CN217800675U

CN217800675U - Ceramic plate grinding machine

Info

Publication number: CN217800675U
Application number: CN202221315535.4U
Authority: CN
Inventors: 于正国; 吴鹏
Original assignee: Saichuang Electric Tongling Co ltd
Current assignee: Guoci Saichuang Electric (Tongling) Co.,Ltd.
Priority date: 2022-05-30
Filing date: 2022-05-30
Publication date: 2022-11-15
Anticipated expiration: 2032-05-30

Abstract

The utility model discloses a ceramic plate grinds machine, include: a product carrying module (1) for containing ceramic plates; the polishing displacement module (2) is used for moving in the X-axis direction and the Y-axis direction on the product suction module; and the polishing module (3) is arranged on the polishing displacement module and used for polishing the ceramic plate on the product suction module. The beneficial effects of the utility model are that realize automated processing with polishing of circuit board, improved the efficiency of polishing.

Description

Ceramic plate grinding machine

Technical Field

The utility model relates to a pottery grinds technical field, especially relates to ceramic plate grinds machine.

Background

The Ceramic circuit board mainly comprises four major categories of HTCC (high-Temperature Co-fibrous Ceramic), LTCC (Low-Temperature Co-fibrous Ceramic), DBC (Direct Bonded Copper) and DPC (Direct plated Copper). Wherein DPC is a direct copper-plated circuit board, and the preparation process comprises: firstly, the ceramic substrate is preprocessed and cleaned, a copper metal composite layer is sputtered and combined on the ceramic substrate in a vacuum coating mode which is a film professional manufacturing technology, then the circuit manufacturing is completed through photoresist coating exposure, developing, etching and film removing processes of photolithography, finally the thickness of the circuit is increased through electroplating/chemical plating deposition, and the metallized circuit manufacturing is completed after the photoresist is removed. In the DPC preparation process, the flatness of the surface of the DPC ceramic circuit board is crucial to the process. At present, the surface of a copper layer is usually treated by grinding or polishing, and the surface scratches are serious after processing, and a circuit board is damaged to a certain extent.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem be that current circuit board cutting can not automated processing, provides a ceramic plate grinds machine for this reason.

The technical scheme of the utility model is that: a ceramic plate grinding mill comprising: the product bearing module is used for bearing the ceramic plate; the polishing displacement module is used for moving in the X-axis direction and the Y-axis direction on the product suction module; and the polishing module is arranged on the polishing displacement module and used for polishing the ceramic plate on the product suction module.

In the above scheme, the product bearing module comprises a lower fixing plate, a plurality of suction ports are uniformly distributed on the lower fixing plate, pipe joints communicated with the suction ports are formed in the side face of the lower fixing plate, the pipe joints are communicated with a negative pressure source, an upper adsorption plate is mounted on the upper surface of the lower fixing plate, a plurality of suction grooves in one-to-one correspondence with the suction ports are formed in the upper adsorption plate, and the suction grooves are used for adsorbing the ceramic plate.

In the above scheme, the polishing displacement module comprises Y-axis moving mechanisms respectively located on two side edges of the product bearing module, the Y-axis moving mechanism is in driving connection with an X-axis moving mechanism, the Y-axis moving mechanism comprises a Y-axis displacement module and a Y-axis displacement driving servo, the X-axis moving mechanism comprises an X-axis displacement module and an X-axis displacement driving servo, and the X-axis displacement module is in sliding fit with the Y-axis displacement module and is driven by the Y-axis displacement driving servo to move along the Y axis.

In the scheme, the polishing displacement module is arranged on the platform, the platform is positioned above the product bearing module, and the Y-axis moving mechanism is fixedly connected with the platform through the support column.

In the above scheme, the polishing module comprises a mounting plate in sliding fit with the X-axis displacement module, a Z-axis driving mechanism is mounted on the mounting plate, a circular truncated cone-shaped polishing head is mounted at the bottom of the Z-axis driving mechanism, an alternating current rotating motor is mounted on the side surface of the Z-axis driving mechanism, and the alternating current rotating motor generates a rotating magnetic field to drive the circular truncated cone-shaped polishing head to rotate.

In the scheme, the grinding fluid interface is formed on the lower surface of the circular truncated cone type grinding head.

The improvement of the scheme is that the product bearing module, the polishing displacement module and the polishing module are contained in a box body.

In the scheme, the polishing displacement module and the polishing module are in signal connection with the electric cabinet.

The utility model has the advantages that: the automatic processing of polishing with the circuit board has been realized, has improved the efficiency of polishing.

Drawings

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a schematic view of the product carrier module of FIG. 1;

FIG. 4 is a perspective view of FIG. 3;

FIG. 5 is a schematic view of the sanding displacement module of FIG. 1;

FIG. 6 is a schematic view of the sanding module of FIG. 1;

in the figure: 1. the device comprises a product bearing module, 11, a lower fixing plate, 12, an air suction opening, 13, a pipe joint, 14, an upper adsorption plate, 15, a suction groove, 2, a polishing displacement module, 21, a Y-axis displacement module, 22, a Y-axis displacement driving servo, 23, an X-axis displacement module, 24, an X-axis displacement driving servo, 25, a platform, 26, a support column, 3, a polishing module, 31, a mounting plate, 32, a Z-axis driving mechanism, 33, a circular table type polishing head, 34, an alternating current rotating motor, 35, a grinding fluid interface, 4, a box body, 5 and an electric cabinet.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and embodiments.

As shown in fig. 1 to 6, example 1: the utility model comprises a product bearing module 1, which is used for containing a ceramic plate; the polishing displacement module 2 is used for moving in the X-axis direction and the Y-axis direction on the product suction module; and the polishing module 3 is arranged on the polishing displacement module and used for polishing the ceramic plate on the product suction module. The product bearing module comprises a lower fixing plate 11, a plurality of suction ports 12 are uniformly distributed on the lower fixing plate, a pipe joint 13 communicated with the suction ports is formed in the side face of the lower fixing plate, the pipe joint is communicated with a negative pressure source, an upper adsorption plate 14 is mounted on the upper surface of the lower fixing plate, a plurality of suction grooves 15 which are in one-to-one correspondence with the suction ports are formed in the upper adsorption plate and are communicated with the suction ports, and the suction grooves are used for adsorbing ceramic plates. The polishing displacement module comprises Y-axis moving mechanisms respectively located on two side edges of the product bearing module, the Y-axis moving mechanisms are connected with X-axis moving mechanisms in a driving mode, the X-axis moving mechanisms and the two Y-axis moving mechanisms enclose a door-shaped area, the product bearing mold is located in the door-shaped area, the Y-axis moving mechanisms comprise Y-axis displacement modules 21 and Y-axis displacement driving servos 22, the X-axis moving mechanisms comprise X-axis displacement modules 23 and X-axis displacement driving servos 24, and the X-axis displacement modules are in sliding fit with the Y-axis displacement modules and move along the Y axis through the Y-axis displacement driving servos. The polishing module comprises a mounting plate 31 in sliding fit with the X-axis displacement module, the mounting plate can slide along the X-axis direction under the drive of an X-axis displacement drive servo, a Z-axis drive mechanism 32 is mounted on the mounting plate, the Z-axis drive mechanism can be an air cylinder or an electric cylinder, a circular table type polishing head 33 is mounted at the bottom of the Z-axis drive mechanism, an alternating current rotating motor 34 is mounted on the side face of the Z-axis drive mechanism, and the alternating current rotating motor generates a rotating magnetic field to drive the circular table type polishing head to rotate. The alternating current motor generates a rotating magnetic field by alternating current phase difference flowing through a motor stator, and the rotating magnetic field drives the circular table type polishing head to rotate. The grinding fluid interface 35 has been seted up to the lower surface of round platform type head of polishing, and the grinding fluid provides the cooling lubrication's effect when polishing in letting in this grinding fluid interface through external pipeline.

Example 2: the difference from embodiment 1 is that the polishing displacement module is arranged on a platform 25, the platform is positioned above the product bearing module, a window is arranged on the platform, the suction groove of the product bearing module can be exposed from the window, and the Y-axis moving mechanism is fixedly connected with the platform through a support column 26.

Example 3: the difference from embodiment 1 is that the product carrying module, the sanding displacement module and the sanding module are housed in a box 4. The box body is provided with a transparentization window, the internal conditions can be seen, the polishing displacement module and the polishing module are in signal connection with the electric cabinet 5, and the electric cabinet is used for controlling the polishing displacement module and the polishing module to start and stop.

The utility model discloses a use method as follows: the sucking inslot of putting into the ceramic plate is artifical, through the negative pressure suction, make the suction opening produce the negative pressure and adsorb the ceramic plate through inhaling the groove, along X axle and Y axle horizontal migration displacement module of polishing, the module of polishing is aimed at the ceramic plate and is rotated and polish, the lapping liquid flows the ceramic plate surface from the lapping liquid interface, Z axle actuating mechanism can remove along the Z axle, adjust the high position of interchange rotating electrical machines, and then adjust the elasticity of round platform type head of polishing and ceramic plate laminating.

Claims

1. Ceramic plate grinds machine, characterized by: the method comprises the following steps: a product carrying module (1) for containing ceramic plates; the polishing displacement module (2) is used for moving in the X-axis direction and the Y-axis direction on the product suction module; and the polishing module (3) is arranged on the polishing displacement module and used for polishing the ceramic plate on the product suction module.

2. A ceramic plate grinder as claimed in claim 1, wherein: the product bearing module comprises a lower fixing plate (11), wherein a plurality of air suction openings (12) are uniformly distributed in the lower fixing plate, a pipe joint (13) communicated with the air suction openings is formed in the side face of the lower fixing plate, the pipe joint is communicated with a negative pressure source, an upper adsorption plate (14) is mounted on the upper surface of the lower fixing plate, a plurality of suction grooves (15) in one-to-one correspondence with the air suction openings are formed in the upper adsorption plate, and the suction grooves are used for adsorbing the ceramic plate.

3. A ceramic plate grinding machine as claimed in claim 1, characterized in that: the polishing displacement module comprises Y-axis moving mechanisms respectively positioned on two side edges of the product bearing module, the Y-axis moving mechanisms are connected with X-axis moving mechanisms in a driving mode and comprise Y-axis displacement modules (21) and Y-axis displacement driving servos (22), the X-axis moving mechanisms comprise X-axis displacement modules (23) and X-axis displacement driving servos (24), and the X-axis displacement modules are in sliding fit with the Y-axis displacement modules and move along the Y axis through the Y-axis displacement driving servos.

4. A ceramic plate grinding machine as claimed in claim 3, characterized in that: the polishing displacement module is arranged on a platform (25), the platform is positioned above the product bearing module, and the Y-axis moving mechanism is fixedly connected with the platform through a support column (26).

5. A ceramic plate grinding machine as claimed in claim 1, characterized in that: the polishing module comprises a mounting plate (31) in sliding fit with the X-axis displacement module, a Z-axis driving mechanism (32) is mounted on the mounting plate, a circular table type polishing head (33) is mounted at the bottom of the Z-axis driving mechanism, an alternating current rotating motor (34) is mounted on the side face of the Z-axis driving mechanism, and the alternating current rotating motor generates a rotating magnetic field to drive the circular table type polishing head to rotate.

6. A ceramic plate grinding machine according to claim 5, characterized in that: and the lower surface of the circular truncated cone type polishing head is provided with a grinding fluid interface (35).

7. A ceramic plate grinding machine as claimed in claim 1, characterized in that: the product carrying module, the polishing displacement module and the polishing module are accommodated in a box body (4).

8. A ceramic plate grinding machine as claimed in claim 1, characterized in that: the polishing displacement module and the polishing module are in signal connection with the electric cabinet (5).