CN217768348U - Metal packaging shell of integrated circuit device - Google Patents

Metal packaging shell of integrated circuit device Download PDF

Info

Publication number
CN217768348U
CN217768348U CN202221092621.3U CN202221092621U CN217768348U CN 217768348 U CN217768348 U CN 217768348U CN 202221092621 U CN202221092621 U CN 202221092621U CN 217768348 U CN217768348 U CN 217768348U
Authority
CN
China
Prior art keywords
drain pan
integrated circuit
shell
top shell
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202221092621.3U
Other languages
Chinese (zh)
Inventor
庄涛
夏林
庄兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Zhenxin Electronic Technology Co ltd
Original Assignee
Hefei Zhenxin Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Zhenxin Electronic Technology Co ltd filed Critical Hefei Zhenxin Electronic Technology Co ltd
Priority to CN202221092621.3U priority Critical patent/CN217768348U/en
Application granted granted Critical
Publication of CN217768348U publication Critical patent/CN217768348U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

The utility model discloses a metal package shell of integrated circuit device, including drain pan and top shell, top shell cup joints with the drain pan, the both sides outer wall of drain pan is provided with the spacing groove, the both sides of top shell are provided with spacing bolt, spacing bolt and spacing groove joint, the surface of drain pan is provided with the stitch through-hole, the top of drain pan is provided with first sealed pad, the sealed pad of second respectively, the inner wall top of top shell is provided with the seal groove, the utility model relates to an integrated circuit technical field. This metal package shell of integrated circuit device has reached the metal package shell and has constituted by drain pan and top shell jointly, installs integrated circuit and drain pan, and the stitch is worn out through the stitch through-hole to cup joint top shell and drain pan, rotate spacing bolt, make spacing bolt stretch out and carry out the joint with the spacing groove, and then fix drain pan and top shell, improve equipment life's purpose.

Description

Metal packaging shell of integrated circuit device
Technical Field
The utility model relates to an integrated circuit field, more specifically say, relate to a metal package shell of integrated circuit device.
Background
An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function. Integrated circuit devices typically require a metal package to be attached to the integrated circuit to protect the integrated circuit. At present, the metal packaging shell of the existing integrated circuit device is single in structure, inconvenient for workers to rapidly install and disassemble, poor in fixing stability of the integrated circuit, and further influences the service life of equipment, and cannot meet the use requirements.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
The metal package shell of current integrated circuit device to exist among the prior art, single structure, the staff of being not convenient for installs fast and dismantles, and integrated circuit fixed stability is poor, and then influences equipment life, can't satisfy the problem of user demand, the utility model aims to provide a metal package shell of integrated circuit device, it can realize that metal package shell comprises drain pan and top shell jointly, install integrated circuit and drain pan, the stitch is worn out through the stitch through-hole, and cup joint top shell and drain pan, rotate spacing bolt, make spacing bolt stretch out and carry out the joint with the spacing groove, and then fix drain pan and top shell, the drain pan top sets up first sealed pad and second sealed pad, when top shell cup joints with the drain pan, the seal groove extrudees with first sealed pad, second sealed pad, improve the installation sealing performance of drain pan and top shell, top shell inside sets up extrusion spring and stripper plate, be convenient for extrude fixedly to integrated circuit, improve integrated circuit fixed stability, improve equipment life.
2. Technical scheme
In order to solve the above problems, the utility model adopts the following technical proposal.
The utility model provides a metal package shell of integrated circuit device, includes drain pan and top shell, the top shell cup joints with the drain pan, the both sides outer wall of drain pan is provided with the spacing groove, the both sides of top shell are provided with spacing bolt, spacing bolt and spacing groove joint, the surface of drain pan is provided with the stitch through-hole, the top of drain pan is provided with first sealed pad, the sealed pad of second respectively, the inner wall top of top shell is provided with the seal groove, the seal groove is corresponding with first sealed pad, the sealed pad of second.
Preferably, the inner wall of the top shell is fixedly connected with a stop block, and the stop block corresponds to the inner wall of the bottom shell.
Preferably, the middle of the top shell is provided with a groove, the bottom of the inner wall of the groove is fixedly connected with an extrusion spring, and one end, far away from the groove, of the extrusion spring is fixedly connected with the extrusion plate.
Preferably, the material of the first sealing gasket and the second sealing gasket is rubber.
Preferably, the material of the bottom shell and the top shell is stainless steel.
Preferably, a sponge pad is arranged on the surface of the extrusion plate.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages of:
1. constitute jointly by drain pan and top shell through the metal package shell, install integrated circuit and drain pan, the stitch is worn out through the stitch through-hole to cup joint top shell and drain pan, rotate spacing bolt, make spacing bolt stretch out and carry out the joint with the spacing groove, and then fix drain pan and top shell.
2. Set up first sealed pad and second through the drain pan top and seal up, when top shell cup joints with the drain pan, the seal groove extrudees with first sealed pad, second sealed pad, improves the installation sealing performance of drain pan and top shell.
3. Through the inside extrusion spring and the stripper plate that set up of top shell, be convenient for extrude fixedly to integrated circuit, improve integrated circuit fixed stability.
Drawings
Fig. 1 is a schematic view of the overall internal structure of the present invention;
fig. 2 is a schematic view of the overall external structure of the present invention;
fig. 3 is a schematic view of a part a of the enlarged structure of fig. 1 according to the present invention.
The reference numbers in the figures illustrate:
1. a bottom case; 2. a top shell; 3. a limiting groove; 4. a limit bolt; 5. pin through holes; 6. a first gasket; 7. a second gasket; 8. a sealing groove; 9. a stopper; 10. a groove; 11. extruding the spring; 12. and (5) extruding the plate.
Detailed Description
The drawings in the embodiments of the present invention will be combined; the technical scheme in the embodiment of the utility model is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the present invention; rather than all embodiments. Based on the embodiment of the utility model; all other embodiments obtained by a person skilled in the art without making any inventive step; all belong to the protection scope of the utility model.
Example 1:
referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a metal package shell of integrated circuit device, including drain pan 1 and top shell 2, top shell 2 cup joints with drain pan 1, the both sides outer wall of drain pan 1 is provided with spacing groove 3, the both sides of top shell 2 are provided with spacing bolt 4, spacing bolt 4 and 3 joints in spacing groove, the surface of drain pan 1 is provided with stitch through-hole 5, the top of drain pan 1 is provided with first sealed pad 6 respectively, the sealed pad 7 of second, the inner wall top of top shell 2 is provided with seal groove 8, seal groove 8 and first sealed pad 6, the sealed pad 7 of second is corresponding. The metal package shell comprises drain pan 1 and top shell 2 jointly, install integrated circuit and drain pan 1, the stitch is worn out through stitch through-hole 5, and cup joint top shell 2 and drain pan 1, rotate limit bolt 4, make limit bolt 4 stretch out and carry out the joint with spacing groove 3, and then fix drain pan 1 and top shell 2, drain pan 1 top sets up first sealed 6 and the sealed 7 of second that fills up, when top shell 2 cup joints with drain pan 1, seal groove 8 and first sealed 6 of filling up, the sealed 7 of second extrudees, improve the installation sealing performance of drain pan 1 and top shell 2.
The inner wall of the top shell 2 is fixedly connected with a stop dog 9, and the stop dog 9 corresponds to the inner wall of the bottom shell 1. The inner wall of top shell 2 sets up dog 9, is convenient for support the lateral wall of drain pan 1, further improves drain pan 1 and top shell 2 installation stability.
The middle of top shell 2 is provided with recess 10, and the inner wall bottom fixedly connected with extrusion spring 11 of recess 10, the one end and the stripper plate 12 fixed connection of recess 10 are kept away from to extrusion spring 11. The top shell 2 is internally provided with an extrusion spring 11 and an extrusion plate 12, so that the integrated circuit is conveniently extruded and fixed, and the fixing stability of the integrated circuit is improved.
The first gasket 6 and the second gasket 7 are made of rubber. The sealing gasket is made of rubber, so that the overall sealing performance is improved.
The bottom shell 1 and the top shell 2 are made of stainless steel. The bottom shell 1 and the top shell 2 are made of stainless steel, so that the integrated circuit is protected.
A sponge pad is provided on the surface of the compression plate 12. Further 12, a spongy cushion is arranged at the bottom of the integrated circuit, so that the integrated circuit is protected.
The above; is only a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; according to the technical scheme of the utility model and the improvement conception, equivalent substitution or change is carried out; are all covered by the protection scope of the utility model.

Claims (6)

1. A metal package shell of an integrated circuit device comprises a bottom shell (1) and a top shell (2), and is characterized in that: top shell (2) cup joints with drain pan (1), the both sides outer wall of drain pan (1) is provided with spacing groove (3), the both sides of top shell (2) are provided with spacing bolt (4), spacing bolt (4) and spacing groove (3) joint, the surface of drain pan (1) is provided with stitch through-hole (5), the top of drain pan (1) is provided with first sealed pad (6), the sealed pad (7) of second respectively, the inner wall top of top shell (2) is provided with seal groove (8), seal groove (8) are corresponding with first sealed pad (6), the sealed pad (7) of second.
2. A metal package of an integrated circuit device, according to claim 1, further comprising: the inner wall of the top shell (2) is fixedly connected with a stop block (9), and the stop block (9) corresponds to the inner wall of the bottom shell (1).
3. A metal package of an integrated circuit device, according to claim 1, further comprising: the middle of top shell (2) is provided with recess (10), the inner wall bottom fixedly connected with extrusion spring (11) of recess (10), the one end and stripper plate (12) fixed connection of recess (10) are kept away from in extrusion spring (11).
4. A metal package housing for an integrated circuit device, as recited in claim 1, wherein: the first sealing gasket (6) and the second sealing gasket (7) are made of rubber.
5. A metal package housing for an integrated circuit device, as recited in claim 1, wherein: the bottom shell (1) and the top shell (2) are made of stainless steel.
6. A metal package housing for an integrated circuit device, as recited in claim 3, wherein: the surface of the extrusion plate (12) is provided with a spongy cushion.
CN202221092621.3U 2022-05-09 2022-05-09 Metal packaging shell of integrated circuit device Active CN217768348U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221092621.3U CN217768348U (en) 2022-05-09 2022-05-09 Metal packaging shell of integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221092621.3U CN217768348U (en) 2022-05-09 2022-05-09 Metal packaging shell of integrated circuit device

Publications (1)

Publication Number Publication Date
CN217768348U true CN217768348U (en) 2022-11-08

Family

ID=83883237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221092621.3U Active CN217768348U (en) 2022-05-09 2022-05-09 Metal packaging shell of integrated circuit device

Country Status (1)

Country Link
CN (1) CN217768348U (en)

Similar Documents

Publication Publication Date Title
US6665186B1 (en) Liquid metal thermal interface for an electronic module
US8509622B2 (en) Optical module and optical communication system
CN101154601A (en) Semiconductor device and manufacturing method thereof
CN217768348U (en) Metal packaging shell of integrated circuit device
CN210956638U (en) Embedded type sensing UNITMA chip packaging structure
US6333460B1 (en) Structural support for direct lid attach
CN105405649B (en) A kind of waterproof capacitor
CN206709016U (en) A kind of good LED drive power of water resistance
CN215494097U (en) High-frequency oscillator for high-precision radar
CN212390107U (en) Gas cylinder with safety protection device
CN209374444U (en) A kind of chip EMI shielding elastomer and chip EMI shielding and radiator
CN207517661U (en) A kind of bio-identification module and mobile terminal
CN219371686U (en) Contact box
CN208706626U (en) A kind of semiconductor crystal wafer encapsulating structure
CN218471957U (en) Low-voltage MOS device
CN218353002U (en) SMD radiator structure
CN207587534U (en) A kind of heat radiating type capacitor
CN219497768U (en) Flip-chip package
CN214625021U (en) Shell sealing mechanism and electronic equipment
CN219163384U (en) Novel integrated circuit chip
CN212377284U (en) Shaft sealing mechanism for special semiconductor equipment
CN213954324U (en) High-temperature-resistant rubber sealing ring for automobile
CN217239444U (en) Chip device
CN212570965U (en) Parallel seal welding encapsulation of high temperature ceramic tube shell based on FC chip
CN220172114U (en) Discrete device with rapid heat dissipation performance for semiconductor

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant