CN217749934U - Processing platform - Google Patents

Processing platform Download PDF

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Publication number
CN217749934U
CN217749934U CN202123341808.0U CN202123341808U CN217749934U CN 217749934 U CN217749934 U CN 217749934U CN 202123341808 U CN202123341808 U CN 202123341808U CN 217749934 U CN217749934 U CN 217749934U
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platform
side wall
workpiece
bearing
slide rail
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CN202123341808.0U
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Chinese (zh)
Inventor
施心星
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Suzhou Lumi Laser Technology Co ltd
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Suzhou Lumi Laser Technology Co ltd
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Abstract

The application discloses processing platform, including first platform, second platform, hold carrier and aligning gear. The first platform is provided with a first cavity; the second platform is connected with the first platform in a sliding mode along a first preset direction, and the second platform is provided with a second cavity. The bearing piece comprises a bearing plate used for bearing the workpiece to be machined, the bearing piece is connected with the second platform in a sliding mode along a second preset direction, and the second preset direction is perpendicular to the first preset direction. The correcting mechanism is located in the first cavity and used for correcting and aligning the workpiece to be processed, and the correcting mechanism is connected with the first platform. In the embodiment of the application, the correcting mechanism is arranged in the first cavity of the first platform, so that the load of the second platform is reduced, and the high-speed movement of the second platform is more stable.

Description

Processing platform
Technical Field
The utility model relates to a wafer laser beam machining field especially relates to a processing platform.
Background
In the related art, a commonly used grooving platform is to place a wafer on the grooving platform, correct and position the wafer, and then perform grooving on the wafer by using laser. At present, two mutually vertical platforms are superposed on a machining platform on the market, then a rotating table is erected above the two superposed platforms, and then a vision system is installed between the rotating table and the superposed platforms to realize the correction and alignment of the wafer so as to perform the grooving machining operation on the wafer.
SUMMERY OF THE UTILITY MODEL
The utility model provides a precision finishing platform can alleviate the load of second platform for the motion of second platform is more stable.
Specifically, the embodiment of the application provides a precision machining platform, including first platform, second platform, load bearing member and aligning gear.
The first platform has a first cavity; the second platform is connected with the first platform in a sliding mode along a first preset direction, and the second platform is provided with a second cavity. The bearing piece comprises a bearing plate used for bearing a workpiece to be machined, the bearing piece is connected with the second platform in a sliding mode along a second preset direction, and the second preset direction is perpendicular to the first preset direction. The correcting mechanism is located in the first cavity and used for correcting and aligning the workpiece to be processed, and the correcting mechanism is connected with the first platform.
According to some embodiments, a plurality of first sliding rails are arranged on the first platform, all the first sliding rails extend along the first preset direction, and the second platform is connected with the first sliding rails in a sliding manner. The first slide rails are arranged to bear loads together, and compared with a single slide rail, the loads are distributed to each first slide rail in the plurality of first slide rails, so that the load of one first slide rail is reduced, and the running stability of the second platform is improved.
According to some embodiments, the lower end of the second platform is provided with a plurality of step structures, and the step structures are in one-to-one contact with the first sliding rails so as to limit the second platform. The step structure enables the second platform to slide more stably along the first sliding rail, and prevents the second platform and the first sliding rail from moving relatively.
According to some embodiments, the second platform includes a first side wall and a second side wall on the inner side, the first side wall and the second side wall extend along the second preset direction, the first side wall and the second side wall are both provided with a second slide rail, the second slide rail extends along the second preset direction, and the bearing member is slidably connected to the second slide rail. The bearing piece is directly connected with the second sliding rail, so that the load can be reduced, and the gravity center of the processing platform can be lowered, so that the processing platform can run more stably.
According to some embodiments, the first side wall and the second side wall are further provided with grooves for limiting the bearing. The groove enables the bearing piece to slide along the second sliding rail more stably, and the bearing piece and the second sliding rail are prevented from moving relatively.
According to some embodiments, the first platform comprises a baffle and a side plate, the baffle is connected with the side plate, the baffles are all located above the first slide rail, and the baffle penetrates through the second platform. The baffle can shelter from the dust impurity etc. in the environment, reduces dust impurity and gets into in the first slide rail, prevent first slide rail piles up too much and leads to the operation card to pause because of dust impurity.
According to some embodiments, the carrier plate is a light transmissive carrier plate. The bearing plate is light-transmitting, so that the correcting mechanism detects and identifies the position of the workpiece to be machined on the bearing plate and corrects and aligns the workpiece to be machined.
According to some embodiments, the alignment mechanism is in vertical sliding connection with the first platform. The correcting mechanism can change the distance between the correcting mechanism and the workpiece to be processed by moving along the vertical direction, and more data of the workpiece to be processed is measured, so that the position of the workpiece to be processed on the bearing plate can be corrected more clearly and accurately.
According to some embodiments, the carrier further comprises a connecting portion, the connecting portion being slidably connected to the second platform, the carrier plate being rotatably connected to the connecting portion. When the workpiece to be machined is machined, the bearing plate drives the workpiece to be machined to rotate, so that the workpiece to be machined can be machined more uniformly.
According to some embodiments, the bearing plate is provided with a plurality of adsorption holes. When the workpiece to be machined is machined, the adsorption hole can adsorb the workpiece to be machined on the bearing plate in a vacuum mode, so that the workpiece to be machined is fixed on the bearing plate.
The beneficial effect of this application does: in the embodiment of the application, the correcting mechanism is arranged in the first cavity of the first platform, so that not only is the space saved, but also the load of the second platform is reduced, and the high-speed movement of the second platform is more stable.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a processing platform according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view taken at C-C of FIG. 1;
FIG. 3 is an enlarged view of the structure of FIG. 2 at D;
fig. 4 is a schematic perspective view of a processing platform according to an embodiment of the present disclosure;
fig. 5 is an enlarged schematic view of the structure at E in fig. 4.
Reference numerals:
1. a first platform; 11. a first cavity; 12. a first slide rail; 13. a baffle plate; 14. a side plate; 2. a second platform; 21. a second cavity; 22. a step structure; 23. a first side wall; 24. a second side wall; 241. a groove; 25. a second slide rail; 3. a carrier; 31. a carrier plate; 311. an adsorption hole; 32. a connecting portion; 4. a correction mechanism; 5. a first driving member.
Detailed Description
In order to more clearly illustrate the embodiments of the present application or technical solutions in related arts, the following description will be clearly and completely described in conjunction with the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
At present, two mutually vertical platforms are superposed on a general processing platform on the market, then a bearing part is erected above the two superposed platforms through a heightening mechanism, and then a vision correcting mechanism is installed between the bearing part and the platforms for realizing the correction and alignment of wafers so as to perform slotting processing operation on the wafers. However, after the carrier is erected and the vision correction mechanism is installed, the load of the platform is increased, so that the high-speed movement of the platform is unstable.
In order to solve the above technical problem, an embodiment of the present application provides a processing platform, which can reduce a load of a second platform, so that the motion of the second platform is more stable.
In particular, the present application provides a machining platform, which, with reference to fig. 1 and 2, comprises a first platform 1, a second platform 2, a carrier 3 and a calibration mechanism 4.
The first platform 1 has a first cavity 11; the second platform 2 is connected with the first platform 1 in a sliding manner along a first preset direction AA, and the second platform 2 is provided with a second cavity 21. The bearing piece 3 comprises a bearing plate 31 for bearing a workpiece to be machined, the bearing piece 3 is connected with the second platform 2 in a sliding mode along a second preset direction BB, and the second preset direction BB is perpendicular to the first preset direction AA. The correcting mechanism 4 is located in the first cavity 11 and used for correcting and aligning the workpiece to be processed, and the correcting mechanism 4 is connected with the first platform 1.
Specifically, the processing platform may be fixedly disposed on the ground or a flat table, and the shapes of the first cavity 11 and the second cavity 21 are not limited, and may be a cylinder or a cube. The bearing plate 31 has a flat plate surface for bearing a workpiece to be machined, and the flat plate surface is parallel to a horizontal plane. When the correcting mechanism 4 performs correction and alignment on the workpiece to be processed, the first cavity 11 is communicated with the second cavity 21, so that the correcting mechanism 4 cannot be shielded by the second platform 2 when working. The workpiece to be machined can be a wafer, and the machining platform can be used for slotting the wafer.
It should be noted that, in the related art, the calibration mechanism 4 is erected between the second platform 2 and the bearing plate 31 to calibrate and align the workpiece to be processed, so that the second platform 2 drives the bearing member 3 and the calibration mechanism 4 to move together, which increases the load of the second platform 2, and makes the high-speed movement of the second platform 2 unstable. In the embodiment of the present application, the calibration mechanism 4 is disposed in the first cavity 11 of the first platform 1, and the second platform 2 does not need to drive the calibration mechanism 4 to move, so that the load of the second platform 2 is reduced, and the high-speed movement of the second platform 2 is more stable.
It can be understood that when the calibration mechanism 4 is erected between the second platform 2 and the carrier plate 31, not only the center of gravity of the processing platform is increased, so that the operation of the processing platform is unstable, but also a large space is occupied. And the correcting mechanism 4 is arranged in the cavity of the first platform 1, so that the gravity center of the processing platform can be reduced, the operation of the processing platform is more stable, and the space is saved.
It should also be noted that the alignment mechanism 4 is cooperatively aligned with the first platform 1 and the second platform 2, so that the position of the workpiece to be processed on the bearing plate 31 is more precise for subsequent processing operations. The calibration mechanism 4 may be a vision system, and the vision system converts a captured target into image signals through a machine vision product, such as a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS), and transmits the image signals to a dedicated image processing system, and the image processing system converts the signals into digital signals and then calibrates and aligns the object according to a result of the determination.
In some embodiments of the present application, with continued reference to fig. 1 and fig. 2, a plurality of first sliding rails 12 are disposed on the first platform 1, all of the first sliding rails 12 extend along the first preset direction AA, and the second platform 2 is slidably connected to the first sliding rails 12.
It should be noted that, by providing the plurality of first slide rails 12, the load can be shared, and compared with a single slide rail, in the plurality of first slide rails 12, the load is distributed to each first slide rail 12, so that the load on one first slide rail 12 is reduced, and the operation stability of the second platform 2 is improved. As shown in fig. 2, the second platform 2 is provided with a first driving member 5 for driving the second platform 2 to slide along the first slide rail 12.
In some embodiments of the present application, referring to fig. 1, a plurality of suction holes 311 are formed in the carrier plate 31, and the suction holes 311 are provided.
It can be understood that when the workpiece to be processed is processed, the absorption hole 311 can absorb the workpiece to be processed on the bearing plate 31 in vacuum, so that the workpiece to be processed is fixed on the bearing plate 31. In the process of machining the workpiece to be machined or the process of machining the workpiece to be machined by rotating along with the bearing plate 31, the workpiece to be machined can be fixed on the bearing plate 31 and does not move relative to the bearing plate 31.
In some embodiments of the present application, referring to fig. 2, the alignment mechanism 4 is slidably coupled to the first platform 1 in a vertical direction.
It should be noted that the calibration mechanism 4 can change the distance to the workpiece to be processed by moving along the vertical direction, so as to measure more data of the workpiece to be processed, thereby calibrating the position of the workpiece to be processed on the bearing plate 31 more clearly and accurately.
In some embodiments of the present application, referring to fig. 2 and 3, a plurality of step structures 22 are disposed at the lower end of the second platform 2, and the step structures 22 are in one-to-one contact with the first slide rails 12 to limit the second platform 2. The step structure 22 makes the second platform 2 slide along the first slide rail 12 more stably, and prevents the second platform 2 and the first slide rail 12 from moving relatively.
In some embodiments of the present application, referring to fig. 4 and 5, the second platform 2 includes an inner first side wall 23 and an inner second side wall 24, the first side wall 23 and the second side wall 24 extend along the second predetermined direction BB, the first side wall 23 and the second side wall 24 are both provided with a second sliding rail 25, the second sliding rail 25 extends along the second predetermined direction BB, and the bearing member 3 is slidably connected to the second sliding rail 25.
It should be noted that, in the related art, the bearing member 3 is configured above the second platform 2 through a raising mechanism, the raising mechanism increases the load of the processing platform, and the erection of the bearing member 3 increases the center of gravity of the processing platform, and both the increase in the load and the increase in the center of gravity may make the operation of the processing platform unstable. In the embodiment of the present application, the part of the bearing component 3 is disposed in the second cavity 21, and the bearing component 3 is directly connected to the second slide rail 25, so that not only the heightening mechanism is not needed, the load can be reduced, but also the gravity center of the processing platform can be reduced, and the operation of the processing platform is more stable. Wherein the carrier 3 is provided with a second driving element for driving the carrier 3 to slide along the second slide rail 25.
In some embodiments of the present application, with continued reference to fig. 4 and 5, the first side wall 23 and the second side wall 24 are further provided with a groove 241 for limiting the position of the carrier 3. As shown in fig. 5, a part of the carrier 3 extends out and is inserted into the groove 241, and the groove 241 makes the sliding of the carrier 3 along the second slide rail 25 more stable, preventing the relative movement between the carrier 3 and the second slide rail 25.
In some embodiments of the present application, referring to fig. 4, the first platform 1 includes a baffle 13 and a side plate 14, the baffle 13 is connected to the side plate 14, the baffle 13 is located above the first slide rail 12, and the baffle 13 penetrates through the second platform 2.
The baffle 13 shields dust and impurities in the environment from entering the first slide rail 12, and prevents the first slide rail 12 from being stuck due to excessive accumulation of dust and impurities. Taking the machining platform for the grooving process as an example, when the workpiece to be machined is subjected to the grooving process, the workpiece to be machined may generate a large amount of impurities such as dust and debris, and the impurities may fall into the first slide rail 12, and the long-time accumulation of the impurities may cause the first slide rail 12 to be jammed or suspended in operation. In the embodiment of the present application, the baffle 13 is disposed above the first slide rail 12, and the baffle 13 can shield the falling impurities, so as to prevent the first slide rail 12 from being jammed or suspended due to excessive accumulation of the impurities.
It should be further noted that the baffle 13 is disposed above the first slide rail 12, the second platform 2 is connected to the first slide rail 12, and the second platform 2 slides along the first slide rail 12, so that the second platform 2 is also located above the first slide rail 12, and the second platform 2 contacts with the first slide rail 12. The baffle 13 penetrates the second platform 2 as shown in fig. 2.
In some embodiments of the present application, the carrier 31 is a light-transmissive carrier.
It can be understood that the carrier plate 31 is transparent, so that the alignment mechanism 4 can detect and identify the position of the workpiece to be processed on the carrier plate 31, and perform alignment on the workpiece to be processed. The carrier plate 31 may be made of optical plastic, glass, or resin, and is not limited herein.
In some embodiments of the present application, referring to fig. 4, the carrier 3 further includes a connecting portion 32, the connecting portion 32 is slidably connected to the second platform 2, and the carrier plate 31 is rotatably connected to the connecting portion 32.
It should be noted that, when the workpiece to be processed is processed, the bearing plate 31 drives the workpiece to be processed to rotate, so that the workpiece to be processed can be processed more uniformly. Taking the example that the processing platform is used for slotting, the workpiece to be machined needs to be slotted, and the workpiece to be machined rotates along with the bearing plate 31, so that the slot body formed on the workpiece to be machined can be more uniform.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc., based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and operate, and therefore the terms describing the positional relationship in the specification are only used for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms can be understood according to specific situations by those of ordinary skill in the art.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A tooling platform, comprising:
a first platform having a first cavity;
the second platform is connected with the first platform in a sliding mode along a first preset direction and is provided with a second cavity;
the bearing piece comprises a bearing plate for bearing a workpiece to be machined, the bearing piece is connected with the second platform in a sliding mode along a second preset direction, and the second preset direction is perpendicular to the first preset direction;
and the correcting mechanism is positioned in the first cavity and used for correcting and aligning the workpiece to be processed, and the correcting mechanism is connected with the first platform.
2. The processing platform of claim 1, wherein the first platform is provided with a plurality of first slide rails, all of the first slide rails extend along the first predetermined direction, and the second platform is slidably connected to the first slide rails.
3. The machining platform according to claim 2, wherein a plurality of step structures are arranged at the lower end of the second platform, and the step structures are in one-to-one contact with the first sliding rails so as to limit the second platform.
4. A work platform according to claim 1, 2 or 3, wherein the second platform comprises a first side wall and a second side wall inside, the first side wall and the second side wall extend along the second predetermined direction, and a second slide rail is disposed on each of the first side wall and the second side wall, the second slide rail extends along the second predetermined direction, and the bearing member is slidably connected to the second slide rail.
5. A tooling platform according to claim 4 wherein said first side wall and said second side wall are further provided with grooves to limit said load bearing members.
6. The processing platform of claim 2, wherein the first platform comprises a baffle plate and a side plate, the baffle plate is connected with the side plate, the baffle plate is located above the first slide rail, and the baffle plate penetrates through the second platform.
7. The processing platform of claim 1, wherein the carrier plate is a light transmissive carrier plate.
8. The processing platform of claim 1, wherein the alignment mechanism is in vertical sliding connection with the first platform.
9. The processing platform of claim 1, wherein the carrier further comprises a connecting portion, the connecting portion being slidably connected to the second platform, the carrier plate being rotatably connected to the connecting portion.
10. The processing platform according to claim 1 or 9, wherein the carrying plate is provided with a plurality of suction holes.
CN202123341808.0U 2021-12-28 2021-12-28 Processing platform Active CN217749934U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123341808.0U CN217749934U (en) 2021-12-28 2021-12-28 Processing platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123341808.0U CN217749934U (en) 2021-12-28 2021-12-28 Processing platform

Publications (1)

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CN217749934U true CN217749934U (en) 2022-11-08

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CN202123341808.0U Active CN217749934U (en) 2021-12-28 2021-12-28 Processing platform

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116652423A (en) * 2023-06-02 2023-08-29 德兴市德芯科技有限公司 Automatic rotation and alignment equipment in laser cutting wafer processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116652423A (en) * 2023-06-02 2023-08-29 德兴市德芯科技有限公司 Automatic rotation and alignment equipment in laser cutting wafer processing
CN116652423B (en) * 2023-06-02 2024-04-16 德兴市德芯科技有限公司 Automatic rotation and alignment equipment in laser cutting wafer processing

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