CN217822795U

CN217822795U - Integrated circuit packaging structure with electromagnetic interference prevention structure

Info

Publication number: CN217822795U
Application number: CN202221732970.7U
Authority: CN
Inventors: 朱文锋
Original assignee: Shenzhen Sanliansheng Technology Co ltd
Current assignee: Shenzhen Sanliansheng Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2022-11-15
Anticipated expiration: 2032-07-05

Abstract

The utility model discloses an integrated circuit packaging structure with electromagnetic interference resistance structure, including the circuit board body, the equal fixedly connected with a plurality of stitch of circuit board body front end and rear end, guard plate before the anterior swing joint in circuit board body upper end, circuit board body upper end rear portion swing joint has the rear fender board, left stop device of preceding guard plate left end fixedly connected with, right stop device of preceding guard plate right-hand member fixedly connected with, right stop device is the same with left stop device structure, the equal fixedly connected with heat abstractor in preceding guard plate upper end and rear fender board upper end. Integrated circuit packaging structure with electromagnetic interference resistance structure, the jam-proof is efficient, the radiating effect is good, stability is high, is fit for the use of integrated circuit encapsulation.

Description

Integrated circuit packaging structure with electromagnetic interference prevention structure

Technical Field

The utility model relates to an integrated circuit technical field, in particular to integrated circuit packaging structure with electromagnetic interference resistance structure.

Background

An integrated circuit is a miniature electronic device or component. The elements such as transistor, resistance, capacitance and inductance and wiring required in a circuit are interconnected by adopting a certain process, manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and then packaged in a tube shell to form a microstructure with the required circuit function, and the existing integrated circuit packaging process has at least the following defects: 1. the existing integrated circuit board can not isolate the external electromagnetic interference after being packaged, thereby influencing the use; 2. after the existing integrated circuit board is packaged, the heat dissipation performance is poor, and the service life is easy to reduce due to long-term overheat use, so that an integrated circuit packaging structure with an electromagnetic interference prevention structure is provided.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides an integrated circuit packaging structure with electromagnetic interference resistance structure can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the technical proposal that:

integrated circuit packaging structure with electromagnetic interference resistance structure, including the circuit board body, the equal fixedly connected with a plurality of stitch of circuit board body front end and rear end, guard plate before the anterior swing joint in circuit board body upper end, circuit board body upper end rear portion swing joint has the rear guard plate, left stop device of preceding guard plate left end fixedly connected with, right stop device of preceding guard plate right-hand member fixedly connected with, right stop device is the same with left stop device structure, the equal fixedly connected with heat abstractor in preceding guard plate upper end and rear guard plate upper end.

Preferably, the front end of the rear protection plate is fixedly connected with a connecting plate, the left end and the right end of the connecting plate are both provided with limiting holes, and the lower end left part and the lower end right part of the rear protection plate are both fixedly connected with a first supporting plate.

Preferably, the rear end of the front protection plate is provided with a notch, the left part of the lower end of the front protection plate and the right part of the lower end of the front protection plate are fixedly connected with a second supporting plate, and the notch is connected with the connecting plate in a sliding manner.

Preferably, the heat dissipation device comprises a heat dissipation fin, the lower end of the heat dissipation fin is fixedly connected with four heat conduction plates, the lower ends of the four heat conduction plates are fixedly connected with heat conduction fins together, the four heat conduction plates are fixedly connected with the rear protection plate in an inserting mode, and the heat conduction fins are in contact with the upper end of the circuit board body.

Preferably, the right limiting device comprises a shell, a sliding rod is movably connected to the right end of the shell in an inserting mode, a pull ring is fixedly connected to the right end of the sliding rod, a limiting block is fixedly connected to the left end of the sliding rod, and a spring is sleeved on the outer surface of the sliding rod.

Preferably, the shell is fixedly installed at the right end of the front protection plate, and the limiting block extends to the limiting hole.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. in the utility model, the circuit board body is wrapped by the rear protection plate and the front protection plate by inserting the connecting plate into the slot, so that the interference on the circuit board body caused by the electromagnetism can be caused, and the limit blocks on the left limiting device and the right limiting device extend into the two limit holes, so that the rear protection plate and the front protection plate can be limited, the connection stability is improved, and the installation and the disassembly are convenient;

2. the utility model discloses in, through set up heat abstractor on back guard plate and the preceding guard plate, and heat abstractor goes up the fixedly connected with fin, through conducting strip and heat-conducting plate with heat conduction to the fin on the circuit board body to can dispel the heat to the circuit board body, improve life, convenient to use.

Drawings

FIG. 1 is a schematic diagram of an integrated circuit package structure with EMI shielding structure according to the present invention;

FIG. 2 is a schematic diagram of the connection of the rear protection plate of the IC package structure with EMI protection of the present invention;

FIG. 3 is a schematic diagram of the overall structure of the heat dissipation device with an EMI structure of the present invention;

fig. 4 is a schematic diagram of the overall structure of the right limiting device of the integrated circuit package structure with the emi shielding structure of the present invention.

In the figure: 1. a circuit board body; 2. a stitch; 3. a right limiting device; 4. a rear guard plate; 5. a heat sink; 6. a left stop device; 7. a front guard plate; 31. a housing; 32. a spring; 33. a pull ring; 34. a slide bar; 35. a limiting block; 41. a first supporting plate; 42. a connecting plate; 43. a limiting hole; 51. a heat sink; 52. a heat conducting plate; 53. a heat conductive sheet; 71. a notch; 72. and a second supporting plate.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

Referring to fig. 1-4, the present invention provides a technical solution:

integrated circuit packaging structure with electromagnetic interference resistance structure, including

circuit board body

1, 1 front end of circuit board body and the equal fixedly connected with a plurality of stitch 2 in rear end, guard plate 7 before the anterior swing joint in 1 upper end of circuit board body, 1 upper end rear portion swing joint of circuit board body has

rear fender

4, 7 left end fixedly connected with left stop device 6 of preceding guard plate, 7 right-hand member fixedly connected with right stop device 3 of preceding guard plate, right stop device 3 is the same with 6 structures in left stop device, 7 upper ends of preceding guard plate and the equal fixedly connected with heat abstractor 5 in 4 upper ends of rear fender.

In the embodiment, the front end of the rear protection plate 4 is fixedly connected with a connecting plate 42, the left end and the right end of the connecting plate 42 are both provided with a limiting hole 43, and the left part and the right part of the lower end of the rear protection plate 4 are both fixedly connected with a first supporting plate 41; open 7 rear ends of preceding guard plate has notch 71, and preceding guard plate 7 lower extreme left part and the equal fixedly connected with of lower extreme right part No. two layer boards 72, notch 71 and connecting plate 42 sliding connection, no. two layer boards 72 and a layer board 41 can lift circuit board body 1 spacing, improve the stability that circuit board body 1 and back guard plate 4 and preceding guard plate 7 are connected.

In this embodiment, the heat dissipation device 5 includes a heat dissipation fin 51, the lower end of the heat dissipation fin 51 is fixedly connected with four heat conduction plates 52, the lower ends of the four heat conduction plates 52 are fixedly connected with heat conduction fins 53, the four heat conduction plates 52 are fixedly connected with the rear protection plate 4 in an inserting manner, and the heat conduction fins 53 are in contact with the upper end of the circuit board body 1; the right limiting device 3 comprises a shell 31, the right end of the shell 31 is movably connected with a sliding rod 34 in a penetrating manner, the right end of the sliding rod 34 is fixedly connected with a pull ring 33, the left end of the sliding rod 34 is fixedly connected with a limiting block 35, and the outer surface of the sliding rod 34 is sleeved with a spring 32; casing 31 fixed mounting is at 7 right-hand members of guard plate in the front, and stopper 35 extends to spacing hole 43, and the conducting strip 53 front end and rear end are the arc structure, and the circuit board body 1 of being convenient for inserts, and after stopper 35 inserted spacing hole 43, can improve the stability that back guard plate 4 and preceding guard plate 7 are connected.

It should be noted that, the utility model discloses an integrated circuit packaging structure with electromagnetic interference resistance structure, in the use, at first guard plate 7 is connected with the anterior interlude of circuit board body 1 before with, back guard plate 4 is connected with the interlude of circuit board body 1 rear portion, make circuit board body 1 be located two No. 41 layer boards and two No. two layer board 72 upper portions, pull ring 33 on outwards spurting left side stop device 6 and the right stop device 3, make connecting plate 42 extend completely to in notch 71, loosen pull ring 33 again, receive spring 32's elastic action, can extrude stopper 35, thereby make stopper 35 extend into spacing hole 43, improve the stability that back guard plate 4 and preceding guard plate 7 are connected, because all be provided with heat abstractor 5 on back guard plate 4 and the preceding 7, back guard plate 4, when preceding guard plate 7 and circuit board body 1 are connected, can make the last heat conduction of heat abstractor 5 and the contact of circuit board body 1 upper end, thereby make the heat conduction that circuit board body 1 during operation produced give fin 51, and dispel the heat through fin 51, thereby improve the life of circuit board body 1, whole integrated circuit packaging structure, the high efficiency of preventing interference, the high stability of integrated circuit packaging effect is fit for the integrated circuit.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. Integrated circuit packaging structure with electromagnetic interference resistance structure, including circuit board body (1), its characterized in that: the circuit board comprises a circuit board body (1), a plurality of pins (2) fixedly connected with the front end and the rear end, a front protection plate (7) is movably connected with the front portion of the upper end of the circuit board body (1), a rear protection plate (4) is movably connected with the rear portion of the upper end of the circuit board body (1), a left limiting device (6) is fixedly connected with the left end of the front protection plate (7), a right limiting device (3) is fixedly connected with the right end of the front protection plate (7), the right limiting device (3) is identical to the left limiting device (6) in structure, and a heat dissipation device (5) is fixedly connected with the upper end of the front protection plate (7) and the upper end of the rear protection plate (4).

2. The integrated circuit package structure with emi shielding structure of claim 1, wherein: rear protection plate (4) front end fixedly connected with connecting plate (42), spacing hole (43) have all been opened to connecting plate (42) left end and right-hand member, rear protection plate (4) lower extreme left part and the equal fixedly connected with layer board (41) in lower extreme right part.

3. The integrated circuit package structure with emi shielding structure of claim 1, wherein: preceding guard plate (7) rear end is opened there is notch (71), the equal fixedly connected with layer board (72) No. two of preceding guard plate (7) lower extreme left part and lower extreme right part, notch (71) and connecting plate (42) sliding connection.

4. The package structure of claim 1, wherein: the heat dissipation device (5) comprises heat dissipation fins (51), wherein the lower ends of the heat dissipation fins (51) are fixedly connected with four heat conduction plates (52), four heat conduction plates (52) are fixedly connected with heat conduction fins (53) at the lower ends of the heat conduction plates, the heat conduction plates (52) are fixedly connected with the rear protection plate (4) in an inserting mode, and the heat conduction fins (53) are in contact with the upper end of the circuit board body (1).

5. The integrated circuit package structure with emi shielding structure of claim 1, wherein: the right limiting device (3) comprises a shell (31), a sliding rod (34) is movably connected to the right end of the shell (31) in a penetrating mode, a pull ring (33) is fixedly connected to the right end of the sliding rod (34), a limiting block (35) is fixedly connected to the left end of the sliding rod (34), and a spring (32) is sleeved on the outer surface of the sliding rod (34).

6. The integrated circuit package structure with emi shielding structure of claim 5, wherein: casing (31) fixed mounting is at preceding guard plate (7) right-hand member, stopper (35) extend to spacing hole (43).