CN217830835U - ESOP packaging component height detection tool - Google Patents
ESOP packaging component height detection tool Download PDFInfo
- Publication number
- CN217830835U CN217830835U CN202222105049.6U CN202222105049U CN217830835U CN 217830835 U CN217830835 U CN 217830835U CN 202222105049 U CN202222105049 U CN 202222105049U CN 217830835 U CN217830835 U CN 217830835U
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- esop
- bottom plate
- chimb
- height detection
- detection tool
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Abstract
The utility model discloses semiconductor testing field, especially an ESOP packaging element height detection instrument, including the bottom plate, set up first chimb in one side of bottom plate, set up the second chimb at the opposite side of bottom plate, first chimb passes through the connecting strip with the second chimb and is connected, and one side of connecting strip is the inclined plane, sets up the opening at first chimb, and the distance of establishing between connecting strip and the bottom plate is D, and the height of ESOP packaging element plastic-sealed body is h, then D = h +0.1mm. The utility model discloses a to ESOP encapsulation component height's short-term test, productivity ratio has been improved.
Description
Technical Field
The utility model belongs to the semiconductor testing field, especially a ESOP encapsulates component height detection instrument.
Background
After the ESOP packaging element is manufactured, height detection is needed, and the reason is that pins of some ESOP packaging elements can be warped, so that the ESOP packaging elements are high on one side and low on the other side, and the false soldering condition is easily caused.
Disclosure of Invention
In order to overcome the defect of the prior art, the utility model provides an ESOP encapsulates component height and detects instrument has realized having improved productivity ratio to the short-term test of ESOP encapsulation component height. The utility model discloses the technical problem that solve is realized through following technical scheme:
the utility model provides a ESOP packaging element height detection instrument, includes the bottom plate, sets up first chimb in one side of bottom plate, sets up the second chimb at the opposite side of bottom plate, and first chimb passes through the connecting strip with the second chimb to be connected, and one side of connecting strip is the inclined plane, sets up the opening at first chimb, and it is D to establish the distance between connecting strip and the bottom plate, and ESOP packaging element plastic-sealed body's height is h, then D = h +0.1mm.
Furthermore, a groove is arranged at the joint of the first convex edge and the inclined surface.
Specifically, the groove is provided below the opening.
Specifically, the groove forms a second slope.
Preferably, the lower end face of the bottom plate is connected with the motor through a connecting rod.
Preferably, the included angle between the bottom plate and the horizontal plane is 15-50 degrees.
The utility model discloses a to ESOP packaging element height's short-term test, productivity ratio has been improved.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a bottom view of FIG. 1;
FIG. 3 is a left side view of FIG. 1;
fig. 4 is a schematic view of the connection between the present invention and the motor.
Detailed Description
Fig. 1 is a schematic structural view of the present invention; FIG. 2 is a bottom view of FIG. 1; FIG. 3 is a left side view of FIG. 1; as shown in fig. 1 to fig. 3, a tool for detecting the height of an ESOP package device includes a bottom plate 1, a first convex edge 2 is disposed on one side of the bottom plate 1, a second convex edge 3 is disposed on the other side of the bottom plate 1, the first convex edge 2 is connected to the second convex edge 3 through a connecting strip 4, one side of the connecting strip 4 is a slope 4.1, an opening 2.1 is disposed on the first convex edge 2, a distance between the connecting strip 4 and the bottom plate 1 is D, a height of an ESOP package device plastic package body is h, and then D = h +0.1mm.
Set up recess 5 in the department that is connected of first chimb 2 and inclined plane 4.1, recess 5 sets up in opening 2.1's below, and recess 5 forms second inclined plane 5.1, the utility model discloses inclined plane 4.1's effect blocks the defective products on inclined plane 4.1 to slide away from opening 2.1, and recess 5's effect makes the defective products slide away from opening 2.1 more easily.
Fig. 4 is the connection diagram with the motor of the present invention, as shown in fig. 4, the lower end surface of the bottom plate 1 is connected to the motor 7 through the connecting rod 6, the included angle a between the bottom plate 1 and the horizontal is 15 ° -50 °, the included angle a of the present embodiment is 30 °, and the motor 7 is utilized to drive the bottom plate 1 to vibrate, so that the ESOP package element can pass through the bottom plate 1 more easily.
Through the utility model discloses ESOP encapsulation component height detection instrument detects the back to the product, detects by board image recognition again, and the yield reaches 100%.
In a word, the utility model discloses a to ESOP packaging element height's quick detection, improved productivity ratio.
Claims (6)
1. The utility model provides a ESOP packaging element height detection instrument, characterized by includes the bottom plate one side of bottom plate sets up first chimb the opposite side of bottom plate sets up the second chimb, first chimb passes through the connecting strip with the second chimb and is connected, one side of connecting strip is the inclined plane first chimb sets up the opening, establishes distance between connecting strip and the bottom plate is D, the height of ESOP packaging element plastic-sealed body is h, then D = h +0.1mm.
2. The ESOP package height detection tool of claim 1, wherein a groove is formed at a connection point of the first convex edge and the inclined surface.
3. The ESOP package height detection tool of claim 2, wherein the groove is disposed below the opening.
4. The ESOP package component height detection tool of claim 2, wherein the groove forms a second slope.
5. The ESOP package component height detection tool of claim 1, wherein the lower end surface of the base plate is connected to a motor through a connecting rod.
6. The ESOP package height detection tool of claim 5, wherein the bottom plate is angled from 15 ° to 50 ° from horizontal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222105049.6U CN217830835U (en) | 2022-08-10 | 2022-08-10 | ESOP packaging component height detection tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222105049.6U CN217830835U (en) | 2022-08-10 | 2022-08-10 | ESOP packaging component height detection tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217830835U true CN217830835U (en) | 2022-11-18 |
Family
ID=84013724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222105049.6U Active CN217830835U (en) | 2022-08-10 | 2022-08-10 | ESOP packaging component height detection tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217830835U (en) |
-
2022
- 2022-08-10 CN CN202222105049.6U patent/CN217830835U/en active Active
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