CN117621287A - Wafer automatic scanning cutting equipment - Google Patents
Wafer automatic scanning cutting equipment Download PDFInfo
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- CN117621287A CN117621287A CN202311840366.5A CN202311840366A CN117621287A CN 117621287 A CN117621287 A CN 117621287A CN 202311840366 A CN202311840366 A CN 202311840366A CN 117621287 A CN117621287 A CN 117621287A
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- turntable
- workbench
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- cylinder
- wafer
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- 238000005520 cutting process Methods 0.000 title claims abstract description 61
- 235000012431 wafers Nutrition 0.000 claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 30
- 239000010432 diamond Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 18
- 230000000712 assembly Effects 0.000 claims abstract description 13
- 238000000429 assembly Methods 0.000 claims abstract description 13
- 238000005452 bending Methods 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000001788 irregular Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor substrate material manufacturing, and particularly discloses wafer automatic scanning and cutting equipment which comprises a workbench, a turntable mechanism, a movable positioning mechanism and a material taking mechanism, wherein a turntable mounting groove is formed in the workbench; the turntable mechanism is arranged in the turntable mounting groove, and comprises a turntable motor and a turntable body connected with an output shaft of the turntable motor, at least two sucker mounting groove positions are formed in the upper surface of the turntable body, and sucker assemblies for fixing wafers to be cut are arranged in each sucker mounting groove position; the movable positioning mechanism comprises a positioning bracket assembly, a diamond cutting head and a laser scanning assembly, wherein the positioning bracket assembly is movably arranged on the workbench, and the diamond cutting head and the laser scanning assembly are respectively and movably arranged on the positioning bracket assembly; the material taking mechanism is arranged on the workbench and used for grabbing the cut wafers. The wafer rounding machine can improve the wafer rounding efficiency and reduce the labor intensity of workers.
Description
Technical Field
The invention relates to the technical field of manufacturing of semiconductor substrate materials, in particular to automatic scanning and cutting equipment for wafers.
Background
Indium phosphide substrates (wafers) have application markets in the field of manufacturing radio frequency devices such as high frequency high power devices, optical fiber communications, wireless transmission, radio astronomy, and the like. Radio frequency devices fabricated using indium phosphide substrates have shown excellent performance in satellite, radar, etc. application scenarios. The method has stronger competitiveness in the aspects of radio frequency front ends of radar and communication systems and analog/mixed signal wide bandwidth circuits, and is suitable for high-speed data processing, high-precision wide bandwidth A/D conversion and other applications. In addition, devices related to indium phosphide-based radio frequency devices such as low noise amplifiers, modules and receivers are also widely used in devices such as satellite communications, millimeter wave radar, active and passive millimeter wave imaging. At bandwidth levels above 100GHz, the use of indium phosphide-based radio frequency devices has significant advantages in terms of wireless transmission in backhaul networks and point-to-point communication networks, and in the future indium phosphide substrates will be expected to become the dominant substrate material for radio frequency devices in 6G communication and even 7G communication wireless transmission networks. However, the rounding process is a time-consuming and labor-consuming process.
In the prior art, an indium phosphide substrate is manually cut into circles, an employee firstly breaks an irregular wafer into a square by using a diamond cutter, then puts the diamond cutter into a clamping plug along the straight edge (in an octagonal shape) of a joint surface at one end of each cut line to cut into circles, and then can perform the operation of the next wafer. The manual operation difficulty and the labor intensity are high, the efficiency is low, and the high-efficiency requirement cannot be met.
Disclosure of Invention
The invention aims to solve the technical problems that: how to improve the wafer rounding efficiency and reduce the labor intensity of workers.
In order to solve the above technical problems, the present invention provides an automatic wafer scanning and cutting device, comprising:
the workbench is provided with a turntable mounting groove;
the turntable mechanism is arranged in the turntable mounting groove, the turntable mechanism comprises a turntable motor and a turntable body connected with an output shaft of the turntable motor, at least two sucker mounting groove positions are formed in the upper surface of the turntable body, and sucker assemblies used for fixing wafers to be cut are arranged in each sucker mounting groove position;
the mobile positioning mechanism comprises a positioning bracket assembly, a diamond cutting head and a laser scanning assembly, wherein the positioning bracket assembly is movably erected on the workbench, and the diamond cutting head and the laser scanning assembly are respectively and movably installed on the positioning bracket assembly; and
and the material taking mechanism is arranged on the workbench and is used for grabbing the cut wafers.
Further preferably, the chuck assembly includes a first chuck for adsorbing and fixing a wafer to be cut and a chuck rotating motor for driving the first chuck to rotate, and the chuck rotating motor and the first chuck are both arranged in the chuck mounting groove.
Further preferably, the suction cup assembly further comprises:
the vacuum source is arranged in the workbench;
the vacuum integrated tube is arranged in the turntable body, and one end of the vacuum integrated tube is connected with the vacuum source; and
the vacuum branch pipe is arranged on the first sucker and is rotationally connected with the vacuum integrated pipe through a rotary joint.
Still preferably, the suction cup assembly further comprises an outer ring and a first cylinder, the outer ring is arranged on the periphery of the first suction cup, the outer ring is arranged in the suction cup mounting groove, and the first cylinder is arranged at the bottom of the outer ring and can drive the outer ring to lift.
Further preferably, the height of the plane of the upper surface of the turntable body is greater than the height of the plane of the upper surface of the workbench, and the height of the plane of the upper surface of the outer ring is equal to or lower than the height of the plane of the upper surface of the first sucker.
Further preferably, the positioning bracket assembly includes:
the two vertical frames are respectively arranged at two sides of the workbench, a first chute is arranged on the workbench, and a limit sliding block matched with the first chute is arranged at the bottom of the vertical frame; and
the transverse frame, the transverse frame sets up two between the grudging post, the second spout has been seted up on the grudging post, the tip of transverse frame slides and locates in the second spout, third spout and fourth spout have been seted up on the transverse frame, diamond cutting head slides and locates in the third spout, laser scanning subassembly slides and locates in the fourth spout.
Still preferably, the positioning support assembly further comprises a first linear screw motor, a second linear screw motor and a third linear screw motor, the first linear screw motor corresponds to the first chute and is arranged inside the workbench, the limit sliding block is controlled by the first linear screw motor, the second linear screw motor is arranged at the top of the stand, the cross frame is controlled by the second linear screw motor to achieve lifting, the third linear screw motor is two groups and respectively corresponds to the third chute and the fourth chute, and the diamond cutting head and the laser scanning assembly are independently controlled by the two groups of the third linear screw motors.
Still preferably, the material taking mechanism comprises a mounting seat arranged on the workbench, a bending support arm is rotatably arranged on the mounting seat, a support arm rotating motor for driving the bending support arm to rotate is arranged at the bottom of the mounting seat, a second sucker used for adsorbing and cutting is arranged at one end of the bending support arm, which is far away from the mounting seat, the second sucker is communicated with the vacuum source, and a detection sensor is arranged on the lower surface of the second sucker.
Further preferably, a second cylinder is further arranged at one end of the bending support arm, which is far away from the mounting seat, and the second sucker is mounted at the piston end of the second cylinder.
Further preferably, the extracting mechanism further comprises:
the third cylinder is arranged on the outer wall of the second cylinder;
the telescopic arm is arranged at the piston end of the third cylinder, and a fourth cylinder is arranged at one end, far away from the third cylinder, of the telescopic arm; and
the clamping block is crescent-shaped and is arranged at the piston end of the fourth cylinder.
Compared with the prior art, the wafer automatic scanning and cutting equipment provided by the invention has the beneficial effects that:
according to the invention, the turntable mounting groove is formed in the workbench, so that the turntable mechanism is convenient to mount, and the turntable body is provided with the plurality of sucker assemblies, so that when the turntable motor drives the turntable body to rotate in the turntable mounting groove, the sucker assemblies can absorb marked irregular wafers to be transferred to a cutting area, the wafers start scanning the whole surface of the wafers by the laser scanning assemblies, the positions and the diameters of the wafers required by the scanning end confirmation are confirmed, the positioning bracket assemblies drive the diamond cutting heads to correspond to the cutting positions, the diamond cutting heads descend to contact with the wafers, the sucker assemblies drive the wafers to rotate to match with the cutting circles, and after the cutting circles are finished, the material picking mechanism picks the cut wafers.
Drawings
Fig. 1 is a perspective view of an automatic wafer scanning and dicing apparatus according to the present invention.
Fig. 2 is a top view of an automatic wafer scanning and dicing apparatus according to the present invention.
Fig. 3 is a schematic structural view of the turntable mechanism according to the present invention.
Figure 4 is a schematic view of the suction cup assembly of the present invention.
Figure 5 is an exploded view of the suction cup assembly of the present invention.
FIG. 6 is a cross-sectional view of section A-A of FIG. 4 in accordance with the present invention.
Fig. 7 is a schematic structural view of the mobile positioning mechanism according to the present invention.
Fig. 8 is a schematic view of the structure of the take-off mechanism of the present invention.
In the figure:
10. a work table; 11. the turntable is provided with a groove; 12. a first chute;
20. a turntable mechanism; 21. a turntable motor; 22. a turntable body; 221. the sucker is arranged at the groove position; 23. a suction cup assembly; 231. a first suction cup; 232. an outer ring; 233. a vacuum integrated tube; 234. the sucking disc rotates the electrical machinery; 235. a vacuum branch pipe; 236. a rotary joint; 237. a first cylinder;
30. a moving positioning mechanism; 31. a vertical frame; 32. a limit sliding block; 33. a second chute; 34. a cross frame; 35. a third chute; 36. a fourth chute; 37. a second linear screw motor; 38. a diamond cutting head; 39. a laser scanning assembly;
40. a material taking mechanism; 41. a mounting base; 42. bending the supporting arm; 43. the supporting arm rotates the motor; 44. a second cylinder; 45. a second suction cup; 46. a third cylinder; 47. a telescoping arm; 48. a fourth cylinder; 49. and a clamping block.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "front", "rear", "left", "right", "upper", "lower", "top", "bottom", "inner", "outer", "between", "near", "far", "height", etc. are used in the present invention to indicate orientations or positional relationships based on the drawings, only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-2, the embodiment provides an automatic wafer scanning and cutting device, which comprises a workbench 10, a turntable mechanism 20, a moving positioning mechanism 30 and a material taking mechanism 40, wherein a turntable mounting groove 11 is formed in the workbench 10, the turntable mechanism 20 is mounted in the turntable mounting groove 11 and is used for transferring a wafer to be cut to a cutting area, the moving positioning mechanism 30 is mounted on the workbench 10 and is used for positioning and rounding the wafer, and the material taking mechanism 40 is mounted on the workbench 10 and is used for grabbing the cut wafer. According to the invention, the manual rounding is modified, so that the rounding efficiency of the wafer is greatly improved, and the labor intensity of workers can be reduced.
In a specific embodiment, referring to fig. 3, the turntable mechanism 20 includes a turntable motor 21 and a turntable body 22 connected to an output shaft of the turntable motor 21, wherein the turntable motor 21 is used for driving the turntable body 22 to rotate, at least two chuck mounting slots 221 are formed on an upper surface of the turntable body 22, and a chuck assembly 23 for fixing a wafer to be cut is disposed in each chuck mounting slot 221; therefore, after the chuck assembly 23 adsorbs the marked irregular wafer, the wafer rotates to the cutting area to be cut under the action of the turntable motor 21, and the at least two chuck mounting slots 221 are arranged in the embodiment to facilitate the pre-feeding of the feeding device (such as a manipulator) so as to realize uninterrupted circle cutting operation, shorten the feeding response time and improve the circle cutting efficiency.
In some embodiments, as will be understood in conjunction with fig. 7, the mobile positioning mechanism 30 includes a positioning bracket assembly movably mounted on the table 10, a diamond cutting head 38 and a laser scanning assembly 39, the diamond cutting head 38 and the laser scanning assembly 39 being movably mounted on the positioning bracket assembly, respectively; therefore, after the wafer to be cut is transferred to the cutting area along with the turntable body 22, the laser scanning assembly 39 starts the whole-surface scanning of the wafer, the scanning is finished to confirm the required position and diameter of the wafer, the positioning support assembly drives the diamond cutting head 38 to correspond to the cutting position, the diamond cutting head 38 descends to contact with the wafer, and the sucker assembly 23 drives the wafer to rotate to match with the wafer to realize circle cutting.
In some embodiments, as shown in fig. 4 to 6, the chuck assembly 23 includes a first chuck 231 for sucking and fixing a wafer to be cut and a chuck rotation motor 234 for driving the first chuck 231 to rotate, and the chuck rotation motor 234 and the first chuck 231 are both disposed in the chuck mounting groove 221; the first suction cup 231 is used for sucking and fixing a wafer, and when the diamond cutting head 38 descends to contact with the wafer, the suction cup rotating motor 234 drives the first suction cup 231 to rotate so as to realize circle cutting.
In the above embodiment, in order to avoid the wafer contacting the table 10 during the dicing process, it is further defined that the upper surface of the turntable body 22 is located at a higher level than the upper surface of the table 10.
In some embodiments, the chuck assembly 23 further comprises a vacuum source provided in the workbench 10, a vacuum manifold 233 provided in the turntable body 22, and a vacuum manifold 235, wherein one end of the vacuum manifold 233 is connected to the vacuum source, the vacuum manifold 235 is provided on the first chuck 231, and the vacuum manifold 235 is rotatably connected to the vacuum manifold 233 through a rotary joint 236; therefore, when the suction cup rotating motor 234 drives the first suction cup 231 to rotate, the communication between the vacuum branch pipe 235 and the vacuum integrated pipe 233 is not affected, so that the first suction cup 231 always has vacuum suction force to suck the wafer in the circle cutting process, and falling off under the action of the diamond cutting head 38 is avoided.
In some embodiments, since the diamond cutting head 38 cuts the wafer to form the joint surface, the cut wafer portion will not fall off directly, for this reason, before the material taking mechanism 40 grabs the wafer, the leftover should be broken off, for this purpose, the chuck assembly 23 further includes an outer ring 232 and a first cylinder 237, the outer ring 232 is disposed on the periphery of the first chuck 231, and the outer ring 232 is disposed in the chuck mounting groove 221, the first cylinder 237 is disposed at the bottom of the outer ring 232 and can drive the outer ring 232 to lift, when the diamond cutting head 38 cuts the wafer, the first cylinder 237 acts to drive the outer ring 232 to lift, so that an upward force is applied to the corner portion, so that the corner portion is broken off at the joint surface, the wafer at the middle portion is firmly absorbed by the first chuck 231, after the corner portion is broken off, the first cylinder 237 drives the outer ring 232 to descend and reset, at this time the material taking mechanism 40 can grab the middle wafer portion and transfer to the next procedure.
In the above embodiment, in order to avoid the outer ring 232 from affecting the accuracy and efficiency of dicing during the wafer dicing process, the height of the plane of the upper surface of the outer ring 232 is further defined to be equal to or lower than the height of the plane of the upper surface of the first suction cup 231.
In the specific embodiment, as will be understood with reference to fig. 7, the positioning bracket assembly includes two vertical frames 31, two horizontal frames 34, a first linear screw motor, a second linear screw motor 37 and a third linear screw motor, the vertical frames 31 are respectively arranged at two sides of the workbench 12, the workbench 12 is provided with a first chute 12, and the bottom of the vertical frame 31 is provided with a limit slide block 32 matched with the first chute 12; the transverse frame 34 is arranged between the two vertical frames 31, the vertical frames 31 are provided with second sliding grooves 33, the end parts of the transverse frame 34 are arranged in the second sliding grooves 33 in a sliding manner, the transverse frame 34 is provided with third sliding grooves 35 and fourth sliding grooves 36, the diamond cutting heads 38 are arranged in the third sliding grooves 35 in a sliding manner, the laser scanning assemblies 39 are arranged in the fourth sliding grooves 36 in a sliding manner, the first linear screw motors are arranged in the workbench 10 corresponding to the first sliding grooves 12, the limit sliding blocks 32 are controlled by the first linear screw motors, the second linear screw motors 37 are arranged at the top of the vertical frames 31, the transverse frame 34 is controlled by the second linear screw motors 37 to realize lifting, the third linear screw motors are two groups and respectively correspond to the third sliding grooves 35 and the fourth sliding grooves 36, and the diamond cutting heads 38 and the laser scanning assemblies 39 are independently controlled by the two groups of third linear screw motors; accordingly, the first linear screw motor can drive the vertical frame 31 to move along the front and rear directions of the workbench 10, the second linear screw motor 37 can drive the transverse frame 34 to move along the up and down directions of the workbench 10, the third linear screw motor can respectively control the diamond cutting head 38 and the laser scanning assembly 39 to move along the left and right directions of the workbench 10, and the positioning accuracy of the diamond cutting head 38 can be ensured after the laser scanning assembly 39 finishes scanning and confirms the required wafer position and diameter, the processing quality of the wafer can be ensured, and the wafer cutting efficiency can be improved through coordinated control of the three directions.
In a specific embodiment, as shown in fig. 8, the material taking mechanism 40 includes a mounting seat 41 disposed on the workbench 10, a bending support arm 42 is rotatably mounted on the mounting seat 41, a support arm rotating motor 43 for driving the bending support arm 42 to rotate is disposed at the bottom of the mounting seat 41, a second sucker 45 for adsorbing the cut material is disposed at one end of the bending support arm 42 away from the mounting seat 41, the second sucker 45 is communicated with a vacuum source, a detection sensor is disposed on the lower surface of the second sucker 45, the support arm rotating motor 43 adjusts the rotating angle of the bending support arm 42 according to the data fed back by the detection sensor, so that the second sucker 45 can be completely adsorbed on the surface of a wafer, and after the first sucker 231 is disconnected from the vacuum source, the second sucker 45 can adsorb the wafer to transfer to the next process.
In the above embodiment, in order to realize lifting of the second suction cup 45 to realize adsorption of the wafer, for this reason, the end of the bending support arm 42 far away from the mounting seat 41 is further provided with the second cylinder 44, the second suction cup 45 is mounted at the piston end of the second cylinder 44, the height position of the second suction cup 45 can be driven by the second cylinder 44, and the contact adsorption of the second suction cup 45 and the wafer can be precisely controlled in cooperation with the data fed back by the detection sensor.
In some embodiments, the reclaiming mechanism 40 further comprises two sets of third cylinders 46, telescopic arms 47 and clamping blocks 49 which are symmetrically arranged, wherein the third cylinders 46 are arranged on the outer wall of the second cylinders 44; the telescopic arm 47 is arranged at the piston end of the third cylinder 46, and a fourth cylinder 48 is arranged at the end, away from the third cylinder 46, of the telescopic arm 47; the clamping block 49 is arranged at the piston end of the fourth cylinder 48; therefore, in this embodiment, the opening size and position of the clamping block 49 can be controlled by the third cylinder 46 and the fourth cylinder 48, so that the second sucker 45 is matched to realize synchronous grabbing of the wafer, the integrity of the wafer in the transferring process is ensured, and the accidental falling damage is avoided.
In other embodiments, in order to make the clamping blocks 49 more matched with the wafer, for this reason, the clamping blocks 49 have a crescent shape, and the concave surfaces of the two clamping blocks 49 are oppositely arranged, so that the clamping blocks 49 can be in contact with the circumference of the wafer, and the clamping stability is improved.
In summary, the embodiment of the invention provides an automatic wafer scanning and cutting device, which is convenient for the installation of a turntable mechanism 20 by arranging a turntable mounting groove 11 on a workbench 10, and because the turntable body 22 is provided with a plurality of sucking disc assemblies 23, when the turntable motor 21 drives the turntable body 22 to rotate in the turntable mounting groove 11, irregular wafers marked by sucking disc assemblies 23 can be transferred to the lower parts of a diamond cutting head 38 and a laser scanning assembly 39, the whole scanning of the wafers is started by the laser scanning assembly 39, the position and the diameter of the wafers required by the scanning end confirmation are required, the positioning bracket assembly drives the diamond cutting head 38 to correspond to the cutting position, the diamond cutting head 38 descends to contact with the wafers, the sucking disc assemblies 23 drive the wafers to rotate to match with the cutting circles, and after the cutting circles are ended, the material taking mechanism 40 grabs the cut wafers.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present invention, and these modifications and substitutions should also be considered as being within the scope of the present invention. While there has been shown and described what are at present considered to be fundamental principles, main features and advantages of the present invention, it will be apparent to those skilled in the art that the present invention is not limited to the details of the foregoing preferred embodiments, and that the examples should be considered as exemplary and not limiting, the scope of the present invention being defined by the appended claims rather than by the foregoing description, and it is therefore intended to include within the invention all changes which fall within the meaning and range of equivalency of the claims.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail herein, but rather is provided for the purpose of enabling those skilled in the art to make and use the embodiments described herein.
Claims (10)
1. A wafer automatic scanning and cutting apparatus, comprising:
the workbench is provided with a turntable mounting groove;
the turntable mechanism is arranged in the turntable mounting groove, the turntable mechanism comprises a turntable motor and a turntable body connected with an output shaft of the turntable motor, at least two sucker mounting groove positions are formed in the upper surface of the turntable body, and sucker assemblies used for fixing wafers to be cut are arranged in each sucker mounting groove position;
the mobile positioning mechanism comprises a positioning bracket assembly, a diamond cutting head and a laser scanning assembly, wherein the positioning bracket assembly is movably erected on the workbench, and the diamond cutting head and the laser scanning assembly are respectively and movably installed on the positioning bracket assembly; and
and the material taking mechanism is arranged on the workbench and is used for grabbing the cut wafers.
2. The automatic wafer scanning and cutting device according to claim 1, wherein the chuck assembly comprises a first chuck for sucking and fixing a wafer to be cut and a chuck rotating motor for driving the first chuck to rotate, and the chuck rotating motor and the first chuck are both arranged in the chuck mounting groove.
3. The wafer automatic scan dicing apparatus of claim 2, wherein the chuck assembly further comprises:
the vacuum source is arranged in the workbench;
the vacuum integrated tube is arranged in the turntable body, and one end of the vacuum integrated tube is connected with the vacuum source; and
the vacuum branch pipe is arranged on the first sucker and is rotationally connected with the vacuum integrated pipe through a rotary joint.
4. The automatic wafer scanning and cutting device according to claim 1, wherein the chuck assembly further comprises an outer ring and a first cylinder, the outer ring is arranged on the periphery of the first chuck, the outer ring is arranged in the chuck mounting groove, and the first cylinder is arranged at the bottom of the outer ring and can drive the outer ring to lift.
5. The apparatus of claim 4, wherein the upper surface of the turntable body has a plane greater than the plane of the upper surface of the table, and the upper surface of the outer ring has a plane equal to or lower than the plane of the upper surface of the first chuck.
6. The automatic wafer scanning and dicing apparatus of claim 1, wherein the positioning bracket assembly comprises:
the two vertical frames are respectively arranged at two sides of the workbench, a first chute is arranged on the workbench, and a limit sliding block matched with the first chute is arranged at the bottom of the vertical frame; and
the transverse frame, the transverse frame sets up two between the grudging post, the second spout has been seted up on the grudging post, the tip of transverse frame slides and locates in the second spout, third spout and fourth spout have been seted up on the transverse frame, diamond cutting head slides and locates in the third spout, laser scanning subassembly slides and locates in the fourth spout.
7. The automatic wafer scanning and cutting device according to claim 6, wherein the positioning bracket assembly further comprises a first linear screw motor, a second linear screw motor and a third linear screw motor, the first linear screw motor is arranged inside the workbench corresponding to the first sliding groove, the limit sliding block is controlled by the first linear screw motor, the second linear screw motor is arranged at the top of the stand, the cross frame is controlled by the second linear screw motor to realize lifting, the third linear screw motors are two groups and are respectively arranged inside the cross frame corresponding to the third sliding groove and the fourth sliding groove, and the diamond cutting head and the laser scanning assembly are independently controlled by the two groups of the third linear screw motors.
8. The automatic wafer scanning and cutting device according to claim 3, wherein the material taking mechanism comprises a mounting seat arranged on the workbench, a bending support arm is rotatably arranged on the mounting seat, a support arm rotating motor for driving the bending support arm to rotate is arranged at the bottom of the mounting seat, a second sucking disc used for sucking and cutting is arranged at one end, away from the mounting seat, of the bending support arm, the second sucking disc is communicated with the vacuum source, and a detection sensor is arranged on the lower surface of the second sucking disc.
9. The automatic wafer scanning and cutting device according to claim 8, wherein a second cylinder is further arranged at one end of the bending support arm away from the mounting seat, and the second sucker is mounted at a piston end of the second cylinder.
10. The automatic wafer scanning and dicing apparatus of claim 9, wherein the take-off mechanism further comprises:
the third cylinder is arranged on the outer wall of the second cylinder;
the telescopic arm is arranged at the piston end of the third cylinder, and a fourth cylinder is arranged at one end, far away from the third cylinder, of the telescopic arm; and
the clamping block is crescent-shaped and is arranged at the piston end of the fourth cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311840366.5A CN117621287A (en) | 2023-12-28 | 2023-12-28 | Wafer automatic scanning cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311840366.5A CN117621287A (en) | 2023-12-28 | 2023-12-28 | Wafer automatic scanning cutting equipment |
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| Publication Number | Publication Date |
|---|---|
| CN117621287A true CN117621287A (en) | 2024-03-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311840366.5A Pending CN117621287A (en) | 2023-12-28 | 2023-12-28 | Wafer automatic scanning cutting equipment |
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| Country | Link |
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| CN (1) | CN117621287A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118218800A (en) * | 2024-05-21 | 2024-06-21 | 山东芯源微电子有限公司 | Semiconductor membranous diffusion source automatic cutting mechanism and method |
| CN118664128A (en) * | 2024-08-23 | 2024-09-20 | 上海多弗众云航空科技有限公司 | Cutting equipment is used in aircraft manufacturing processing |
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2023
- 2023-12-28 CN CN202311840366.5A patent/CN117621287A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118218800A (en) * | 2024-05-21 | 2024-06-21 | 山东芯源微电子有限公司 | Semiconductor membranous diffusion source automatic cutting mechanism and method |
| CN118664128A (en) * | 2024-08-23 | 2024-09-20 | 上海多弗众云航空科技有限公司 | Cutting equipment is used in aircraft manufacturing processing |
| CN118664128B (en) * | 2024-08-23 | 2024-12-17 | 上海多弗众云航空科技有限公司 | Cutting equipment is used in aircraft manufacturing processing |
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