CN217822817U

CN217822817U - OLED panel based on ultrathin glass

Info

Publication number: CN217822817U
Application number: CN202222045328.8U
Authority: CN
Inventors: 周晧煜; 蒋承忠
Original assignee: Anhui Fansheng Display Technology Co ltd
Current assignee: Anhui Fansheng Display Technology Co ltd
Priority date: 2022-08-04
Filing date: 2022-08-04
Publication date: 2022-11-15
Anticipated expiration: 2032-08-04

Abstract

The utility model provides a OLED panel based on ultra-thin glass, wherein, OLED panel includes: the ultrathin glass substrate is provided with a plurality of bending stress dissipation grooves, and the extension direction of each bending stress dissipation groove is perpendicular to the preset bending direction; the substrate electrode layer is formed on one side of the ultrathin glass substrate and comprises a plurality of polymer strip-shaped substrates and functional electrodes which are arranged on the same layer, the polymer strip-shaped substrates at least cover the bending stress dissipation groove, and the functional electrodes are arranged in gaps among the polymer strip-shaped substrates; and the OLED device layer is formed on one side of the high-molecular strip-shaped substrate, which is far away from the ultrathin glass substrate. The utility model discloses can not need from the type, reduce the laminating number of times, reduce the material and use and extravagant, strengthen the panel functionality, reduce the whole thickness of panel, both reduced holistic manufacturing cost, promoted OLED's processing procedure yield again.

Description

OLED panel based on ultrathin glass

Technical Field

The utility model relates to a panel processing procedure field, specifically speaking relates to OLED panel based on ultra-thin glass.

Background

The conventional OLED manufacturing process mainly comprises the following steps:

(1) A glass substrate raw material;

(2) Folding, bottoming and molding the polymer;

(3) An OLED display process;

(4) Stripping the OLED device and the glass;

(5) The OLED device is bonded to a flexible, folded support backplane (typically using a lamination process);

(6) The OLED device is coupled to the encapsulating cover.

Because the OLED device needs to be stripped from the glass in the steps (4) and (5) and then is attached to the flexible folding supporting bottom plate, the process is time-consuming and labor-consuming, and the process yield and the overall production cost of the OLED are limited.

Meanwhile, the ultra-thin glass substrate (UTG substrate) is an important component of the foldable cover plate, and the quality of the ultra-thin substrate itself is critical to achieve the effect of a smaller or even R =2mm bending radius. Particularly, after the UTG substrate is cut into a specific size, special treatment of the edge portion of the UTG substrate is required to remove defects such as edge breakage and microcracks caused by cutting, so as to avoid breaking of glass caused by microcracks and the like when the substrate is bent.

The prior art OLED process has the following problems:

(1) The problem of tearing of the OLED device exists in the stripping process;

(2) The contact with other parts is required to be prevented from influencing the yield in the process of transferring the OLED device;

(3) The problem of inaccurate alignment exists in the attaching process.

The above problems greatly limit the process yield and overall production cost of OLEDs.

Therefore, there is a need for an ultra-thin glass based OLED panel.

Disclosure of Invention

To the problem among the prior art, the utility model aims to provide an OLED panel based on ultra-thin glass has overcome prior art's difficulty, can not need from the type, reduces the laminating number of times, reduces the material and uses and extravagant, and reinforcing panel functionality lowers the whole thickness of panel, has both reduced holistic manufacturing cost, has promoted OLED's processing procedure yield again.

An embodiment of the utility model provides an OLED panel based on ultra-thin glass, include:

the ultrathin glass substrate is provided with a plurality of bending stress dissipation grooves, and the extension direction of each bending stress dissipation groove is perpendicular to the preset bending direction;

the substrate electrode layer comprises a plurality of polymer strip-shaped substrates and functional electrodes, wherein the polymer strip-shaped substrates and the functional electrodes are arranged on one side of the ultrathin glass substrate, the polymer strip-shaped substrates at the same layer at least cover the bending stress dissipation groove, and the functional electrodes are arranged in gaps among the polymer strip-shaped substrates; and

and the OLED device layer is formed on one side of the high-molecular strip-shaped substrate, which deviates from the ultrathin glass substrate.

Preferably, the functional electrode is one or a combination of a power supply electrode, a fingerprint identification electrode, a touch identification electrode and a driving electrode.

Preferably, the bending stress dissipation groove is included in a first projection area of the OLED device layer by a second projection area of the polymer strip substrate on the OLED device layer.

Preferably, the OLED device further comprises an encapsulation cover plate layer formed on one side of the OLED device layer, which is far away from the macromolecule strip-shaped substrate.

Preferably, the ultrathin glass substrate comprises a rigid area for supporting the macromolecule strip-shaped substrate and a bending stress dissipation groove for dissipating bending stress when the panel is bent, and the thickness of the rigid area ranges from 0.1 mm to 0.55 mm.

Preferably, the bending stress dissipation groove is a through groove which penetrates through the ultrathin glass substrate, and a part of the macromolecule strip-shaped substrate is exposed from the bending stress dissipation groove.

Preferably, the bending stress dissipation groove is formed by etching the ultra-thin glass substrate to form a grid structure or a net structure connecting two sides of the dissipation groove, the extension direction of the grid structure is parallel to the preset bending direction, and the thickness of the ultra-thin glass substrate in the bending stress dissipation groove is smaller than that of the rigid area.

Preferably, the thickness of the ultra-thin glass substrate in the bending stress dissipation groove range is 10 to 90 micrometers.

The embodiment of the utility model provides a manufacturing approach of OLED panel based on ultra-thin glass is still provided for make above-mentioned OLED panel based on ultra-thin glass, including following step:

providing an ultrathin glass substrate;

forming a substrate electrode layer on the first side of the ultrathin glass substrate, wherein the substrate electrode layer comprises high-molecular strip-shaped substrates and functional electrodes which are arranged on the same layer, and the functional electrodes are arranged in gaps among the high-molecular strip-shaped substrates;

forming an OLED device layer on one side of the polymer strip-shaped substrate, which is far away from the ultrathin glass substrate;

and locally thinning the second side of the ultrathin glass substrate, and forming a plurality of bending stress dissipation grooves in the thinned area.

Preferably, the forming a substrate electrode layer on the first side of the ultra-thin glass substrate, where the substrate electrode layer includes a strip-shaped polymer substrate and a functional electrode disposed on the same layer, includes:

forming a polymer substrate layer on the first side of the ultrathin glass substrate;

patterning the polymer substrate layer to form a plurality of polymer strip-shaped substrates which are arranged at intervals; and

functional electrodes are arranged among the macromolecule strip-shaped substrates, and the functional electrodes are one or a combination of power supply electrodes, fingerprint identification electrodes, touch identification electrodes and driving electrodes.

An object of the utility model is to provide an OLED panel based on ultra-thin glass can not need from the type, reduces the laminating number of times, reduces the material and uses and extravagant, strengthens the panel functionality, lowers the whole thickness of panel, has both reduced holistic manufacturing cost, has promoted OLED's processing procedure yield again.

Drawings

Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments thereof, with reference to the following drawings.

Fig. 1 is a schematic cross-sectional view of an ultra-thin glass based OLED panel of the present invention.

Fig. 2 is a flow chart of a method of manufacturing an embodiment of an ultra-thin glass based OLED panel of the present invention.

Fig. 3 to 8 are schematic views illustrating the process of the manufacturing method of one embodiment of the ultra-thin glass-based OLED panel according to the present invention.

Reference numerals

1. Ultra-thin glass substrate

10. Bending stress dissipation groove

11. Rigid region

12. Bending stress dissipation groove

2. High molecular strip substrate

3 OLED device layer

4. Packaging cover plate layer

5. Functional electrode

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus, a repetitive description thereof will be omitted.

Fig. 1 is a schematic cross-sectional view of an ultra-thin glass based OLED panel of the present invention. As shown in fig. 1, the utility model discloses an OLED panel based on ultra-thin glass, include: an ultrathin glass substrate 1, a substrate electrode layer, and an OLED device layer 3. The ultra-thin glass substrate 1 has a plurality of bending stress dissipation grooves 10, and the extending direction of the bending stress dissipation grooves 10 is perpendicular to the predetermined bending direction. The substrate electrode layer is formed on one side of the ultrathin glass substrate 1 and comprises a plurality of polymer strip-shaped substrates 2 and functional electrodes 5 on the same layer, the polymer strip-shaped substrates 2 at least cover the bending stress dissipation grooves 10, and the functional electrodes 5 are arranged in gaps among the polymer strip-shaped substrates 2. The OLED device layer 3 is formed on one side of the high-molecular strip-shaped substrate 2, which is far away from the ultrathin glass substrate 1. Particularly, the utility model discloses an OLED device layer is supported to the upper surface of polymer strip substrate 2, and the lower surface part is formed at ultra-thin glass substrate 1, and all the other parts of lower surface can expose in ultra-thin glass substrate 1's the groove of lining up, and function electrode 5 can distribute in the both sides of polymer strip substrate 2 for

function electrode

5 and 2 strokes of polymer strip substrate are with layer structure, and the flexibility of skill reinforcing panel can reduce panel thickness again.

In a preferred embodiment, the functional electrode 5 is one or a combination of a power supply electrode, a fingerprint recognition electrode, a touch recognition electrode, and a driving electrode, but not limited thereto.

In a preferred embodiment, the bending stress dissipation groove 10 is included in a first projection region of the OLED device layer 3 by the polymer strip substrate 2 in a second projection region of the OLED device layer 3, and the area of the polymer strip substrate is not smaller than the large outer frame area of the glass substrate, but not limited thereto.

In a preferred embodiment, an encapsulating cover plate layer 4 is further included, but not limited thereto, formed on a side of the OLED device layer 3 away from the polymer strip substrate 2.

In a preferred embodiment, the ultra-thin glass substrate 1 includes a rigid region 11 for supporting the polymer strip substrate 2 and a bending stress dissipating groove 10 for dissipating bending stress when the panel is bent, and the thickness of the rigid region 11 ranges from 0.1 mm to 0.55 mm, but not limited thereto.

In a preferred embodiment, the bending stress dissipation groove 10 is a through groove, which penetrates through the ultra-thin glass substrate 1, and the local polymer strip-shaped substrate 2 is exposed from the bending stress dissipation groove 10, but not limited thereto.

In a preferred embodiment, the bending stress-dissipating grooves 10 are formed by etching the ultra-thin glass substrate 1 to form a grid structure or a mesh structure connecting two sides of the grooves, the extending direction of the grid structure is parallel to the predetermined bending direction, and the thickness of the ultra-thin glass substrate 1 in the bending stress-dissipating grooves 10 is smaller than that of the rigid region 11, but not limited thereto.

In a preferred embodiment, the thickness of the ultra-thin glass substrate 1 in the bending stress-dissipating groove 10 range from 10 microns to 90 microns, but not limited thereto.

In a preferred embodiment, one side of the polymer strip substrate can be used as a substrate of the OLED device layer, and the other side can block the etching of the ultrathin glass substrate, so that the OLED device layer is prevented from being etched by mistake, and the fault tolerance of etching control is enhanced. The composition of the polymer strip substrate may be polyimide (polyimide), parylene-C (parylene-C), parylene-D (parylene-D), parylene-N (parylene-N), etc., the thickness of the polymer strip substrate: 5-100 um. The process of the polymer strip-shaped substrate comprises the following steps: the existing glass is primed by using a high polymer material, and a coating, or a product, or a hot pressing process can be adopted. Compared with the prior art: the release is not needed, the laminating times are reduced, and the material use and waste are reduced. In the prior art, laser is used for releasing, then a glass substrate is scrapped and is not used, and then an OLED (organic light emitting diode) adhesive material is attached to a supporting material.

The utility model discloses a substrate on OLED device layer can be regarded as to one side of polymer strip substrate 2, and the opposite side can block the sculpture of ultra-thin glass substrate, prevents that OLED device layer from being by mistake sculpture, the fault-tolerant rate of reinforcing sculpture control. In addition, the structure that the polymer strip-shaped substrates 2 and the functional electrodes 5 are arranged on the same layer reduces the use of the polymer strip-shaped substrates 2 and reduces the cost, and the functional electrodes 5 are arranged by utilizing the gaps between the polymer strip-shaped substrates 2, so that the thickness of one electrode layer can be reduced, namely the whole thickness of the panel is reduced.

Fig. 2 is a flow chart of a method of manufacturing an embodiment of an ultra-thin glass based OLED panel of the present invention. Fig. 3 to 8 are schematic views illustrating the process of the manufacturing method of one embodiment of the ultra-thin glass-based OLED panel according to the present invention. As shown in fig. 2 to 8, the method for manufacturing an ultra-thin glass-based OLED panel of the present invention includes the following steps:

s110, providing an ultra-thin glass substrate 1 (see fig. 3), wherein the original thickness of the ultra-thin glass substrate 1 ranges from 0.33 mm to 0.55 mm.

And S120, forming a substrate electrode layer on the first side of the ultrathin glass substrate 1, wherein the substrate electrode layer comprises polymer strip-shaped substrates 2 and functional electrodes 5 which are arranged on the same layer, and the functional electrodes 5 are arranged in gaps among the polymer strip-shaped substrates 2. First, a polymer substrate layer is formed on a first side of the ultra-thin glass substrate 1. Then, the polymer substrate layer is patterned (e.g. by an etching process) to form a plurality of polymer strip-shaped substrates 2 arranged at intervals (see fig. 4). Finally, functional electrodes 5 are arranged between the polymer strip-shaped substrates 2, and the functional electrodes 5 are one or a combination of power supply electrodes, fingerprint identification electrodes, touch identification electrodes and driving electrodes (see fig. 5).

S130, forming an OLED device layer 3 on a side of the polymer strip substrate 2 away from the ultra-thin glass substrate 1 (see fig. 6).

And S140, locally thinning the second side of the ultrathin glass substrate 1, forming a plurality of bending stress dissipation grooves 10 in the thinned area, wherein the bending stress dissipation grooves 10 are through grooves and penetrate through the ultrathin glass substrate 1, and the local macromolecule strip-shaped substrate 2 is exposed from the bending stress dissipation grooves 10. (see FIG. 7)

And S150, forming an encapsulation cover plate layer on the side, away from the polymer strip substrate, of the OLED device layer (see FIG. 8).

The utility model discloses a main step includes: providing a glass substrate raw material, a polymer folding and priming molding process, an OLED display process and a glass substrate etching process. Moreover, the etching process of the glass substrate can be divided into two cases:

(1) The thickness of the glass substrate is not changed, and only the glass in the bending area is etched.

(2) And after the thickness of the glass substrate is reduced, etching the glass in the bending area.

	Conventional folded OLED	The utility model discloses
			Cost (material, equipment, yield)	High (a)	Is low in
Large area exfoliation	Difficulty in	Without stripping process
			Post-bonding process	High precision laminating machine	Non-bonding process

The utility model discloses a with the polymer strip substrate of bending zone department, etching stop layer when can regard as bending zone glass etching, the unanimous effect of buckling can be exported in such design. The thickness of the glass at the bending area is thinner (10-100 um) relative to the thickness of the glass at other non-bending areas. The glass thickness at the bending region is thinner and patterned relative to the glass thickness at other non-bendable regions.

Based on above-mentioned technical characteristic, compared with the prior art, the utility model discloses following technological effect has:

(1) The release is not needed.

(2) The laminating times are reduced, and the material use and waste are reduced.

(3) The overall production cost is reduced.

(4) The process yield of the OLED is improved.

(5) The overall thickness of the panel is reduced.

To sum up, the utility model aims to provide an OLED panel based on ultra-thin glass can not need from the type, reduces the laminating number of times, reduces the material and uses and extravagant, and reinforcing panel functionality reduces the whole thickness of panel, has both reduced holistic manufacturing cost, has promoted OLED's processing procedure yield again.

The foregoing is a more detailed description of the present invention, taken in conjunction with specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments thereof. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. An ultra-thin glass based OLED panel, comprising:

the substrate electrode layer is formed on one side of the ultrathin glass substrate and comprises a plurality of polymer strip-shaped substrates and functional electrodes which are arranged on the same layer, the polymer strip-shaped substrates at least cover the bending stress dissipation groove, and the functional electrodes are arranged in gaps among the polymer strip-shaped substrates; and

and the OLED device layer is formed on one side of the polymer strip-shaped substrate, which is deviated from the ultrathin glass substrate.

2. The ultra-thin glass-based OLED panel of claim 1, wherein the functional electrodes are one or a combination of power supply electrodes, fingerprint recognition electrodes, touch recognition electrodes, drive electrodes.

3. The ultra-thin glass-based OLED panel of claim 1, wherein the bending stress-dissipating slots are contained in a first projected area of the OLED device layer by the polymer strip substrate in a second projected area of the OLED device layer.

4. The ultra-thin glass-based OLED panel of claim 1, further comprising an encapsulating cover plate layer formed on a side of the OLED device layer facing away from the polymer strip substrate.

5. The ultra-thin glass-based OLED panel of claim 1, wherein the ultra-thin glass substrate includes a rigid region supporting the polymer strip substrate and a bending stress dissipating groove for dissipating bending stress when the panel is bent, the rigid region having a thickness in a range of 0.1 mm to 0.55 mm.

6. The ultra-thin glass-based OLED panel of claim 5, wherein the bending stress-dissipating slots are through slots, through the ultra-thin glass substrate, and wherein a portion of the polymer strip substrate is exposed from the bending stress-dissipating slots.

7. The ultra-thin glass-based OLED panel of claim 5, wherein the bending stress dissipation grooves are formed by etching the ultra-thin glass substrate to form a grid structure or a mesh structure connecting two sides of the dissipation grooves, the extending direction of the grid structure is parallel to the preset bending direction, and the thickness of the ultra-thin glass substrate in the bending stress dissipation grooves is smaller than that of the rigid region.

8. The ultra-thin glass-based OLED panel of claim 7, wherein the thickness of the ultra-thin glass substrate in the bending stress dissipating slot range is 10 to 90 microns.