CN217721880U - Heat radiation structure and motor controller - Google Patents

Abstract

The utility model relates to the technical field of industrial control product heat dissipation, in particular to a heat dissipation structure and a motor controller; the heat dissipation structure comprises a mounting piece and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a temperature equalizing plate provided with a flow channel, and the flow channel is used for accommodating a cooling medium; the installed part has first surface and the second surface that is the contained angle setting, and the first surface is used for installing the module that generates heat, and the temperature-uniforming plate is installed with the second surface butt to be located the one side that the installed part deviates from the module that generates heat, make the temperature-uniforming plate be close to or keep away from the both sides height difference of installed part, make the temperature-uniforming plate and the module slope setting that generates heat, with the process through the two-phase circulation phase transition of gas-liquid of coolant in the runner with the samming, the heat transfer with higher speed. The cooling medium in the runners with different heights at the two end parts greatly improves the heat dissipation efficiency of the heat dissipation mechanism through gas-liquid two-phase cyclic change, and the technical problem that the heat dissipation efficiency of the existing heat radiator is low relative to a high-power-density product is effectively solved.

Description

Heat dissipation structure and motor controller

technical field

The utility model relates to the technical field of heat dissipation of industrial control products, in particular to a heat dissipation structure and a motor controller.

Background technique

In related technologies, high-power components such as IGBTs, diodes, and thyristors are commonly used in industrial control fields such as inverters and drives. For such large heating modules, forced air cooling or liquid cooling is usually used for heat dissipation. Existing forced air-cooled or liquid-cooled heat sinks use profiles, shoveling and other technology radiators. This type of radiator is usually integrally formed with a base plate and fins. Compression connection, there is poor thermal diffusion performance, the overall temperature difference of the radiator is large, and the fin efficiency of the heat dissipation fin is low. If you want to achieve a better heat dissipation effect, the radiator will be large in size and heavy in weight, which requires relatively high volume and weight. At that time, conventional heat sinks had obvious heat dissipation bottlenecks, which could not meet the heat dissipation needs of higher power density.

Generally, only the substrate or vapor chamber that is in contact with high-power components can conduct heat quickly, and the uniform temperature or heat conduction effect of the substrate or vapor chamber structure that is far away from high-power components is greatly reduced. The radiator is also not conducive to improving the heat dissipation efficiency, and it cannot meet the heat dissipation needs of higher power density.

Utility model content

The main purpose of the utility model is to provide a heat dissipation structure aimed at solving the technical problem of low heat dissipation efficiency of existing heat sinks for high power density products.

In order to achieve the above purpose, the heat dissipation structure proposed by the utility model is applied to the heat dissipation of the heating module, and the heat dissipation structure includes:

a mounting part, the mounting part has a first surface and a second surface arranged at an angle, and the first surface is used for mounting the heating module; and

a heat dissipation mechanism, the heat dissipation mechanism is arranged on the side of the mounting part away from the heating module, and abuts against the second surface;

The heat dissipation mechanism includes:

A uniform temperature plate, a flow channel is arranged in the uniform temperature plate, and the flow channel is used to accommodate the cooling medium. The temperature uniform plate is installed on the second surface, and at least one end of the uniform temperature plate faces away from the One side of the mounting part is extended;

The cooling medium flows in the channel towards the second surface under the action of gravity.

Optionally, the extending direction of each flow channel is parallel to the extending direction of the chamber;

And/or, the heat dissipation mechanism further includes a radiator, and the radiator is arranged on the vapor chamber.

Optionally, the vapor chamber includes:

a mounting section connected to the second surface, the mounting section being provided with a plurality of first channels; and

An extension section, one end of the extension section is connected to the installation section, and the other end extends away from the installation part, the extension section is provided with a plurality of second channels, and the first channel communicates with the second channel The flow channel is formed, and the heat sink is arranged on the installation section and/or the extension section.

Optionally, the extension section includes:

a connection part, one end of which is connected to the installation section; and

a bending part, the bending part is arranged at the end of the connecting part away from the installation section, the bending part and the connecting part are arranged at an included angle, and the heat sink is arranged at the bending part;

Wherein, the first channel is blocked at one end of the bending part, and the other end is extended toward the connecting part, and the first channel is arranged at both ends of the connecting part through the connecting part.

Optionally, the extension section and the installation section enclose to form a heat dissipation chamber, and the heat sink is attached to the groove wall of the heat dissipation chamber.

Optionally, the radiator includes:

a heat dissipation plate connected to the vapor chamber; and

A plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged on the side of the heat dissipation plate away from the uniform temperature plate, the plurality of heat dissipation fins are arranged at intervals, and heat dissipation is formed between each adjacent two of the heat dissipation fins. aisle.

Optionally, the included angle between the first surface and the second surface is set as an included angle α, and the included angle α satisfies 5°<α<45°.

Optionally, the heating module is detachably connected to the mounting part;

And/or, the installation part is detachably connected to the heat dissipation mechanism; or, the installation part is welded or bonded to the heat dissipation mechanism.

Optionally, the mounting member is a cylinder with a polygonal cross section.

The utility model also proposes a motor controller, and the motor controller includes:

heating module;

a substrate, the heating module is disposed on the substrate; and

According to the heat dissipation structure described in any one of the above, the heat dissipation mechanism of the heat dissipation structure is arranged on a side of the substrate facing away from the heat generating module.

The technical solution of the utility model effectively solves the technical problem of low heat dissipation efficiency of high power density products in the existing radiators by using mounting parts to connect the heat dissipation structure and the heat generation module. The heat dissipation structure includes a mounting part and a heat dissipation mechanism. The heat dissipation mechanism includes a uniform temperature plate provided with a flow channel, and the flow channel is used to accommodate the cooling medium; the mounting part has a first surface and a second surface arranged at an angle, and the first surface of the mounting part The surface is used to install the heating module, and the vapor chamber is arranged on the second surface of the mounting part, so that the height of the two sides of the vapor chamber close to or away from the mounting part is different, so as to realize the phase change through the gas-liquid two-phase circulation of the cooling medium in the flow channel. The process accelerates the uniform temperature and heat transfer. Wherein, as shown in the figure specifically, the flow channel of the vapor chamber is extended toward the obliquely upward direction of the second surface on the side away from the mounting part, so that the liquid cooling medium is in the lower end flow channel of the side of the vapor chamber connected to the mounting part Endothermic vaporization, the vaporized gaseous cooling medium moves toward the higher-end flow channel away from the mounting part, and liquefies in the higher-end flow channel, and the liquefied liquid cooling medium accelerates backflow toward the mounting part under the action of gravity , and flow back to the lower end flow channel on the side of the vapor chamber adjacent to the mounting part, so as to greatly improve the heat dissipation efficiency of the heat dissipation mechanism through the circulation of the cooling medium in the flow channels at different heights at both ends and through the gas-liquid two-phase, effectively It solves the technical problem of low heat dissipation efficiency of existing heat sinks on high power density products. Moreover, compared with radiators with forced air cooling and liquid cooling, adopting the above heat dissipation structure can accelerate the thermal diffusion and heat conduction of the heating module, so as to meet the heat dissipation requirements of high power density.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments of the present utility model, and those skilled in the art can also obtain other drawings according to the structures shown in these drawings without creative work.

Fig. 1 is a schematic diagram of the assembly side view structure of an embodiment of the motor controller of the present invention;

Fig. 2 is a three-dimensional structural schematic diagram of a mounting part of another embodiment of the heat dissipation structure of the present invention;

Fig. 3 is a three-dimensional structural schematic diagram of the heat dissipation mechanism of another embodiment of the heat dissipation structure of the present invention;

Fig. 4 is a schematic diagram of the original plate structure of the vapor chamber in another embodiment of the heat dissipation structure of the present invention;

Fig. 5 is a schematic diagram of the bending and forming structure of the vapor chamber in another embodiment of the heat dissipation structure of the present invention;

Fig. 6 is a three-dimensional structural schematic diagram of another embodiment of the heat dissipation structure of the present invention;

FIG. 7 is a three-dimensional structural schematic diagram of a heat sink according to an embodiment of the heat dissipation structure of the present invention.

Explanation of reference numbers:

label name label name 100 Heat dissipation structure 30 Cooling mechanism 10 Mount 31 vapor chamber 10A Mounting holes 311 installation section 11 first surface 312 extension 12 second surface 3121 Connection 13 third surface 3122 Bending 30A Runner 32 heat sink 30B cooling cavity 321 Radiating plate 30C cooling channel 322 cooling fins 30D Disassembly hole 201 heating module 200 Motor Controller 202 Substrate

The realization of the purpose of the utility model, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

In this utility model, unless otherwise specified and limited, the terms "connection" and "fixation" should be understood in a broad sense, for example, "fixation" can be a fixed connection, a detachable connection, or an integration; It may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary, and it may be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

In addition, in the present application, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the meaning of "and/or" appearing in the whole text includes three parallel schemes, taking "A and/or B as an example", including scheme A, scheme B, or schemes satisfying both A and B. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , also not within the scope of protection required by the utility model.

1 to 7, the utility model proposes a heat dissipation structure 100, which is applied to the heat dissipation of the heating module 201.

In existing radiators, heat dissipation of larger heating modules requires a heat dissipation structure with small volume and high heat dissipation density. Conventional air-cooled or water-cooled profile radiators cannot be designed with high-density heat dissipation fins, and the contact thermal resistance at the root of the toothed radiator is large. The cost of the shovel-tooth radiator is high, the welding reliability of the shovel-tooth radiator substrate and the vapor chamber is not high, and the heat pipe has failure problems, so they cannot meet the heat dissipation needs of higher power density. There are also conventional schemes for radiators such as the plug-in process. The fins need to be inserted into the grooves one by one, and then squeezed and tightened by tooling fixtures. The temperature plate channel; the conventional scheme uses aluminum fins as fins, the heat transfer area of the fins is small, and high power density cannot be achieved; and the conventional scheme uses a uniform temperature plate as the fin to extend outward, and then welds the folded fin on the surface of the uniform temperature plate Or fasten the fin, radiator, etc. to increase the heat exchange area of the radiator. There are many radiators designed in this way. The fins and the vapor chamber, the vapor chamber and the vapor chamber substrate need to be welded and connected. There are many processes, the process is complicated, many fixtures are needed, and the cost is high.

In the embodiment of the present utility model, the heat dissipation structure 100 is applied to the heat dissipation of the heating module 201, including the mounting part 10 and the heat dissipation mechanism 30; as shown in Figures 1 to 4, the mounting part 10 has a first surface arranged at an included angle 11 and the second surface 12, the first surface 11 is used to install the heating module 201; the heat dissipation mechanism 30 is provided on the side of the mounting part 10 away from the heating module 201, and abuts against the second surface 12; the heat dissipation mechanism 30 includes a uniform temperature plate 31. The uniform temperature plate is provided with a plurality of flow channels 30A arranged at intervals. The flow channels 30A are used to accommodate cooling medium. There are flow channels 30A in the uniform temperature plate 31. The flow channels 30A are used to accommodate cooling medium. On the second surface 12 , at least one end of the vapor chamber 31 is extended toward a side away from the mounting part 10 ; the cooling medium flows toward the second surface 12 in the flow channel 30A under the action of gravity.

The technical solution of the utility model effectively solves the technical problem of low heat dissipation efficiency of the existing radiator 32 about high power density products by using the mounting part 10 to connect the heat dissipation structure 100 and the heating module 201. The heat dissipation structure 100 includes a mounting part 10 and a heat dissipation mechanism 30. The heat dissipation mechanism 30 includes a uniform temperature plate 31 provided with a flow channel 30A, and the flow channel 30A is used to accommodate a cooling medium; the mounting part 10 has a first surface 11 and The second surface 12, the first surface 11 of the installation part 10 is used to install the heating module 201, the temperature chamber 31 is arranged on the second surface 12 of the installation part 10, so that the temperature chamber 31 is close to or away from the height of both sides of the installation part 10 Differently, temperature uniformity and heat exchange are accelerated through the gas-liquid two-phase cycle phase transition process of the cooling medium in the flow channel 30A. Wherein, specifically referring to FIG. 1 , the flow channel 30A of the vapor chamber 31 extends obliquely upward from the side of the mounting part 10 toward the second surface 12, so that the liquid cooling medium connects the mounting part 10 to the vapor chamber 31. The lower end flow channel 30A on the side absorbs heat and vaporizes, and the vaporized gaseous cooling medium moves toward the higher end flow channel 30A on the side away from the mounting part 10, and liquefies in the higher end flow channel 30A, and the liquefied liquid cooling medium Under the action of gravity, the cooling medium is accelerated toward the side of the mounting part 10 and flows back into the lower end flow channel 30A of the uniform temperature plate 31 adjacent to the side of the mounting part 10, so that the cooling medium can pass through the flow channels 30A at different heights at both ends, The heat dissipation efficiency of the heat dissipation mechanism 30 is greatly improved through the cycle change of the gas-liquid two phases, effectively solving the technical problem of low heat dissipation efficiency of the existing heat sink 32 for high power density products. Moreover, compared with the heat sink 32 with forced air cooling and liquid cooling, the adoption of the heat dissipation structure 100 can accelerate the heat diffusion and heat conduction of the heating module 201 to meet the heat dissipation requirements of high power density.

It is assumed that in an installation scenario, the heating module 201 is installed on the first surface 11 along the vertical plane, then the first surface 11 is parallel to the vertical plane, and the temperature chamber 31 is installed with the mounting part 10 through the second surface 12, as shown The assembly structure shows that the temperature chamber 31 has an elevation angle with the horizontal plane, and the elevation angle refers to the α angle shown in Figure 1, and the frequency of the gas-liquid two-phase change is accelerated by gravity to improve the heat dissipation efficiency.

Optionally, the vapor chamber 31 of the heat dissipation mechanism 30 is provided with a plurality of flow channels 30A, the extension direction of each flow channel 30A is parallel to the extension direction of the temperature chamber 31, and the arrangement of the plurality of flow channels 30A matches the two There is a height difference setting on the side to improve the thermal conductivity of the temperature chamber 31, which is used to solve the heat dissipation problem of high power density devices such as IGBT and MOSFET, and to improve the heat dissipation capacity of the radiator 32 through the circulation change of the gas-liquid two-phase of the cooling medium , to improve the power density of the whole machine and reduce the size of the whole machine.

Optionally, the heat dissipation mechanism 30 further includes a radiator 32, a temperature chamber 31 is installed on the second surface 12 of the installation part 10, at least one end of the temperature chamber 31 is extended toward a side away from the installation part 10, and the temperature chamber 31 A plurality of flow channels 30A are provided, and the extension direction of each flow channel 30A is parallel to the extension direction of the temperature chamber 31 . The radiator 32 is arranged on the temperature chamber 31 to increase the heat dissipation area.

In this embodiment, the flow channel 30A of the vapor chamber 31 is arranged inside the plate of the chamber 31 , at least one end of the chamber 31 is extended away from the side of the mounting part 10 , and the radiator 32 is arranged on the chamber 31 . The direct contact heat between the vapor chamber 31 and the heating module 201 is transferred to the side of the vapor chamber 31 away from the mounting part 10, and the radiator 32 increases the heat dissipation area, and the two-phase phase change in the flow channel 30A accelerates the heat conduction efficiency and the tilt angle The return velocity of the cooling medium in the flow channel 30A is increased, effectively reducing the problems of large contact thermal resistance and low heat conduction efficiency at the root of the radiator 32 .

It can be understood that the temperature chamber 31 can be arranged in a rectangular shape, and each flow channel 30A is distributed along the long side of the rectangular temperature chamber 31, and the second surface 12 is inclined to the first surface, so that the temperature chamber 31 as a whole Inclined settings can use height difference and gravity to increase heat transfer and heat conduction rates and accelerate heat dissipation.

Optionally, the mounting member 10 is a cylinder with a polygonal cross section.

In this embodiment, the mounting part 10 is set as a triangular prism, and is a right-angled triangular prism. The cut surface of the mounting part 10 of the right-angled triangular prism is a right-angled triangle, and the plane where the right-angled long side of the right-angled triangle is set as the first surface 11, the plane of the right-angled triangle The plane where the hypotenuse is located is set as the second surface 12, the plane where the right-angled short side of the triangle is located is set as the third surface 13, the first surface 11 is set parallel to the vertical plane, and then the third surface 13 is set parallel to the horizontal plane. The heat dissipation mechanism 30 is set on the second surface 12 so that the plane where the flow channel 30A is located is set at an elevation angle to the third plane 13, so that the two sides of the temperature chamber 31 close to or away from the mounting part 10 present a height difference in the direction of gravity, and the acceleration is uniform. The heat conduction and uniform temperature rate of the warm plate 31.

Or, in another embodiment, the mounting part 10 is set as a right-angled trapezoidal prism, and by means of the trapezoidal inclination design, the plane where the flow channel 30A is located forms an angle with the horizontal plane, which improves the heat dissipation capacity and facilitates the cooling of the cooling medium in the flow channel 30A. The gravity-assisted reflow is faster, and the heat transfer capacity is significantly improved compared with the case where the cooling mechanism 30 is used horizontally.

It should be noted that the radiator 32 of the utility model is arranged in multiples to increase the heat dissipation area, and the equal temperature plate 31 is set as a harmonica tube equal temperature plate 31, which has good temperature equalization performance, and the harmonica tube equal temperature plate 31 is installed When forming an elevation angle with the horizontal plane, the heat transfer capacity of the harmonica tube is assisted by gravity, the temperature uniformity of the harmonica tube chamber 31 is improved, the efficiency of the fins 322 is improved, and the heat dissipation capacity of the radiator 32 is improved.

Undoubtedly, the harmonica tube vapor chamber 31 is provided with a plurality of cooling medium circulation channels, that is, the vapor chamber 31 is provided with a plurality of flow channels 30A, and each flow channel 30A is independent, even if one channel fails, the other channels still remain. Effectively, avoiding damage and failure of the cooling medium channel 30A to affect heat dissipation efficiency.

Optionally, the temperature chamber 31 includes an installation section 311 and an extension section 312, the installation section 311 is connected to the second surface 12, the installation section 311 is provided with a plurality of first channels, and the first channels are installed on the temperature chamber 31. The local flow channel 30A on the section 311; one end of the extension section 312 is connected to the installation section 311, and the other end is extended away from the installation part 10. The extension section 312 is provided with a plurality of second channels, and the second channels are opened in the uniform temperature plate 31 Another partial flow passage 30A on the extension section 312 of the first passage is connected with a second passage to form a flow passage 30A. The arrangement of multiple flow passages 30A can increase the effective uniform temperature and temperature conduction area of the uniform temperature plate 31, The radiator 32 is disposed on the installation section 311 and/or the extension section 312 .

It can be understood that one or more radiators 32 can be provided. When the number of radiators 32 is set to one, the radiator 32 is arranged on the installation section 311 and is located on the side of the installation section 311 facing away from the installation part 10 . The heat dissipation rate of the side of the vapor chamber 31 adjacent to the heating module 201 is increased.

Or, a heat sink 32 is arranged on the extension section 312, and is located on the side of the extension section 312 facing the mounting part 10, so as to increase the heat dissipation rate of the vapor chamber 31 away from the heating module 201 side, so that the temperature chamber 31 is at a distance from the heating module 201. The heat dissipation at the farther end is faster, and the rate of vaporization at the farther end is increased to equalize the temperature, and the rate of liquefaction and reflux to absorb heat is increased at the same time, thereby improving the heat dissipation efficiency.

When the number of radiators 32 is set to two or more, the two or more radiators 32 can be respectively arranged on the installation section 311 and/or the extension section 312, so as to greatly increase the heat dissipation surface area and improve the heat dissipation efficiency.

Optionally, the installation section 311 and the extension section 312 are integrally formed.

In this embodiment, the installation section 311 and the extension section 312 are arranged at an included angle, which can be arranged as an L-shaped vapor chamber 31 or a U-shaped temperature chamber 31, and at least one radiator 32 can be arranged on the side of the installation section 311 away from the installation part 10 On one side, the mounting section 311 can not only dissipate heat directly, but also conduct heat conduction through the flow channel 30A and the material of the mounting section 311 itself to accelerate heat dissipation. A radiator 32 can also be provided on the extension section 312 of the L-shaped vapor chamber 31 or U-shaped vapor chamber 31 to improve the heat dissipation efficiency of the far-end heat conduction of the vapor chamber 31 to the far end of the mounting part 10. The radiator 32 is located at The L-shaped inner side of the L-shaped vapor chamber 31 or the U-shaped notch of the U-shaped vapor chamber 31 can increase the space utilization rate while increasing heat dissipation, and can effectively control the volume of the heat dissipation mechanism 30, so that it can be balanced in terms of heat dissipation and volume. Meet the heat dissipation needs of higher power density.

As shown in FIG. 5 and FIG. 6 , optionally, the extension section 312 and the installation section 311 enclose to form a cooling cavity 30B, and the radiator 32 is attached to the groove wall of the cooling cavity 30B.

Optionally, the extension section 312 includes a connecting portion 3121 and a bending portion 3122. One end of the connecting portion 3121 is connected to the installation section 311; Arranged at an included angle, the radiator 32 is arranged at the bent portion 3122; wherein, the first channel is blocked at one end of the bent portion 3122, and the other end is extended toward the connecting portion 3121, and the first channel is located at both ends of the connecting portion 3121 and runs through The connection part 3121 is provided.

In this embodiment, the extension section 312 includes a connection part 3121 and a bending part 3122, and the connection part 3121, the bending part 3122 and the installation section 311 are enclosed to form a mouth-shaped or back-shaped temperature chamber 31 structure, that is, the connection part 3121 , the bending part 3122 and the installation section 311 form a mouth-shaped or back-shaped heat dissipation chamber 30B, and the inner sides of the mouth-shaped or back-shaped heat dissipation chamber 30B are respectively welded to the radiator 32, and buckle or folded fins 322 can also be used. Weld on the inner side of the zigzag or zigzag cooling cavity 30B. The first channel and the second channel enclose to form a flow channel 30A, and the elevation angle between the plane where the flow channel 30A is located and the horizontal plane is an included angle α, so that the side of the same flow channel 30A close to the mounting part 10 is lower than the side of the bending section, that is The projection position of the proximal flow channel 30A of the mounting part 10 on the first installation surface is lower than the projection position of the distal flow channel 30A on the first installation surface, which facilitates the return velocity of the liquid cooling medium to be increased by gravity to improve heat dissipation efficiency .

It should be noted that, when the space permits, a radiator 32 can be provided on the outer cavity wall of the square or back-shaped cooling chamber 30B facing away from the mounting part 10, so as to increase the heat dissipation efficiency, increase the heat dissipation area at the far end, and improve The average temperature and heat conduction rate of the entire temperature chamber 31.

7, optionally, the radiator 32 includes a cooling plate 321 and a plurality of cooling fins 322, the cooling plate 321 is connected to the uniform temperature plate 31; the plurality of cooling fins 322 are located on the cooling plate 321 away from the uniform temperature 31 , a plurality of cooling fins 322 are arranged at intervals, and a cooling channel 30C is formed between every two adjacent cooling fins 322 .

It should be noted that the radiator 32 is a profile radiator 32 , or a shovel-tooth radiator 32 , or a radiator 32 with fastening fins 322 , or a radiator 32 with folded fins 322 . There are multiple radiators 32 , or a free combination of the above-mentioned radiators 32 .

Optionally, the heating module 201 is detachably connected to the mounting part 10 , and the mounting part 10 is provided with mounting holes for installation, which is convenient for detachable assembly or maintenance and replacement of the mounting part 10 . And/or, the heat dissipation mechanism 30 is provided with a detachable mounting hole 30D corresponding to the mounting part 10, so as to realize the detachable connection between the mounting part 10 and the heat dissipation mechanism 30, and facilitate adjustment of the angle between the heat dissipation mechanism 30 and the first mounting surface, that is, Adjust the angle between the plane where the flow channel 30A is located and the horizontal plane, specifically by changing the angle between the first mounting surface and the second mounting surface; or, the mounting part 10 and the heat dissipation mechanism 30 are welded or bonded to use the heat dissipation structure 100 as a An overall pre-installed structural part only needs to be installed through the first mounting surface of the mounting part 10 during installation, which improves the stability of the radiator 32 and the vapor chamber 31, and improves the reliability of heat dissipation.

Optionally, in the mounting member 10 of any of the above embodiments, the angle between the first surface 11 and the second surface 12 is set as an angle α, and the angle α satisfies 5°<α<45°. Preferably, the included angle α satisfies 10°≤α≤25°, where α can take values of 10°, 15°, 20°, and 25°, and controlling the angle of α to no more than 30° can significantly improve heat dissipation efficiency.

The utility model also proposes a motor controller 200. The motor controller 200 includes a heating module 201, a substrate 202, and a heat dissipation structure 100 as described above. The specific structure of the heat dissipation structure 100 refers to the above-mentioned embodiment. The device 200 adopts all the technical solutions of all the above-mentioned embodiments, and therefore at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. Wherein, the heating module 201 is arranged on the base plate 202;

In this embodiment, the base plate 202 and the heat dissipation structure 100 are arranged and connected at an angle through the mounting member 10, so that the plane where each flow channel 30A is located has an elevation angle with the horizontal plane, and the cooling medium realizes the gas-liquid two-phase phase in the flow channel 30A. During the changing process, the liquefied liquid cooling medium in the flow channel 30A farther away from the mounting part 10 and the base plate 202 is accelerated toward the side of the mounting part 10 under the action of gravity and flows back to the nearer end of the cooling mechanism 30 adjacent to the side of the mounting part 10 In the flow channel 30A, the cooling medium passes through the flow channel 30A at different heights at both ends, and through the circulation of the gas-liquid two-phase, the heat dissipation efficiency of the heat dissipation mechanism 30 is greatly improved, and the existing radiator 32 is effectively solved for high power density products. The technical problem of low heat dissipation efficiency. Moreover, compared with the heat sink 32 with forced air cooling and liquid cooling, the adoption of the above heat dissipation structure 100 can accelerate the thermal diffusion and heat conduction of the heating module 201 to meet the heat dissipation requirements of high power density.

The above is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. Under the inventive concept of the utility model, the equivalent structural transformation made by using the specification of the utility model and the contents of the accompanying drawings, or Direct/indirect application in other relevant technical fields is included in the patent protection scope of the present utility model.

Claims (10)

1. A heat dissipation structure, characterized in that, the heat dissipation structure comprises: a mounting part, the mounting part has a first surface and a second surface arranged at an angle, and the first surface is used for mounting the heating module; and a heat dissipation mechanism, the heat dissipation mechanism is arranged on a side of the mounting part away from the heating module, and abuts against the second surface; The heat dissipation mechanism includes: A uniform temperature plate, a flow channel is arranged in the uniform temperature plate, the flow channel is used to accommodate the cooling medium, the temperature uniform plate is installed on the second surface, and at least one end of the uniform temperature plate faces away from the One side of the mounting part is extended; The cooling medium flows in the channel towards the second surface under the action of gravity. 2. The heat dissipation structure according to claim 1, characterized in that, the extension direction of each of the flow channels is parallel to the extension direction of the vapor chamber; And/or, the heat dissipation mechanism further includes a radiator, and the radiator is arranged on the temperature chamber. 3. The heat dissipation structure according to claim 2, wherein the vapor chamber comprises: a mounting section connected to the second surface, the mounting section being provided with a plurality of first channels; and An extension section, one end of the extension section is connected to the installation section, and the other end extends away from the installation part, the extension section is provided with a plurality of second channels, and the first channel communicates with the second channel The flow channel is formed, and the heat sink is arranged on the installation section and/or the extension section. 4. The heat dissipation structure according to claim 3, wherein the extension section comprises: a connection part, one end of which is connected to the installation section; and a bending part, the bending part is arranged at the end of the connecting part away from the installation section, the bending part and the connecting part are arranged at an included angle, and the heat sink is arranged at the bending part; Wherein, the first channel is blocked at one end of the bending part, and the other end is extended toward the connecting part, and the first channel is arranged at both ends of the connecting part through the connecting part. 5 . The heat dissipation structure according to claim 3 , wherein the extension section and the installation section enclose to form a heat dissipation cavity, and the heat sink is attached to a groove wall of the heat dissipation cavity. 6 . 6. The heat dissipation structure according to claim 2, wherein the heat sink comprises: a heat dissipation plate connected to the vapor chamber; and A plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged on the side of the heat dissipation plate away from the temperature equalization plate, the plurality of heat dissipation fins are arranged at intervals, and heat dissipation is formed between each adjacent two of the heat dissipation fins. aisle. 7. The heat dissipation structure according to claim 1, wherein the included angle between the first surface and the second surface is set as an included angle α, and the included angle α satisfies 5°<α<45°. 8. The heat dissipation structure according to claim 1, wherein the heating module is detachably connected to the mounting part; And/or, the installation part is detachably connected to the heat dissipation mechanism; or, the installation part is welded or bonded to the heat dissipation mechanism. 9. The heat dissipation structure according to any one of claims 1 to 8, wherein the mounting member is a cylinder with a polygonal cross section. 10. A motor controller, characterized in that, the motor controller comprises: heating module; a substrate, the heating module is disposed on the substrate; and The heat dissipation structure according to any one of claims 1 to 9, wherein the heat dissipation mechanism of the heat dissipation structure is arranged on a side of the substrate facing away from the heat generating module.

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