CN217838737U - Novel half-cutting device applied to half-cutting of various substrates - Google Patents

Abstract

The utility model discloses a be applied to novel half-cut device of all kinds of base plates half-cut, including the bottom plate, be used for carrying out the cutting assembly of cutting, set up the guide rail subassembly that is used for adjusting cutting assembly cutting position on the bottom plate and set up the base plate base that is used for bearing the weight of the base plate on the bottom plate, guide rail subassembly is including setting up the Y guide rail on the bottom plate, setting up the X guide rail on the Y guide rail and setting up the Z guide rail on the X guide rail, cutting assembly includes clamp splice and the glass sword by the clamp splice centre gripping, the clamp splice is fixed on the sliding block of Z guide rail, the base plate base sets up on the bottom plate, the base plate base includes a locating plate and sets up a plurality of plummer on the locating plate be provided with pressure sensor on the base plate base, pressure sensor is connected with a display device, can realize being applicable to the lobe of different materials base plate's lobe of a leaf demand, prevents that the undersize can's unable mar that splits, or lead to the cracked phenomenon of base plate because of pressure is too big.

Description

Novel half-cutting device applied to half-cutting of various substrates

Technical Field

The embodiment of the utility model provides a relate to base plate half-cut equipment technical field, concretely relates to be applied to novel half-cut device of all kinds of base plates half-cut.

Background

In various industries related to different substrate processing, sample preparation detection is often required for microstructures on a substrate, or operation requirements for semi-slicing different substrates are generated due to other processes, for example, in the production process of an AR optical waveguide lens, verification of microstructures of substrates with different process sections and different materials (such as sample preparation of a scanning electron microscope) is often required, at present, a glass slide carrying overhead substrate is generally used, and a glass cutter is manually used for cutting, and the slicing mode often causes that a cutting surface is easy to be inclined, the section is not flat, and meanwhile, the phenomenon of fragments is easy to occur; this is because the conventional breaking apparatus has the problem that uncontrollable breaking operation occurs in the breaking due to the failure to feed back different stress parameters, and the contact surface is easily worn and slip dislocation easily occurs by merely using the slide to set up the sample.

SUMMERY OF THE UTILITY MODEL

Therefore, the embodiment of the utility model provides a be applied to novel half-cut device of all kinds of base plates half-cut to solve among the prior art because the lobe of a leaf demand that can not adapt to different base plates leads to the cracked problem of the too big base plate of pressure.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the utility model provides a be applied to novel half-cut device of all kinds of base plates half-cut, characterized by: the cutting assembly comprises a base plate, a cutting assembly used for cutting the base plate, a guide rail assembly arranged on the base plate and used for adjusting the cutting position of the cutting assembly, and a base plate base arranged on the base plate and used for bearing the base plate, wherein the guide rail assembly comprises a Y guide rail arranged on the base plate, an X guide rail arranged on the Y guide rail and a Z guide rail arranged on the X guide rail, the cutting assembly comprises a clamping block and a glass cutter clamped by the clamping block, the clamping block is fixed on a sliding block of the Z guide rail, the base plate base is arranged on the base plate, the base plate base comprises a positioning plate and a plurality of bearing tables arranged on the positioning plate, and the bearing tables are fixedly provided with pressure sensors which are connected with a number indicating device.

Furthermore, an overhead area is formed between the positioning plate and the plurality of bearing tables.

Further, the pressure sensor is a membrane pressure sensor.

Further, the film pressure sensor is disposed below the substrate base.

Further, the number indicating device is a voltmeter connected with the pressure sensor.

Furthermore, the X guide rail and the Z guide rail are both hand wheel driving guide rails.

The embodiment of the utility model provides a have following advantage: when the substrate needs to be cut, the positions of the X guide rail and the Y guide rail are adjusted, point location calibration is carried out, namely the position of the glass cutter head is accurately determined, then the Z guide rail is moved to enable the glass cutter head to be in contact with the substrate and apply certain pressure, the corresponding voltage value can be read from the voltmeter, and the applied pressure is determined according to the voltage value so as to meet the requirements of the splinters of different substrates. Under the prerequisite that can satisfy the lobe of a leaf function, the special system base plate microscope carrier that the base plate sample can be maked somebody a mere figurehead is not destroyed in order to protect product surface relief structure in the setting, and install film pressure sensor additional in sample microscope carrier below, through external voltmeter, obtain cut-parts in-process pressure numerical value, according to the pressure numerical value that obtains, adjustment Z axle direction drives the tool bit motion, with the lobe of a leaf demand that is applicable to different material base plates, prevent the unable mar that splits of pressure undersize, or because of the too big cracked phenomenon of base plate that leads to of pressure.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.

Fig. 1 is a schematic overall structure diagram of a novel half-cutting device applied to half-cutting of various substrates according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a substrate base structure of a novel half-cutting device applied to half-cutting of various substrates provided by the embodiment of the present invention.

In the figure: 1. a base plate; 2. a substrate; 31. a Y guide rail; 32. an X guide rail; 33. a Z-rail; 41. a clamping block; 42. a glass cutter; 5. a substrate base; 51. positioning a plate; 52. a bearing platform; 6. a pressure sensor; 7. a voltmeter.

Detailed Description

The present invention is described in detail with reference to the specific embodiments, and other advantages and effects of the present invention will be apparent to those skilled in the art from the disclosure herein. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

The embodiment is as follows: the utility model provides a be applied to novel half-cut device of all kinds of base plates half-cut, as shown in figure 1, including bottom plate 1, be used for carrying out the cutting subassembly of cutting to base plate 2, set up the guide rail subassembly that is used for adjusting cutting subassembly cutting position on bottom plate 1 and set up the base plate base 5 that is used for bearing base plate 2 on bottom plate 1. The guide rail assembly comprises two Y guide rails 31 arranged on the bottom plate 1, an X guide rail 32 arranged on the Y guide rail 31 and a Z guide rail 33 arranged on the X guide rail 32, in the embodiment, the number of the Y guide rails 31 is two, the number of the X guide rails 32 and the number of the Z guide rails 33 are one, the two Y guide rails 31 are respectively fixed on two sides of the bottom plate 1 and are parallel to each other, sliding blocks on the Y guide rails 31 are symmetrically arranged, two ends of the X guide rails 32 are respectively fixed on the sliding blocks of the two Y guide rails 31, and the X guide rails 32 are driven by the sliding blocks of the two Y guide rails 31 to move along the directions of the two Y guide rails 31; the Z guide rail 33 is fixed on the sliding block of the X guide rail 32, and is driven by the sliding block of the X guide rail 32 to move in the vertical direction of the two Y guide rails 31; sliding blocks are also arranged on the Z guide rail 33, and the sliding blocks on the Z guide rail 33 can move up and down along the direction vertical to the bottom plate 1. In this embodiment, the Y guide rail 31 is preferably a motor-driven guide rail, and the X guide rail 32 and the Z guide rail 33 are both hand wheel-driven guide rails, which are convenient for control.

The cutting assembly comprises a clamping block 41 and a glass cutter 42 arranged on the clamping block 41, the clamping block 41 is fixed on a sliding block of a Z guide rail 33 and is driven by the sliding block of the Z guide rail 33 to move, the glass cutter 42 is arranged on the clamping block 41 and is clamped by the clamping block 41, and the cutter head of the glass cutter 42 is reversely perpendicular to the bottom plate 1.

Referring to fig. 1 and 2, the substrate base 5 is disposed on the bottom plate 1, the substrate base 5 includes a positioning plate 51 and a bearing platform 52 disposed on the positioning plate 51, the positioning plate 51 and the bearing platform 52 form the substrate base 5 of the overhead substrate 2, i.e., a large space is left between the substrate 2 and the positioning plate 51, and the substrate base 5 can be designed according to actual conditions to form different overhead areas to adapt to the substrates 2 with different shapes and types due to different shapes and types of the substrates 2. In the present embodiment, taking the most common square substrate 2 as an example, the two elongated carriers 52 with a square cross section are disposed on the carrier 52, and are respectively fixed on the positioning plate 51 in parallel, and the substrate 2 with cutting is placed on the two carriers 52, so as to form an overhead area between the substrate 2 and the positioning plate 51, thereby facilitating the cutting of the substrate 2.

A pressure sensor 6 for testing the bearing pressure of the substrate 2 is further fixedly disposed above the bearing table 52, in this embodiment, the pressure sensor 6 is preferably a film pressure sensor disposed below the positioning plate 51 for detecting the pressure borne by the substrate 2 when the glass cutter 42 is pressed against the substrate 2 and the substrate 2 is cut, in this embodiment, the film pressure sensor is further connected to a voltmeter 7 for evaluating the pressure borne by the substrate 2 according to the display indication of the voltmeter 7. The pressure sensors 6 include but are not limited to film pressure sensors, and may also be pressure sensors 6 of other types, which are all disposed on the substrate base 5 and may be disposed above the bearing table 52, as long as the pressure applied to the test substrate 2 can be realized, and no limitation is made herein. The voltmeter 7 may alternatively be replaced by other devices for indicating the pressure applied to the substrate 2, and is not limited herein. When the Z guide rail 33 is a guide rail driven by a precision motor such as a servo motor, the pressure sensor 6 is directly connected to the servo motor, and the movement of the Z guide rail 33 is controlled according to a preset threshold of the servo motor.

When the substrate 2 needs to be cut, the positions of the X guide rail 32 and the Y guide rail 31 are adjusted, point location calibration is performed, that is, the position of the tool bit of the glass knife 42 is accurately determined, then the Z guide rail 33 is moved to enable the tool bit of the glass knife 42 to contact the substrate 2 and apply a certain pressure, after the substrate base 5 bears the pressure, the film pressure sensor senses the pressure and transmits a signal, a corresponding voltage value can be read from the voltmeter 7, and the applied pressure is determined according to the voltage value, so that the substrate 2 splitting requirements of different substrates are met. Under the prerequisite that can satisfy the lobe of a leaf function, the purpose-built base plate base 5 that sets up 2 samples of base plate that can make somebody a mere figurehead is not destroyed in order to protect product surface relief structure, and install film pressure sensor additional in sample microscope carrier below, through external voltmeter 7, obtain the pressure numerical value of cut-parts in-process, according to the pressure numerical value that obtains, adjustment Z axle direction drives the tool bit motion, with the lobe of a leaf demand that is applicable to different material base plates 2, prevent the unable mar that splits of pressure undersize from appearing, or lead to the cracked phenomenon of base plate 2 because of pressure is too big.

Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims (6)

1. The utility model provides a be applied to novel half-cut device of all kinds of base plates half-cut, characterized by: including bottom plate (1), be used for carrying out the cutting subassembly of cutting to base plate (2), set up be used for the adjustment on bottom plate (1) the guide rail subassembly of cutting subassembly cutting position and setting are in be used for bearing on bottom plate (1) base plate (5) of base plate (2), guide rail subassembly is including setting up Y guide rail (31) on bottom plate (1), setting are in X guide rail (32) on Y guide rail (31) and setting are in Z guide rail (33) on X guide rail (32), cutting subassembly includes clamp splice (41) and by glass sword (42) of clamp splice (41) centre gripping, clamp splice (41) are fixed on the sliding block of Z guide rail (33), base plate base (5) set up on bottom plate (1), base plate (5) are including a locating plate (51) and setting up a plurality of plummer (52) on locating plate (51) be provided with pressure sensor (6) on base plate (5), pressure sensor (6) are connected with a registration device.

2. The novel half-cutting device applied to half-cutting of various substrates as claimed in claim 1, wherein: an overhead area is formed between the positioning plate (51) and the bearing tables (52).

3. The novel half-cutting device applied to the half-cutting of various substrates as claimed in claim 1, wherein: the pressure sensor (6) is a film pressure sensor.

4. The novel half-cutting device applied to half-cutting of various substrates as claimed in claim 3, wherein: the film pressure sensor is arranged below the substrate base (5).

5. The novel half-cutting device applied to the half-cutting of various substrates as claimed in claim 1, wherein: the number indicating device is a voltmeter (7) connected with the pressure sensor (6).

6. The novel half-cutting device applied to the half-cutting of various substrates as claimed in claim 1, wherein: the X guide rail (32) and the Z guide rail (33) are both hand wheel driving guide rails.

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