CN219497768U - Flip-chip package - Google Patents

Abstract

The utility model discloses a flip chip packaging body which comprises a lower shell, wherein the upper surface of the lower shell is connected with an upper shell through glue, a chip is fixedly connected to the top inner wall of the upper shell, a first metal contact is fixedly connected to the lower surface of the chip, a round hole is formed in the lower surface of the lower shell, a rubber ring is fixedly connected to the inside of the round hole, a metal sheet is fixedly connected to the inner surface of the rubber ring, a second metal contact is fixedly connected to the lower surface of the metal sheet, a groove is formed in the left surface of the lower shell, and a third metal contact is arranged on the upper surface of a substrate. By the structure, the stress at the second metal contact point can be avoided through the rubber ring and the elastic metal sheet, and the fluidity of the filling rubber is increased through the groove.

Description

Flip-chip package

Technical Field

The utility model relates to the technical field of packages, in particular to a flip chip package.

Background

Compared with a normal chip, the flip chip has better heat dissipation function, has the advantages of low voltage, high brightness, high reliability, high saturation current density and the like, so that the flip chip has wide application on a high-power LED device, and because the flip chip is connected with a machine board by virtue of a convex point, and the situation of thermal expansion difference exists, stress can be generated on a connecting point in thermal circulation, and therefore underfill glue needs to be filled between the chip and a substrate for relieving stress fatigue of the connecting point.

Disclosure of Invention

The utility model aims to at least solve one of the technical problems in the prior art and provide a flip chip package body, wherein the stress at a second metal contact point can be avoided through a rubber ring and a metal sheet with elasticity, and the fluidity of filling glue can be increased through a groove.

In order to achieve the above object, the present utility model further provides a flip chip package having the above structure, comprising:

the upper surface glue of the lower shell is connected with an upper shell, the top inner wall of the upper shell is fixedly connected with a chip, and the lower surface of the chip is fixedly connected with a first metal contact;

the lower surface of the lower shell is provided with a round hole, the inside of the round hole is fixedly connected with a rubber ring, the inner surface of the rubber ring is fixedly connected with a metal sheet, the lower surface of the metal sheet is fixedly connected with a second metal contact, and the left surface of the lower shell is provided with a groove;

and the upper surface of the substrate is provided with a third metal contact.

According to the flip chip package, the first metal contacts and the second metal contacts are distributed in rectangular arrays.

According to the flip-chip package, the metal sheet has elasticity, and the upper surface of the metal sheet is in contact with the lower surface of the first metal contact for conducting electricity.

According to the flip-chip package, the third metal contact is in contact with the lower surface of the second metal contact.

According to the flip chip package, the grooves are uniformly distributed in front and back for facilitating the flow of the filling glue.

According to the flip-chip package, the second metal contact extends to the outside of the lower case.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described below with reference to the drawings and examples;

FIG. 1 is an internal block diagram of a flip chip package according to the present utility model;

FIG. 2 is an enlarged schematic view of the structure A in FIG. 1;

FIG. 3 is a left side view of a flip chip package of the present utility model;

fig. 4 is a schematic view of a part of a flip chip package according to the present utility model.

Legend description:

1. a lower housing; 2. an upper housing; 3. a chip; 4. a first metal contact; 5. a groove; 6. a metal sheet; 7. a rubber ring; 8. a second metal contact; 9. a substrate.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

Referring to fig. 1-4, the flip chip package according to the embodiment of the utility model includes a lower housing 1, an upper housing 2 is connected to an upper surface of the lower housing 1 by glue, a chip 3 is fixedly connected to a top inner wall of the upper housing 2, a first metal contact 4 is fixedly connected to a lower surface of the chip 3, and the first metal contact 4 and a second metal contact 8 are distributed in rectangular arrays.

The lower surface of lower casing 1 is provided with the round hole, and the inside fixedly connected with rubber ring 7 of round hole, the internal surface fixedly connected with sheetmetal 6 of rubber ring 7, sheetmetal 6 have elasticity, and the upper surface of sheetmetal 6 and the lower surface contact of first metal contact 4 for electrically conduct, the lower surface fixedly connected with second metal contact 8 of sheetmetal 6, the left surface of lower casing 1 is provided with recess 5, evenly distributed around recess 5 for the flow of being convenient for fill glue.

The substrate 9, the upper surface of the substrate 9 is provided with a third metal contact, the third metal contact is in contact with the lower surface of the second metal contact 8, and the second metal contact 8 extends to the outside of the lower case 1.

Working principle: the chip 3 is fixed in the upper shell 2, the upper shell 2 and the lower shell 1 are fixed, when the second metal contact 8 is extruded, the second metal contact 8 and the elastic metal sheet 6 can be buffered through the rubber ring 7, so that the stress at the second metal contact 8 is avoided, and when the glue is applied, the mobility of the filling glue is increased through the groove 5.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims (6)

1. A flip chip package, comprising:

the upper surface glue of the lower shell (1) is connected with an upper shell (2), a chip (3) is fixedly connected to the top inner wall of the upper shell (2), and a first metal contact (4) is fixedly connected to the lower surface of the chip (3);

the lower surface of the lower shell (1) is provided with a round hole, the inside of the round hole is fixedly connected with a rubber ring (7), the inner surface of the rubber ring (7) is fixedly connected with a metal sheet (6), the lower surface of the metal sheet (6) is fixedly connected with a second metal contact (8), and the left surface of the lower shell (1) is provided with a groove (5);

and a substrate (9), wherein a third metal contact is arranged on the upper surface of the substrate (9).

2. A flip-chip package according to claim 1, characterized in that the first metal contacts (4) and the second metal contacts (8) are distributed in a rectangular array.

3. A flip chip package according to claim 1, wherein the metal sheet (6) has elasticity, and an upper surface of the metal sheet (6) is in contact with a lower surface of the first metal contact (4).

4. A flip chip package according to claim 1, characterized in that the third metal contact is in contact with the lower surface of the second metal contact (8).

5. A flip-chip package according to claim 1, characterized in that the grooves (5) are uniformly distributed back and forth.

6. A flip-chip package according to claim 1, characterized in that the second metal contacts (8) extend to the outside of the lower housing (1).