below the fixing part;

one end of the elastic part, which is far away from the fixed part, is arranged in a suspended manner.

In one possible implementation, the elastic portion has an arc portion that is arched in a direction of the heat sink.

In a possible implementation manner, at least one placing groove and a plurality of grooves for mounting the power device are arranged on the bracket, and each placing groove is arranged between two adjacent grooves for mounting the IGBT or the diode;

the elastic pressing sheets are mounted on the placing grooves, and at least part of each elastic part is positioned in a groove for mounting the IGBT or the diode.

In a possible implementation manner, a limiting rib is arranged in the placing groove, and the limiting rib is abutted against the inner wall of the fixing part.

In a possible implementation manner, a heat dissipation window is arranged in a groove for installing the IPM or the rectifier bridge, and the heat dissipation window penetrates through the bracket.

In a possible implementation manner, the controller further comprises a thermistor, the bracket is provided with U-shaped grooves, and the part of the bracket between the U-shaped grooves is formed into an elastic structure;

the elastic structure is provided with a through hole, and a pin of the thermistor is connected to the circuit board through the through hole.

In a possible implementation manner, a limiting groove is arranged on the elastic structure, and the through hole is arranged in the limiting groove;

the depth of the limiting groove is smaller than the height of the thermistor.

In a possible implementation manner, a recessed structure is arranged at the bottom of the bracket, and a mounting space for mounting components is formed between the bracket and the circuit board through the recessed structure.

In a possible realization, the top of the bracket is provided with a stress slot.

In a possible implementation manner, the support is provided with a positioning column, the bottom plate is provided with a positioning hole, and the positioning column is inserted and matched with the positioning hole.

In a possible implementation manner, a limit rib is arranged at the edge of the support, the limit rib protrudes out of the top of the support, and the bottom plate abuts against the inner side of the limit rib.

In a possible implementation manner, a plurality of mounting holes are formed in the cover plate, and centers of the plurality of mounting holes are not in the same straight line along a length direction of the cover plate.

The technical scheme provided by the application can achieve the following beneficial effects:

the application provides a controller, power device can realize effectively dispelling the heat with radiator heat conduction contact.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

FIG. 1 is an exploded view of a controller provided in accordance with an embodiment of the present application;

FIG. 2 is a side view of a controller provided in one embodiment of the present application;

FIG. 3 is a top view of a controller provided in one embodiment of the present application;

FIG. 4 is an exploded view of a controller provided in accordance with another embodiment of the present application;

FIG. 5 is a schematic view of the structure of the elastic pressing sheet;

FIG. 6 is a schematic structural view of a stent;

FIG. 7 is a top view of the bracket;

FIG. 8 isbase:Sub>A cross-sectional view at A-A of FIG. 7;

FIG. 9 is an enlarged view at B in FIG. 6;

FIG. 10 is a side view of the bracket;

fig. 11 is a top view of a heat sink.

Reference numerals:

1-a circuit board;

2-a scaffold;

21-a groove;

211-a heat dissipation window;

22-placing the groove;

221-limiting ribs;

23-a U-shaped slot;

24-an elastic structure;

241-a limiting groove;

242-perforation;

25-a locating post;

26-a recessed structure;

27-stress groove;

28-limiting flange;

3-a radiator;

31-a cover plate;

32-a bottom plate;

321-a first fixing hole;

33-refrigerant pipes;

4-a power device;

41-a rectifier bridge;

42-a diode;

43-IGBT；

44-IPM；

5-elastic tabletting;

51-a fixed part;

511-a second fixing hole;

512-buffer space;

52-an elastic portion;

521-an arc-shaped part;

6-a thermistor;

7-a screw;

y-width direction.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Detailed Description

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element through intervening elements.

In a controller requiring heat dissipation of power devices, in order to reduce space, the power devices such as IGBTs and diodes are generally placed in a straight line and on the front side of a PCB board, between the PCB board and a heat sink. At this moment, the power device needs to be fixed at the bottom of the radiator through the pressing sheet and the screw from the lower part, and the avoiding hole of the screw needs to be formed in the PCB in the installation mode, so that the wiring and the layout of the PCB are not facilitated. In addition, when the controller is applied to an air conditioner and uses a refrigerant for heat dissipation, the mode needs to avoid a groove for placing a refrigerant pipe on the radiator during installation, otherwise, a cut is generated to easily cut the refrigerant pipe; specifically, the refrigerant pipe may be a copper pipe or an aluminum pipe.

The embodiment of the application provides a controller, which can be applied to the field of air conditioners, in particular to an air conditioner controller, and comprises a circuit board 1, a radiator 3, a bracket 2 and a power device 4. Wherein, the bracket 2 is fixed between the heat sink 3 and the circuit board 1 so as to keep a space between the heat sink 3 and the circuit board 1. The circuit board 1 can be a hard PCB; the heat sink 3 and the circuit board 1 are kept at an interval, so that the power device 4 can be conveniently mounted and arranged on one hand, and the heat dissipation of the power device 4 is facilitated on the other hand.

Wherein, the power device 4 is installed on the side surface of the heat sink 3 or the side of the bracket 2 facing the heat sink 3, and the pin of the power device 4 is electrically connected with the circuit board 1. It should be noted that, in a scenario, the power device may be disposed between the heat sink and the circuit board, and the heat sink and the power device are sequentially fixed to the bottom of the heat sink through screws from below the circuit board. Therefore, avoiding holes need to be formed in a circuit board (such as a PCB), which is not beneficial to the layout of the PCB; in addition, if a refrigerant heat dissipation mode is used, refrigerant pipes (such as copper pipes) used for transmitting refrigerants are arranged in the radiator, the bottom of the radiator is thin, and when screws are screwed at the bottom of the radiator, if screw holes are not accurately positioned or the screws are not accurately driven into the radiator, the screws easily cause the bottom of the radiator to break and damage the copper pipes.

Therefore, as shown in fig. 1 to 3, in an embodiment of the present application, the power device 4 may not be placed between the heat sink 3 and the circuit board 1, but the power device 4 is installed on the side surface of the heat sink 3, the power device 4 may be installed on the heat sink 3 first, and then the heat sink 3 is installed on the circuit board 1, or the heat sink 3 may be installed on the circuit board 1 first, and then the power device 4 is installed on the heat sink 3, so that the installation manner of the power device 4 is more flexible, the assembly position between the power device 4 and the heat sink 3 is easily determined, and is not blocked by the devices such as the circuit board 1, and the installation accuracy of the power device 4 can be reliably ensured, and the circuit board does not need to be modified by forming an avoiding hole, and the like, and the refrigerant pipe 33 inside the heat sink 3 can also be prevented from being damaged. When the heat sink 3 is assembled with the circuit board 1, a surface of the heat sink 3 on which the power device 4 is mounted may be perpendicular to the circuit board 1 or parallel to the circuit board 1, and a specific mounting posture of the heat sink 3 may be determined according to an actual mounting environment, which is not limited in this embodiment.

In another embodiment, as shown in fig. 4, the power device 4 may also be mounted on the bracket 2 on a side facing the heat sink 3, and the heat conduction is achieved by the support of the bracket 2 abutting against the heat sink 3, wherein the bracket 2 may be fixedly mounted with the circuit board 1 and the heat sink 3, so that the power device 4 on the bracket 2 may abut against the heat sink 3, and the insufficient creepage distance and the damage of the heat sink 3 caused by using screws may be avoided.

As shown in fig. 3, the heat sink 3 includes a housing, and the power device 4 is fixed to a side surface of the housing, which is a side surface of the housing in the width direction Y, by a screw or a pressing sheet. The shell specifically comprises a cover plate 31 and a bottom plate 32, wherein the cover plate 31 is buckled on the bottom plate 32, a space for installing a refrigerant pipe 33 is formed between the cover plate 31 and the bottom plate 32, the refrigerant pipe 33 is generally a U-shaped pipe, and the width direction of the U-shaped pipe is the width direction Y of the shell. Specifically, the side surface of the base plate 32 may have a hole for mounting a screw, and the power device 4 may be directly fixed on the base plate 32 by a screw or a pressing plate, so as to facilitate the mounting of the power device 4 and ensure the position accuracy of the mounting of the power device 4.

As a specific implementation manner, as shown in fig. 4, the heat sink 3 includes a cover plate 31 and a bottom plate 32, the cover plate 31 is fastened to the bottom plate 32, a space for installing the refrigerant pipe 33 is formed between the cover plate 31 and the bottom plate 32, and the bottom plate 32 is provided with a first fixing hole 321. The controller further comprises an elastic pressing sheet 5 and a screw 7, the elastic pressing sheet 5 is installed on the support 2, the bottom surface of the power device 4 is abutted to the elastic pressing sheet 5, and the top surface of the power device 4 is abutted to the bottom plate 32 through the elastic pressing sheet 5, so that the heat dissipation surface of the power device 4 is in heat conduction contact with the bottom plate 32, and the heat dissipation effect on the power device 4 is achieved. The elastic pressing sheet 5 is provided with a second fixing hole 511, the stud of the screw 7 is fastened in the first fixing hole 321 and the second fixing hole 511, and the nut of the screw 7 is pressed on one side of the bottom plate 32 facing the cover plate 31. That is, the screw 7 may be fastened in the second fixing hole 511 through the first fixing hole 321 from a side of the bottom plate 32 toward the cover plate 31. By tightening the screw 7, the elastic pressing piece 5 is pulled toward the base plate 32, so that the elastic pressing piece 5 presses the power device 4 against the base plate 32.

When the controller is assembled, the elastic pressing sheet 5 can be placed at a set position on the bracket 2, the power device 4 is placed at a set position on the elastic pressing sheet 5, the bottom plate 32 of the heat sink 3 is placed above the power device 4, the bottom plate 32 is pressed on the power device 4, meanwhile, the first fixing hole 321 can be aligned with the second fixing hole 511 on the elastic pressing sheet 5, the screw 7 is used for being installed from one side above the bottom plate 32 to the direction of the bracket 2, namely, the screw 7 penetrates through the first fixing hole 321 on the bottom plate 32 and then is screwed in the second fixing hole 511 of the elastic pressing sheet 5, so that the power device 4 can be pressed on the bottom plate 32 through the elastic pressing sheet 5, and the heat dissipation effectiveness of the heat sink 3 on the power device 4 is ensured. It should be emphasized that the screw 7 is installed from the side of the bottom plate 32 departing from the bracket 2 to the direction of the bracket 2, and after the bottom plate 32 and the elastic pressing sheet 5 are installed, the bottom plate 32, the cover plate 31 and the refrigerant pipe 33 in the heat sink 3 can be assembled, so that the damage of the screw 7 to the refrigerant pipe 33 in the installation process is completely avoided.

In addition, after the heat sink 3, the power device 4, the elastic pressing sheet 5 and the bracket 2 are assembled, the whole can be turned by 180 degrees so as to connect the circuit board 1 to the bracket 2 and the heat sink 3 from the back of the circuit board 1, thereby completing the assembly of the controller.

Specifically, as shown in fig. 5, the elastic pressing piece 5 includes a fixed portion 51 and elastic portions 52, the fixed portion 51 is mounted on the bracket 2, two ends of the fixed portion 51 are respectively connected with one elastic portion 52, and each elastic portion 52 is respectively abutted with one power device 4. The second fixing hole 511 is disposed in the fixing portion 51, and a buffer space 512 is disposed below the fixing portion 51. One end of the elastic part 52 far from the fixed part 51 is suspended.

This elasticity preforming 5 can be integrated into one piece structure, fixed part 51 can guarantee that elasticity preforming 5 installs on support 2 reliably, elasticity portion 52 has certain elastic deformation's ability, under natural condition, the one end of keeping away from fixed part 51 on the elasticity portion 52 can unsettled setting, when radiator 3 presses power device 4 in the top of elasticity portion 52, elasticity portion 52 takes place elastic deformation and produces elasticity, make the top of power device 4 butt closely on the bottom plate 32 of radiator 3, thereby the validity of power device 4 with the contact of radiator 3 has been guaranteed, the radiating effect has been guaranteed. By providing the buffer space 512 below the fixing portion 51, when the bottom plate 32 and the elastic pressing plate 5 are fastened by using a screw, a portion of the screw can penetrate out of the second fixing hole 511 into the buffer space 512, so as to prevent the bracket 2 from being scratched due to the screw contacting the bracket 2.

As shown in fig. 5, the elastic portion 52 has an arc portion 521 arched toward the heat sink 3, and the arc portion 521 can improve the reliability of the contact between the elastic portion 52 and the power device 4, that is, when the elastic portion 52 slightly swings, a certain position on the arc portion 521 can still be in contact with the power device 4, so as to ensure that the power device 4 can be pressed against the heat sink 3 by the elastic portion 52. In addition, the elastic pressing sheet 5 can simultaneously compress the two power devices 4 without designing a special elastic sheet for each power device 4, so that the structure is simplified, the space is saved, and the arrangement of components is more compact.

In addition, the elastic pressing piece 5 may be designed to be used for pressing and fixing only one power device, that is, the elastic pressing piece 5 has the elastic portion 52 only on one side, which is not limited in this embodiment.

Specifically, as shown in fig. 4 and fig. 6, at least one placing groove 22 and a plurality of grooves 21 for mounting the Power device 4 are provided on the support 2, wherein the Power device 4 may have various types, such as Insulated Gate Bipolar Transistor (IGBT), diode 42, rectifier bridge 41, intelligent Power Module (IPM), etc., and each placing groove 22 is provided between two adjacent grooves 21 for mounting the IGBT or the diode; the elastic pressing pieces 5 are mounted to the placement grooves 22, and at least a part of each elastic portion 52 is located in one of the grooves 21 for mounting the IGBT43 or the diode 42.

The groove 21 can realize the positioning of the power device 4, the shape of the groove 21 can correspond to the shape of the power device 4, the depth of the groove 21 is smaller than the thickness of the power device 4, and at least part of the power device 4 can protrude out of the groove 21 to realize the abutting joint with the heat sink 3. In which, the placing slot 22 is disposed at a position between two adjacent recesses 21 for mounting the IGBT43 or the diode 42, so that the elastic portions 52 on both sides of one elastic pressing piece 5 can respectively press the IGBT43 or the diode 42 in different recesses 21 against the heat sink 3. Wherein, the placing slot 22 can prevent the elastic pressing sheet 5 from moving and ensure the stability of the elastic pressing sheet 5.

The IGBT43 and the diode 42 generally have screw holes for inserting screws, and conventionally, the IGBT and the diode are generally fixed to a heat sink by fitting screws into the screw holes. In this embodiment, by using the elastic pressing piece 5, the IGBT43 and the diode 42 can be pressed against the insulating tape or the insulating sheet on the heat sink 3 by the elastic force of the elastic pressing piece 5 without using screws for fastening, so that the problem of insufficient creepage distance does not occur. Wherein, be provided with insulating sticky tape or insulating piece in the position department relative with power device on the radiator 3, can solve the not enough problem of creepage distance through the cooperation of elasticity preforming 5 and insulating sticky tape or insulating piece. Wherein, the insulating tape and the insulating sheet have good heat-conducting property.

The support 2 in the embodiment of the application is of an integral structure, and is convenient to process, manufacture and install. Of course, the rack may be designed for each power device 4 independently, i.e. each rack is used for mounting only one power device 4.

As shown in fig. 6, the positioning groove 22 may be provided with a stopper rib 221, and the stopper rib 221 abuts against an inner wall of the fixing portion 51. After the elastic pressing piece 5 is placed in the placing groove 22, the buffer space 512 can be sleeved on the periphery of the limiting rib 221, the fixing portion 51 can be abutted against the limiting rib 221, limitation is achieved, installation of the elastic pressing piece 5 is facilitated, and the elastic pressing piece 5 can be prevented from shaking randomly.

Specifically, as shown in fig. 4, 6, and 7, a heat radiation window 211 may be provided in the groove 21 for mounting the IPM44 or the rectifier bridge 41, the heat radiation window 211 penetrating the bracket 2. The power device 4, such as the rectifier bridge 41 and the IPM44, which are main heat generating modules, may have a heat dissipating window 211 disposed in the groove 21 for mounting the rectifier bridge 41 and the IPM44, so that heat may be dissipated through the heat sink 3, and further heat dissipation may be achieved through the heat dissipating window 211, thereby preventing heat from accumulating in the groove 21 for mounting the rectifier bridge 41 and the IPM 44.

Some controllers do not have a device for collecting the temperature of the IGBT43, which is not beneficial to software monitoring and control, and because the existing devices are narrow in arrangement space, there is no space for arranging other detection devices. In this embodiment, as shown in fig. 4, 6, 7 and 9, the controller further includes a thermistor 6, U-shaped grooves 23 are formed on the bracket 2, an elastic structure 24 is formed on the bracket 2 at a position between the U-shaped grooves 23, a through hole 242 is formed on the elastic structure 24, and a pin of the thermistor 6 is connected to the circuit board 1 through the through hole 242.

Wherein, the elastic structure 24 is a part of the bracket 2, and due to the arrangement of the U-shaped groove 23, only one end of the elastic structure 24 is connected with other parts of the bracket 2, so that the elastic structure 24 can be slightly elastically deformed in the penetrating direction of the U-shaped groove 23 under the condition of being pressed. Specifically, the elastic structure 24 is disposed in the groove 21 for mounting the IGBT43, before the IGBT43 is mounted, the pin of the thermistor 6 may first pass through the through hole 242 on the elastic structure 24, then the IGBT43 may be placed in the groove 21, the bottom of the IGBT43 may be pressed on the thermistor 6, the top of the IGBT43 may be abutted against the heat sink 3, the heat sink 3 may press the IGBT43 thermistor 6, at this time, the elastic structure 24 is pressed to generate elastic deformation, and generate elastic force, which may enable the thermistor 6 to be reliably abutted against the IGBT43, thereby ensuring effective contact between the thermistor 6 and the IGBT43, and achieving temperature collection of the IGBT43 by the thermistor 6.

Specifically, as shown in fig. 9, a limiting groove 241 is disposed on the elastic structure 24, the through hole 242 is disposed in the limiting groove 241, and the depth of the limiting groove 241 is smaller than the height of the thermistor 6, which is the height of the thermistor in the arrangement manner shown in fig. 4. Some positions of thermistor 6 can block in spacing groove 241, can prevent through the restraint of spacing groove 241 that thermistor 6 from rocking, and another part position of thermistor 6 can bulge in spacing groove 241 to in with IGBT43 butt.

In addition, the thermistor 6 can also be fixed to the corresponding power device by means of manual welding.

As a specific implementation manner, as shown in fig. 10, a recessed structure 26 is provided at the bottom of the bracket 2, and a mounting space for mounting components is formed between the bracket 2 and the circuit board 1 through the recessed structure 26. This installation space can be convenient for install some paster devices on circuit board 1, has promoted circuit board 1's space utilization, makes the controller realize more functions when having the miniaturization.

As a specific implementation, as shown in fig. 10, the top of the bracket 2 is provided with a stress slot 27. It should be noted that, two ends of the bracket 2 may be portions connected to the circuit board 1 and the heat sink 3, and the bracket 2, the circuit board 1, and the heat sink 3 may be fastened by screwing. When screws are used to tighten the ends of the bracket 2, the entire bracket 2 is subjected to concentrated stress in the middle area, which may cause the bracket 2 to twist or even cause the bracket 2 to break. For this reason, in the present embodiment, the stress concentration can be relieved by providing the stress groove 27 at the top of the bracket 2, and the stress groove 27 may have a groove-like structure extending in the longitudinal direction at the top of the bracket 2.

As a specific implementation manner, as shown in fig. 6 and fig. 8, the support 2 is provided with a positioning column 25, the bottom plate 32 is provided with a positioning hole, and the positioning column 25 is inserted into and matched with the positioning hole. When assembling the controller, can install power device 4 in recess 21 of support 2 earlier, install radiator 3 on support 2 again, and during the installation of radiator 3, can realize the location of radiator 3 and support 2 through the cooperation of reference column 25 and locating hole, guarantee the installation accuracy.

As a specific implementation manner, as shown in fig. 6, the edge of the bracket 2 is provided with a limit rib 28, the limit rib 28 protrudes out of the top of the bracket 2, and the bottom plate 32 abuts against the inner side of the limit rib 28. In the assembly process of the bracket 2 and the radiator 3, the edge of the bottom plate 32 of the radiator 3 can be abutted against the inner side of the limit rib 28, so that the radiator 3 can be prevented from shaking, and the stability of installation is ensured.

As a specific implementation manner, as shown in fig. 11, the cover plate 31 is provided with a plurality of mounting holes, and the centers of the plurality of mounting holes are not aligned on the same line along the length direction of the cover plate 31. The refrigerant pipe 33 for transmitting the refrigerant may be fixed between the cover plate 31 and the bottom plate 32 by engaging the cover plate 31 and the bottom plate 32. If the screws for connecting the cover plate 31 and the bottom plate 32 are arranged in a line, the fastening force of the cover plate 31 and the bottom plate 32 to the refrigerant pipe 33 is too concentrated on a straight line, and the fastening force of the cover plate 31 and the bottom plate 32 at the positions on both sides of the straight line to the refrigerant pipe 33 is small, which easily causes the refrigerant pipe 33 to move. Therefore, in this embodiment, the centers of the mounting holes are not aligned, so that the cover plate 31 and the bottom plate 32 can provide pressing force to the refrigerant pipe 33 at different positions, which is beneficial to improving the reliability of fixing the refrigerant pipe 33.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (12)

1. A controller, comprising:

a circuit board (1);

a heat sink (3);

the bracket (2) is fixed between the heat radiator (3) and the circuit board (1) so that an interval is kept between the heat radiator (3) and the circuit board (1);

the power device (4), the power device (4) is installed on the surface of the heat sink (3) through screws or pressing sheets.

2. The controller according to claim 1, wherein the power device (4) is mounted to a side surface of the heat sink (3) in the width direction (Y) by a screw or a pressing plate.

3. A controller according to claim 1, characterized in that the power device (4) is mounted on the side of the bracket (2) facing the heat sink (3) and is in heat-conducting contact with the heat sink (3), and the pins of the power device (4) are electrically connected to the circuit board (1).

4. The controller according to claim 3, wherein the heat sink (3) comprises a cover plate (31) and a bottom plate (32), the cover plate (31) is fastened to the bottom plate (32), a space for installing a refrigerant pipe (33) is formed between the cover plate (31) and the bottom plate (32), and a first fixing hole (321) is formed in the bottom plate (32);

the controller further comprises an elastic pressing sheet (5) and a screw (7), the elastic pressing sheet (5) is mounted on the support (2), the bottom surface of the power device (4) abuts against the elastic pressing sheet (5), and the power device (4) abuts against the bottom plate (32) through the elastic pressing sheet (5);

the elastic pressing sheet (5) is provided with a second fixing hole (511), a stud of the screw (7) is fastened in the first fixing hole (321) and the second fixing hole (511), and a nut of the screw (7) is pressed on one side, facing the cover plate (31), of the bottom plate (32).

5. The controller according to claim 4, wherein the elastic pressing sheet (5) comprises a fixed part (51) and an elastic part (52), the fixed part (51) is mounted on the bracket (2), two ends of the fixed part (51) are respectively connected with one elastic part (52), and each elastic part (52) is respectively abutted with one power device (4);

the second fixing hole (511) is arranged on the fixing part (51), and a buffer space (512) is arranged below the fixing part (51);

one end of the elastic part (52) far away from the fixed part (51) is arranged in a suspended mode.

6. A control according to claim 5, characterized in that the resilient part (52) has an arcuate part (521) that is arched in the direction of the heat sink (3).

7. The controller according to claim 5, characterized in that the bracket (2) is provided with at least one placement slot (22) and a plurality of grooves (21) for mounting the power device (4), each placement slot (22) is arranged between two adjacent grooves (21) for mounting IGBTs or diodes;

the elastic pressing sheets (5) are mounted on the placing grooves (22), and at least part of each elastic part (52) is positioned in a groove (21) for mounting an IGBT or a diode.

8. The controller according to claim 7, wherein a limiting rib (221) is arranged in the placing groove (22), and the limiting rib (221) is abutted against the inner wall of the fixing part (51).

9. A controller according to claim 7, wherein a heat dissipating window (211) is provided in the recess (21) for mounting the IPM or rectifier bridge, said heat dissipating window (211) extending through said bracket (2).

10. A controller according to any one of claims 4-9, characterized in that the controller further comprises a thermistor (6), the bracket (2) is provided with U-shaped grooves (23), and the parts of the bracket (2) between the U-shaped grooves (23) are formed into elastic structures (24);

the elastic structure (24) is provided with a through hole (242), and the pin of the thermistor (6) is connected to the circuit board (1) through the through hole (242).

11. A control according to claim 10, wherein the resilient structure (24) is provided with a retaining groove (241), the through hole (242) being provided in the retaining groove (241);

the depth of the limiting groove (241) is smaller than the height of the thermistor (6).

12. The controller according to any one of claims 4 to 9, characterized in that a recessed structure (26) is arranged at the bottom of the bracket (2), and a mounting space for mounting components is formed between the bracket (2) and the circuit board (1) through the recessed structure (26); a stress groove (27) is formed in the top of the support (2); a positioning column (25) is arranged on the support (2), a positioning hole is formed in the bottom plate (32), and the positioning column (25) is inserted and matched with the positioning hole; the edge of the bracket (2) is provided with a limiting flange (28), the limiting flange (28) protrudes out of the top of the bracket (2), and the bottom plate (32) is abutted against the inner side of the limiting flange (28); the cover plate (31) is provided with a plurality of mounting holes, and the centers of the mounting holes are not on the same straight line along the length direction of the cover plate (31).

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