CN217691201U

CN217691201U - Aluminum nitride ceramic composite substrate structure

Info

Publication number: CN217691201U
Application number: CN202220946394.XU
Authority: CN
Inventors: 施俊男; 江永平; 周建操
Original assignee: Hubei Huaxin Material Technology Co ltd
Current assignee: Hubei Huaxin Material Technology Co ltd
Priority date: 2022-04-23
Filing date: 2022-04-23
Publication date: 2022-10-28
Anticipated expiration: 2032-04-23

Abstract

The utility model relates to an aluminum nitride ceramic composite substrate structure, which comprises a substrate, the upper surface of base plate is fixed with the protection film, the upper surface of protection film is equipped with printing opacity mechanism, the upper surface of printing opacity mechanism is equipped with protection mechanism, protection mechanism's upper surface is equipped with the circuit layer, printing opacity mechanism is including the first layer of pasting that is fixed in the protection film upper surface, the first upper surface of pasting the layer is fixed with first euphotic layer, the upper surface of first euphotic layer is fixed with the second and pastes the layer, the upper surface of layer is pasted to the second is fixed with the second euphotic layer. This aluminium nitride ceramic composite substrate structure through setting up printing opacity mechanism, has increased the light transmissivity of base plate, makes the chip use the in-process display degree improve and reduced the power consumption, satisfies the production demand that the product was indicated to the high apparent, through the protection mechanism who sets up, has increased the protective properties to the base plate, makes the chip increase electrically conductive and waterproof performance in the use, is favorable to protecting the chip.

Description

Aluminum nitride ceramic composite substrate structure

Technical Field

The utility model relates to an aluminum nitride ceramic technical field specifically is an aluminum nitride ceramic composite substrate structure.

Background

The aluminum nitride ceramic is a ceramic material with excellent comprehensive performance, has excellent properties of thermal conductivity, high-temperature insulation, low dielectric constant, thermal expansion coefficient similar to that of Si and the like, is widely applied to aviation, aerospace and other intelligent power systems as a substrate material, and is considered as an ideal material for packaging a new generation of high-concentration semiconductor substrates and electronic devices.

The aluminum nitride is used as a substrate material for packaging a microelectronic system, a metallization circuit is very necessary on the surface of the substrate, particularly a high-precision thin film circuit, a micron-sized circuit needs to be made on the surface of aluminum nitride ceramic, a photoetching technology is a preferred process, the existing aluminum nitride ceramic substrate has the defect of poor light transmission performance, and due to the poor light transmission performance of the aluminum nitride ceramic, the display degree of a chip is reduced in the using process, the energy consumption is high, and the production and use requirements of products cannot be met, so that an aluminum nitride ceramic composite substrate structure is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides an aluminum nitride ceramic composite substrate structure possesses advantages such as the light transmissivity is better, and it is relatively poor to have solved aluminum nitride ceramic's light transmissivity, leads to the chip to show the degree and reduce in the use, and consumes energy higher, can't satisfy the problem of the production of product and the demand of use.

In order to achieve the above purpose, the utility model provides a following technical scheme: an aluminum nitride ceramic composite substrate structure comprises a substrate body, wherein a protective film is fixed on the upper surface of the substrate body, a light transmission mechanism is arranged on the upper surface of the protective film, a protection mechanism is arranged on the upper surface of the light transmission mechanism, and a circuit layer is arranged on the upper surface of the protection mechanism;

the light transmission mechanism comprises a first pasting layer fixed on the upper surface of the protective film, a first light transmission layer is fixed on the upper surface of the first pasting layer, a second pasting layer is fixed on the upper surface of the first light transmission layer, and a second light transmission layer is fixed on the upper surface of the second pasting layer.

Further, the first adhesive layer is an acrylic resin adhesive layer, and the first light-transmitting layer is a PVP light-transmitting layer.

Further, the second pasting layer is a phenolic resin pasting layer, and the second euphotic layer is a polydimethylsiloxane euphotic layer.

Further, the base plate body is an aluminum nitride ceramic compound machine base plate, the protective film is a titanium film protective film, and the circuit layer is a copper circuit layer.

Further, the protection mechanism comprises a heat conduction layer fixed on the upper surface of the second euphotic layer, a waterproof layer is fixed on the upper surface of the heat conduction layer, and a protection layer is fixed on the upper surface of the waterproof layer.

Further, the heat-conducting layer is a heat-conducting silica gel heat-conducting layer, the waterproof layer is an amino resin waterproof layer, and the protective layer is a silicon dioxide protective layer.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this aluminium nitride ceramic composite substrate structure through setting up printing opacity mechanism, has increased the light transmissivity of base plate, makes the chip improve and reduced the power consumption in the use display degree, satisfies the production demand that the product was indicated to the height showing.

2. This aluminum nitride ceramic composite substrate structure through the protection mechanism that sets up, has increased the protective properties to the base plate, makes the chip increase electrically conductive and waterproof performance in the use, is favorable to protecting the chip.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the light transmission mechanism of the present invention;

fig. 3 is a schematic structural diagram of the protection mechanism of the present invention.

In the figure: the circuit board comprises a substrate body 1, a protective film 2, a light transmitting mechanism 3, a first adhesive layer 301, a first light transmitting layer 302, a second adhesive layer 303, a second light transmitting layer 304, a protective mechanism 4, a heat conductive layer 401, a waterproof layer 402, a protective layer 403 and a circuit layer 5.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-2, the aluminum nitride ceramic composite substrate structure of the present embodiment includes a substrate body 1, a protective film 2 is fixed on an upper surface of the substrate body 1, and since the outer surface of the substrate body 1 is rough, the protective film 2 needs to be matched with the outer surface of the substrate body 1 to reduce the surface roughness, a light transmission mechanism 3 is disposed on the upper surface of the protective film 2, a protection mechanism 4 is disposed on the upper surface of the light transmission mechanism 3, and a circuit layer 5 is disposed on the upper surface of the protection mechanism 4.

The light transmission mechanism 3 includes a first adhesive layer 301 fixed to the upper surface of the protective film 2, a first light-transmitting layer 302 fixed to the upper surface of the first adhesive layer 301, a second adhesive layer 303 fixed to the upper surface of the first light-transmitting layer 302, and a second light-transmitting layer 304 fixed to the upper surface of the second adhesive layer 303.

The first adhesive layer 301 is an acrylic resin adhesive layer, which has water resistance and better adhesion, the first light-transmitting layer 302 is a PVP light-transmitting layer, which integrates PVC and PP materials, so that the performance of PVC and PP is effectively utilized, the second adhesive layer 303 is a phenolic resin adhesive layer, which is compatible with various organic and inorganic fillers, the wetting speed is very high, which can provide the required mechanical strength, heat resistance and electrical performance, the second light-transmitting layer 304 is a polydimethylsiloxane light-transmitting layer, which is tasteless and high in transparency from colorless and transparent volatile liquid to extremely high-viscosity liquid or silica gel, the substrate body 1 is an aluminum nitride ceramic compound substrate, the thermal conductivity is high, the expansion coefficient is low, the strength is high, the high temperature resistance, the chemical corrosion resistance, the resistivity is high, the dielectric loss is small, the protective film 2 is a titanium film protective film, the chemical stability is good, and the circuit layer 5 is a copper circuit layer.

In the light-transmitting mechanism 3 of this embodiment, the first adhesive layer 301, the first light-transmitting layer 302, the second adhesive layer 303, and the second light-transmitting layer 304 are provided, so that the light-transmitting performance of the substrate body 1 is increased, the display degree in use is increased, and the power consumption is reduced.

Referring to fig. 3, in order to increase the protection of the substrate body 1, the protection mechanism 4 in this embodiment includes a heat conductive layer 401 fixed on the upper surface of the second light-transmitting layer 304, a waterproof layer 402 is fixed on the upper surface of the heat conductive layer 401, and a protection layer 403 is fixed on the upper surface of the waterproof layer 402.

Wherein, heat-conducting layer 401 is the heat-conducting silica gel heat-conducting layer, has excellent dampproofing, antidetonation and corona resistance, and waterproof layer 402 is the amino resin waterproof layer, has good drug resistance, water-fast and weather resistance etc. and protective layer 403 is the silica dioxide protective layer, is a colorless transparent solid that is hard, fragile, indissolvable.

The protection mechanism 4 in this embodiment improves the protection of the substrate body 1 by providing the heat conductive layer 401, the waterproof layer 402, and the protection layer 403.

The working principle of the above embodiment is as follows:

(1) The first adhesive layer 301 is an acrylic resin adhesive layer, has water resistance, better adhesion, better insulator, better crack resistance and foaming property, is an alkali-resistant cleaning agent, has better physical and mechanical properties, is excellent in weather resistance, chemical resistance and water resistance, and is high in light and color retention, the first light-transmitting layer 302 is a PVP light-transmitting layer, is an effective scientific formula, integrates PVC and PP materials into a whole, effectively utilizes the essence of PVC and the flexibility of PP, the second adhesive layer 303 is a phenolic resin adhesive layer, phenolic resin is an important adhesive, is multifunctional, is compatible with various organic and inorganic fillers, has a high wetting speed, can provide required mechanical strength, heat resistance and electrical performance after cross-linking, is a polydimethylsiloxane light-transmitting layer 304, is a colorless and transparent liquid or silica gel with extremely high viscosity, is tasteless and transparent, has no odor, high transparency, has heat resistance, small change of viscosity along with temperature, is waterproof, has small surface tension, has high tensile strength, has a high thermal conductivity, is added in a chemical-corrosion-resistant copper-resistant circuit, a high-resistance and high-resistance composite machine, is a heat-resistant and heat-resistant protective film, and a heat-insulating film is a heat-resistant and heat-resistant composite board, and is a heat-resistant titanium nitride-resistant film, and a heat-resistant composite board, and has a high-resistant and high-resistant chemical-resistant and high-resistant chemical-resistant aluminum-resistant film, and high-resistant property, and a high-resistant chemical-resistant copper-resistant composite board, and is a high-resistant composite board, and is an ideal heat-resistant composite board, and is a heat-resistant film, and is a heat-resistant substrate, and is a heat-resistant composite board, and is a heat-resistant substrate, and is a heat-resistant composite board.

(2) The heat conducting layer 401 is a heat conducting silica gel heat conducting layer, and has excellent moisture-proof, shock-proof, corona-resistant, electric leakage-resistant and chemical medium-resistant performances, the waterproof layer 402 is an amino resin waterproof layer, a paint film using amino resin as a cross-linking agent has excellent gloss, color retention, hardness, drug resistance, water resistance, weather resistance and the like, and the protective layer 403 is a silicon dioxide protective layer, is a hard, brittle and indissolvable colorless transparent solid, and has a good protective performance.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An aluminum nitride ceramic composite substrate structure, includes substrate body (1), its characterized in that: a protective film (2) is fixed on the upper surface of the substrate body (1), a light transmission mechanism (3) is arranged on the upper surface of the protective film (2), a protection mechanism (4) is arranged on the upper surface of the light transmission mechanism (3), and a circuit layer (5) is arranged on the upper surface of the protection mechanism (4);

light-transmitting mechanism (3) are including being fixed in first layer (301) of pasting of protection film (2) upper surface, the upper surface of first layer (301) of pasting has first euphotic layer (302), the upper surface of first euphotic layer (302) is fixed with the second and pastes layer (303), the upper surface that layer (303) were pasted to the second has second euphotic layer (304).

2. The aluminum nitride ceramic composite substrate structure of claim 1, wherein: the first adhesive layer (301) is an acrylic resin adhesive layer, and the first light-transmitting layer (302) is a PVP light-transmitting layer.

3. The aluminum nitride ceramic composite substrate structure of claim 1, wherein: the second pasting layer (303) is a phenolic resin pasting layer, and the second light-transmitting layer (304) is a polydimethylsiloxane light-transmitting layer.

4. The aluminum nitride ceramic composite substrate structure of claim 1, wherein: the base plate body (1) is an aluminum nitride ceramic compound machine base plate, the protective film (2) is a titanium film protective film, and the circuit layer (5) is a copper circuit layer.

5. The aluminum nitride ceramic composite substrate structure of claim 1, wherein: the protection mechanism (4) comprises a heat conduction layer (401) fixed on the upper surface of the second light-transmitting layer (304), a waterproof layer (402) is fixed on the upper surface of the heat conduction layer (401), and a protection layer (403) is fixed on the upper surface of the waterproof layer (402).

6. The aluminum nitride ceramic composite substrate structure of claim 5, wherein: the heat conduction layer (401) is a heat conduction silica gel heat conduction layer, the waterproof layer (402) is an amino resin waterproof layer, and the protective layer (403) is a silicon dioxide protective layer.