CN217749892U - Laser etching equipment - Google Patents

Abstract

The utility model discloses a laser etching device; radium carving equipment includes: the device comprises a rack, a feeding mechanism, a conveying mechanism, a material taking mechanism, a turnover mechanism, a rotating mechanism, a laser mechanism and a discharging mechanism, wherein the feeding mechanism, the conveying mechanism, the material taking mechanism, the turnover mechanism, the rotating mechanism, the laser mechanism and the discharging mechanism are arranged on the rack; the feeding mechanism, the conveying mechanism, the material taking mechanism, the turnover mechanism, the rotating mechanism, the laser mechanism and the blanking mechanism are arranged in a corresponding position. The utility model discloses can reduce various unstable factors in the manpower production process, the uniformity of guarantee material radium carving improves the yields, has still reduced the cost of labor.

Description

Laser etching equipment

Technical Field

The utility model relates to a radium carving technical field especially relates to a radium carving equipment.

Background

In the production of present radium carving product, mostly adopt manual operation, cause the appearance of defective products and the cost of labor is high easily.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a radium carving equipment.

In order to solve the technical problem, the utility model discloses a following technical scheme:

the utility model provides a radium carving equipment, include: the device comprises a rack, a feeding mechanism, a conveying mechanism, a material taking mechanism, a turnover mechanism, a rotating mechanism, a laser mechanism and a discharging mechanism, wherein the feeding mechanism, the conveying mechanism, the material taking mechanism, the turnover mechanism, the rotating mechanism, the laser mechanism and the discharging mechanism are arranged on the rack; the feeding mechanism, the conveying mechanism, the material taking mechanism, the turnover mechanism, the rotating mechanism, the laser mechanism and the blanking mechanism are arranged in a corresponding mode; the feeding mechanism is used for placing a material tray filled with materials; the conveying mechanism is used for conveying the material tray to the material taking mechanism; the material taking mechanism is used for transplanting materials to the turnover mechanism; the turnover mechanism is used for turning over materials, the material taking mechanism transplants the turned materials to the rotating mechanism, the rotating mechanism rotates the turned materials to the laser mechanism, the laser mechanism is used for laser of the turned materials to obtain the laser-etched materials, the material taking mechanism transplants the laser-etched materials to a material tray, the conveying mechanism conveys the material tray containing the laser-etched materials to the blanking mechanism, and the blanking mechanism is used for collecting the material tray.

In a specific embodiment, the feeding mechanism and the discharging mechanism have the same structure; the feeding mechanism is positioned at one end of the conveying mechanism, and the discharging mechanism is positioned at the other end of the conveying mechanism; the feeding mechanism comprises a left feeding assembly and a right feeding assembly which has the same structure with the left feeding assembly; the left feeding assembly and the right feeding assembly are respectively positioned on two sides of the conveying mechanism; the left feeding assembly comprises a mounting frame fixed on the rack, a plurality of supporting plates for placing the material tray and a driving assembly; one end of the driving assembly is connected with the mounting frame, and the other end of the driving assembly is in transmission connection with the supporting plate.

In one embodiment, the conveying mechanism comprises a belt conveying assembly, a positioning guide rod and a positioning cylinder; the belt conveying assembly corresponds to the feeding mechanism and the discharging mechanism in position, the positioning guide rod is located on one side of the belt conveying assembly, the positioning air cylinder is located on the other side of the belt conveying assembly, and the positioning guide rod corresponds to the positioning air cylinder in position.

In one embodiment, the material taking mechanism comprises a multi-axis manipulator and a material taking assembly; the material taking assembly is in transmission connection with the multi-shaft manipulator and comprises a guide rod, a fixed seat and a material taking cylinder; the one end of guide bar with the multi-axis manipulator is connected, and the other end with the fixing base is connected, get the material cylinder with the fixing base is connected, the flexible end of getting the material cylinder still is connected with and inhales the dish portion, it is used for absorbing the material to inhale the dish portion.

In a specific embodiment, the turnover mechanism comprises a supporting seat fixed on the rack, a turnover cylinder, a storage plate and a limiting assembly; the upset cylinder with the supporting seat is connected, put the thing board with the transmission of upset cylinder is connected, it is equipped with the thing chamber of putting that is used for placing the material on the thing board to put, spacing subassembly is located put on the thing board, and with the position of putting the thing chamber is corresponding.

In a specific embodiment, the upper end and the lower end of the object placing plate are both provided with the object placing cavity and the limiting assembly; the limiting assembly comprises a limiting cylinder and a limiting pressure plate; the limiting air cylinder is connected with the object placing plate, the limiting pressing plate is in transmission connection with the limiting air cylinder, the limiting pressing plate corresponds to the position of the object placing cavity, and the limiting pressing plate is used for limiting materials.

In a specific embodiment, the limit pressing plate comprises a first limit pressing plate and a second limit pressing plate; the first limiting pressing plate and the second limiting pressing plate are in transmission connection with the limiting cylinder, and the first limiting pressing plate and the second limiting pressing plate are closed or opened.

In a specific embodiment, the rotating mechanism comprises a mounting plate fixed on the rack, a rotating cylinder, a rotating plate and a material placing plate; the rotary cylinder is connected with the mounting plate, the rotary plate is in transmission connection with the rotary cylinder, the material placing plate is connected with the rotary plate, and the material placing plate is used for placing materials.

In a specific embodiment, the material placing plate is further connected with a pressing assembly, and the pressing assembly is used for pressing the material.

In a specific embodiment, the pressing assembly comprises a pressing cylinder and a pressing plate, the pressing plate is in transmission connection with the pressing cylinder, and the pressing plate is movably connected with the material placing plate.

Compared with the prior art, the utility model beneficial effect be: various unstable factors in the manual production process can be reduced, the consistency of material laser etching is guaranteed, the yield is improved, and the labor cost is reduced.

The invention is further described with reference to the accompanying drawings and specific embodiments.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following descriptions are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic structural diagram of the laser etching apparatus provided by the present invention;

fig. 2 is a schematic structural view of the feeding mechanism, the conveying mechanism and the discharging mechanism provided by the present invention;

fig. 3 is a schematic structural diagram of a driving assembly provided by the present invention;

fig. 4 is a schematic structural view of the conveying mechanism and the material tray provided by the present invention;

fig. 5 is a schematic structural view of a material taking mechanism provided by the present invention;

fig. 6 is a schematic structural view of the turnover mechanism provided by the present invention;

fig. 7 is a schematic structural diagram of the rotating mechanism provided by the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and the following detailed description.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly, e.g., as meaning connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the terminology used in the description presented above should not be understood as necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.

Referring to fig. 1 to 7, the utility model discloses a specific embodiment of radium carving equipment, include: the device comprises a rack 10, a feeding mechanism 20, a conveying mechanism 30, a material taking mechanism 40, a turnover mechanism 50, a rotating mechanism 60, a laser mechanism 70 and a blanking mechanism 80, wherein the feeding mechanism 20, the conveying mechanism 30, the material taking mechanism 40, the turnover mechanism 50, the rotating mechanism 60, the laser mechanism 70 and the blanking mechanism 80 are arranged on the rack 10; the feeding mechanism 20, the conveying mechanism 30, the material taking mechanism 40, the turnover mechanism 50, the rotating mechanism 60, the laser mechanism 70 and the blanking mechanism 80 are correspondingly arranged; the feeding mechanism 20 is used for placing a material tray 90 containing materials 100; the conveying mechanism 30 is used for conveying the material tray 90 to the material taking mechanism 40; the material taking mechanism 40 is used for transplanting the material 100 to the turnover mechanism 50; the turnover mechanism 50 is used for turning over materials 100, the material taking mechanism 40 transplants the turned materials 100 to the rotation mechanism 60, the rotation mechanism 60 rotates the turned materials 100 to the laser mechanism 70, the laser mechanism 70 is used for performing laser on the turned materials 100 to obtain laser-carved materials 100, the material taking mechanism 40 transplants the laser-carved materials 100 to a material tray 90, the conveying mechanism 30 conveys the material tray 90 containing the laser-carved materials 100 to the blanking mechanism 80, and the blanking mechanism 80 is used for collecting the material tray 90.

Specifically, this radium carving equipment can realize radium carving material automatically, for example: bracelet product etc. can reduce various unstable factors in the manpower production process, for example: fatigue, carelessness and the like, the consistency of the material laser etching is guaranteed, the yield is improved, and the labor cost is reduced.

Referring to fig. 1 to 4, the feeding mechanism 20 and the discharging mechanism 80 have the same structure; the feeding mechanism 20 is positioned at one end of the conveying mechanism 30, and the blanking mechanism 80 is positioned at the other end of the conveying mechanism 30; the feeding mechanism 20 comprises a left feeding assembly 21 and a right feeding assembly 22 which has the same structure as the left feeding assembly 21; the left feeding assembly 21 and the right feeding assembly 22 are respectively positioned at two sides of the conveying mechanism 30; the left feeding assembly 21 comprises a mounting frame 211 fixed on the rack 10, a plurality of supporting plates 212 for placing the material tray 90 and a driving assembly 213; one end of the driving component 213 is connected to the mounting bracket 211, and the other end is in transmission connection with the supporting plate 212.

Specifically, one side of the material tray 90 containing the materials 100 is placed on the supporting plate 212 of the left feeding assembly 21, the other side of the material tray 90 is placed on the supporting plate 212 of the right feeding assembly 22, the plurality of material trays 90 containing the materials 100 are sequentially arranged from top to bottom, and then the driving assembly 213 drives the supporting plate 212 to move upwards or downwards to realize feeding or discharging.

Specifically, the driving assembly 213 includes a servo motor, a belt, a gear, a sprocket set, and a chain; the servo motor drives the gears, the two gears are respectively converted into forces in two directions to drive the chain wheel sets on the two sides to move in the same direction, and the chains on the two sides and the supporting plate 212 are driven to operate together, so that the material tray 90 is driven to move upwards or downwards, and feeding or discharging is realized.

Specifically, in the present embodiment, the width of the material tray 90 is greater than the width of the belt transmission assembly 31, so that the material tray 90 moves upward or downward to realize feeding or discharging.

Referring to fig. 1 and 4, the conveying mechanism 30 includes a belt conveying assembly 31, a positioning guide rod 32 and a positioning cylinder 33; the belt transmission assembly 31 corresponds to the feeding mechanism 20 and the blanking mechanism 80 in position, the positioning guide rod 32 is located on one side of the belt transmission assembly 31, the positioning air cylinder 33 is located on the other side of the belt transmission assembly 31, and the positioning guide rod 32 corresponds to the positioning air cylinder 33 in position.

Specifically, the belt transfer assembly 31 is prior art and will not be described in detail herein.

Specifically, the belt transmission assembly 31 conveys the material tray 90 falling on the belt transmission assembly 31 to a position corresponding to the material taking mechanism 40, and the positioning cylinder 33 positions the material tray 90 through the positioning guide rod 32, so that the material taking mechanism 40 takes the material or the laser-engraved material 100 is put back to the material tray 90.

Referring to fig. 1 and 5, the material taking mechanism 40 includes a multi-axis manipulator 41 fixed on the frame 10 and a material taking assembly 42; the material taking assembly 42 is in transmission connection with the multi-axis manipulator 41, and the material taking assembly 42 comprises a guide rod 421, a fixed seat 422 and a material taking cylinder 423; one end of the guide rod 421 is connected with the multi-axis manipulator 41, the other end is connected with the fixing seat 422, the material taking cylinder 423 is connected with the fixing seat 422, the telescopic end of the material taking cylinder 423 is further connected with a sucking disc part 424, and the sucking disc part 424 is used for sucking the material 100.

Specifically, multi-axis manipulator 41 is 4 axles, and it is 6 to inhale dish portion 424, gets material cylinder 423 and is two sets of, and 3 materials can be absorbed to the single.

Specifically, the multi-axis manipulator 41 drives the material taking cylinder 423 to suck the material 100 from the material tray 90 to the turnover mechanism 50 to complete turnover, then the overturned material 100 is sucked and placed on the rotating mechanism 60, so that the laser mechanism 70 performs laser, then the laser material 100 is sucked and placed on the turnover mechanism 50 to complete turnover, and then the overturned material 100 is sucked and placed back to the material tray 90.

Referring to fig. 1 and 6, the turnover mechanism 50 includes a support base 51 fixed on the frame 10, a turnover cylinder 52, a placement plate 53 and a limiting assembly 54; the upset cylinder 52 with the supporting seat 51 is connected, put the thing board 53 with the transmission of upset cylinder 52 is connected, it is equipped with the thing chamber 531 that is used for placing material 100 on the thing board 53 to put, spacing subassembly 54 is located put on the thing board 53, and with it is corresponding to put the position in thing chamber 531.

Specifically, the multi-axis manipulator 41 places the material 100 in the object placing cavity 531 of the object placing plate 53, the limiting component 54 limits the material 100, the overturning cylinder 52 works to drive the object placing plate 53 to overturn, and the multi-axis manipulator 41 takes away the overturned material 100.

Referring to fig. 1 and 6, the upper end and the lower end of the object placing plate 53 are both provided with the object placing cavity 531 and the limiting component 54; the limiting assembly 54 comprises a limiting cylinder 541 and a limiting pressing plate 542; the limiting air cylinder 541 is connected with the object placing plate 53, the limiting pressing plate 542 is in transmission connection with the limiting air cylinder 541, the limiting pressing plate 542 corresponds to the object placing cavity 531, and the limiting pressing plate 542 is used for limiting the material 100.

Specifically, the spacing cylinder 541 of lower extreme is closed, and the spacing cylinder 541 work of upper end drives spacing clamp plate 542 and opens, and multiaxis manipulator 41 places material 100 in putting the thing chamber 531 of putting thing board 53, and the spacing cylinder 541 of upper end is closed, and upset cylinder 52 work drives puts thing board 53 upset 180 degrees, and the spacing cylinder 541 of lower extreme changes to the upper end and drives spacing clamp plate 542 and open, and the upset is accomplished to material 100, and multiaxis manipulator 41 takes material 100 away.

Referring to fig. 1 and 6, the limiting pressure plate 542 includes a first limiting pressure plate 5421 and a second limiting pressure plate 5422; the first limiting pressing plate 5421 and the second limiting pressing plate 5422 are in transmission connection with the limiting cylinder 541, and the first limiting pressing plate 5421 and the second limiting pressing plate 5422 are closed or opened.

Specifically, the limiting pressing plate 542 is divided into a first limiting pressing plate 5421 and a second limiting pressing plate 5422, and the two sides of the material 100 are respectively pressed and limited, so that the material 100 is not prone to falling in the overturning process. Meanwhile, the first limit pressing plate 5421 and the second limit pressing plate 5422 move outwards when opened, so that the multi-axis manipulator 41 can conveniently discharge or take materials.

Referring to fig. 1 and 7, the rotating mechanism 60 includes a mounting plate 61 fixed to the frame 10, a rotating cylinder 62, a rotating plate 63 and a material placing plate 64; the rotating cylinder 62 is connected with the mounting plate 61, the rotating plate 63 is in transmission connection with the rotating cylinder 62, the material placing plate 64 is connected with the rotating plate 63, and the material placing plate 64 is used for placing materials 100.

Specifically, the material placing plates 64 are provided in two sets, respectively at both ends of the rotating plate 63. The multi-axis manipulator 41 places the overturned material 100 on the material placing plate 64, and the rotating cylinder 62 works to drive the rotating plate 63 to rotate 180 degrees, so that the material 100 is located at a position corresponding to the laser mechanism 70, and the material is subjected to laser etching.

Referring to fig. 1 and 7, the material placing plate 64 is further connected with a compacting assembly 65, and the compacting assembly 65 is used for compacting the material 100.

Specifically, the pressing assembly 65 prevents the material 100 from easily shifting or falling off during the rotation process, so as to improve the laser etching precision.

Referring to fig. 1 and 7, the pressing assembly 65 includes a pressing cylinder 651 and a pressing plate 652, the pressing plate 652 is in transmission connection with the pressing cylinder 651, and the pressing plate 652 is movably connected with the material placing plate 64.

Specifically, the pressing cylinder 651 is arranged at the bottom of the rotating plate 63, one end of the pressing plate 652 is in transmission connection with the pressing cylinder 651, and the other end of the pressing plate 652 is movably connected with the material placing plate 64. The pressing plate 652 is provided with a sliding chute, the material placing plate 64 is provided with a screw corresponding to the sliding chute, and the pressing plate 652 is slidably connected with the material placing plate 64 through the sliding chute. When the multi-axis manipulator 41 places the turned material 100 on the material placing plate 64, the pressing cylinder 651 works to drive the pressing plate 652 to move, so as to press the material 100; when the laser material 100 is removed by the multi-axis manipulator 41 after the laser treatment, the pressing cylinder 651 works to drive the pressing plate 652 to move, and the material 100 is loosened.

Referring to fig. 1 and 7, the laser mechanism 70 is a known laser machine and will not be described in detail.

In the present embodiment, the number of the turning mechanism 50, the rotating mechanism 60 and the laser mechanism 70 is two, so as to improve the production efficiency.

Specifically, in the present embodiment, the rack 10 is further provided with a display, an exhaust fan, a power supply, a switch, and other components, which will not be described in detail herein.

The application scene of the laser etching equipment is as follows: the feeding mechanism 20 stacks a plurality of material trays 90 containing materials 100, then the materials are fed to the conveying mechanism 30, the conveying mechanism 30 conveys the material trays 90 to the material taking mechanism 40, the material taking mechanism 40 transplants the materials 100 to the turnover mechanism 50, the turnover mechanism 50 overturns the materials 100, the material taking mechanism 40 transplants the overturned materials 100 to the rotating mechanism 60, the rotating mechanism 60 rotates the overturned materials 100 to the laser mechanism 70, the laser mechanism 70 carries out laser engraving on the overturned materials 100 to obtain the laser engraved materials 100, the material taking mechanism 40 transplants the laser engraved materials 100 to the turnover mechanism 50, the turnover mechanism 50 overturns the laser engraved materials 100 again, and the material taking mechanism 40 puts the overturned materials 100 back to the material trays 90; when a tray of materials 100 is fully etched and replaced by laser, the conveying mechanism 30 conveys the material tray 90 to the discharging mechanism 80, the discharging mechanism 80 is used for collecting the material tray 90, automatically and upwards superposes the material tray to full, and then prompts a user to take away the material tray to complete the whole production flow.

The above-mentioned embodiment is the utility model discloses the implementation scheme of preferred, in addition, the utility model discloses can also realize by other modes, any obvious replacement is all within the protection scope of the utility model under the prerequisite that does not deviate from this technical scheme design.

Claims (10)

1. The utility model provides a radium carving equipment which characterized in that includes: the device comprises a rack, a feeding mechanism, a conveying mechanism, a material taking mechanism, a turnover mechanism, a rotating mechanism, a laser mechanism and a discharging mechanism, wherein the feeding mechanism, the conveying mechanism, the material taking mechanism, the turnover mechanism, the rotating mechanism, the laser mechanism and the discharging mechanism are arranged on the rack; the feeding mechanism, the conveying mechanism, the material taking mechanism, the turnover mechanism, the rotating mechanism, the laser mechanism and the blanking mechanism are corresponding in position; the feeding mechanism is used for placing a material tray filled with materials; the conveying mechanism is used for conveying the material tray to the material taking mechanism; the material taking mechanism is used for transplanting materials to the turnover mechanism; the turnover mechanism is used for turning over materials, the material taking mechanism transplants the turned materials to the rotating mechanism, the rotating mechanism rotates the turned materials to the laser mechanism, the laser mechanism is used for laser of the turned materials to obtain the laser-etched materials, the material taking mechanism transplants the laser-etched materials to a material tray, the conveying mechanism conveys the material tray containing the laser-etched materials to the blanking mechanism, and the blanking mechanism is used for collecting the material tray.

2. The laser etching apparatus as claimed in claim 1, wherein the feeding mechanism and the blanking mechanism have the same structure; the feeding mechanism is positioned at one end of the conveying mechanism, and the discharging mechanism is positioned at the other end of the conveying mechanism; the feeding mechanism comprises a left feeding assembly and a right feeding assembly which has the same structure as the left feeding assembly; the left feeding assembly and the right feeding assembly are respectively positioned on two sides of the conveying mechanism; the left feeding assembly comprises a mounting frame fixed on the rack, a plurality of supporting plates for placing the material tray and a driving assembly; one end of the driving assembly is connected with the mounting frame, and the other end of the driving assembly is in transmission connection with the supporting plate.

3. The laser etching apparatus according to claim 2, wherein the conveying mechanism comprises a belt conveying assembly, a positioning guide rod and a positioning cylinder; the belt conveying assembly corresponds to the feeding mechanism and the discharging mechanism in position, the positioning guide rod is located on one side of the belt conveying assembly, the positioning air cylinder is located on the other side of the belt conveying assembly, and the positioning guide rod corresponds to the positioning air cylinder in position.

4. The laser etching apparatus as claimed in claim 3, wherein the material taking mechanism comprises a multi-axis robot and a material taking assembly; the material taking assembly is in transmission connection with the multi-shaft manipulator and comprises a guide rod, a fixed seat and a material taking cylinder; the one end of guide bar with the multi-axis manipulator is connected, and the other end with the fixing base is connected, get the material cylinder with the fixing base is connected, the flexible end of getting the material cylinder still is connected with and inhales the dish portion, it is used for absorbing the material to inhale the dish portion.

5. The laser etching apparatus as claimed in claim 4, wherein the turning mechanism includes a supporting base fixed on the frame, a turning cylinder, a placement plate and a limiting component; the upset cylinder with the supporting seat is connected, put the thing board with the transmission of upset cylinder is connected, it is equipped with the thing chamber of putting that is used for placing the material on the thing board to put, spacing subassembly is located put on the thing board, and with the position of putting the thing chamber is corresponding.

6. The laser etching apparatus according to claim 5, wherein the object placing cavity and the limiting assembly are arranged at the upper end and the lower end of the object placing plate; the limiting assembly comprises a limiting cylinder and a limiting pressure plate; the limiting cylinder is connected with the object placing plate, the limiting pressing plate is in transmission connection with the limiting cylinder, the limiting pressing plate corresponds to the object placing cavity in position, and the limiting pressing plate is used for limiting materials.

7. The laser etching apparatus as claimed in claim 6, wherein the position-limiting pressing plate comprises a first position-limiting pressing plate and a second position-limiting pressing plate; the first limiting pressing plate and the second limiting pressing plate are in transmission connection with the limiting cylinder, and the first limiting pressing plate and the second limiting pressing plate are closed or opened.

8. The laser etching apparatus according to claim 5, wherein the rotating mechanism comprises a mounting plate fixed to the frame, a rotating cylinder, a rotating plate and a material placing plate; the rotary cylinder is connected with the mounting plate, the rotary plate is in transmission connection with the rotary cylinder, the material placing plate is connected with the rotary plate, and the material placing plate is used for placing materials.

9. The laser etching apparatus as claimed in claim 8, wherein the material placing plate is further connected with a pressing assembly, and the pressing assembly is used for pressing the material.

10. The laser etching apparatus as claimed in claim 9, wherein the pressing assembly includes a pressing cylinder and a pressing plate, the pressing plate is in transmission connection with the pressing cylinder, and the pressing plate is movably connected with the material placing plate.

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