CN217739936U

CN217739936U - Side formula fingerprint module

Info

Publication number: CN217739936U
Application number: CN202221424728.3U
Authority: CN
Inventors: 李江波; 张�成; 姚燕杰; 王丽; 位贤龙
Original assignee: Jiangsu A Kerr Bio Identification Technology Co Ltd
Current assignee: Anhui Kaier Communication Technology Co ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-11-04
Anticipated expiration: 2032-06-09

Abstract

The utility model discloses a side formula fingerprint module, include: the fingerprint chip comprises a PCB, a fingerprint chip electrically connected to one end of the PCB and a connector electrically connected to the other end of the PCB, wherein a plurality of first bonding pads are arranged in the middle region of one side of the PCB, the two sides of each first bonding pad are positioned at two ends of the PCB, at least one second bonding pad is arranged on each side of the PCB, a plurality of third bonding pads corresponding to the first bonding pads and fourth bonding pads corresponding to the second bonding pads are arranged on one side of the fingerprint chip, the third bonding pads correspond to the first bonding pads, the fourth bonding pads correspond to the second bonding pads, the first bonding pads and the corresponding third bonding pads are connected through solder paste welding, the second bonding pads and the corresponding fourth bonding pads are connected through solder paste welding, the first bonding pads and the third bonding pads are different in area size, and the fourth bonding pads and the second bonding pads are the same in area size. The utility model discloses both can avoid the chip position to take place the skew and influence welding precision, can avoid the tin cream to be heated excessive again, improve welding strength and welded structure's stability.

Description

Side edge type fingerprint module

Technical Field

The utility model relates to a side formula fingerprint module belongs to electron device technical field.

Background

Fingerprint identification module is through the module collection fingerprint image that has the fingerprint collection function, draws the fingerprint characteristic in the fingerprint of gathering through specific fingerprint algorithm from the fingerprint of gathering to compare its fingerprint template with gather processing in advance, if the similarity exceeds predetermined threshold value, then the fingerprint is compared and is passed through, verifies user's legal identity. Because of the lifelong invariance, uniqueness and convenience of fingerprints, the fingerprint identification module is widely applied to various terminal devices.

With the development of mobile terminals such as mobile phones, tablet computers, notebook computers, and the like toward light weight, thinness, multi-functionalization, and low cost, small-sized, high-density, high-performance, and diversified fingerprint identification chips play an increasingly important role in the mobile terminals. However, as the size of the fingerprint recognition chip becomes smaller and smaller, when the chip is soldered on the circuit substrate using Surface-mount technology (SMT), a problem of poor soldering strength is likely to occur.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a side formula fingerprint module, this side formula fingerprint module both can avoid the chip position to take place the skew and influence the welding precision, can avoid the solder paste to be heated excessive again, improves welding strength and welded structure's stability.

In order to solve the technical problem, the utility model adopts the technical scheme that: a side fingerprint module, comprising: the fingerprint identification device comprises a PCB, a fingerprint chip electrically connected to one end of the PCB and a connector electrically connected to the other end of the PCB, wherein a plurality of first bonding pads are arranged in the middle area of one side of the PCB, which faces the fingerprint chip, at least one second bonding pad is arranged on each of two sides of the first bonding pad and at two ends of the PCB, and a plurality of third bonding pads corresponding to the first bonding pads and fourth bonding pads corresponding to the second bonding pads are arranged on one side of the fingerprint chip, which faces the PCB;

every between first pad and the third pad that corresponds, every all through tin cream welded connection between second pad and the fourth pad that corresponds, the area size of first pad and third pad is inequality, the area size of fourth pad and second pad is the same.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the area of the third pad is larger than that of the first pad.

2. In the above scheme, the first pad, the second pad, the third pad and the fourth pad are all rectangular pads.

3. In the above scheme, the length of each first pad is smaller than the length of the third pad located directly above the first pad.

4. In the above scheme, the width of each first pad is the same as the width of the third pad directly above the first pad.

5. In the above scheme, a plurality of grooves are formed in the surface of the PCB facing the fingerprint chip, and the surfaces of the first bonding pad and the second bonding pad embedded in the grooves are lower than the surface of the PCB.

6. In the above scheme, the plurality of first pads are arranged at equal intervals along the length direction of the PCB.

7. In the above scheme, the plurality of first pads are distributed in two rows, and the plurality of first pads in each row are arranged at equal intervals along the length direction of the PCB.

8. In the above scheme, the connector is used for electrically connecting with a main board of the electronic device.

9. In the above scheme, a cover plate is connected to the fingerprint chip in an adhesive manner, and the side of the fingerprint chip, which is opposite to the PCB, is provided with a cover plate.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model relates to a side formula fingerprint module, its every between first pad and the third pad that corresponds, every all through tin cream welded connection between second pad and the fourth pad that corresponds, the area size of first pad and third pad is inequality, the area size of fourth pad and second pad is the same, sets up through the differentiation combination to the pad size, and the intensification of processing, cooling in-process both can avoid the chip position to take place the skew to influence the welding precision, can avoid tin cream to be heated again and overflow, improve welding strength and welded structure's stability.

Drawings

Fig. 1 is a schematic structural view of the side fingerprint module of the present invention;

fig. 2 is a schematic view of the side-edge fingerprint module according to the present invention;

fig. 3 is a schematic view of a local cross section of the side fingerprint module of the present invention.

In the drawings above: 1. a PCB board; 11. a first pad; 12. a second pad; 13. a groove; 2. a fingerprint chip; 21. a third pad; 22. a fourth pad; 3. a gap layer; 4. a glue layer; 5. a connector; 6. and (7) a cover plate.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a side fingerprint module, comprising: the fingerprint identification device comprises a PCB (printed circuit board) 1, a fingerprint chip 2 electrically connected to one end of the PCB 1 and a connector 5 electrically connected to the other end of the PCB 1, wherein a plurality of first bonding pads 11 are arranged in the middle area of one side of the PCB 1, which faces the fingerprint chip 2, at least one second bonding pad 12 is respectively arranged on two sides of the first bonding pads 11 and at two ends of the PCB 1, and a plurality of third bonding pads 21 corresponding to the first bonding pads 11 and fourth bonding pads 22 corresponding to the second bonding pads 12 are arranged on one side of the fingerprint chip 2, which faces the PCB 1;

every between first pad 11 and the third pad 21 that corresponds, every all through tin cream welded connection between second pad 12 and the fourth pad 22 that corresponds, first pad 11 is inequality with the area size of third pad 21, the area size of fourth pad 22 is the same with second pad 12.

The area of the third pad 21 is larger than that of the first pad 11; the first bonding pad 11, the second bonding pad 12, the third bonding pad 21 and the fourth bonding pad 22 are all rectangular bonding pads; the length of each of the above-described first pads 11 is smaller than the length of the third pad 21 located immediately above it; the width of each of the first pads 11 is the same as the width of the third pad 21 immediately above the first pad;

the surface of the PCB 1 facing the fingerprint chip 2 is provided with a plurality of grooves 13, and the surfaces of the first bonding pad 11 and the second bonding pad 12 embedded in the grooves 13 are lower than the surface of the PCB 1;

the first pads 11 are distributed in two rows, and the first pads 11 in each row are arranged at equal intervals along the length direction of the PCB board 1.

Example 2: a side fingerprint module, comprising: the fingerprint identification device comprises a PCB (printed circuit board) 1, a fingerprint chip 2 electrically connected to one end of the PCB 1 and a connector 5 electrically connected to the other end of the PCB 1, wherein a plurality of first bonding pads 11 are arranged in the middle area of one side of the PCB 1, which faces the fingerprint chip 2, at least one second bonding pad 12 is respectively arranged on two sides of the first bonding pads 11 and at two ends of the PCB 1, and a plurality of third bonding pads 21 corresponding to the first bonding pads 11 and fourth bonding pads 22 corresponding to the second bonding pads 12 are arranged on one side of the fingerprint chip 2, which faces the PCB 1;

every between first pad 11 and the third pad 21 that corresponds, every all through tin cream welded connection between second pad 12 and the fourth pad 22 that corresponds, first pad 11 is inequality with the area size of third pad 21, the area size of fourth pad 22 and second pad 12 is the same.

A plurality of the first pads 11 are arranged at equal intervals along the length direction of the PCB board 1; the connector 5 is used for electrically connecting with a main board of the electronic device; a cover plate 6 is connected with one side of the fingerprint chip 2 opposite to the PCB 1 in an adhering way;

the fingerprint chip 2 and the connector 5 are respectively connected to the surfaces of two sides of the PCB board 1; the PCB board 1 is a strip-shaped PCB board; the cover plate 6 is a glass cover plate; a clearance layer 3 is formed between the PCB 1 and the chip 2, a glue layer 4 is filled in the clearance layer 3, and the clearance layer can be fully filled through a simple process of injecting glue on one side, so that the integral structural strength and the waterproof and dustproof performance are improved, the welding pad and the welding point are prevented from being corroded by chemical liquid medicine in the subsequent reliability test and other processes, and the integral weather resistance and reliability are improved.

When the side type fingerprint module is adopted, each of the side type fingerprint module is connected between the first bonding pad and the corresponding third bonding pad and between the second bonding pad and the corresponding fourth bonding pad in a welding mode through solder paste, the area sizes of the first bonding pad and the third bonding pad are different, the area sizes of the fourth bonding pad and the second bonding pad are the same, through the differentiated combination setting of the sizes of the bonding pads, the chip position can be prevented from being deviated in the heating and cooling processes of processing to influence the welding precision, the solder paste can be prevented from being heated and overflowing, and the welding strength and the stability of a welding structure are improved.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. A side fingerprint module, comprising: PCB board (1), electricity connect in fingerprint chip (2) of PCB board (1) one end and the electricity connect in connector (5) of PCB board (1) other end, its characterized in that: the fingerprint identification device is characterized in that a plurality of first bonding pads (11) are arranged in the middle area of one side, facing the fingerprint chip (2), of the PCB (1), at least one second bonding pad (12) is arranged on each of two sides of each first bonding pad (11) and located at two ends of the PCB (1), and a plurality of third bonding pads (21) corresponding to the first bonding pads (11) and fourth bonding pads (22) corresponding to the second bonding pads (12) are arranged on one side, facing the PCB (1), of the fingerprint chip (2);

every between first pad (11) and corresponding third pad (21), every all through tin cream welded connection between second pad (12) and the fourth pad (22) that corresponds, the area size of first pad (11) and third pad (21) is inequality, the area size of fourth pad (22) and second pad (12) is the same.

2. The edge-type fingerprint module of claim 1, wherein: the area of the third pad (21) is larger than that of the first pad (11).

3. The side fingerprint module of claim 1, wherein: the first bonding pad (11), the second bonding pad (12), the third bonding pad (21) and the fourth bonding pad (22) are all rectangular bonding pads.

4. The edge-type fingerprint module of claim 3, wherein: the length of each first bonding pad (11) is smaller than that of a third bonding pad (21) positioned right above the first bonding pad.

5. The side fingerprint module of claim 3 or 4, wherein: the width of each first bonding pad (11) is the same as that of a third bonding pad (21) directly above the first bonding pad.

6. The side fingerprint module of claim 1, wherein: a plurality of grooves (13) are formed in the surface, facing the fingerprint chip (2), of the PCB (1), and the surfaces of the first bonding pad (11) and the second bonding pad (12) embedded into the grooves (13) are lower than the surface of the PCB (1).

7. The side fingerprint module of claim 1, wherein: the first welding pads (11) are arranged at equal intervals along the length direction of the PCB (1).

8. The side fingerprint module of claim 1, wherein: the plurality of first bonding pads (11) are distributed in two rows, and the plurality of first bonding pads (11) in each row are arranged at equal intervals along the length direction of the PCB (1).

9. The edge-type fingerprint module of claim 1, wherein: the connector (5) is used for being electrically connected with a main board of the electronic equipment.

10. The edge-type fingerprint module of claim 1, wherein: a cover plate (6) is connected to the fingerprint chip (2) in an adhesive mode and is back to one side of the PCB (1).