CN217690410U - LED nixie tube based on LED flip chip packaging technology - Google Patents

Abstract

The utility model relates to a LED nixie tube based on LED flip chip packaging technology, the utility model effectively solves the problems of thick packaging thickness and poor use stability of the existing LED nixie tube; the technical scheme includes that a plurality of light-emitting points are arranged on a first surface array of a PCB, an LED flip chip is arranged on each light-emitting point, an IC board and a chip resistor are welded on a second surface of the PCB, and a plurality of PIN PINs are vertically arranged on the second surface of the PCB; according to the scheme, the LED flip chip is directly packaged on the PCB, the traditional steps of fixing the LED flip chip to be crystal and bonding wires are omitted, the distance between adjacent luminous points is further reduced, the size and the weight of the nixie tube are reduced, the LED flip chip and the PCB are well combined, a bonding wire link is omitted, the production flow is simplified, and the problem of poor insufficient welding and wire breakage inside the LED nixie tube chip is effectively solved.

Description

LED nixie tube based on LED flip chip packaging technology

Technical Field

The utility model relates to a LED charactron encapsulation technology field especially relates to LED charactron based on LED flip chip packaging technology.

Background

The nixie tube is one of display screens, and can be lightened by inputting relative current to different pins of the nixie tube, so that the nixie tube can display all parameters which can be represented by numbers, such as time, date, temperature and the like, and the nixie tube is usually packaged together by a plurality of LED chips according to a certain pattern and arrangement;

the LED chip in the traditional nixie tube is installed on the PCB through the bonding pad in a forward installation mode, and the LED chip is connected with the electrode on the PCB through the metal welding wire, as shown in figure 6, the nixie tube is packaged in the mode, so that the disadvantages of high thickness, large volume and heavy weight of the nixie tube are often caused;

moreover, the packaging method is easy to cause the problem of power supply of the LED chip (the metal bonding wires are extruded by external force and are easy to break) caused by the damage of the metal bonding wires, so that the product quality of the LED nixie tube cannot be guaranteed, the number of defective products in the product is increased, and the service life of the LED nixie tube is shortened in the future use process;

in view of the above, we provide an LED nixie tube based on LED flip chip packaging technology to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In view of the above circumstances, the utility model provides a LED charactron based on LED flip chip packaging technology, this scheme directly encapsulates LED flip chip on PCB, it is brilliant good earlier just adorning the chip solid traditional elder generation with LED, the step of bonding wire again, make the interval of adjacent luminous point further reduce, the volume of charactron has been reduced, weight, LED flip chip and PCB's good combination, save the bonding wire link, simplify the production flow, the inside rosin joint of LED charactron chip and the bad problem of broken string have been solved effectively.

LED charactron based on LED flip chip packaging technology, including the PCB board, its characterized in that, the first face array of PCB board is equipped with a plurality of luminous points and every be equipped with LED flip chip on the luminous point, the welding of PCB board second face has IC board, chip resistor, PCB board second face is equipped with a plurality of PIN needles perpendicularly.

Preferably, the second surface of the PCB is welded with an electrolytic capacitor.

Preferably, the first face cover of PCB board is equipped with lid and PCB board second face and is equipped with sealed glue.

Preferably, the cover body is pc and is connected with the PCB through sealing glue.

Preferably, the surfaces of a plurality of the luminous points are covered with a little transparent adhesive.

Preferably, the sealant is epoxy resin.

Preferably, the sealant is silica gel.

The beneficial effects of the technical scheme are as follows:

(1) According to the scheme, the LED flip chip is directly packaged on the PCB, so that the phenomenon that the electrode of the LED forward chip occupies the light-emitting area (the electrode of the LED forward chip is positioned above) is avoided, and the light-emitting area and the light-emitting efficiency of the nixie tube are improved compared with a mode of packaging the forward chip;

(2) The LED flip chip and the PCB are tightly attached and well combined, so that a bonding wire link is omitted, the production flow is simplified, the problems of insufficient solder joint and wire breakage in the LED nixie tube chip are effectively solved, the durability of the LED flip chip is improved, and the overall performance and the quality of the LED nixie tube are improved;

(3) Because the LED flip chip does not need to be subjected to metal welding wires any more, the distance between adjacent light-emitting points is further reduced, the size and the weight of the nixie tube are reduced, the packaging thickness of a nixie tube product is further reduced, and the applicability of different structures is improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the cover and PCB of the present invention after cross-section;

FIG. 3 is a schematic view of the PCB of the present invention;

FIG. 4 is a schematic structural view of another embodiment of the present invention;

FIG. 5 is a schematic diagram showing the separated state of the cover and PCB board of the present invention;

FIG. 6 is a schematic view of a front-mounted chip mounting structure in the prior art;

fig. 7 is the utility model discloses LED flip chip, PCB board mounting means structure sketch map.

Detailed Description

The foregoing and other technical matters, features and functions of the present invention will become more apparent from the following detailed description of the embodiments with reference to the attached drawings of fig. 1 to 7, wherein all structural matters mentioned in the following embodiments are referred to by the attached drawings of the specification.

Embodiment 1, this embodiment provides an LED digital tube based on LED flip chip packaging technology, including PCB board 1, and the improvement of this scheme lies in: the LED flip chip packaging structure comprises a PCB (printed circuit board) 1, wherein a plurality of light-emitting points 2 are arranged in an array on a first surface of the PCB 1, each light-emitting point 2 is provided with an LED flip chip 3, a pad 4 corresponding to each LED flip chip 3 is arranged at a position on the PCB corresponding to each light-emitting point 2, each LED flip chip 3 is fixed on the PCB through the pad 4, as shown in the attached drawing 7 (the position, in a dotted line frame, of each LED flip chip 3 is an enlarged schematic view of the electric connection part of each pad 4 of the PCB 1), solder paste 14 is arranged on each pad 4, positive and negative electrodes of each LED flip chip 3 are connected and fixed with the positive and negative electrodes on the PCB 1 through the solder paste 14 (after the LED flip chip 3 is placed on the corresponding pad 4, the PCB 1 is placed in a reflow furnace for welding, and further connection between the LED flip chip 3 and the PCB 1 is realized), the electrodes of the LED flip chip 3 are electrically connected with the electrodes on the PCB 1 through the solder paste 14, and packaging is realized in such a manner, and the conventional LED flip chip 12 is prevented from being electrically connected with the PCB 1 through metal bonding wires 13 to realize high packaging thickness and further stable packaging, so that the packaging of the packaging structure is more stable and the packaging performance of a digital tube is realized;

and adopt the mode of 3 encapsulation of LED flip chip, also avoided traditional LED to just adorn the encapsulation and lead to the luminous area of LED chip to shelter from (make the luminous area of LED chip reduce, luminous efficiency reduce), LED is just adorning chip 12 structure, and its electrode is above, from last to material down: the LED digital tube comprises a P-GaN layer, a luminous layer, an N-GaN layer, a substrate, electrodes and metal bonding wires 13, wherein part of a light source (shown in figure 6) emitted by an LED chip can be shielded by the electrodes and a transparent conducting layer on the P-GaN layer can absorb light emitted by the LED chip, so that the brightness of the LED chip is reduced, and the LED flip chip adopts an LED flip packaging mode, wherein positive and negative electrodes of an LED flip chip 3 are arranged on the bottom surface (shown in figure 7) and are directly electrically connected with positive and negative electrodes on a PCB (1) through tin paste 14 (the metal bonding wires 13 are not needed, and the problem of poor internal false welding and wire breakage is avoided), so that the use stability of the LED digital tube is improved;

as shown in fig. 2, an IC board 11 (Integrated Circuit, which forms a microstructure having a required Circuit function) is welded to the second surface of the PCB, a Chip resistor 10 (resistors with different specifications, such as 0603, 0402, and the like, can be selected according to actual lines, and resistors with different resistances, such as 330 Ω,10K Ω, and the like, can be selected according to the actual lines), the Chip resistor 10 can reduce voltage, distribute voltage, limit current, and provide necessary operating conditions (voltage or current) for various components on the PCB Circuit, so as to provide a good operating environment for the operation of the LED Chip, as shown in fig. 1, a plurality of PIN PINs 5 are vertically arranged on the second surface of the PCB 1, so as to achieve electrical connection between the PCB 1 and an external Circuit;

note: the IC board 11 and the chip resistor 10 on the second surface of the PCB 1 are directly connected to the PCB 1 by soldering via the solder paste 14.

Embodiment 2, on the basis of embodiment 1, as shown in fig. 2, an electrolytic capacitor 6 (one kind of capacitor, the capacitance per unit volume is very large, the constituent materials of the electrolytic capacitor 6 are common industrial materials, such as aluminum, etc., and the devices for manufacturing the electrolytic capacitor 6 are common industrial devices, which can be mass-produced and have relatively low cost) is welded on the second surface of the PCB board 1, and the electrolytic capacitor 6 plays roles of power filtering, decoupling, signal coupling, time constant setting, dc blocking, etc. in the circuit of the PCB board 1.

Embodiment 3, on the basis of embodiment 1, as shown in fig. 2, the first face cover of PCB is equipped with lid 8 and the second face of PCB is equipped with sealed glue 7, and lid 8 realizes the sealed effect of having filled sealed glue 7 realization to PCB 1 to the protection of PCB 1 and the second face of PCB.

Embodiment 4, on the basis of embodiment 3, the cover body 8 is made of a pc material (having characteristics of heat resistance, impact resistance, high flame retardancy, and the like), and the cover body 8 is connected with the PCB board through the sealing compound 7, so that the PCB board 1 is in a better sealing environment under the protection of the cover body 8 and the sealing compound 7.

In embodiment 5, on the basis of embodiment 1, as shown in fig. 4, in order to further improve the protection effect on the LED flip chip 3, a layer of dot transparent adhesive 9 (having the characteristics of collision prevention, shock resistance, extremely high transparency, and the like) is covered on the surfaces of the plurality of light emitting dots 2.

Embodiment 6, on the basis of embodiment 4, the sealant 7 is epoxy resin, which has excellent physical mechanical and electrical insulation properties and adhesion properties with various materials, and can achieve a good packaging effect for the PCB board 1.

Embodiment 7, on the basis of embodiment 4, sealed glue 7 also can adopt silica gel to seal protection PCB board 1, and silica gel is compared its thermal stress less and elasticity is bigger for epoxy, plays good guard action to the LED chip in the use, is favorable to improving the reliability of whole product.

The above description is only for the purpose of illustration, and it should be understood that the present invention is not limited to the above embodiments, and various modifications conforming to the spirit of the present invention are within the scope of the present invention.

Claims (7)

1. LED charactron based on LED flip chip packaging technique, including PCB board (1), its characterized in that, PCB board (1) first face array is equipped with a plurality of luminous points (2) and every be equipped with LED flip chip (3) on luminous point (2), PCB board (1) second face welding has IC board (11), chip resistor (10), PCB board (1) second face is equipped with a plurality of PIN needles (5) perpendicularly.

2. The LED nixie tube based on the LED flip-chip packaging technology as claimed in claim 1, wherein the second side of the PCB (1) is soldered with an electrolytic capacitor (6).

3. The LED nixie tube based on the LED flip chip packaging technology as claimed in claim 1, wherein the first surface of the PCB is sleeved with a cover (8) and the second surface of the PCB is provided with a sealant (7).

4. The LED nixie tube based on the LED flip-chip packaging technology as claimed in claim 3, wherein the cover (8) is pc and the cover (8) is connected with the PCB board via a sealing adhesive (7).

5. The LED nixie tube based on the LED flip-chip packaging technology as claimed in claim 1, wherein the surfaces of a plurality of the light-emitting points (2) are covered with a transparent adhesive (9).

6. The LED nixie tube based on the LED flip-chip packaging technology as claimed in claim 4, wherein the sealant (7) is epoxy resin.

7. The LED nixie tube based on the LED flip chip packaging technology as claimed in claim 4, wherein the sealant (7) is silica gel.

Images