CN217673731U - Automatic film tearing structure - Google Patents
Automatic film tearing structure Download PDFInfo
- Publication number
- CN217673731U CN217673731U CN202221268983.3U CN202221268983U CN217673731U CN 217673731 U CN217673731 U CN 217673731U CN 202221268983 U CN202221268983 U CN 202221268983U CN 217673731 U CN217673731 U CN 217673731U
- Authority
- CN
- China
- Prior art keywords
- heating
- adhesive tape
- hot melt
- cylinder
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an automatic film tearing structure, which comprises a table plate, a tape stretching mechanism, a tape clamping mechanism and a heating mechanism; the tape tensioning mechanism comprises Zhang Daijia, and a hot melt adhesive tape feeding mechanism is arranged on the tape tensioning frame; a first driving cylinder is arranged between the Zhang Daijia and the vertical plate, and the tensioning belt frame is driven to lift on the vertical plate through the first driving cylinder; the heating mechanism comprises a heating frame, and a heating assembly for heating the adhesive tape and a cutting mechanism for cutting the adhesive tape are arranged on the heating frame; and a second driving cylinder is arranged between the heating frame and the vertical plate and drives the heating frame to lift on the vertical plate through the second driving cylinder. The utility model discloses in the structure, use hot melt sticky tape to melt its head end heating and be stained with and glue on the protection film at wafer profile edge, then remove through the hot melt sticky tape that drives the adhesion on the protection film and slowly tear the protection film off, the manual dyestripping has reduced personnel's operation relatively, has reduced artifical use cost, has improved the operating efficiency.
Description
Technical Field
The utility model belongs to the technical field of the wafer dyestripping, in particular to automatic dyestripping structure.
Background
In some procedures of a wafer manufacturing process, a protective film needs to be attached to the wafer, and meanwhile, the protective film needs to be torn off subsequently.
Wafer processing is pipelined processing, if adopt the manual work to tear the membrane to the wafer, need a large amount of manual works just can satisfy the tear film demand, increased artifical use cost undoubtedly to artificial work efficiency can directly influence the machining efficiency of wafer, can not guarantee wafer preparation machining efficiency's stability.
How to design automatic dyestripping structure, how to realize automatic wafer dyestripping, reduce artifical use cost to guarantee the preparation machining efficiency of wafer, become the problem that the solution is badly needed.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide an automatic dyestripping structure for wafer dyestripping adopts artifical the completion among the solution prior art, and artifical use cost is high and wafer preparation machining efficiency does not have the problem of guarantee.
In order to realize the purpose, the utility model provides an automatic film tearing structure, which comprises a table disc, a tape stretching mechanism, a clamping mechanism and a heating mechanism, wherein the tape stretching mechanism, the clamping mechanism and the heating mechanism are all positioned at the upper side of the table disc, and the tape stretching mechanism, the clamping mechanism and the heating mechanism are connected on the same vertical plate;
the tape tensioning mechanism comprises Zhang Daijia, and a hot melt adhesive tape feeding mechanism is arranged on the tape tensioning frame; a first driving cylinder is arranged between the Zhang Daijia and the vertical plate, and the tensioning belt frame is driven to lift on the vertical plate through the first driving cylinder;
a clamping movement module is arranged between the clamping mechanism and the vertical plate and drives the clamping mechanism to move horizontally through the clamping movement module;
the heating mechanism comprises a heating frame, and a heating assembly for heating the adhesive tape and a cutting mechanism for cutting the adhesive tape are arranged on the heating frame; a second driving cylinder is arranged between the heating frame and the vertical plate and drives the heating frame to lift on the vertical plate through the second driving cylinder;
by adopting the technical scheme: after the wafer is placed on the table disc, the hot melt adhesive tape on the tape stretching mechanism is clamped by the clamping mechanism, and then the hot melt adhesive tape is pulled out to the upper part of the wafer under the action of the clamping movement module; the heating assembly on the heating mechanism can press the hot melt adhesive tape on the surface of the wafer film and heat the hot melt adhesive tape to adhere the hot melt adhesive tape on the wafer film, and meanwhile, the cutting mechanism on the heating mechanism can cut off the hot melt adhesive tape adhered on the wafer film; and finally, when the clamping moving module drives the clamping mechanism to return to the original position, the film on the wafer can be attached to the hot melt adhesive tape, so that the automatic film tearing process of the wafer is completed.
In an embodiment of the present invention, the table plate is slidably disposed on the guide rail, and a driving mechanism is disposed adjacent to the guide rail and drives the table plate to move on the guide rail through the driving mechanism; the driving mechanism comprises a motor, an output shaft of the motor is coaxially connected with a screw rod, and the screw rod penetrates through the table plate;
by adopting the technical scheme: the platform disc can move on the guide rail under the cooperation of motor and lead screw, realizes corresponding automatic unloading of going up, ensures that the wafer can move to the dyestripping station after placing on the platform disc and carry out corresponding dyestripping flow.
In an embodiment of the present invention, a suction cup is disposed at a central position of an upper portion of the table plate;
by adopting the technical scheme: the sucking disc can adsorb the wafer, increases the stability after the wafer is placed on the platform dish to avoid tearing the membrane in-process wafer and remove, guarantee to tear the smooth completion of membrane operation.
In an embodiment of the present invention, the hot melt adhesive tape feeding mechanism includes a hot melt adhesive tape feeding module, a tape pushing module, an entrainment component and a cutting knife groove, wherein the hot melt adhesive tape feeding module is used for feeding a hot melt adhesive tape; the belt pushing block is connected to the extending end of the first cylinder; the belt clamping assembly comprises an upper clamping block and a lower clamping block which are respectively positioned at the upper side and the lower side of the belt pushing block; the cutter cutting groove is connected to the extending end of the second cylinder;
by adopting the technical scheme: hot-melt film to provide a hot-melt adhesive tape; the belt pushing block can push the hot melt adhesive tape out under the action of the first air cylinder, so that power for pushing the hot melt adhesive tape out of the hot melt adhesive film is provided; the clamping belt component can clamp the hot melt adhesive tape, so that the hot melt adhesive tape is in a stable state after being cut off, and the influence of falling of the hot melt adhesive tape on the film tearing operation of the next wafer is avoided; the cutter groove provides yielding of the cutter, and the follow-up cutter can complete cutting-off operation of the hot melt adhesive tape.
In an embodiment of the present invention, the belt clamping mechanism includes a belt clamping frame, a third cylinder is disposed on the belt clamping frame, an extending end of the third cylinder is connected to an upper press block, and a lower press block is disposed under the upper press block;
by adopting the technical scheme: after the third cylinder is started, the upper pressing block presses the hot melt adhesive tape on the lower pressing block, so that the hot melt adhesive tape is clamped.
In an embodiment of the present invention, the heating assembly includes a fourth cylinder installed on the heating frame, and an extending end of the fourth cylinder is connected with the heating head downward;
by adopting the technical scheme: after the fourth cylinder starts, the heating head connected to the extending end of the fourth cylinder can press the surface of the hot melt adhesive tape down, and the hot melt adhesive tape is heated through the heating head.
In an embodiment of the present invention, the cutting mechanism includes a fifth cylinder installed on the heating frame, an extending end of the fifth cylinder is connected to a cutting knife, the cutting knife passes through the transverse cutting guide groove, and the transverse cutting guide groove is installed on the heating frame;
by adopting the technical scheme: the fifth cylinder can drive the cutter to move transversely, so that the lower hot melt adhesive tape is cut off; the crosscut guide groove increases the movement stability of the cutting knife.
Advantageous effects
In the structure of the utility model, the hot melt adhesive tape is used to heat and melt the head end of the hot melt adhesive tape to be adhered on the protective film at the edge of the outline of the wafer, and then the hot melt adhesive tape adhered on the protective film is driven to move to slowly tear the protective film, so that the manual operation is reduced compared with the manual film tearing, and the operation efficiency is improved; compared with the film tearing method, the film tearing method improves the diversity of the film tearing method; the automatic film tearing structure is an indispensable part in the full-automatic film tearing machine, and has good economic and social benefits after popularization and application.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the heating mechanism of the present invention.
Fig. 3 is a schematic view of the film spreading mechanism of the present invention.
Fig. 4 is a schematic view of the film clamping mechanism of the present invention.
Fig. 5 is a schematic view of the table of the present invention.
In the figure: 1. a table plate; 11. a guide rail; 12. a screw rod; 13. a motor; 14. a suction cup; 2. a tape tensioning mechanism; 21. zhang Daijia; 22. hot-melt film; 23. a first cylinder; 24. a belt pushing block; 25. an upper clamping block; 26. a lower clamping block; 27. a second cylinder; 28. cutting a cutter groove; 3. an entrainment mechanism; 31. a clamp belt movement module; 32. a tape clamping frame; 33. a third cylinder; 34. pressing the block; 35. pressing the block; 4. a heating mechanism; 41. a heating rack; 42. a fourth cylinder; 43. a heating head; 44. a fifth cylinder; 45. a cutting knife; 46. transecting the guide channel.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 5. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
As shown in fig. 1-5, the utility model provides an automatic film tearing structure, which comprises a table plate 1, a tape stretching mechanism 2, a tape clamping mechanism 3 and a heating mechanism 4, wherein the tape stretching mechanism 2, the tape clamping mechanism 3 and the heating mechanism 4 are all positioned on the upper side of the table plate 1, and the tape stretching mechanism 2, the tape clamping mechanism 3 and the heating mechanism 4 are connected on the same vertical plate; the tape tensioning mechanism 2 comprises Zhang Daijia, and a hot melt adhesive tape feeding mechanism is arranged on the tape tensioning frame 21; a first driving cylinder is arranged between Zhang Daijia and the vertical plate, and the first driving cylinder drives the belt-tensioning frame 21 to lift on the vertical plate; an entrainment motion module 31 is arranged between the entrainment mechanism 3 and the vertical plate, and the entrainment mechanism 3 is driven to move horizontally by the entrainment motion module 31; the heating mechanism 4 comprises a heating frame 41, and a heating assembly for heating the adhesive tape and a cutting mechanism for cutting the adhesive tape are arranged on the heating frame 41; a second driving cylinder is arranged between the heating frame 41 and the vertical plate, and the heating frame 41 is driven to lift on the vertical plate through the second driving cylinder; by adopting the technical scheme: after the wafer is placed on the table disc 1, the hot melt adhesive tape on the tape tensioning mechanism 2 is clamped by the clamping mechanism 3, and then the hot melt adhesive tape is pulled out to the upper part of the wafer under the action of the clamping movement module 31; the heating assembly on the heating mechanism 4 can press the hot melt adhesive tape on the surface of the wafer film and heat the hot melt adhesive tape to adhere the hot melt adhesive tape on the wafer film, and meanwhile, the cutting mechanism on the heating mechanism 4 can cut off the hot melt adhesive tape adhered on the wafer film; finally, when the clamping movement module 31 drives the clamping mechanism 3 to return to the original position, the film on the wafer can be adhered to the hot melt adhesive tape, and the automatic film tearing process of the wafer is completed.
Further, the table plate 1 is arranged on the guide rail 11 in a sliding manner, and a driving mechanism is arranged on the adjacent side of the guide rail 11 and drives the table plate 1 to move on the guide rail 11 through the driving mechanism; the driving mechanism comprises a motor 13, an output shaft of the motor 13 is coaxially connected with a screw rod 12, and the screw rod 12 penetrates through the table plate 1; by adopting the technical scheme: the table plate 1 can move on the guide rail 11 under the matching of the motor 13 and the screw rod 12, so that corresponding automatic loading and unloading are realized, and the wafer can be moved to a film tearing station to perform a corresponding film tearing process after being placed on the table plate 1.
Further, a sucking disc 14 is arranged at the center of the upper part of the table plate 1; by adopting the technical scheme: the suction cup 14 can adsorb the wafer, increase the stability of the wafer after being placed on the table plate 1, prevent the wafer from moving in the film tearing process, and ensure that the film tearing operation is smoothly completed.
Further, the hot melt adhesive tape feeding mechanism comprises a hot melt adhesive tape feeding film 22, a tape pushing block 24, an entrainment component and a cutting knife groove 28, wherein the hot melt adhesive tape feeding block is used for pushing the hot melt adhesive tape; the belt pushing block 24 is connected to the extending end of the first cylinder 23; the clamping belt component comprises an upper clamping block 25 and a lower clamping block 26 which are respectively positioned at the upper side and the lower side of the belt pushing block 24; the cutter cutting groove 28 is connected to the extending end of the second cylinder 27; by adopting the technical scheme: the hot melt film 22 provides a hot melt adhesive tape; the belt pushing block 24 can push the hot melt adhesive belt out under the action of the first air cylinder 23 to provide power for pushing the hot melt adhesive belt out of the hot melt adhesive film 22; the clamping belt component can clamp the hot melt adhesive tape, so that the hot melt adhesive tape is in a stable state after being cut off, and the influence of falling of the hot melt adhesive tape on the film tearing operation of the next wafer is avoided; the cutter groove 28 provides the yielding position of the cutter 45, and ensures that the subsequent cutter 45 can complete the cutting operation of the hot melt adhesive tape.
Further, the belt clamping mechanism 3 comprises a belt clamping frame 32, a third cylinder 33 is arranged on the belt clamping frame 32, an extending end of the third cylinder 33 is downwards connected with an upper pressing block 34, and a lower pressing block 35 is arranged right below the upper pressing block 34; by adopting the technical scheme: after the third air cylinder 33 is activated, the upper pressing block 34 presses the hot melt adhesive tape against the lower pressing block 35, thereby clamping the hot melt adhesive tape.
Further, the heating assembly comprises a fourth cylinder 42 mounted on the heating frame 41, and a heating head 43 is connected to the extending end of the fourth cylinder 42; by adopting the technical scheme: after the fourth air cylinder 42 is started, the heating head 43 connected to the extending end of the fourth air cylinder 42 can press down the surface of the hot melt adhesive tape, and the heating of the hot melt adhesive tape is completed through the heating head 43.
Further, the cutting mechanism comprises a fifth air cylinder 44 mounted on the heating frame 41, a cutting knife 45 is connected to an extending end of the fifth air cylinder 44, the cutting knife 45 penetrates through a transverse cutting guide groove 46, and the transverse cutting guide groove 46 is mounted on the heating frame 41. By adopting the technical scheme: the fifth cylinder 44 can drive the cutting knife 45 to move transversely, so that the lower hot melt adhesive tape is cut off; the transecting guide groove 46 increases the movement stability of the cutting knife 45.
In specific implementation, when the automatic film tearing structure works in an initial state, the heating mechanism 4 and the tape tensioning mechanism 2 are both in a rising state, the clamping mechanism 3 is in a left limit position, and the table plate 1 structure is in a left limit position; in an initial state, the manipulator conveys the wafer pasted with the protective film to the workbench disc 1; then the workbench disc 1 moves to the right, so that the left side of the outer contour of the wafer is positioned under the heating head 43, then the tension mechanism 2 descends to be close to the workbench disc 1, and the clamping mechanism 3 moves to the left side of the film port to clamp the film; then the bench disc 1 and the band stretching structure 2 are kept still, the band stretching structure 3 moves leftwards to pull out the hot melt adhesive band, after the hot melt adhesive band is pulled out, the heating mechanism 4 descends to be close to the working bench disc 1, then the heating head 43 also descends, the hot melt adhesive band is pressed downwards to directly contact with the protective film on the edge of the wafer outline, the hot melt adhesive band and the wafer protective film are adhered together, then the lower cutter groove 28 extends forwards to the lower part of the hot melt adhesive band, and the cutter 45 extends forwards in the cutter groove 28 for one round to cut off the hot melt adhesive band; then the tape stretching structure 2 and the heating mechanism 4 sequentially ascend to the initial position from front to back, the tape clamping structure 3 moves to the right to tear the film, and meanwhile, the table disc 1 structure moves to the left until the wafer protective film is completely torn off; finally, the mechanical arm carries away the wafer with the torn film; namely, a film tearing process is completed.
In summary, the utility model provides an automatic film tearing structure, using the heating head 43 to heat and melt the end of the hot melt adhesive tape and stick on the protective film at the edge of the wafer outline, then slowly tearing the protective film by driving the hot melt adhesive tape adhered on the protective film to move, which reduces the personnel operation compared with manual film tearing and improves the operation efficiency; compared with the film tearing method, the film tearing method improves the diversity of the film tearing method; the automatic film tearing structure is an indispensable part in the full-automatic film tearing machine, and has good economic and social benefits after popularization and application. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (7)
1. Automatic dyestripping structure, including bench set (1), stretch a tape unit structure (2), smuggle mechanism (3) and heating mechanism (4) secretly, its characterized in that: the belt tensioning mechanism (2), the clamping mechanism (3) and the heating mechanism (4) are all positioned on the upper side of the table plate (1), and the belt tensioning mechanism (2), the clamping mechanism (3) and the heating mechanism (4) are connected to the same vertical plate;
the tape tensioning mechanism (2) comprises Zhang Daijia (21), and a hot melt adhesive tape feeding mechanism is arranged on the Zhang Daijia (21); a first driving cylinder is arranged between the Zhang Daijia (21) and the vertical plate, and the first driving cylinder drives Zhang Daijia (21) to lift on the vertical plate;
an entrainment motion module (31) is arranged between the entrainment mechanism (3) and the vertical plate, and the entrainment mechanism (3) is driven to horizontally move by the entrainment motion module (31);
the heating mechanism (4) comprises a heating frame (41), and a heating assembly for heating the adhesive tape and a cutting mechanism for cutting the adhesive tape are arranged on the heating frame (41); and a second driving cylinder is arranged between the heating frame (41) and the vertical plate, and the heating frame (41) is driven to lift on the vertical plate through the second driving cylinder.
2. The self-tear film structure of claim 1, wherein: the table plate (1) is arranged on the guide rail (11) in a sliding mode, a driving mechanism is arranged on the adjacent side of the guide rail (11), and the table plate (1) is driven to move on the guide rail (11) through the driving mechanism; the driving mechanism comprises a motor (13), an output shaft of the motor (13) is coaxially connected with a screw rod (12), and the screw rod (12) penetrates through the table plate (1).
3. The self-tear film structure of claim 1, wherein: a sucker (14) is arranged at the center of the upper part of the table plate (1).
4. The self-tear film structure of claim 1, wherein: the hot melt adhesive tape feeding mechanism comprises a hot melt adhesive tape feeding film (22), a tape pushing block (24), an entrainment component and a cutting knife groove (28), wherein the hot melt adhesive tape feeding film is used for feeding an adhesive tape; the belt pushing block (24) is connected to the extending end of the first cylinder (23); the belt clamping assembly comprises an upper clamping block (25) and a lower clamping block (26) which are respectively positioned at the upper side and the lower side of the belt pushing block (24); the cutter cutting groove (28) is connected to the extending end of the second cylinder (27).
5. The self-tear film structure of claim 1, wherein: smuggle mechanism (3) including clip area frame (32), be provided with third cylinder (33) on clip area frame (32), the end that stretches out of third cylinder (33) is connected with briquetting (34) down, be provided with briquetting (35) down under last briquetting (34).
6. The self-tear film structure of claim 1, wherein: the heating assembly comprises a fourth air cylinder (42) installed on a heating frame (41), and the extending end of the fourth air cylinder (42) is downwards connected with a heating head (43).
7. The self-tear film structure of claim 1, wherein: the cutting mechanism comprises a fifth air cylinder (44) installed on the heating frame (41), the extending end of the fifth air cylinder (44) is connected with a cutting knife (45), the cutting knife (45) penetrates through a transverse cutting guide groove (46), and the transverse cutting guide groove (46) is installed on the heating frame (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221268983.3U CN217673731U (en) | 2022-05-25 | 2022-05-25 | Automatic film tearing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221268983.3U CN217673731U (en) | 2022-05-25 | 2022-05-25 | Automatic film tearing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217673731U true CN217673731U (en) | 2022-10-28 |
Family
ID=83741396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221268983.3U Active CN217673731U (en) | 2022-05-25 | 2022-05-25 | Automatic film tearing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217673731U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878027A (en) * | 2024-03-12 | 2024-04-12 | 无锡江松科技股份有限公司 | High-efficiency silicon wafer automatic film tearing machine and film tearing method for hot melt adhesive tape |
-
2022
- 2022-05-25 CN CN202221268983.3U patent/CN217673731U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117878027A (en) * | 2024-03-12 | 2024-04-12 | 无锡江松科技股份有限公司 | High-efficiency silicon wafer automatic film tearing machine and film tearing method for hot melt adhesive tape |
| CN117878027B (en) * | 2024-03-12 | 2024-05-24 | 无锡江松科技股份有限公司 | High-efficiency silicon wafer automatic film tearing machine and film tearing method for hot melt adhesive tape |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107031902B (en) | A kind of preceding road package system of backlight and method | |
| CN203554888U (en) | Automatic alignment assembling machine | |
| CN217673731U (en) | Automatic film tearing structure | |
| CN208361514U (en) | A kind of braid capacitor adhesive tape adhering machine | |
| CN104416358A (en) | Wire drawing and cutting device | |
| CN211062691U (en) | Edge sealing equipment for refrigeration chip | |
| CN219467077U (en) | Foam laminating machine | |
| CN218657763U (en) | High-speed aluminum-to-nickel tab integrated machine | |
| CN217779186U (en) | Film tearing mechanism and film tearing device | |
| CN217376406U (en) | Automatic chip film tearing machine | |
| CN115783419A (en) | Automatic case sealer of water activity sticky tape | |
| CN110712362A (en) | Automatic film pasting equipment and film pasting method thereof | |
| CN211792325U (en) | Automatic package golden finger equipment | |
| CN214875859U (en) | Automatic film sticking machine | |
| CN214818831U (en) | Cutting device of semi-automatic film plastic uptake machine | |
| CN213593668U (en) | Foam laminating device for touch screen | |
| CN209740364U (en) | Automatic tape pasting mechanism with high tape pasting efficiency | |
| CN209487637U (en) | A kind of soft package lithium battery patch eyebrow gluing mechanism | |
| CN112392814A (en) | Automatic laminating equipment of fastener | |
| CN208290681U (en) | A kind of film-removing device | |
| CN221216337U (en) | Automatic layering and automatic grabbing device for cut pieces | |
| CN116369637B (en) | Zipper rubberizing punching machine | |
| CN220290844U (en) | Long-direction rubberizing device for cylindrical battery | |
| CN214988276U (en) | Cotton clamping mechanism for notebook computer | |
| CN218987186U (en) | Multi-head same-action film tearing device for mobile phone cover plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |