CN217747881U

CN217747881U - Secondary non-full-coverage type gluing device for preventing ultrathin wafer from floating

Info

Publication number: CN217747881U
Application number: CN202221839630.4U
Authority: CN
Inventors: 杨珮艺; 周春荣; 刘勇; 焦伟宏
Original assignee: Shanghai M Microtech Electronics Co ltd
Current assignee: Shanghai M Microtech Electronics Co ltd
Priority date: 2022-07-16
Filing date: 2022-07-16
Publication date: 2022-11-08
Anticipated expiration: 2032-07-16

Abstract

The utility model provides a prevent showy non-all standing formula rubber coating device of showy secondary of extra thin slice wafer, including the grudging post, servo electronic jar is installed to the inside lower extreme of grudging post, the supporting disk is installed to servo electronic jar output, the motor is installed to the grudging post upper end, the motor output is connected with the carousel, the carousel rotates and installs on the inside top of grudging post, splint are installed to the carousel lower extreme, the liquid storage box is installed to the inside lower extreme of splint, liquid storage box lower extreme is equipped with one row of a plurality of flowing back mouth of pipe, just flowing back mouth of pipe size is from liquid storage box lower extreme center to liquid storage box lower extreme side grow gradually, liquid storage box both sides wall lower extreme all is connected with smooths the board. The utility model discloses can be so that the glue film homogeneity is better, improve the glue film homogeneity, avoid the wafer edge to produce deckle edge, improve the rubber coating effect, can also carry out accurate the accuse to thickness, size and the glue yield of wafer rubberizing water layer to can effectively avoid the too thick problem of glue.

Description

Secondary non-full-coverage type gluing device for preventing ultrathin wafer from floating

Technical Field

The utility model mainly relates to a glued technical field of wafer, concretely relates to prevent showy secondary non-all standing formula rubber coating device of ultra-thin slice wafer.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. According to the process requirement of chemical plating, the wafer is kept in a vertical state in the plating tank, the tank distance in the Teflon wafer box is generally 3mm, the thickness of the thinned wafer is 100-200um, and each wafer box can fully produce 25 wafers at a time, but because the thickness of the wafer is extremely thin, after the wafer is placed in the tank in the wafer box, the wafer is easy to move in the tank due to a large gap between the tank and the tank, the wafer is easy to float out of the wafer box when entering chemical liquid, and a mechanical arm is released when the machine detects that the wafer floats out, so that the wafers in the whole batch float out of the wafer box, and the production plating or direct product scrapping can be caused.

In order to solve the problem of wafer floating, a glass sheet is adhered to the back of a thin wafer in a current common mode, according to the mode, manual adhesion is needed, the difficulty is high, time is consumed, the wafer is extremely thin, warping possibly exists to a certain degree, and due to different operator differences, the flatness difference is large, and the capacity of a chemical electroplating process production line is limited greatly. Therefore, the back gluing mode is considered to be used for solving the problem, but during gluing, the situation that if the glue is coated thickly at one time, longer time is needed during glue curing, the curing effect is poor, long-time curing can cause adverse effects on the wafer, if the gluing is too thin, the obvious weight increasing effect cannot be achieved, manual gluing is performed, the working efficiency is low, and the uniformity of gluing the wafer cannot be guaranteed.

SUMMERY OF THE UTILITY MODEL

The utility model mainly provides a prevent showy secondary non-all standing formula rubber coating device of ultra-thin slice wafer for solve the technical problem who provides among the above-mentioned background art.

The utility model provides a technical scheme that above-mentioned technical problem adopted does:

a secondary non-full-coverage type gluing device for preventing ultrathin wafers from floating comprises a vertical frame, wherein a servo electric cylinder is installed at the lower end inside the vertical frame, a supporting disc is installed at the output end of the servo electric cylinder, a motor is installed at the upper end of the vertical frame, the output end of the motor is connected with a rotary disc, the rotary disc is rotatably installed at the top end inside the vertical frame, a clamping plate is installed at the lower end of the rotary disc, a liquid storage box is installed at the lower end inside the clamping plate, a piston plate slides inside the liquid storage box, a plurality of electric telescopic rods are connected between the piston plate and the top wall inside the clamping plate, a row of a plurality of liquid drainage pipe orifices are formed in the lower end of the liquid storage box, the sizes of the liquid drainage pipe orifices are different, and the sizes of the liquid drainage pipe orifices are gradually increased from the center of the lower end of the liquid storage box to the side edge of the lower end of the liquid storage box; deposit liquid case both sides wall lower extreme and all be connected with and smooth the flat board, every it all slides on the flat board has two movable sliding blocks, every it all is equipped with the shifting chute on the flat board to smooth, every the inside lifting groove that all is equipped with of movable sliding block, it has the connecting rod to slide on the lifting groove, just the connecting rod other end runs through the shifting chute, be connected with the extrusion spring between connecting rod and the lifting groove roof, two are relative be connected with the side scraping board between the connecting rod, it is equipped with two blend stops, every the blend stop lower extreme all is connected with the support bar of slip on smoothing the board, two support bar and two side scraping board one-to-ones, and corresponding be connected with the telescopic link between support bar and the side scraping board.

Preferably, a vacuum chuck is mounted on the support plate, and a chuck on the vacuum chuck is located at the center of the support plate.

Preferably, one side of the liquid storage tank is provided with an observation window, and distance scales are arranged beside the observation window.

Preferably, install the regulation strip on the deposit liquid case lateral wall, the inside two dead slots that are equipped with of regulation strip, every the inside screw rod, two of all rotating of dead slot is installed, two thread line on the screw rod is opposite, and two the screw rod axle center links to each other, every all threaded connection has the regulating block on the screw rod, the regulating block is connected with the removal slider, regulation strip one side is equipped with the adjustment disk of being connected with the screw rod axle center.

Preferably, the two barrier strips are tightly contacted with the lower end of the liquid storage box.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) The size of the liquid discharge pipe orifice of the device is gradually increased from the center of the lower end of the liquid storage box to the side edge of the lower end of the liquid storage box, the blanking speed of the liquid discharge pipe orifice which is farther away from the center of the lower end of the liquid storage box is faster, the glue on the wafer is uniformly distributed, so that the uniformity of the glue layer is better, and the smoothing plate rotates along with the rotation of the liquid storage box, so that the glue is smoothed, the uniformity of the glue layer is improved, the side scraper plate cleans the side wall of the glue layer, the burrs at the edge of the wafer are avoided, and the gluing effect is improved;

(2) When the device is used, the thickness of the glue layer is adjusted through the servo electric cylinder, the size range of the glue layer is adjusted through rotating the adjusting disc, and the discharge amount of glue is controlled through the observation window and the distance scale, so that the thickness and size of the glue layer on the wafer and the glue amount are accurately controlled, the problem of over-thick glue can be effectively avoided, manual gluing is not needed, and the practicability is high;

(3) By adopting the gluing method, firstly the whole weight of the wafer can be increased by gluing, the wafer is prevented from floating out of the wafer box, secondly, no chemical solution permeates into the back of the wafer, the wafer protecting effect is better than that of a glass patch, and the glue curing efficiency and effect can be improved by adopting the secondary gluing method of gluing and curing in multiple times.

The present invention will be explained in detail with reference to the drawings and specific embodiments.

Drawings

Fig. 1 is a perspective view of the present invention;

FIG. 2 is a schematic view of a partial structure of the present invention;

FIG. 3 is a schematic view of the liquid storage tank of the present invention;

FIG. 4 is a schematic view of a partial plan structure of the present invention;

FIG. 5 is a schematic view of the plane structure of the adjusting strip of the present invention;

fig. 6 is a schematic perspective view of the side scraper of the present invention.

In the figure: 1. erecting a frame; 11. a servo electric cylinder; 12. a support disc; 13. a motor; 14. a turntable; 15. a vacuum chuck; 2. an adjustment bar; 21. an empty groove; 22. a screw; 23. an adjusting block; 24. an adjusting disk; 3. a liquid storage tank; 31. a splint; 32. a piston plate; 33. an electric telescopic rod; 34. an observation window; 35. distance scales; 36. a liquid discharge pipe orifice; 4. flattening the plate; 41. moving the slide block; 42. a moving groove; 43. a connecting rod; 44. a side flight; 45. blocking strips; 46. a supporting strip; 47. a telescopic rod; 48. a lifting groove; 49. compressing the spring.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the present invention are shown, but the present invention can be implemented in different forms, and is not limited to the embodiments described in the text, and on the contrary, these embodiments are provided so as to make the disclosure more thorough and complete.

Please refer to fig. 1 and 2, the present invention provides a technical solution: the utility model provides a prevent showy not full coverage formula rubber coating device of secondary of ultra-thin slice wafer, includes grudging post 1, servo electronic jar 11 is installed to the inside lower extreme of grudging post 1, supporting disk 12 is installed to servo electronic jar 11 output, and supporting disk 12 is used for placing the wafer, through the altitude mixture control to servo electronic jar 11, makes supporting disk 12 position change, can change the height of wafer, thereby adjusts the interval between wafer and the smoothing board 4, prescribes a limit to the thickness of wafer surface glue film, and servo electronic jar 11 can adopt the servo electronic jar of ampere too gram GY50L, and its position repetition precision is 0.01mm, thereby can carry out reasonable precision adjustment to the thickness of wafer surface glue film, install vacuum chuck 15 on supporting disk 12, the sucking disc on the vacuum chuck 15 is located supporting disk 12 center, and the vacuum equipment who is connected with vacuum chuck 15 installs at supporting disk 12 lower extreme, when using, puts the wafer on supporting disk 12, makes vacuum chuck 15 aim at the wafer to the round crystal, starts vacuum equipment suction, makes negative pressure produce in the sucking disc 15, thereby firmly adsorb the round crystal, avoids the round crystal to remove at the rubber coated time.

Please refer to fig. 1-3 again, the motor 13 is installed at the upper end of the vertical frame 1, the output end of the motor 13 is connected with the rotary table 14, the rotary table 14 is rotatably installed at the top end inside the vertical frame 1, the lower end of the rotary table 14 is installed with the clamping plate 31, the lower end inside the clamping plate 31 is installed with the liquid storage tank 3, glue is arranged in the liquid storage tank 3, the piston plate 32 slides inside the liquid storage tank 3, a plurality of electric telescopic rods 33 are connected between the piston plate 32 and the top wall inside the clamping plate 31, the electric telescopic rods 33 can be NKLA8 direct current electric push rods, the lower end of the liquid storage tank 3 is provided with a row of a plurality of liquid discharge pipe orifices 36, one side of the liquid storage tank 3 is provided with the observation window 34, and the distance scale 35 is arranged beside the observation window 34. Start electric telescopic handle 33 for piston plate 32 pushes down, thereby extrude the inside glue of deposit liquid tank 3 through flowing back mouth of pipe 36, make glue fall on the wafer, through observation window 34 and distance scale 35, can survey a glue liquid level descending height fast, because of deposit liquid tank 3 bottom surface area is fixed, consequently, can calculate a glue discharge amount fast, through the control to electric telescopic handle 33, make piston plate 32 displacement can adjust, thereby can control the glue discharge amount.

Please refer to fig. 1-3, the sizes of the liquid discharge nozzles 36 are different, and the sizes of the liquid discharge nozzles 36 gradually increase from the center of the lower end of the liquid storage tank 3 to the side edge of the lower end of the liquid storage tank 3, because the liquid storage tank 3 rotates and the liquid discharge nozzles 36 move with the liquid storage tank, but the distances of the rotation and the movement of each liquid discharge nozzle 36 are different, the farther the liquid discharge nozzle 36 from the center of the lower end of the liquid storage tank 3 rotates and moves, if the sizes of the liquid discharge nozzles 36 are the same, the same discharging speed will result in uneven distribution of glue on the wafer and affect the uniformity of the glue layer, therefore, the sizes of the liquid discharge nozzles 36 gradually increase from the center of the lower end of the liquid storage tank 3 to the side edge of the lower end of the liquid storage tank 3, and the farther the liquid discharge nozzle 36 from the center of the lower end of the liquid storage tank 3 has the higher discharging speed, thereby ensuring uniform distribution of glue on the wafer and better uniformity of the glue layer.

Please refer to fig. 1-6, the lower ends of the two side walls of the liquid storage tank 3 are connected with the leveling plates 4, each of the leveling plates 4 has two sliding blocks 41, each of the leveling plates 4 has a moving groove 42, each of the moving blocks 41 has a lifting groove 48, the lifting groove 48 has a connecting rod 43, the other end of the connecting rod 43 passes through the moving groove 42, a pressing spring 49 is connected between the top walls of the connecting rod 43 and the lifting groove 48, a side scraper 44 is connected between two opposite connecting rods 43, the lower end of the liquid storage tank 3 has two bars 45, the two bars 45 are in tight contact with the lower end of the liquid storage tank 3, the lower end of each bar 45 is connected with a supporting strip 46 sliding on the leveling plate 4, the two supporting strips 46 are in one-to-one correspondence with the two side scrapers 44, and a telescopic rod 47 is connected between the corresponding supporting strip 46 and the side scraper 44, when in use, the side scrapers 44 clean the side edges of the side of the adhesive layer, the adhesive layer can be prevented from generating burrs, the size range of the adhesive layer can be determined by the side scrapers 44, and the liquid discharge side scrapers 36 can be selectively moved, so that the liquid discharge can only block the liquid discharge of the liquid discharge pipe orifice 36, and the liquid discharge baffle 36.

Please refer to fig. 1-6, an adjusting strip 2 is mounted on a side wall of the liquid storage tank 3, two empty slots 21 are disposed inside the adjusting strip 2, a screw 22 is rotatably mounted inside each empty slot 21, thread lines on the two screw 22 are opposite, axes of the two screw 22 are connected, an adjusting block 23 is connected to each screw 22 through a thread, the adjusting block 23 is connected to a movable slider 41, and an adjusting disc 24 connected to the axis of the screw 22 is disposed on one side of the adjusting strip 2. Through manual rotation adjustment disk 24 for two screws 22 rotate, because of the thread line on two screws 22 is opposite, make two regulating blocks 23 move in different directions, remove slider 41 and follow the removal, make side scraper 44 remove, thereby realize the size range regulation of glue film.

The utility model discloses a concrete operation mode as follows:

when the device is used, a wafer is placed in the center of the upper end of the supporting plate 12, the vacuum chuck 15 is aligned with a round crystal, a vacuum device is started to suck air, negative air pressure is generated in the vacuum chuck 15, the round crystal is firmly adsorbed, then the servo electric cylinder 11 is started, the wafer moves upwards until the wafer is contacted with the flattening plate 4, the adjusting plate 24 is manually rotated, the two screw rods 22 rotate, the two adjusting blocks 23 move in different directions due to opposite thread lines on the two screw rods 22, the moving slide block 41 moves along with the moving slide block, the side scraper 44 moves to enable the side wall of the side scraper 44 to be attached to the side wall of the wafer, the barrier strip 45 moves along with the movement of the side scraper 44, the liquid discharge pipe orifice 36 is selectively blocked, then the servo electric cylinder 11 is adjusted to be lowered by 0.04mm, the electric telescopic rod 33 and the motor 13 are started simultaneously, the electric telescopic rod 33 enables the piston plate 32 to be pressed downwards, thereby extrude the glue inside the liquid storage box 3 through the unblocked liquid discharge pipe orifice 36, so that the glue falls on the wafer, the discharge amount of the glue can be controlled through the observation window 34 and the distance scale 35, the motor 13 drives the liquid storage box 3 to rotate, the liquid discharge pipe orifice 36 moves along with the glue, and the glue distribution on the wafer is ensured to be uniform because the size of the liquid discharge pipe orifice 36 is gradually increased from the center of the lower end of the liquid storage box 3 to the side edge of the lower end of the liquid storage box 3, the blanking speed of the liquid discharge pipe orifice 36 which is farther from the center of the lower end of the liquid storage box 3 is faster, so that the glue on the wafer is better in uniformity of the glue layer, the placating plate 4 rotates along with the rotation of the liquid storage box 3, the side scraping plate 44 cleans the side wall of the wafer, the glue layer is ensured to be smooth, the burrs on the edge of the glue layer are avoided, after the first glue coating, the wafer is solidified, so that the first glue layer covers the whole surface of the wafer, first glue film thickness is 0.04mm, then, carry out the rubber coating for the second time, start servo electronic jar 11, make the wafer move up, until the wafer with smooth 4 contacts on the board, manual rotation adjustment disk 24, make side scraper blade 44 remove, prescribe a limit to second glue film size range, at this moment, side scraper blade 44 lower extreme and first glue film surface contact, adjust servo electronic jar 11 afterwards, make it descend 0.07mm, then start electric telescopic handle 33 and motor 13 simultaneously, with the glue flattening, form the second glue film after the solidification.

The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, if the method and the technical solution of the present invention are adopted, the present invention can be directly applied to other occasions without substantial improvement, and the present invention is within the protection scope of the present invention.

Claims

1. The utility model provides a prevent floated non-all covering formula rubber coating device of secondary of ultrathin piece wafer, includes grudging post (1), its characterized in that: the hydraulic cylinder type liquid storage device is characterized in that a servo electric cylinder (11) is installed at the lower end of the inside of the vertical frame (1), a supporting plate (12) is installed at the output end of the servo electric cylinder (11), a motor (13) is installed at the upper end of the vertical frame (1), the output end of the motor (13) is connected with a rotary plate (14), the rotary plate (14) is rotatably installed at the top end of the inside of the vertical frame (1), a clamping plate (31) is installed at the lower end of the rotary plate (14), a liquid storage box (3) is installed at the lower end of the inside of the clamping plate (31), a piston plate (32) slides inside the liquid storage box (3), a plurality of electric telescopic rods (33) are connected between the piston plate (32) and the top wall of the inside of the clamping plate (31), a row of a plurality of liquid discharge pipe orifices (36) are formed in the lower end of the liquid storage box (3), the plurality of liquid discharge pipe orifices (36) are different in size, and the size of the liquid discharge pipe orifices (36) gradually increases from the center of the lower end of the liquid storage box (3);

deposit liquid case (3) both sides wall lower extreme all is connected with and smooths dull and stereotyped (4), every it all slides on dull and stereotyped (4) has two to remove slider (41), every it all is equipped with shifting chute (42), every to remove slider (41) inside all is equipped with lift groove (48), it has connecting rod (43) to slide on lift groove (48), just connecting rod (43) other end runs through shifting chute (42), be connected with between connecting rod (43) and lift groove (48) roof extrusion spring (49), two are relative be connected with side scraping plate (44) between connecting rod (43), it is equipped with two blend stop (45) to deposit liquid case (3) lower extreme, every blend stop (45) lower extreme all is connected with support bar (46) of sliding on smoothing board (4), two support bar (46) and two side scraping plate (44) one-to-one, and corresponding be connected with telescopic link (47) between support bar (46) and side scraping plate (44).

2. The secondary non-full-coverage gluing device for preventing ultra-thin wafers from floating as claimed in claim 1, wherein: the vacuum chuck (15) is installed on the supporting disk (12), and the chuck on the vacuum chuck (15) is located at the center of the supporting disk (12).

3. The secondary non-full-coverage gluing device for preventing ultra-thin wafers from floating as claimed in claim 1, wherein: an observation window (34) is arranged on one side of the liquid storage box (3), and distance scales (35) are arranged beside the observation window (34).

4. The secondary non-full-coverage gluing device for preventing ultra-thin wafers from floating as claimed in claim 1, wherein: install regulation strip (2) on deposit liquid case (3) lateral wall, regulation strip (2) inside is equipped with two dead slots (21), every dead slot (21) inside all rotates and installs screw rod (22), two the screw thread line on screw rod (22) is opposite, and two screw rod (22) axle center links to each other, every all threaded connection has regulating block (23) on screw rod (22), regulating block (23) and removal slider (41) are connected, regulation strip (2) one side is equipped with adjusting disk (24) of being connected with screw rod (22) axle center.

5. The secondary non-full-covering type glue coating device for preventing the ultra-thin wafer from floating as claimed in claim 1, wherein: the two barrier strips (45) are tightly contacted with the lower end of the liquid storage tank (3).