CN217825820U - Heat dissipation device of intelligent head-mounted product and intelligent head-mounted product - Google Patents
Heat dissipation device of intelligent head-mounted product and intelligent head-mounted product Download PDFInfo
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- CN217825820U CN217825820U CN202221843748.4U CN202221843748U CN217825820U CN 217825820 U CN217825820 U CN 217825820U CN 202221843748 U CN202221843748 U CN 202221843748U CN 217825820 U CN217825820 U CN 217825820U
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Abstract
This paper discloses heat abstractor and intelligent head-mounted product of product are worn to intelligence belongs to smart machine technical field, and this heat abstractor includes: the heat dissipation structure comprises a micro fan and heat dissipation fins, wherein the heat dissipation fins are tightly connected with a heating body on a PCB (printed circuit board) through a heat conduction material, an air outlet of the micro fan is connected with an air inlet end of the heat dissipation fins, and a through air channel is formed between an air inlet of the micro fan and an air outlet end of the heat dissipation fins; through the design of the micro fan, the radiating fins and the air channels which are sealed at the periphery, a heat exchange system is constructed in a limited product space, and quick heat exchange between the inner space of the product and the outer space of the product is realized, so that the effect of reducing the temperature of the whole product is achieved, and the user experience is improved.
Description
Technical Field
This paper belongs to smart machine technical field, especially relates to a heat abstractor and intelligent head-mounted product of product are worn to intelligence.
Background
With the use of intelligent head-mounted products such as AR/VR in various fields becoming more and more extensive, people focus on such products and gradually turn to the comfort of wearing the products from the product function of earlier stage. As intelligent head-mounted products generally need to run an intelligent operating system, the capability requirements on the processor are increasing with the increasing level of various application algorithms. And the treater is calculated the power and is promoted, has also brought the chip and has generated heat and lead to the problem that whole product generates heat, if the heat of gathering on the chip can't be dispelled rapidly, not only can influence the functioning speed of chip, also can lead to wearing the product whole temperature more and more high to influence the comfort level that the product was worn.
The existing head-wearing product has small internal space, and the heat dissipation scheme adopted generally is to coat heat conduction gel on the surface of a chip and rapidly conduct the heat of the chip to other places through large-area heat conduction materials (such as copper foils, graphite sheets, temperature equalization plates and the like) to play a role in reducing the highest temperature of the chip.
SUMMERY OF THE UTILITY MODEL
This paper lies in providing heat abstractor and intelligent head-mounted product of product are worn to intelligence, through miniature fan, heat radiation fins and confined wind channel design all around, constructs a heat exchange system in limited product space, realizes that product inner space and product exterior space carry out quick heat exchange to play the effect that reduces whole product temperature, improved user experience.
The technical scheme adopted for solving the technical problems is as follows:
according to one aspect herein, there is provided a heat dissipation device of a smart headset, comprising: the heat dissipation structure comprises a micro fan and heat dissipation fins, wherein the heat dissipation fins are tightly connected with a heating body on a PCB (printed circuit board) through a heat conduction material, an air outlet of the micro fan is connected with an air inlet end of the heat dissipation fins, and a through air channel is formed between an air inlet of the micro fan and an air outlet end of the heat dissipation fins.
Optionally, the heat dissipation device further comprises a housing, and the micro fan, the heat dissipation fins, the PCB and the heating element are all arranged in the housing.
Optionally, the micro fan is a high-speed centrifugal micro fan, and the air inlet of the micro fan is located at the upper side and/or the lower side of the micro fan. And a gap is reserved between the air inlet and the shell.
Optionally, an isolation structure is disposed inside the housing, the isolation structure is located at a position where the air outlet of the micro fan is connected to the air inlet end of the heat dissipation fin, and the isolation structure extends from the inside of the housing to the entire outer edge of the air outlet of the micro fan.
Optionally, the isolation structure is a protruding rib or foam.
Optionally, the micro fan is a high-speed axial micro fan, and the air inlet of the micro fan is opposite to the air outlet.
Optionally, the housing is provided with a first through hole corresponding to the air inlet, and the housing is provided with a second through hole corresponding to the air outlet end of the heat dissipation fin.
Optionally, the cooling device further comprises a temperature detection module and a main control module, wherein the temperature detection module is used for detecting the temperature of the environment where the cooling fins are located, and when the temperature reaches a preset temperature threshold value, the main control module controls the micro fan to rotate at a specified rotating speed.
Optionally, the main control module performs adaptive control on the micro fan through a temperature and rotating speed correspondence table.
As another aspect of the present invention, a pair of intelligent head-mounted products is provided, which includes the heat dissipation device described above.
The utility model discloses heat abstractor and intelligent head-mounted product of product are worn to intelligence, this heat abstractor includes: the heat dissipation structure comprises a micro fan and heat dissipation fins, wherein the heat dissipation fins are tightly connected with a heating body on a PCB (printed circuit board) through a heat conduction material, an air outlet of the micro fan is connected with an air inlet end of the heat dissipation fins, and a through air channel is formed between an air inlet of the micro fan and an air outlet end of the heat dissipation fins; through the design of the micro fan, the radiating fins and the air channels which are sealed at the periphery, a heat exchange system is constructed in a limited product space, and quick heat exchange between the inner space of the product and the outer space of the product is realized, so that the effect of reducing the temperature of the whole product is achieved, and the user experience is improved.
Drawings
Fig. 1 is a structural diagram of a heat dissipation device of an intelligent head-mounted product according to a first embodiment of the present invention;
fig. 2 is a diagram illustrating an installation effect of a heat dissipation device according to a first embodiment of the present invention;
fig. 3 is a cross-sectional view of a heat dissipation device according to a first embodiment of the present invention;
fig. 4 is a schematic view illustrating a direction of air circulation in an air duct of a heat dissipation device according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a control function of a heat dissipation device according to a first embodiment of the present invention;
fig. 6 is a schematic view illustrating a heat dissipation effect test of a heat dissipation device according to an embodiment of the present invention.
Reference numerals are as follows:
1-micro fan, 2-radiating fins, 3-air channel, 4-PCB, 5-shell and 6-heating element.
The objects, features, and advantages described herein are further illustrated by the accompanying drawings in connection with the embodiments.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer and more obvious, the present invention is further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not restrictive.
In the following description, suffixes such as "module", "part", or "unit" used to denote elements are used only for the convenience of description of the present invention, and have no specific meaning in itself. Thus, "module", "component" or "unit" may be used mixedly.
Example one
As shown in fig. 1, in this embodiment, a heat dissipation device for a smart headset includes: the heat dissipation structure comprises a micro fan 1 and heat dissipation fins 2, wherein the heat dissipation fins 2 are tightly connected with a heating body 6 on a PCB 4 through heat conduction materials, an air outlet of the micro fan 1 is connected with an air inlet end of the heat dissipation fins 2, and a through air channel 3 is formed between an air inlet of the micro fan 1 and an air outlet end of the heat dissipation fins 2.
In this embodiment, through the design of the micro fan 1, the heat dissipation fins 2 and the air ducts 3 with the periphery closed, a heat exchange system is constructed in a limited product space, so that the product internal space and the product external space can be subjected to rapid heat exchange, the effect of reducing the temperature of the whole product is achieved, and the user experience is improved. In this embodiment, a base is disposed below the heat dissipation fins 2, the base is tightly connected to the heat generating body 6 on the PCB 4 through a heat conductive material, and the area of the lower surface of the base is larger than the area of the upper surface of the heat generating body 6. Fig. 2 shows an effect of mounting the radiator fin 2 on the heating element 6.
In this embodiment, the surface area of the fins on the heat sink fins 2 is large, which is usually several times the surface area under the base, and the heat sink fins 2 dissipate heat through the large surface area on the fins.
As another embodiment, the area of the lower surface of the heat radiation fin 2 may be equal to or less than the area of the upper surface of the heat generating body 6, and the heat radiation fin 2 is disposed at the hottest position on the heat generating body 6.
As shown in fig. 1, in this embodiment, the heat dissipation device further includes a housing 5, and the micro fan 1, the heat dissipation fins 2, the PCB 4, and the heating element 6 are all disposed in the housing 5, so as to protect the heat dissipation fins and combine with the air duct 3, thereby achieving one-way circulation of air in the air duct 3.
In this embodiment, to better describe the internal structure of the heat dissipation apparatus, fig. 3 providesbase:Sub>A partial cross-sectional view of the heat dissipation apparatus, wherebase:Sub>A plane where an air outlet end of the heat dissipation fin 2 is located isbase:Sub>A front surface of the heat dissipation apparatus,base:Sub>A cross-section C-C in fig. 3 isbase:Sub>A cross-sectional view inbase:Sub>A front view direction, and the internal structure of the heat dissipation fin 2 can be seen,base:Sub>A cross-section B-B isbase:Sub>A cross-sectional view inbase:Sub>A rear view direction, and the internal structure of the micro-fan 1 can be seen, andbase:Sub>A cross-sectionbase:Sub>A-base:Sub>A isbase:Sub>A cross-sectional view inbase:Sub>A right view direction, and the internal structure of the air duct 3 can be seen. In this embodiment, the micro fan 1 is a high-speed centrifugal micro fan, and the air inlet of the micro fan 1 is located at the upper side and/or the lower side of the micro fan 1. A gap is arranged between the air inlet and the shell 5.
In the present embodiment, the centrifugal type micro-fan is a flat structure, and is more suitable for a head-mounted device having a small longitudinal space, and sucks air through the gap and then sends the air from the air outlet of the micro-fan 1 to a high-temperature region.
In this embodiment, the air outlet of the micro fan 1 is used as a boundary, the area where the micro fan 1 is located is a low-temperature area, and the area where the heat dissipation fins are located is a high-temperature area.
In this embodiment, 5 inboards of shell are provided with isolating structure, isolating structure is located 1 miniature fan's air outlet with heat radiation fins 2's air inlet end department of meeting, isolating structure is extended to by 5 inboards of shell 1 the whole outward flange of miniature fan's 1 air outlet, this isolating structure will gap between air outlet department and the shell is filled up for low temperature region and high temperature region only communicate through miniature fan 1's air outlet, in order to avoid the air refluence of high temperature region to low temperature region, are inhaled by miniature fan 1, and miniature fan 1 can only inhale the cold air of low temperature region through the air intake.
In this embodiment, the isolation structure is a protruding rib or foam, the thickness of the rib or foam in the air circulation direction is less than or equal to 5mm, and the rib or foam is arranged between the air outlet and the housing in a shape of a Chinese character 'hui'.
As another embodiment, the isolation structure may be disposed at any position between the air inlet and the air outlet, and the gap between the position and the housing may be filled.
In this embodiment, the micro fan 1 is a high-speed axial micro fan, and the air inlet of the micro fan 1 is opposite to the air outlet.
In this embodiment, high rotational speed axial-flow type micro fan is more applicable to the great intelligent product in longitudinal space, and through the air intake inhaled air relative with the air outlet, compare with centrifugal micro fan through the clearance inhaled air of the downside, the circulation of air is more unobstructed, and the radiating effect is better.
In this embodiment, the micro fan 1 is a high-speed centrifugal micro fan or a high-speed axial micro fan, both of which rotate in one direction to ensure that the air in the air duct 3 flows in one direction from the low temperature region to the high temperature region.
In this embodiment, the micro fan 1 has a waterproof housing, and the cavity has good leakproofness again, has improved the waterproof performance of intelligent head-mounted product greatly.
In this embodiment, when the intelligent head-mounted product is in the low power consumption mode, the heat generated by the heating element 6 is not large, the heat is rapidly conducted to the heat dissipation fins 2 through the heat conduction material, the heat is rapidly diffused through the huge surface area of the heat dissipation fins 2, and a high temperature region is formed around the heat dissipation fins 2. The area where the high-speed micro fan 1 is located is a low-temperature area, physical isolation is arranged around an air inlet of the micro fan 1 and an air duct 3 where a high-temperature area is located, low-temperature air is discharged from an air outlet of the micro fan 1 to enter the high-temperature area of the radiating fins 2 along with the high-speed rotation of the micro fan 1, and due to the unidirectional flow of the air, the air in the high-temperature area is rapidly discharged out of the shell 5, so that the purposes of heat dissipation and cooling are achieved.
In this embodiment, the housing 5 is provided with a first through hole corresponding to the air inlet, the air inlet sucks in low-temperature air through the first through hole and flows into the high-temperature region along the closed air duct 3 in a single direction, the housing 5 is provided with a second through hole corresponding to the air outlet end of the heat dissipation fin 2, the air flowing in from the first through hole completes heat exchange in the area of the heat dissipation fin 2, and flows out from the second through hole after heat exchange.
In this embodiment, when the micro fan 1 is an axial micro fan, the air inlet and the air outlet are disposed opposite to each other, and the first through hole on the housing 5 is disposed corresponding to the air inlet; when the micro fan 1 is a centrifugal micro fan, the air inlets are disposed at the upper and lower sides of the micro fan 1, the first through holes of the housing 5 may be disposed at the air inlets at the upper and lower sides of the micro fan 1, or the first through holes may be disposed at the positions opposite to the air outlets as in the case of an axial micro fan, so that the micro fan 1 may suck air through the gap between the fan and the housing 5.
As shown in fig. 4, which is a schematic view of the air circulation direction in the air duct 3 of the heat dissipation device, air enters the air duct 3 from the first through hole a, and flows out from the second through hole B of the heat dissipation fin 2 after heat exchange by the heat dissipation fin 2, so as to realize rapid heat exchange between the inner space of the product and the outer space of the product, thereby reducing the temperature of the whole product.
When the intelligent head-wearing product is in a high-power-consumption working mode, the heat generated by the heating body 6 is rapidly increased, and when the main control module detects that the temperature of the equipment reaches a control threshold value, the micro fan 1 is controlled to rotate at a specified rotating speed, so that the air in the cavity flows directionally, and the hot air is rapidly discharged out of the equipment.
In this embodiment, the cooling system further includes a temperature detection module and a main control module, a control schematic diagram of the cooling system is shown in fig. 5, the temperature detection module is configured to detect a temperature of an environment where the cooling fins 2 are located, and when the temperature reaches a preset temperature threshold, the main control module controls the micro fan 1 to rotate at a specified rotation speed.
In this embodiment, the main control module performs adaptive control on the micro fan 1 through a temperature and rotation speed correspondence table.
As shown in fig. 6, in order to test the heat dissipation effect of the heat dissipation device in this embodiment, the position of the casing C below the micro-fan 1 is taken as a T1 temperature detection point, and the position of the casing D below the heat dissipation fins 2 is taken as a T2 temperature detection point, and the test results are shown in the following table:
| test mode | Starting temperature | End temperature |
| Fan switch | T1：28.4 T2：28.7 | T1：33.1 T2：34.3 |
| Non-opening fan | T1：28.3 T2：28.4 | T1：38.1 T2：38.3 |
Therefore, the highest temperature of the head-mounted product can be reduced by 4-5 ℃ through the heat dissipation device in the embodiment, and the practicability is high.
As another embodiment, the heat dissipation fin 2 may also be a finned heat pipe.
Example two
In this embodiment, an intelligent head-mounted product includes the heat dissipation device described above.
In this embodiment, through the design of the micro fan 1, the heat dissipation fins 2 and the air ducts 3 with the periphery closed, a heat exchange system is constructed in a limited product space, so that the product internal space and the product external space can be subjected to rapid heat exchange, the effect of reducing the temperature of the whole product is achieved, and the user experience is improved.
Through the description of the foregoing embodiments, it is clear to those skilled in the art that the method of the foregoing embodiments may be implemented by software plus a necessary general hardware platform, and certainly may also be implemented by hardware, but in many cases, the former is a better embodiment. Based on such understanding, the technical solution of the present invention essentially or the part contributing to the prior art can be embodied in the form of a software product, and the computer software product is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk), and includes a plurality of instructions for enabling a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the method of the embodiments of the present invention.
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, without thereby limiting the scope of the invention. Any modification, equivalent replacement or improvement made by those skilled in the art without departing from the scope and spirit of the present invention should be within the scope of the claims of the present invention.
Claims (10)
1. A heat sink of an intelligent headgear product, comprising: the heat dissipation structure comprises a micro fan and heat dissipation fins, wherein the heat dissipation fins are tightly connected with a heating body on a PCB (printed circuit board) through a heat conduction material, an air outlet of the micro fan is connected with an air inlet end of the heat dissipation fins, and a through air channel is formed between an air inlet of the micro fan and an air outlet end of the heat dissipation fins.
2. The heat dissipation device of claim 1, further comprising a housing, wherein the micro fan, the heat dissipation fins, the PCB, and the heat generator are disposed inside the housing.
3. The heat dissipation device of claim 2, wherein the micro fan is a high-speed centrifugal micro fan, the air inlet of the micro fan is located at an upper side and/or a lower side of the micro fan, and a gap is formed between the air inlet and the housing.
4. The heat dissipation device of claim 3, wherein an isolation structure is disposed inside the housing, the isolation structure is located at a junction between the air outlet of the micro fan and the air inlet end of the heat dissipation fin, and the isolation structure extends from an inside of the housing to an entire outer edge of the air outlet of the micro fan.
5. The heat dissipation device of claim 4, wherein the isolation structure is a protruding rib or foam.
6. The heat dissipation device of claim 2, wherein the micro fan is a high-speed axial micro fan, and an air inlet of the micro fan is disposed opposite to the air outlet.
7. The heat dissipation device of an intelligent headset product according to any one of claims 3 to 6, wherein the housing is provided with a first through hole corresponding to the air inlet, and the housing is provided with a second through hole corresponding to the air outlet end of the heat dissipation fin.
8. The heat dissipation device of an intelligent headset of claim 1, further comprising a temperature detection module and a main control module, wherein the temperature detection module is configured to detect a temperature of an environment where the heat dissipation fins are located, and when the temperature reaches a preset temperature threshold, the main control module controls the micro fan to rotate at a specified rotation speed.
9. The heat dissipation device of claim 8, wherein the main control module adaptively controls the micro fan through a temperature and rotation speed mapping table.
10. An intelligent headgear product comprising the heat dissipation device of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221843748.4U CN217825820U (en) | 2022-07-18 | 2022-07-18 | Heat dissipation device of intelligent head-mounted product and intelligent head-mounted product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221843748.4U CN217825820U (en) | 2022-07-18 | 2022-07-18 | Heat dissipation device of intelligent head-mounted product and intelligent head-mounted product |
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| CN217825820U true CN217825820U (en) | 2022-11-15 |
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| CN202221843748.4U Active CN217825820U (en) | 2022-07-18 | 2022-07-18 | Heat dissipation device of intelligent head-mounted product and intelligent head-mounted product |
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| CN (1) | CN217825820U (en) |
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- 2022-07-18 CN CN202221843748.4U patent/CN217825820U/en active Active
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