CN217726445U

CN217726445U - Wafer brushing device

Info

Publication number: CN217726445U
Application number: CN202222586596.0U
Authority: CN
Inventors: 邵树宝; 蒋超伟; 张海珠; 王泳彬
Original assignee: Jiangsu Xinmeng Semiconductor Equipment Co ltd
Current assignee: Jiangsu Xinmeng Semiconductor Equipment Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2022-11-04
Anticipated expiration: 2032-09-29

Abstract

The utility model discloses a wafer brushing device, which comprises a supporting arm, a brush disc component and a hydraulic rotator connected with the supporting arm, wherein the brush disc component comprises an outflow channel with an outlet, the hydraulic rotator comprises a fluid cavity, an upper connecting part and a rotating component, the fluid cavity is fixedly connected with the upper connecting part or is integrally formed, the rotating component is arranged in the fluid cavity, and a containing cavity is arranged in the fluid cavity; the inside of support arm is provided with first fluid passage, and the inside of going up connecting portion is provided with interface channel, goes up connecting portion and has seted up a plurality of liquid through holes, and the fluid can flow through in proper order and get into behind first fluid passage and the interface channel and hold the chamber, again from the outflow passageway and through the export blowout, and rotating assembly is used for rotatory and drive the brush dish subassembly rotation when the chamber is held in the fluid follow interface channel entering. The utility model discloses need not additionally to set up fixed nozzle, drive the rotatory rotating electrical machines of brush dish part, overall structure is simple.

Description

Wafer brushing device

Technical Field

The utility model relates to a wafer brushing device.

Background

In the manufacturing process of semiconductor wafers, a wafer cleaning process is widely applied to the field of chip manufacturing, and after the wafers are subjected to a Chemical Mechanical Polishing (CMP) process, pollutants such as organic compound particles and metal impurities are remained on the surfaces of the wafers, and the pollutants affect the next process, so that the performance of the chips is seriously damaged. For this reason, the wafer needs to be brushed after the CMP process to remove surface contaminants.

In a conventional wafer brushing apparatus (for example, patent CN 105957821A), a brush plate portion is rotated above a wafer by a rotating motor, an air cylinder up-and-down device controls a contact surface between the brush plate and the wafer, and the rotating motor drives a synchronous pulley to rotate the brush plate portion. During the wafer brushing process, the cleaning device swings left and right, and the fixed nozzle fixed on the cleaning chamber or the brushing device sprays cleaning liquid on the brushing part, so that pollutants and particles are removed on the wafer by the brushing part. The brushing device needs to be additionally provided with a motor to drive a synchronous belt pulley so as to be transmitted to the brush disc assembly, so that the brushing device is complex in overall structure and high in cost; in addition, the brush plate cannot realize self-cleaning, and a fixed nozzle for spraying cleaning liquid is easily polluted after being used for a period of time, and particles are remained on the surface, so that secondary pollution in the wafer brushing process is caused again.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model aims to provide a modified wafer brushing device, the device overall structure is comparatively simple, and need not to use fixed nozzle, can avoid the wafer to scrub the secondary pollution of in-process once more.

In order to solve the above problem, the utility model provides a following scheme:

a wafer brushing device comprises a supporting arm and a brush disc assembly, wherein the brush disc assembly comprises an outflow channel with an outlet, the wafer brushing device further comprises a hydraulic rotator connected with the supporting arm, the hydraulic rotator comprises a fluid chamber, an upper connecting part and a rotating assembly, the fluid chamber is fixedly connected with the upper connecting part or integrally formed, the rotating assembly is arranged in the fluid chamber, an accommodating cavity is formed in the fluid chamber, the upper connecting part is fixedly connected with the supporting arm, and the rotating assembly is fixedly connected with the brush disc assembly;

a first fluid channel is arranged inside the supporting arm, a connecting channel is arranged inside the upper connecting part, a plurality of liquid through holes are formed in the upper connecting part, the first fluid channel, the connecting channel, the liquid through holes, the accommodating cavity and the outflow channel are communicated, and fluid can sequentially flow through the first fluid channel, the connecting channel, the liquid through holes, the accommodating cavity and the outflow channel and is ejected through the outlet;

the rotating assembly comprises a supporting rod and a plurality of rotating blades arranged on the supporting rod, the rotating blades are arranged in the accommodating cavity, the supporting rod is rotatably connected with the fluid cavity, and the brush disc assembly is fixedly connected with the supporting rod;

the rotating assembly is used for rotating when fluid enters the accommodating cavity from the connecting channel and driving the brush disc assembly to rotate.

The type of the fluid is not particularly limited, and may be, for example, water or a commonly used wafer cleaning liquid. The utility model discloses a wafer brushing device sets up the hydraulic pressure circulator, and it is rotatory when fluid such as washing liquid entering holds the chamber to can drive brush dish subassembly rotatory, and then can make the brush dish subassembly scrub the wafer. The cleaning liquid can flow through the fluid passage, the accommodating chamber and the outflow passage and is sprayed out from the outlet, so that a fixed nozzle is not required to be additionally arranged.

The number of the rotating blades is not particularly limited, and the rotating blades can be two, three or more, the material, shape and thickness of the rotating blades are not particularly limited, as long as the rotating assembly can be integrally used for rotating when fluid enters the accommodating cavity and driving the brush disc assembly to rotate.

Preferably, the liquid passing hole is disposed opposite to the rotary blade. The number of the liquid passing holes is not particularly limited, and may be two, three or more, and the shape of the liquid passing holes is also not particularly limited, and may be, for example, an oval shape, a circular shape, a square shape, an irregular shape, or the like. Fluid flows to the containing cavity from the liquid through hole, and because the fluid has certain velocity of flow, when the fluid passes through a plurality of rotating blades, the rotating blades can be driven to rotate, and the rotating blades drive the brush disc group to rotate through the supporting rod.

In some embodiments, the upper end of the upper connecting portion is detachably and fixedly connected with the supporting arm. The fixing means is not particularly limited, and may be any of various conventional fixing means such as a screw connection and the like.

In some embodiments, the brush plate assembly further comprises a brush plate bottom rod, a brush plate base and a brush body, the brush plate bottom rod is fixedly connected with the brush plate base, the brush body is fixedly arranged on the brush plate base, and part of the outflow channel is arranged inside the brush plate bottom rod. The brush body in the brush plate component is used for contacting the wafer and cleaning the wafer.

In some embodiments, the lower end of the support rod is detachably and fixedly connected with the upper end of the brush tray bottom rod, the side wall of the brush tray bottom rod and/or the side wall of the support rod is/are provided with a plurality of liquid flow holes respectively communicated with the outflow channel, the liquid flow holes are positioned at the lower part of the accommodating cavity, and fluid flows into the outflow channel from the accommodating cavity through the liquid flow holes. The fixing means is not particularly limited, and may be any of various conventional fixing means such as a screw connection and the like.

In some embodiments, the wafer brushing device further comprises a rotating motor and a rotating shaft, the rotating motor is used for rotating the rotating shaft around the axis line of the rotating shaft, the hydraulic rotator is connected with one end of the supporting arm, and the other end of the supporting arm is connected with the rotating shaft. The type of the rotating electric machine is not particularly limited, and the manner in which the rotating electric machine rotates the rotating shaft is not particularly limited. Preferably, the rotary motor is a rotary stepper motor.

In some embodiments, the axis of the rotating shaft is perpendicular to the axis of the support arm, and the support arm extends in a horizontal direction.

In some embodiments, the wafer brushing device further comprises a rotating shaft holder for holding the rotating shaft.

In some embodiments, a second fluid passage is provided inside the rotating shaft, the second fluid passage communicating with the first fluid passage. The second fluid channel inside the rotating shaft can be communicated with the cleaning liquid conveying pipeline, so that the cleaning liquid can be finally sprayed onto the wafer from the outlet through the second fluid channel, the first fluid channel, the containing cavity and the outflow channel.

In the present invention, the terms "first" and "second" are used only for convenience of description, and are not used to distinguish the two from each other in certain aspects such as structure, material, and type of passing liquid.

In some embodiments, the support arm includes a first arm extending in a horizontal direction and a second arm extending in a vertical direction, and the upper connecting portion is fixedly connected to the second arm.

In some embodiments, the wafer brushing device further comprises a liquid receiving cup for containing a cleaning liquid for cleaning the brush body. When the surface of the brush body is dirty, the brush body can be conveniently self-cleaned in time.

In some embodiments, the wafer brushing apparatus further comprises a linear electric cylinder for controlling the raising and lowering of the rotating shaft. The ascending and descending of the rotating shaft drives the ascending and descending of the supporting arm, so that the distance between the brush disc assembly and the wafer can be adjusted, and the wafer is conveniently brushed and taken out.

In some embodiments, the wafer brushing device further comprises a fixing seat for fixing the linear electric cylinder.

The beneficial effects of the utility model are that:

fluid such as water or cleaning liquid can flow through the fluid channel, the accommodating cavity and the outflow channel and is sprayed out through an outlet of the outflow channel, so that the brush disc assembly can brush the wafer without additionally arranging a fixed nozzle to spray out the cleaning liquid. Furthermore, the utility model discloses a set up the hydraulic pressure circulator in wafer brushing device, it can rotate and drive the brush dish subassembly rotatory when the chamber is held in the fluid entering, and then cleans the wafer, therefore wafer brushing device need not to set up alone and drives the rotating electrical machines of brush dish part rotation etc for its overall structure is comparatively simple.

Drawings

FIG. 1 is a schematic view of a wafer brushing apparatus;

FIG. 2 is an enlarged view of a portion of the hydraulic spinner and brush plate assembly of FIG. 1;

FIG. 3 is a schematic diagram of a hydraulic rotator;

FIG. 4 is a schematic structural view of a brush plate assembly;

FIG. 5 is a schematic structural diagram of a wafer brushing apparatus including a rotating shaft holder;

FIG. 6 is a top view of the wafer brushing apparatus in operation;

FIG. 7 is a schematic view of a brush tray assembly self-cleaning;

wherein, 1-a support arm; 2-a brush disc assembly; 3-an outflow channel; 4-a hydraulic rotator; 5-a fluid chamber; 6-an upper connecting part; 7-a first fluid channel; 8-connecting channels; 9-a support bar; 10-rotating blades; 11-liquid through hole; 12-brushing the bottom rod of the plate; 13-brush disk base; 14-a brush body; 15-a liquid flow hole; 16-a rotating electrical machine; 17-a rotation axis; 18-a rotating shaft holder; 19-a second fluid channel; 20-liquid receiving cup; 21-linear electric cylinder; 22-a fixed seat; 23-a washing chamber; 25-a wafer; 26-liquid containing disc; 27-containing chamber.

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Detailed Description

The invention will be further understood from the specific examples of the invention given below, which are not intended to limit the invention.

The present invention will be further described with reference to the accompanying drawings and preferred embodiments of the invention. The direction of the arrows in fig. 1-4 refer to the direction of fluid flow.

Example one

As shown in fig. 1-7, the present embodiment provides a wafer brushing apparatus.

As shown in fig. 1-4 and 6, the wafer brushing device includes a support arm 1 and a brush plate assembly 2, the brush plate assembly 2 includes an outflow channel 3 including an outlet, the wafer brushing device further includes a hydraulic rotator 4 connected to the support arm 1, the hydraulic rotator 4 includes a fluid chamber 5, an upper connection portion 6 and a rotation assembly, the fluid chamber 5 and the upper connection portion 6 are fixedly connected or integrally formed, the rotation assembly is disposed in the fluid chamber 5, an accommodation cavity 27 is disposed inside the fluid chamber 5, the upper connection portion 6 is fixedly connected to the support arm 1, and the rotation assembly is fixedly connected to the brush plate assembly 2; a first fluid channel 7 is arranged in the support arm 1, a connecting channel 8 is arranged in the upper connecting part 6, the upper connecting part 6 is provided with a plurality of liquid through holes 11, the first fluid channel 7, the connecting channel 8, the liquid through holes 11, the accommodating cavity 27 and the outflow channel 3 are communicated, and fluid can sequentially flow through the first fluid channel 7, the connecting channel 8, the liquid through holes 11, the accommodating cavity 27 and the outflow channel 3 and is ejected through an outlet; the rotating assembly comprises a supporting rod 9 and a plurality of rotating blades 10 arranged on the supporting rod 9, the rotating blades 10 are arranged in the accommodating cavity 27, the supporting rod 9 is rotatably connected with the fluid chamber 5, and the brush disc assembly 2 is fixedly connected with the supporting rod 9; the rotation assembly is adapted to rotate and bring the brush disc assembly 2 into rotation when fluid enters the receiving chamber 27 from the connecting channel 8. After flowing in from the first fluid channel 7, a fluid, such as a cleaning liquid for cleaning the wafer 25, flows through the connecting channel 8, the liquid through hole 11, the accommodating chamber 27 and the outflow channel 3, and is finally ejected from the outlet in the brush plate assembly 2 to the surface of the wafer 25, so that the brush plate assembly 2 can effectively brush the wafer 25.

The number of the rotary blades 10 is not particularly limited, and may be two, three or more, and although only 2 are shown in fig. 2 to 3, the present invention is not limited thereto; the material, shape and thickness of the rotary blade 10 are not particularly limited, either, as long as the rotary assembly as a whole is capable of rotating and carrying the brush disk assembly 2 in rotation when the fluid enters the receiving chamber 27.

The position of the liquid passage hole 11 is not particularly limited as long as the liquid flowing out of the liquid passage hole 11 can contact the rotary vane 10, and the liquid passage hole 11 is preferably provided to face the rotary vane 10. The number of the liquid passing holes 11 is not particularly limited, and may be two, three or more, and although only 2 are shown in fig. 2 to 3, the present invention is not limited thereto; the shape of the liquid through hole 11 is not particularly limited, and may be, for example, an oval shape, a circular shape, a square shape, an irregular shape, or the like. The way of fixedly connecting the upper connecting portion 6 and the support arm 1 is not particularly limited, and preferably, the upper end of the upper connecting portion 6 and the support arm 1 are detachably and fixedly connected, and more preferably, the two are screwed.

Further, as shown in fig. 2 and 4, the brush plate assembly 2 further includes a brush plate bottom rod 12, a brush plate base 13 and a brush body 14, the brush plate bottom rod 12 is fixedly connected with the brush plate base 13, the brush body 14 is fixedly arranged on the brush plate base 13, and part of the outflow channel 3 is arranged inside the brush plate bottom rod 12. The brush body 14 of the brush plate assembly 2 is used to contact and clean the wafer 25. The lower end of the support rod 9 is detachably and fixedly connected with the upper end of the brush tray bottom rod 12, a plurality of liquid flow holes 15 which are respectively communicated with the outflow channel 3 are arranged on the side wall of the brush tray bottom rod 12 and/or the side wall of the support rod 9, the liquid flow holes 15 are positioned at the lower part of the accommodating cavity 27, and fluid flows into the outflow channel 3 from the accommodating cavity 27 through the liquid flow holes 15. The fixing means is not particularly limited, and may be any of various conventional fixing means such as a screw connection. The flow openings 15 can be provided either on the side walls of the brush holder base rod 12 or on the side walls of the support rod 9, or both, as long as the fluid in the receiving space 27 can flow through the flow openings 15 into the outflow channel 3 in the brush holder assembly 2.

As shown in fig. 2 and 6, after flowing into the first fluid channel 7 inside the support arm 1, a fluid, such as a cleaning solution for cleaning the wafer 25, flows through the connecting channel 8 inside the upper connecting portion 6, and then flows into the accommodating cavity 27 of the brush plate assembly 2 from the fluid through hole 11 in the upper connecting portion 6, in the process, the fluid impacts the rotary blade 10, the rotary blade 10 further rotates, and the support rod 9 fixedly connected to the rotary blade 10 also rotates, so as to drive the brush plate assembly 2 to rotate, so that the brush bodies 14 on the brush plate assembly 2 spin and brush on the wafer 25, and at the same time, the fluid enters the outflow channel 3 in the bottom rod 12 of the brush plate from the accommodating cavity 27 through the fluid through hole 15, and finally is ejected onto the wafer 25 through the outlet of the outflow channel 3, thereby achieving effective cleaning of the wafer 25.

Further, as shown in fig. 5 and 6, the wafer brushing apparatus further includes a rotating motor 16 and a rotating shaft 17, the rotating motor 16 is used for rotating the rotating shaft 17 around its axis, the hydraulic rotator 4 is connected to one end of the support arm 1, and the other end of the support arm 1 is connected to the rotating shaft 17. The type of the rotating motor 16 is not particularly limited, and the manner in which the rotating motor 16 rotates the rotating shaft 17 is not particularly limited, and in the present embodiment, the rotating motor 16 is preferably a rotary stepping motor. The specific structure of the rotating shaft 17 is not particularly limited, and may be, for example, one entire rotating shaft 17, or two rotating shafts 17 having different thicknesses and fixedly connected by screws; the axis of the rotating shaft 17 is perpendicular to the axis of the support arm 1, and the support arm 1 extends in the horizontal direction. Preferably, the support arm 1 comprises a first arm extending in a horizontal direction and a second arm extending in a vertical direction, the upper connecting portion 6 being fixedly connected with the second arm. The wafer brushing apparatus further includes a rotation shaft holder 18, and the rotation shaft holder 18 is used for fixing the rotation shaft 17. The wafer brushing device further comprises a linear electric cylinder 21 and a fixed seat 22 for fixing the linear electric cylinder 21, wherein the linear electric cylinder 21 is used for controlling the ascending and descending of the rotating shaft 17. The ascending and descending of the rotating shaft 17 drives the ascending and descending of the supporting arm 1, so that the distance between the brush disc assembly 2 and the wafer 25 can be adjusted, and the wafer 25 can be conveniently scrubbed and taken out.

Further, as shown in fig. 1 and 6, a second fluid passage is provided inside the rotary shaft 17, and the second fluid passage communicates with the first fluid passage 7. The second fluid passage 19 inside the rotary shaft 17 may be connected to a cleaning solution delivery pipe to deliver the cleaning solution through the second fluid passage, the first fluid passage 7, the housing chamber 27 and the outflow passage 3, and finally to be ejected from the outlet onto the wafer 25.

Further, as shown in fig. 6-7, the wafer brushing apparatus further includes a liquid receiving cup 20, and the liquid receiving cup 20 is used for containing a cleaning liquid for cleaning the brush body 14. When the surface of the brush body 14 is dirty, the brush body 14 can be timely and conveniently self-cleaned. As shown in fig. 6, in actual use, the wafer brushing apparatus is usually installed in the cleaning chamber 23, the cleaning chamber 23 is provided with a wafer brushing platform, the wafer 25 is placed on the wafer brushing platform, the wafer brushing platform is provided with a liquid containing disc 26 for temporarily receiving the fluid sprayed from the brush disc assembly 2, and the liquid receiving cup 20 is also provided in the cleaning chamber 23.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention, so that the present invention is not limited to the above embodiments.

Claims

1. The utility model provides a wafer brushing device, includes support arm and brush dish subassembly, the brush dish subassembly is including the outflow passageway that contains the export, its characterized in that: the wafer brushing device further comprises a hydraulic rotator connected with the supporting arm, the hydraulic rotator comprises a fluid chamber, an upper connecting part and a rotating assembly, the fluid chamber and the upper connecting part are fixedly connected or integrally formed, the rotating assembly is arranged in the fluid chamber, an accommodating cavity is arranged in the fluid chamber, the upper connecting part is fixedly connected with the supporting arm, and the rotating assembly is fixedly connected with the brush disc assembly;

a first fluid channel is arranged inside the supporting arm, a connecting channel is arranged inside the upper connecting part, a plurality of liquid through holes are formed in the upper connecting part, the first fluid channel, the connecting channel, the liquid through holes, the accommodating cavity and the outflow channel are communicated, and fluid can sequentially flow through the first fluid channel, the connecting channel, the liquid through holes, the accommodating cavity and the outflow channel and is ejected out through the outlet;

the rotating assembly is used for rotating when fluid enters the containing cavity from the connecting channel and driving the brush disc assembly to rotate.

2. The wafer scrubbing apparatus of claim 1, wherein: the upper end of the upper connecting part is detachably and fixedly connected with the supporting arm.

3. The wafer scrubbing apparatus of claim 1, wherein: the brush plate assembly further comprises a brush plate bottom rod, a brush plate base and a brush body, the brush plate bottom rod is fixedly connected with the brush plate base, the brush body is fixedly arranged on the brush plate base, and part of the outflow channel is arranged inside the brush plate bottom rod.

4. The wafer scrubbing apparatus of claim 3, wherein: the lower extreme of bracing piece with the upper end detachable fixed connection of brush dish sill bar, the lateral wall of brush dish sill bar and/or be provided with a plurality ofly on the lateral wall of bracing piece respectively with the liquid flow hole of outflow passageway intercommunication, the liquid flow hole is located hold the lower part in chamber, the fluid is followed hold the chamber warp the liquid flow hole flows in the outflow passageway.

5. The wafer scrubbing apparatus of claim 1, wherein: the wafer brushing device further comprises a rotating motor and a rotating shaft, the rotating motor is used for enabling the rotating shaft to rotate around the axis line of the rotating shaft, the hydraulic rotator is connected with one end of the supporting arm, and the other end of the supporting arm is connected with the rotating shaft.

6. The wafer scrubbing apparatus of claim 5, wherein: the axis of the rotating shaft is vertical to the axis of the supporting arm, and the supporting arm extends along the horizontal direction.

7. The wafer scrubbing apparatus of claim 5, wherein: the rotating motor is a rotating stepping motor.

8. The wafer scrubbing apparatus of claim 5, wherein: the wafer brushing device further comprises a rotating shaft fixing frame, and the rotating shaft fixing frame is used for fixing the rotating shaft.

9. The wafer scrubbing apparatus of claim 5, wherein: and a second fluid channel is arranged in the rotating shaft and communicated with the first fluid channel.

10. The wafer scrubbing apparatus of claim 1, wherein: the support arm includes the first arm that extends along the horizontal direction and the second arm that extends along vertical direction, go up connecting portion with second arm fixed connection.

11. The wafer scrubbing apparatus of claim 3, wherein: the wafer brushing device further comprises a liquid receiving cup, and the liquid receiving cup is used for containing cleaning liquid for cleaning the brush body.

12. The wafer scrubbing apparatus of claim 5, wherein: the wafer brushing device further comprises a linear electric cylinder, and the linear electric cylinder is used for controlling the rotating shaft to ascend and descend.

13. The wafer scrubbing apparatus of claim 12, wherein: the wafer brushing device further comprises a fixing seat used for fixing the linear electric cylinder.