CN217721880U

CN217721880U - Heat radiation structure and motor controller

Info

Publication number: CN217721880U
Application number: CN202221651940.3U
Authority: CN
Inventors: 王能飞; 陶安发; 严运锋; 武友才; 王毅; 刘司轶
Original assignee: Suzhou Huichuan Control Technology Co Ltd
Current assignee: Suzhou Huichuan Control Technology Co Ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2022-11-01
Anticipated expiration: 2032-06-29

Abstract

The utility model relates to the technical field of industrial control product heat dissipation, in particular to a heat dissipation structure and a motor controller; the heat dissipation structure comprises a mounting piece and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a temperature equalizing plate provided with a flow channel, and the flow channel is used for accommodating a cooling medium; the installed part has first surface and the second surface that is the contained angle setting, and the first surface is used for installing the module that generates heat, and the temperature-uniforming plate is installed with the second surface butt to be located the one side that the installed part deviates from the module that generates heat, make the temperature-uniforming plate be close to or keep away from the both sides height difference of installed part, make the temperature-uniforming plate and the module slope setting that generates heat, with the process through the two-phase circulation phase transition of gas-liquid of coolant in the runner with the samming, the heat transfer with higher speed. The cooling medium in the runners with different heights at the two end parts greatly improves the heat dissipation efficiency of the heat dissipation mechanism through gas-liquid two-phase cyclic change, and the technical problem that the heat dissipation efficiency of the existing heat radiator is low relative to a high-power-density product is effectively solved.

Description

Heat radiation structure and motor controller

Technical Field

The utility model relates to an industrial control product heat dissipation technical field, in particular to heat radiation structure and machine controller.

Background

In the related art, high-power components such as IGBTs, diodes, thyristors and the like are commonly used in the industrial control field of frequency converters, drivers and the like, and for such large heating modules, a forced air cooling heat dissipation mode or a liquid cooling heat dissipation mode is generally adopted. The conventional radiator adopts the radiator adopting the processes of sectional materials, relieving teeth and the like, the radiator is usually formed by integrally forming a base plate and fins, the base plate and the fins of the gear-inserting radiator are connected by extrusion, the heat diffusion performance is poor, the integral temperature difference of the radiator is large, the fin efficiency of the radiating fins is low, the radiator is large in size and heavy in weight due to the fact that the good radiating effect is achieved, and when the requirements on size and weight are high, the conventional radiator has an obvious radiating bottleneck and cannot meet the radiating requirement of higher power density.

The conventional radiator can only rapidly conduct heat through a substrate or a temperature-equalizing plate which is in contact with a high-power component generally, the temperature equalization or the heat conduction effect of the substrate or the temperature-equalizing plate structure far away from the high-power component is greatly reduced, and even if the radiator with a large size is made, the improvement of the heat dissipation efficiency is not facilitated, and the heat dissipation requirement of higher power density cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat radiation structure aims at solving the technical problem that the radiating efficiency is low about the high power density product of current radiator.

In order to achieve the above object, the utility model provides a heat radiation structure is applied to the heat dissipation of the module that generates heat, heat radiation structure includes:

the mounting piece is provided with a first surface and a second surface which are arranged at an included angle, and the first surface is used for mounting the heating module; and

the heat dissipation mechanism is arranged on one side, away from the heating module, of the mounting piece and is abutted against the second surface;

the heat dissipation mechanism includes:

the temperature-equalizing plate is internally provided with a flow channel, the flow channel is used for accommodating a cooling medium, the temperature-equalizing plate is arranged on the second surface, and at least one end of the temperature-equalizing plate extends towards one side far away from the mounting piece;

the cooling medium flows within the flow channel toward the second surface under the influence of gravity.

Optionally, the extending direction of each flow channel is parallel to the extending direction of the temperature equalizing plate;

and/or, the heat dissipation mechanism also comprises a radiator, and the radiator is arranged on the temperature equalizing plate.

Optionally, the vapor chamber comprises:

a mounting section connected to the second surface, the mounting section having a plurality of first channels; and

the extension section, extension section one end with the installation section is connected, and the other end dorsad the installed part extends the setting, the extension section is equipped with a plurality of second passageways, first passageway with the second passageway intercommunication forms the runner, the radiator is located the installation section and/or the extension section.

Optionally, the extension section comprises:

one end of the connecting part is connected with the mounting section; and

the bending part is arranged at one end of the connecting part far away from the mounting section, an included angle is formed between the bending part and the connecting part, and the radiator is arranged at the bending part;

the first channel is located at one end of the bending portion and is blocked, the other end of the first channel extends towards the connecting portion, and the two ends of the first channel located at the connecting portion penetrate through the connecting portion.

Optionally, the extension section and the installation section enclose to form a heat dissipation cavity, and the heat radiator is attached to the groove wall of the heat dissipation cavity.

Optionally, the heat sink comprises:

the heat dissipation plate is connected with the temperature equalizing plate; and

the radiating fins are arranged on one side, away from the temperature-equalizing plate, of the radiating plate, and the radiating fins are arranged at intervals, and radiating channels are formed between every two adjacent radiating fins.

Optionally, an included angle between the first surface and the second surface is set as an included angle α, and the included angle α satisfies 5 ° < α <45 °.

Optionally, the heat generating module is detachably connected with the mounting part;

and/or the mounting piece is detachably connected with the heat dissipation mechanism; or the mounting piece is welded or bonded with the heat dissipation mechanism.

Optionally, the mounting member is a cylinder having a polygonal cross-section.

The utility model discloses still provide a machine controller, machine controller includes:

a heat generating module;

the heating module is arranged on the substrate; and

the heat dissipation structure of any one of the above claims, wherein the heat dissipation mechanism of the heat dissipation structure is disposed on a side of the substrate facing away from the heat generating module.

The utility model discloses technical scheme is through adopting the installed part to connect heat radiation structure and the module that generates heat, effectively solves the technical problem that the radiating efficiency of current radiator is low about the high power density product. The heat dissipation structure comprises an installation part and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a temperature equalization plate provided with a flow channel, and the flow channel is used for accommodating a cooling medium; the installed part has first surface and the second surface that is the contained angle setting, and the first surface of installed part is used for the installation module that generates heat, and the second surface of installed part is located to the temperature-uniforming plate for the both sides height difference that the temperature-uniforming plate is close to or keeps away from the installed part, with the process through the two-phase circulation phase transition of cooling medium gas-liquid in the runner is samming, the heat transfer with higher speed. As shown in the specific reference figure, one side of the flow channel of the temperature-equalizing plate, which is far away from the installation part, extends towards the oblique upper side of the second surface, so that the liquid cooling medium absorbs heat and vaporizes in the flow channel at the lower end of one side of the temperature-equalizing plate, the vaporized gaseous cooling medium moves towards the flow channel at the higher end of one side, which is far away from the installation part, and is liquefied in the flow channel at the higher end, the liquefied cooling medium flows back towards one side of the installation part under the action of gravity and flows back to the flow channel at the lower end of one side of the temperature-equalizing plate, so that the heat dissipation efficiency of the heat dissipation mechanism is greatly improved through the gas-liquid two-phase circulation change in the flow channels at different heights at the two ends, and the technical problem that the heat dissipation efficiency of the existing heat sink is low in relation to a high-power-density product is effectively solved. Moreover, compared with a radiator adopting forced air cooling and liquid cooling for heat dissipation, the heat dissipation structure can accelerate heat dissipation and heat conduction of the heating module so as to meet the heat dissipation requirement of high power density.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic assembly side view of an embodiment of the motor controller of the present invention;

fig. 2 is a schematic perspective view of a mounting member according to another embodiment of the heat dissipation structure of the present invention;

fig. 3 is a schematic perspective view of a heat dissipation mechanism according to another embodiment of the heat dissipation structure of the present invention;

fig. 4 is a schematic structural view of an original plate of a vapor chamber according to another embodiment of the heat dissipation structure of the present invention;

fig. 5 is a schematic view of a uniform temperature plate bending and forming structure according to another embodiment of the heat dissipation structure of the present invention;

fig. 6 is a schematic perspective view of another embodiment of the heat dissipation structure of the present invention;

fig. 7 is a schematic perspective view of a heat sink according to an embodiment of the heat dissipation structure of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Heat radiation structure	30	Heat dissipation mechanism
10	Mounting member	31	Temperature equalizing plate
				10A	Mounting hole		311	Mounting segment
11	First surface	312	Extension section
				12	Second surface	3121	Connecting part
13	Third surface	3122	A bent part
				30A	Flow passage		32	Heat radiator
30B	Heat dissipation cavity	321	Heat radiation plate
				30C	Heat dissipation channel	322	Radiating fin
30D	Dismounting hole	201	Heating module
				200	Motor controller	202	Substrate

The realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 to 7, the present invention provides a heat dissipation structure 100 for dissipating heat generated by a heat generating module 201.

In the existing radiator, a heat dissipation structure with small volume and high heat dissipation density is needed for heat dissipation of a large heating module, a conventional air-cooled or water-cooled section radiator cannot be provided with high-density heat dissipation fins, the root contact thermal resistance of a gear shaping radiator is large, the cost of the gear shaping radiator is high, the welding reliability is not high when a baseplate of the gear shaping radiator is welded with a temperature-equalizing plate, and a heat pipe fails, so that the heat dissipation requirement with high power density cannot be met. In the conventional radiator, such as a plugging process, fins need to be inserted into grooves one by one, and then are extruded and fastened through a tooling fixture, if a temperature-equalizing plate is used as a base plate, the base plate is deformed, so that a channel of the temperature-equalizing plate is damaged; according to the conventional scheme, the aluminum sheet is used as the fin, the heat exchange area of the fin is small, and high power density cannot be realized; in addition, the fins of the conventional scheme are extended outwards by using the uniform temperature plate, and then the heat exchange area of the radiator is increased by welding folding fins or buckling fins, the radiator and the like on the surface of the uniform temperature plate.

In the embodiment of the present invention, the heat dissipation structure 100 is applied to heat dissipation of the heat generation module 201, and includes a mounting member 10 and a heat dissipation mechanism 30; as shown in fig. 1 to 4, the mounting member 10 has a first surface 11 and a second surface 12 arranged at an included angle, the first surface 11 is used for mounting the heat generating module 201; the heat dissipation mechanism 30 is arranged on one side of the mounting member 10 away from the heating module 201 and is abutted against the second surface 12; the heat dissipation mechanism 30 comprises a temperature equalization plate 31, the temperature equalization plate is provided with a plurality of flow channels 30A arranged at intervals, the flow channels 30A are used for accommodating cooling media, the flow channels 30A are arranged in the temperature equalization plate 31, the flow channels 30A are used for accommodating cooling media, the temperature equalization plate 31 is installed on the second surface 12, and at least one end of the temperature equalization plate 31 extends towards one side far away from the installation part 10; the cooling medium is caused to flow under gravity within the flow passage 30A towards the second surface 12.

The utility model discloses technical scheme is through adopting installed part 10 to connect heat radiation structure 100 and the module 201 that generates heat, effectively solves the technical problem that the radiating efficiency is low about the high power density product of current radiator 32. The heat dissipation structure 100 comprises a mounting member 10 and a heat dissipation mechanism 30, wherein the heat dissipation mechanism 30 comprises a temperature equalization plate 31 provided with a flow channel 30A, and the flow channel 30A is used for accommodating a cooling medium; the mounting member 10 has a first surface 11 and a second surface 12 which are arranged at an included angle, the first surface 11 of the mounting member 10 is used for mounting the heating module 201, and the temperature equalizing plate 31 is arranged on the second surface 12 of the mounting member 10, so that the heights of two sides of the temperature equalizing plate 31 close to or far away from the mounting member 10 are different, and the process of gas-liquid two-phase circulation phase change in the flow channel 30A through the cooling medium accelerates temperature equalization and heat exchange. Specifically, as shown in fig. 1, one side of the flow channel 30A of the temperature-equalizing plate 31, which is far away from the mounting component 10, extends toward the obliquely upper side of the second surface 12, so that the liquid cooling medium absorbs heat and vaporizes in the lower end flow channel 30A of the temperature-equalizing plate 31, which is connected to the mounting component 10, the vaporized gaseous cooling medium moves toward the higher end flow channel 30A, which is far away from the mounting component 10, and is liquefied in the higher end flow channel 30A, and the liquefied liquid cooling medium accelerates to flow back toward the mounting component 10 under the action of gravity to the lower end flow channel 30A of the temperature-equalizing plate 31, which is near to the mounting component 10, so that the heat dissipation efficiency of the heat dissipation mechanism 30 is greatly improved through the gas-liquid two-phase circulation change of the cooling medium in the flow channels 30A with different heights at the two end portions, and the technical problem of the existing heat dissipation 32 that the heat dissipation efficiency is low with respect to a high-power density product is effectively solved. Moreover, compared with the heat sink 32 with forced air cooling and liquid cooling, the heat dissipation structure 100 can accelerate the heat dissipation and heat conduction of the heat generating module 201 to meet the heat dissipation requirement of high power density.

In an installation scenario, the heating module 201 is installed on the first surface 11 along a vertical plane, the first surface 11 is parallel to the vertical plane, the temperature equalization plate 31 is installed with the installation member 10 through the second surface 12, and it is shown that the temperature equalization plate 31 has an elevation angle with the horizontal plane in the assembly structure, the elevation angle refers to an angle α shown in fig. 1, and the gas-liquid two-phase change frequency is accelerated by gravity to improve the heat dissipation efficiency.

Optionally, the temperature-uniforming plate 31 of the heat-dissipating mechanism 30 is provided with a plurality of flow channels 30A, an extending direction of each flow channel 30A is parallel to an extending direction of the temperature-uniforming plate 31, the arrangement of the plurality of flow channels 30A is matched with the arrangement of the height difference at two sides of the temperature-uniforming plate 31, so that the heat-conducting property of the temperature-uniforming plate 31 is improved, the heat-dissipating problem of high-power density devices such as IGBTs and MOSFETs is solved, and the purposes of improving the heat-dissipating capability of the heat sink 32, improving the power density of the whole machine and reducing the size of the whole machine are achieved through the gas-liquid two-phase cyclic change of the cooling medium.

Optionally, the heat dissipation mechanism 30 further includes a heat sink 32, the temperature-equalizing plate 31 is installed on the second surface 12 of the installation component 10, at least one end of the temperature-equalizing plate 31 extends toward a side away from the installation component 10, the temperature-equalizing plate 31 is provided with a plurality of flow channels 30A, an extending direction of each flow channel 30A is parallel to an extending direction of the temperature-equalizing plate 31, and the heat sink 32 is installed on the temperature-equalizing plate 31 to increase a heat dissipation area.

In this embodiment, the flow channel 30A of the temperature-uniforming plate 31 is disposed inside the plate of the temperature-uniforming plate 31, at least one end of the temperature-uniforming plate 31 is extended from one side of the mounting member 10, the heat sink 32 is disposed on the temperature-uniforming plate 31, so as to conduct the direct contact heat between the temperature-uniforming plate 31 and the heating module 201 to one side of the temperature-uniforming plate 31 away from the mounting member 10, and the heat sink 32 increases the heat dissipation area, the two-phase change in the flow channel 30A accelerates the heat conduction efficiency and increases the reflux speed of the cooling medium in the flow channel 30A at an inclined elevation angle, thereby effectively reducing the problems of large thermal contact resistance at the root of the heat sink 32 and low heat conduction efficiency.

It can be understood that the temperature-uniforming plate 31 can be configured as a rectangle, and then each flow channel 30A is distributed along the long side of the rectangular temperature-uniforming plate 31, and the second surface 12 and the first surface are obliquely configured, so that the temperature-uniforming plate 31 is integrally obliquely configured, and the heat exchange and heat conduction rates can be improved by means of height difference and gravity, and the heat dissipation is accelerated.

Optionally, the mounting member 10 is a cylinder with a polygonal cross-section.

In this embodiment, installed part 10 establishes to the triangular prism, and is the right angle triangular prism, and the tangent plane of installed part 10 of right angle triangular prism is right angle triangle, and right angle triangle's right angle long limit place plane establishes to first surface 11, right angle triangle's hypotenuse place plane and establishes to second surface 12, and triangle's right angle minor face place plane establishes to third surface 13, first surface 11 and vertical face parallel arrangement, then third surface 13 and horizontal plane parallel arrangement. The heat dissipation mechanism 30 is disposed on the second surface 12 to make the plane of the flow channel 30A and the third plane 13 form an elevation angle, so that the two sides of the temperature equalizing plate 31 close to or far from the mounting member 10 form a height difference in the gravity direction, thereby accelerating the heat conduction and temperature equalizing rate of the temperature equalizing plate 31.

Or, in another embodiment, the mounting member 10 is a right trapezoid prism, and by means of the design of the inclined plane inclination angle of the trapezoid, the plane where the flow channel 30A is located forms an included angle with the horizontal plane, so as to improve the heat dissipation capability, facilitate the cooling medium in the flow channel 30A to flow back faster with the aid of gravity, and significantly improve the heat transfer capability compared with the case of horizontal use of the heat dissipation mechanism 30.

It should be noted that the utility model discloses a radiator 32 sets up to a plurality of in order to increase heat radiating area, and temperature-uniforming plate 31 sets up to harmonica pipe temperature-uniforming plate 31, has good temperature-uniforming performance, and constitutes the angle of elevation with the horizontal plane when installing harmonica pipe temperature-uniforming plate 31 to utilize the supplementary reinforcing harmonica pipe heat transfer capacity of gravity, improve harmonica pipe temperature-uniforming plate 31 temperature-uniforming performance, improve fin 322 efficiency, and then reach the purpose that promotes radiator 32 heat-sinking capacity.

Needless to say, the harmonica-shaped tube temperature-uniforming plate 31 is provided with a plurality of channels through which the cooling medium flows, that is, a plurality of flow channels 30A are arranged in the temperature-uniforming plate 31, each flow channel 30A is independent, and even if one channel fails, other channels are still effective, so that the cooling medium flow channels 30A are prevented from being damaged and failing to influence the heat dissipation efficiency.

Optionally, the temperature-uniforming plate 31 includes a mounting section 311 and an extending section 312, the mounting section 311 is connected to the second surface 12, the mounting section 311 is provided with a plurality of first channels, and the first channels are local flow channels 30A opened on the mounting section 311 of the temperature-uniforming plate 31; one end of the extension section 312 is connected to the mounting section 311, the other end extends and is disposed opposite to the mounting member 10, the extension section 312 is provided with a plurality of second channels, the second channels are another local flow channels 30A disposed on the extension section 312 of the temperature equalizing plate 31, a first channel is communicated with a second channel to form a flow channel 30A, the arrangement of the plurality of flow channels 30A can increase the effective temperature equalizing and conducting areas of the temperature equalizing plate 31, and the heat sink 32 is disposed on the mounting section 311 and/or the extension section 312.

It is understood that the heat sink 32 can be provided in one or more, and when the number of the heat sinks 32 is set to one, the heat sink 32 is provided on the mounting section 311 and is located on the side of the mounting section 311 facing away from the mounting member 10, so as to increase the heat dissipation rate of the side of the vapor chamber plate 31 adjacent to the heat generating module 201.

Or, a heat sink 32 is disposed on the extension section 312 and located on one side of the extension section 312 facing the mounting component 10, so as to increase the heat dissipation rate of the side of the temperature equalizing plate 31 away from the heating module 201, so that the heat dissipation of the far end of the temperature equalizing plate 31 away from the heating module 201 is faster, the vaporization rate of the temperature equalizing plate 31 facing away from the heating module is increased, and the heat absorption rate of the liquefied reflux is increased, thereby increasing the heat dissipation efficiency.

When the number of the heat sinks 32 is two or more, the two or more heat sinks 32 may be respectively disposed on the mounting section 311 and/or the extension section 312, so as to greatly increase the heat dissipation surface area and improve the heat dissipation efficiency.

Optionally, the mounting section 311 and the extension section 312 are provided as an integral structure.

In this embodiment, the installation section 311 and the extension section 312 are disposed at an included angle, and may be disposed on the L-shaped temperature-uniforming plate 31 or the U-shaped temperature-uniforming plate 31, and the at least one heat sink 32 may be disposed on one side of the installation section 311 departing from the installation component 10, so that the installation section 311 may directly dissipate heat, and may also conduct heat through the material of the flow channel 30A and the installation section 311 itself, thereby speeding up heat dissipation. Extension section 312 at L type temperature-uniforming plate 31 or U type temperature-uniforming plate 31 also can be equipped with radiator 32, promote the distal end radiating efficiency that temperature-uniforming plate 31 heat conduction is far away to installed part 10, radiator 32 is located L type inboard of L type temperature-uniforming plate 31 or the U type notch of U type temperature-uniforming plate 31, increase space utilization when increasing the heat dissipation, can effectively control the volume of heat dissipation mechanism 30, make it all satisfy the heat dissipation needs of higher power density in the aspect of heat dissipation and volume.

Referring to fig. 5 and fig. 6 together, optionally, the extension 312 and the mounting section 311 enclose to form a heat dissipation cavity 30B, and the heat sink 32 is attached to a groove wall of the heat dissipation cavity 30B.

Optionally, the extending section 312 includes a connecting portion 3121 and a bending portion 3122, one end of the connecting portion 3121 is connected to the mounting section 311; the bent portion 3122 is disposed at an end of the connecting portion 3121 away from the mounting section 311, the bent portion 3122 forms an included angle with the connecting portion 3121, and the heat sink 32 is disposed at the bent portion 3122; one end of the first channel located at the bending portion 3122 is blocked, the other end extends toward the connecting portion 3121, and both ends of the first channel located at the connecting portion 3121 penetrate through the connecting portion 3121.

In this embodiment, the extending section 312 includes a connecting portion 3121 and a bending portion 3122, the connecting portion 3121, the bending portion 3122 and the mounting portion 311 are enclosed to form a square or rectangular-shaped uniform temperature board 31 structure, that is, the connecting portion 3121, the bending portion 3122 and the mounting portion 311 are enclosed to form a square or rectangular-shaped heat dissipation cavity 30B, the heat sinks 32 are respectively welded to the inner sides of the square or rectangular-shaped heat dissipation cavity 30B, or the fastening or folding fins 322 may be welded to the inner sides of the square or rectangular-shaped heat dissipation cavity 30B. The first channel and the second channel are enclosed to form a flow channel 30A, the elevation angle of the plane where the flow channel 30A is located and the horizontal plane is an included angle alpha, so that the position, close to one side of the installation part 10, on the same flow channel 30A is lower than one side of the bending section, namely the projection position of the near-end flow channel 30A of the installation part 10 on the first installation surface is lower than the projection position of the far-end flow channel 30A on the first installation surface, the backflow speed of the liquid cooling medium is convenient to improve through the action of gravity, and the heat dissipation efficiency is improved.

It should be noted that, when the space allows, the outer cavity wall of the square or rectangular-shaped heat dissipation cavity 30B on the side away from the mounting member 10 may be provided with a heat sink 32, so as to increase the heat dissipation efficiency, and at the same time, increase the heat dissipation area of the distal end, and increase the temperature equalization and the heat conduction rate of the whole temperature equalization plate 31.

Referring to fig. 7 in combination, optionally, the heat sink 32 includes a heat dissipation plate 321 and a plurality of heat dissipation fins 322, the heat dissipation plate 321 is connected to the temperature equalization plate 31; the plurality of heat dissipation fins 322 are disposed on a side of the heat dissipation plate 321 away from the vapor chamber 31, the plurality of heat dissipation fins 322 are disposed at intervals, and a heat dissipation channel 30C is formed between every two adjacent heat dissipation fins 322.

The heat sink 32 is a profile heat sink 32, a tooth heat sink 32, a snap fin 322, or a folded fin 322, or the heat sink 32. The number of the heat sinks 32 may be plural, or a combination of the plural heat sinks 32 may be freely made.

Optionally, the heating module 201 is detachably connected to the mounting member 10, and the mounting member 10 is provided with a mounting hole for mounting, so as to facilitate detachable assembly or maintenance and replacement of the mounting member 10. And/or, the heat dissipating mechanism 30 is provided with a dismounting hole 30D for dismounting and mounting corresponding to the mounting member 10, so as to realize that the mounting member 10 is detachably connected with the heat dissipating mechanism 30, and the angle between the heat dissipating mechanism 30 and the first mounting surface, that is, the included angle between the plane of the flow channel 30A and the horizontal plane, can be adjusted conveniently, specifically by changing the included angle between the first mounting surface and the second mounting surface; or, the mounting member 10 and the heat dissipation mechanism 30 are welded or bonded, so that the heat dissipation structure 100 is a pre-mounted structural member as a whole, and the mounting is realized only by the first mounting surface of the mounting member 10 during mounting, thereby improving the setting stability of the heat sink 32 and the temperature equalization plate 31 and improving the heat dissipation reliability.

Optionally, in the mounting member 10 of any of the above embodiments, the included angle between the first surface 11 and the second surface 12 is set to be an included angle α, and the included angle α satisfies 5 ° < α <45 °. Preferably, the included angle alpha is more than or equal to 10 degrees and less than or equal to 25 degrees, wherein the alpha can be 10 degrees, 15 degrees, 20 degrees and 25 degrees, the angle of the alpha is controlled to be not more than 30 degrees, and the effect of improving the heat dissipation efficiency is obvious.

The utility model discloses still provide a machine controller 200, machine controller 200 is including generating heat module 201, base plate 202 and as above-mentioned arbitrary heat radiation structure 100, and this heat radiation structure 100's concrete structure refers to above-mentioned embodiment, because this machine controller 200 has adopted all technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and here is no longer repeated one by one. The heating module 201 is disposed on the substrate 202; the heat dissipation mechanism 30 of the heat dissipation structure 100 is disposed on a side of the substrate 202 opposite to the heat generating module 201.

In this embodiment, the substrate 202 and the heat dissipation structure 100 are disposed and connected at an included angle through the mounting component 10, so that an elevation angle is formed between the plane where each flow channel 30A is located and the horizontal plane, the cooling medium realizes a phase change process of gas phase and liquid phase in the flow channel 30A, the liquefied liquid cooling medium in the flow channel 30A at the far end from the mounting component 10 and the substrate 202 accelerates to flow back to the flow channel 30A at the near end of the heat dissipation mechanism 30 near the mounting component 10 under the action of gravity, the cooling medium greatly improves the heat dissipation efficiency of the heat dissipation mechanism 30 through the circulation change of gas phase and liquid phase in the flow channels 30A at different heights at the two end portions, and the technical problem that the heat dissipation efficiency of the existing heat sink 32 is low with respect to the high power density product is effectively solved. Moreover, compared with the heat sink 32 with forced air cooling and liquid cooling, the heat dissipation structure 100 can accelerate the heat dissipation and heat conduction of the heat generating module 201 to meet the heat dissipation requirement of high power density.

The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A heat dissipation structure, comprising:

the heat dissipation mechanism includes:

2. The heat dissipation structure of claim 1, wherein the extending direction of each of the flow channels is parallel to the extending direction of the vapor chamber;

3. The heat dissipation structure of claim 2, wherein the vapor chamber comprises:

the extension section, extension section one end with the installing section is connected, and the other end dorsad the installed part extends the setting, the extension section is equipped with a plurality of second passageways, first passageway with second passageway intercommunication forms the runner, the radiator is located the installing section and/or the extension section.

4. The heat dissipation structure of claim 3, wherein the extension section comprises:

one end of the connecting part is connected with the mounting section; and

the bent part is arranged at one end, away from the mounting section, of the connecting part, the bent part and the connecting part are arranged at an included angle, and the radiator is arranged at the bent part;

5. The heat dissipation structure of claim 3, wherein the extension section and the mounting section enclose a heat dissipation cavity, and the heat sink is attached to a wall of the heat dissipation cavity.

6. The heat dissipation structure of claim 2, wherein the heat sink comprises:

7. The heat dissipation structure according to claim 1, wherein an angle between the first surface and the second surface is set to an angle α satisfying 5 ° < α <45 °.

8. The heat dissipation structure of claim 1, wherein the heat generating module is detachably connected to the mounting member;

9. The heat dissipating structure of any one of claims 1 to 8, wherein the mounting member is a cylinder having a polygonal cross section.

10. A motor controller, characterized in that the motor controller comprises:

a heat generating module;

the heating module is arranged on the substrate; and

the heat dissipation structure as claimed in any one of claims 1 to 9, wherein the heat dissipation mechanism of the heat dissipation structure is disposed on a side of the substrate facing away from the heat generating module.