CN217825530U - Circuit module for voltage conversion circuit - Google Patents

Abstract

The utility model relates to a circuit module for voltage conversion circuit, including energy storage inductance and switch converting circuit, the bottom of energy storage inductance is provided with two convex at least connecting portion, and two connecting portion set up respectively in the both sides of bottom, and switch converting circuit sets up on the circuit board, and the circuit board is installed between two connecting portion, the surface coating sealing layer of circuit board, and the sealing layer is not higher than the surface of two connecting portion, and the surface of two connecting portion sets up the connection pad that is used for circuit module's input and output. Adopt the utility model discloses the circuit module of scheme, current voltage conversion circuit relatively, when being applied to control circuit on, need not to carry on solitary PCB wiring again on control circuit, only need simple welding and PCB board on can to the wiring setting of whole control circuit board has been made things convenient for greatly, because the volume of circuit module only is equivalent to the volume of energy storage inductance wherein in addition, its space that occupies has also significantly reduced is favorable to control circuit board's miniaturization.

Description

Circuit module for voltage conversion circuit

Technical Field

The utility model relates to a circuit module for voltage conversion circuit belongs to semiconductor circuit application technical field.

Background

The present voltage conversion circuit, i.e. a DC-DC (direct current-direct current) circuit, is increasingly and widely applied to various household electrical appliance controllers, and provides power supplies with various voltages for the operation of a control circuit to replace the conventional linear voltage conversion circuit. The voltage conversion circuit is essentially a small-sized switching power supply and mainly comprises a switching power supply chip, an energy storage inductor and other peripheral resistance-capacitance elements, wherein the switching power supply chip internally comprises a PWM signal generator which is operated by a switching tube and a driving switching tube. When the current voltage conversion circuit is applied to a control circuit, the circuit is generally arranged on a PCB of the control circuit, and the circuit is required to be designed together with the control circuit every time, because the voltage conversion circuit works in a high-frequency environment, whether EMC parameters meet the requirements or not needs to be considered when the control circuit is designed every time, therefore, the debugging of PCB wiring is required to be repeatedly carried out in the design process, thereby the design cycle of the whole control circuit is influenced, and in some occasions that the circuit board of the control circuit needs to be miniaturized, the occupied area of the voltage conversion circuit is relatively large, and the requirement of miniaturized design is also influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that need solve is to solve current voltage conversion circuit because need the independent design influence control circuit's design cycle's problem.

The utility model discloses at first provide a circuit module for voltage conversion circuit, circuit module includes energy storage inductance and switch converting circuit, the bottom of energy storage inductance is provided with two convex at least connecting portion, two connecting portion set up the both sides in the bottom respectively, switch converting circuit sets up on the circuit board, the circuit board is installed between two connecting portion, the surface coating sealing layer of circuit board, the sealing layer is not higher than the surface of two connecting portion, the surface of two connecting portion sets up the connection pad that is used for circuit module's input and output.

Optionally, the circuit board comprises:

a circuit substrate;

the electronic circuit layer is arranged on the surface of the circuit substrate, and is provided with an element mounting position and a lead bonding pad;

and the electronic components are mounted on the component mounting positions.

Optionally, the circuit substrate is a copper-clad ceramic substrate, and the electronic circuit layer is a copper foil layer disposed on the surface of the ceramic substrate.

Alternatively, the circuit substrate is a ceramic substrate, and the resistors in the electronic circuit layer and the electronic component are sintered on the surface of the ceramic substrate to form a ceramic thick film circuit.

Optionally, the connecting portion is provided with a metal frame protruding toward the circuit board, a portion of the metal frame forming the connecting pad, the metal frame connecting the electronic circuit layer of the circuit board.

Optionally, the metal framework includes first section, interlude and the end section of buckling the connection in proper order, wherein the first section sets up the bottom surface of connecting portion, the interlude sets up the side of connecting portion, the end section stretches out towards another connecting portion, the first section forms the pad, the end section is connected the surface of circuit board.

Optionally, the surfaces of the two connection portions are respectively provided with two connection pads to respectively form an input positive electrode and a negative electrode, and an output positive electrode and a negative electrode of the circuit module.

Optionally, the energy storage inductor and the electronic component mounted on the circuit board are packaged in a chip package manner.

Optionally, the sealing layer is a resin.

The utility model discloses a circuit module for voltage conversion circuit, including energy storage inductance and switch converting circuit, the bottom of energy storage inductance is provided with two convex at least connecting portion, and two connecting portion set up the both sides in the bottom respectively, and switch converting circuit sets up on the circuit board, and the circuit board is installed between two connecting portion, the surface coating sealing layer of circuit board, the sealing layer is not higher than the surface of two connecting portion, and the surface of two connecting portion sets up the connection pad that is used for circuit module's input and output. Adopt the utility model discloses the circuit module of scheme, current voltage conversion circuit relatively, when being applied to control circuit on, need not to carry out solitary PCB wiring again on control circuit, only need simple welding and PCB board on can to the wiring setting of whole control circuit board has been made things convenient for greatly, because circuit module's volume only is roughly the same with the volume of energy storage inductance wherein, also the space that its occupy that has significantly reduced is favorable to control circuit board's miniaturization moreover.

Drawings

Fig. 1 is a schematic structural diagram of a circuit module for a voltage conversion circuit according to an embodiment of the present invention;

fig. 2 is a block diagram illustrating an arrangement of the connection portion and the circuit board of the switch conversion circuit according to an embodiment of the present invention;

fig. 3 is a bottom schematic view of an energy storage inductor according to an embodiment of the present invention;

fig. 4 is a schematic circuit diagram of a voltage conversion circuit according to an embodiment of the present invention;

fig. 5 is a simplified schematic plan view of a circuit board surface of a switching circuit according to an embodiment of the present invention;

fig. 6 is a cross-sectional view of a circuit board of a switch conversion circuit according to an embodiment of the present invention;

fig. 7 is a simplified diagram of a specific structure of the connection portion and the connection pad according to an embodiment of the present invention.

Reference numerals:

the energy storage inductor comprises an energy storage inductor 10, a first connecting portion 11, a first connecting pad 111, a second connecting portion 12, a second connecting pad 121, a circuit board 20, a circuit substrate 21, a bonding wire 22, an electronic element 23, an electronic circuit layer 24, a sealing layer 30, a metal frame 40, a first section 41, an intermediate section 42 and a tail section 43.

Detailed Description

It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict in structure or function. The present invention will be described in detail below with reference to examples.

The utility model provides a circuit module for voltage conversion circuit, as shown in fig. 1 to 7, circuit module includes energy storage inductance 10 and switch converting circuit, energy storage inductance 10's bottom is provided with two convex at least connecting portions and is first connecting portion 11 and second connecting portion 12 respectively, first connecting portion 11 and second connecting portion 12 set up the both sides in the bottom respectively, switch converting circuit sets up on circuit board 20, circuit board 20 installs between first connecting portion 11 and second connecting portion 12, circuit board 20's surface coating sealing layer 30, sealing layer 30 is not higher than the surface of first connecting portion 11 and second connecting portion 12, the surface of first connecting portion 11 and second connecting portion 12 sets up the connection pad that is used for circuit module's input and output. The voltage conversion circuit is used for isolating the energy storage inductor 10 with a large size, other circuits are arranged on the circuit board 20 corresponding to the switch conversion circuit, the circuit board 20 is arranged at the bottom of the energy storage inductor 10, and the surface of the circuit board 20 is sealed by the sealing layer 30 through the sealing layer 30, so that the size of the whole switch conversion circuit only occupies the size of the energy storage inductor 10, when the voltage conversion circuit is applied to a control circuit, only a bonding pad of a connecting part at the bottom of the energy storage inductor 10 and a corresponding bonding pad on the surface of the control circuit are required to be welded, the surface of the control circuit only needs to be set into input and output bonding pads, and other additional wiring is not required. Therefore, the voltage conversion circuit is arranged into the circuit module, wiring arrangement of the whole control circuit board is greatly facilitated, and the control circuit board can meet EMC (Electromagnetic Compatibility) parameters when the circuit module is installed on the control circuit board as long as the circuit module meets the EMC parameters during design. Because the magnetic material is arranged inside the energy storage inductor 10, when the circuit board 20 of the switching conversion circuit is arranged at the bottom of the energy storage inductor 10, and when the circuit board is switched on and off at a high speed, electromagnetic Interference signals of the parameters can be effectively shielded by the magnetic material in the energy storage inductor 10, so that the battery radiation of the circuit module is effectively improved, and the EMI (Electromagnetic Interference) parameters are further reduced. And because the volume that the circuit module took only energy storage inductance 10 is big or small, relative on control circuit board independent PCB wiring, the space of control circuit board that its occupied also reduces greatly to this design miniaturization that is favorable to controlling automatically controlled board.

In order to facilitate further miniaturization of the circuit module, the energy storage inductor 10 and the electronic component 23 in the switching circuit are preferably packaged in a chip. At this time, two connection electrodes at the bottom of the energy storage inductor 10 packaged by the patch can be simply transformed, and the two electrodes are arranged in a protruding manner to form two connection portions, namely, the first connection portion 11 and the second connection portion 12. At least input and output pads of the circuit module are arranged on the bottom surface of the connecting part, and generally, 4 input and output pads are respectively an input positive electrode and an input negative electrode, and an output positive electrode and an output negative electrode are respectively arranged on the bottom surfaces of the two connecting parts. One negative, i.e., ground, terminal may also be shared, so that one pad may be omitted. The bottom surface of the connecting portion may further be provided with two connected pads of the energy storage inductor 10, and the pads may also be disposed on the inward side surface of the connecting portion, or disposed in other areas of the energy storage inductor 10 where the connecting portion is not disposed, so as to facilitate connection with the circuit board 20 of the switch conversion circuit. Form the installation cavity between two connecting portion, the circuit board sets up in the installation cavity, then through encapsulating technology coating sealed material such as epoxy in order to form sealing layer 30, sealing layer 30 solidification back, its solid state stability is good, plays the effect of protection and sealed circuit board, just so formed the circuit module of integration.

Fig. 4 shows a specific circuit of the voltage conversion circuit, which is specifically used for voltage reduction, and reduces +12V to +5V, and the specific circuit is mainly composed of a switching power supply chip U5, an energy storage inductor L24, and a peripheral resistance-capacitance element. The volume of the energy storage inductor L24 is relatively large, and when the other electronic components 23 are packaged by using a patch, the volume is relatively small, so that the switching conversion circuit formed by the electronic components 23 can be designed on a small circuit board 20 and connected with the two ends of the energy storage inductor 10L24 through thin connecting wires, thereby forming the whole voltage conversion circuit.

Fig. 2 is a block diagram showing an arrangement of the connection portions and the circuit board 20 of the switch converting circuit, where the two connection portions on the left and right are respectively provided with connection pads, specifically two first connection pads 111 provided on the first connection portion 11, two second connection pads 121 provided on the second connection portion 12, as input and output ends of the circuit module, respectively +12V, GND and +5V and GND for input and output, and two pads L-1 and L-2 connected to the energy storage inductor 10, and these two pads L-1 and L-2 can be referred to fig. 1, and metal thin wires are led out from two ends of the energy storage inductor 10 and directly connected to these two pads, so as to electrically connect the energy storage inductor 10 and the circuit board 20. Certainly, the energy storage inductor 10 may also be electrically connected to the circuit board 20 in other manners, for example, two connection pads are disposed at the bottom of the energy storage inductor 10, the two connection pads are respectively two ends of the energy storage inductor 10, and then the two connection pads and the two pads L-1 and L-2 are respectively connected by thin metal wires, so that the two connection pads may also be electrically connected. The circuit board 20 and the two first connection pads 111, the two second connection pads 121, and the electronic components on the surface of the circuit board 20 are electrically connected by thin metal wires, thereby forming a complete voltage conversion circuit.

The thin metal wire may employ a bonding wire 22 made of copper wire or aluminum wire, which may have a diameter of 38um or 100um. Fig. 3 is a simplified structural diagram of the bottom of the energy storage inductor 10, in which the connecting portions are respectively disposed on two sides of the bottom, and two connecting pads are respectively disposed on the surfaces of the two connecting portions to serve as the input end and the output end of the circuit module. The area between the two connection portions is used for mounting the circuit board 20 of the switching circuit.

In some embodiments of the present invention, in order to facilitate miniaturization and heat dissipation of the circuit board, as shown in fig. 5 and 6, the circuit board includes a circuit substrate 21, an electronic circuit layer 24, and a plurality of electronic components 23, which are connected in sequence. The electronic circuit layer 24 is provided on the surface of the circuit board 21, the electronic circuit layer 24 is provided with a component mounting site and a lead pad, and the plurality of electronic components 23 are mounted on the component mounting site. The wire bond pads are used to connect jumpers such as with bond wires 22 described above. The plurality of electronic components 23 include a chip-on-chip switching power supply chip and a resistance-capacitance element. The circuit substrate 21 may be a copper-clad ceramic substrate or a common ceramic substrate. If a copper-clad ceramic substrate is adopted, the copper foil layer on the surface of the copper-clad ceramic substrate can be etched to form an electronic circuit layer 24, and then an electronic component 23 is welded on a component mounting position; if a common ceramic substrate is adopted, the resistor and the electronic circuit can be sintered on the ceramic substrate through a thick film circuit process to form a ceramic thick film circuit, and compared with a copper-clad ceramic substrate, the sintered resistor has different resistance values, the volume of the resistor is different, and the resistor different from the resistor on the copper-clad ceramic substrate has the same volume, so that the volume of the ceramic substrate can be further reduced.

Fig. 7 is a specific structure of the connection portion and the connection pad, showing the structure of one of the connection portions, and the structure of the other connection portion is the same. The connection portion is provided with a metal frame 40 protruding toward the circuit board, a portion of the metal frame 40 forming a connection pad, the metal frame 40 connecting the electronic circuit layer 24 of the circuit board 20.

Specifically, the thin metal frame 40 is arranged at the bottom of the connecting part and the side surface facing the mounting cavity, the metal frame 40 may be made of a copper material, the metal frame 40 includes three sections which are sequentially bent and connected, wherein a first section 41 is arranged on the bottom surface of the connecting part to form a connecting pad, an intermediate section 42 is arranged on the side surface, and another end section 43 extends towards the mounting cavity to form an extending section for connecting the circuit board 20 of the switch conversion circuit, in particular, during mounting, the first section 41 is arranged on the bottom surface of the connecting part, the end section 43 is connected on the surface of the circuit board 20, the surface of the end section 43 and the surface of the electronic circuit layer 24 can be fixed by welding, so that the two connecting parts have four end sections 43 in total, and are connected on the surface of the circuit board 20, in particular, respectively welded with the two first connecting pads 111 and the two second connecting pads 121, the end section 43 is arranged on the circuit board 20, namely, the circuit board 20 is connected below the four end sections 43 in a hanging manner, and the circuit board 20 is reliably fixed and mounted in the mounting cavity by welding manner. And then coating a layer of epoxy resin in the safety chamber, forming a sealing layer 30 after the epoxy resin is cured, so as to coat the circuit board in the sealing layer 30 and realize the protection of the circuit board, wherein the surface of the sealing layer 30 is not higher than the surfaces of the two connecting parts, so that when the circuit module is conveniently installed on a PCB of a specific control circuit, the connecting pad can not be connected with the pad on the PCB due to the protrusion of the sealing layer 30, and the circuit module and the PCB can be reliably fixed and electrically connected.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

While embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (9)

1. The utility model provides a circuit module for voltage conversion circuit, circuit module includes energy storage inductance and switch converting circuit, its characterized in that, energy storage inductance's bottom is provided with two convex at least connecting portion, two connecting portion set up the both sides in the bottom respectively, switch converting circuit sets up on the circuit board, the circuit board install in between two connecting portion, the surface coating sealing layer of circuit board, the sealing layer is not higher than the surface of two connecting portion, two the surface setting of connecting portion is used for the connection pad of circuit module's input and output.

2. The circuit module of claim 1, wherein the circuit board comprises:

a circuit substrate;

the electronic circuit layer is arranged on the surface of the circuit substrate, and is provided with an element mounting position and a lead bonding pad;

a plurality of electronic components mounted to the component mounting sites.

3. The circuit module according to claim 2, wherein the circuit substrate is a copper-clad ceramic substrate, and the electronic circuit layer is a copper foil layer provided on a surface of the ceramic substrate.

4. The circuit module of claim 2, wherein the circuit substrate is a ceramic substrate, and the electronic circuit layer and the resistors in the electronic component are sintered on the surface of the ceramic substrate to form a ceramic thick film circuit.

5. A circuit module according to claim 2, characterized in that the connection portion is provided with a metal frame projecting towards the circuit board, parts of the metal frame forming the connection pads, the metal frame connecting the electronic circuit layers of the circuit board.

6. The circuit module according to claim 5, wherein the metal frame comprises a first section, a middle section and a last section which are sequentially connected in a bending manner, the first section is arranged on the bottom surface of the connecting portion, the middle section is arranged on the side surface of the connecting portion, the last section extends towards the other connecting portion, the first section forms the bonding pad, and the last section is connected with the surface of the circuit board.

7. The circuit module according to claim 1, wherein two connection pads are provided on the surfaces of the two connection portions, respectively, to form an input positive electrode and a negative electrode, and an output positive electrode and a negative electrode of the circuit module, respectively.

8. The circuit module of claim 1, wherein the energy storage inductor and the electronic component mounted on the circuit board are packaged in a chip package.

9. The circuit module of claim 1, wherein the sealing layer is an epoxy.

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