CN216818369U - LED for realizing ultrathin high-brightness side hairstyle - Google Patents
LED for realizing ultrathin high-brightness side hairstyle Download PDFInfo
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- CN216818369U CN216818369U CN202220399065.8U CN202220399065U CN216818369U CN 216818369 U CN216818369 U CN 216818369U CN 202220399065 U CN202220399065 U CN 202220399065U CN 216818369 U CN216818369 U CN 216818369U
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- glass fiber
- fiber substrate
- copper foils
- led chip
- die bond
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Abstract
The utility model discloses a light-emitting diode capable of realizing ultrathin high-brightness side hairstyle, which comprises a glass fiber substrate, a die bonding copper foil, an LED chip, positive and negative electrode copper foils and fluorescent powder epoxy resin, wherein the center of the upper surface of the glass fiber substrate is provided with a die bonding position, the upper surface of the glass fiber substrate is provided with two paths of die bonding copper foils converged to the die bonding position, the LED chip is arranged at the die bonding position in an inverted posture, the positive and negative electrodes of the LED chip are electrically connected with the two paths of die bonding copper foils respectively in a reflow soldering mode towards the glass fiber substrate, and the positive and negative electrode copper foils are etched on the lower surface of the glass fiber substrate. By the mode, the utility model provides the ultrathin high-brightness side hairstyle light-emitting diode, the LED chip is packaged in the strip-shaped fluorescent powder epoxy resin to realize side large-area light emission, the light-emitting area is enlarged by adopting an inverted solid crystal structure, so that the light-emitting intensity is effectively improved, and the size and the thickness of a finished product are effectively reduced by subtracting a wire arc.
Description
Technical Field
The utility model relates to the field of LEDs, in particular to a light-emitting diode for realizing ultrathin high-brightness side hairstyle.
Background
The conventional SMD side LED product uses the front mounted chip to realize the basic electro-optical characteristics of LED by wire bonding process.
At present, a chip is normally installed on the market, a wire bonding process is carried out, and then light emission is realized through packaging; the mode has the defects of low luminous intensity, limited size of a functional area and the like;
firstly, the front-mounted chip has two welded pads on the light emitting surface on the light emitting principle, the general size is phi 50-80um, and the area of the light emitting surface is reduced by shielding the area of the pads, so that the light emitting intensity is influenced;
furthermore, when the normal chip is used, the wire bonding process is required, and the height of the bonding wire is generally reserved at 100-.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing the ultrathin high-brightness side hairstyle light-emitting diode, the LED chip is packaged in the strip-shaped fluorescent powder epoxy resin to realize side large-area light emission, the flip chip die bonding structure is adopted to enlarge the light-emitting area so as to effectively improve the light-emitting intensity, and the wire arc is subtracted so as to effectively reduce the size and the thickness of a finished product.
In order to solve the technical problems, the utility model adopts a technical scheme that: the LED comprises a glass fiber substrate, a die bond copper foil, an LED chip, positive and negative copper foils and fluorescent powder epoxy resin, wherein a die bond position is arranged in the center of the upper surface of the glass fiber substrate, two die bond copper foils converging to the die bond position are arranged on the upper surface of the glass fiber substrate, the LED chip is arranged at the die bond position in an inverted posture, the positive and negative electrodes of the LED chip are electrically connected with the two die bond copper foils through reflow soldering respectively towards the glass fiber substrate, the positive and negative copper foils are etched on the lower surface of the glass fiber substrate, the positive and negative copper foils are electrically connected with the two die bond copper foils through conductive copper foils etched in the glass fiber substrate, and a layer of fluorescent powder epoxy resin is packaged on the LED chip.
In a preferred embodiment of the present invention, the phosphor epoxy resin is coated on the entire upper surface of the glass fiber substrate.
In a preferred embodiment of the present invention, the gap between the positive and negative electrode copper foils and the die attach copper foil is filled with epoxy resin through via-hole treatment.
In a preferred embodiment of the utility model, the glass fiber substrate is strip-shaped, and the two paths of die bond copper foils are arranged symmetrically and have equal lengths on two sides of the LED chip.
The utility model has the beneficial effects that: according to the LED for realizing the ultrathin high-brightness side hairstyle, the LED chip is packaged in the strip-shaped fluorescent powder epoxy resin to realize side large-area light emission, the light-emitting area is enlarged by adopting the flip-chip die-bonding structure, so that the light-emitting intensity is effectively improved, and the size and the thickness of a finished product are effectively reduced by subtracting a wire arc.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a perspective view of a preferred embodiment of an LED for realizing ultra-thin high brightness side hairstyle according to the present invention;
FIG. 2 is an exploded view of a preferred embodiment of an LED for achieving an ultra-thin high brightness side hairstyle of the present invention;
fig. 3 is a front structural view of a preferred embodiment of an led for realizing ultra-thin high brightness side hairstyle according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
As shown in fig. 1-3, embodiments of the present invention include:
the LED comprises a glass fiber substrate 1, a die bond copper foil 2, an LED chip 3, positive and negative electrode copper foils 4 and fluorescent powder epoxy resin 5, wherein a die bond position is arranged in the center of the upper surface of the glass fiber substrate 1, two die bond copper foils 2 converging to the die bond position are arranged on the upper surface of the glass fiber substrate 1, the LED chip 3 is arranged at the die bond position in an inverted posture, the positive and negative electrodes of the LED chip 3 are respectively electrically connected with the two die bond copper foils 2 in a reflow soldering mode towards the glass fiber substrate 1, the positive and negative electrode copper foils 4 are etched on the lower surface of the glass fiber substrate 1, the conductive copper foils etched in the glass fiber substrate 1 are electrically connected with the two die bond copper foils 2, and the LED chip 3 is packaged with a layer of fluorescent powder epoxy resin 5.
Wherein, the fluorescent powder epoxy resin 5 covers the whole upper surface of the glass fiber substrate 1.
Furthermore, epoxy resin 6 is filled between the positive and negative electrode copper foils 4 and the die bonding copper foil 2 through hole plugging treatment.
Further, the glass fiber substrate 1 is strip-shaped, and the two paths of the die bond copper foils 2 are arranged on two sides of the LED chip 3 symmetrically and have equal lengths.
During production, die bonding and welding high-temperature tin paste is uniformly printed on a die bonding copper foil 2 on a glass fiber substrate 1 by using a high-precision printer, a flip chip is fixed at a die bonding position by using a high-precision die bonding machine, the precise butt joint of positive and negative electrode copper foils 4 of a flip LED chip 3 and a printed high-temperature tin paste point on the glass fiber substrate 1 needs to be controlled in the process, the error does not exceed 0.005mm, and then the reflow soldering process is used for soldering.
Therefore, the product adopts a blue-white light waveband flip chip, uses a printing reflow soldering process, and subtracts a bonding wire process, thereby achieving the purpose of improving the brightness.
The product has the following characteristics:
1. the LED chip 3 which is inverted is used, so that the luminous intensity is increased in the light emitting principle;
2. the whole thickness of the product is further reduced by using printing and reflow soldering processes and subtracting a wire bonding process and a wire arc according to the requirement of a flip chip manufacturing process.
In summary, the utility model provides an ultra-thin high-brightness side-emitting light emitting diode, which is characterized in that an LED chip 3 is packaged in a strip-shaped phosphor epoxy resin 5 to realize side-direction large-area light emission, and an inverted die-bonding structure is adopted to enlarge the light emitting area, thereby effectively improving the light emitting intensity, and simultaneously, the size and thickness of a finished product are effectively reduced by subtracting a wire arc.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. The LED is characterized by comprising a glass fiber substrate, a die bond copper foil, an LED chip, positive and negative electrode copper foils and fluorescent powder epoxy resin, wherein the die bond position is arranged in the center of the upper surface of the glass fiber substrate, two paths of die bond copper foils converged to the die bond position are arranged on the upper surface of the glass fiber substrate, the LED chip is arranged at the die bond position in an inverted posture, the positive and negative electrodes of the LED chip are electrically connected with the two paths of die bond copper foils through reflow soldering respectively towards the glass fiber substrate, the positive and negative electrode copper foils are etched on the lower surface of the glass fiber substrate, the positive and negative electrode copper foils are electrically connected with the two paths of die bond copper foils through conductive copper foils etched in the glass fiber substrate, and a layer of fluorescent powder epoxy resin is packaged on the LED chip.
2. The ultra-thin high brightness side hairstyle led of claim 1, wherein the phosphor epoxy resin is coated on the entire upper surface of the glass fiber substrate.
3. The LED for realizing ultrathin and high brightness side hairstyle according to claim 1, wherein the space between the positive and negative copper foils and the die bond copper foil is filled with epoxy resin through hole plugging treatment.
4. The LED for realizing ultrathin high brightness side hairstyle according to claim 1, wherein the glass fiber substrate is strip-shaped, and the two paths of die bond copper foils are arranged symmetrically at two sides of the LED chip in equal length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220399065.8U CN216818369U (en) | 2022-02-25 | 2022-02-25 | LED for realizing ultrathin high-brightness side hairstyle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220399065.8U CN216818369U (en) | 2022-02-25 | 2022-02-25 | LED for realizing ultrathin high-brightness side hairstyle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216818369U true CN216818369U (en) | 2022-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220399065.8U Active CN216818369U (en) | 2022-02-25 | 2022-02-25 | LED for realizing ultrathin high-brightness side hairstyle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216818369U (en) |
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2022
- 2022-02-25 CN CN202220399065.8U patent/CN216818369U/en active Active
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