CN217656794U - High-precision metallized semi-hole circuit board - Google Patents
High-precision metallized semi-hole circuit board Download PDFInfo
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- CN217656794U CN217656794U CN202123388684.1U CN202123388684U CN217656794U CN 217656794 U CN217656794 U CN 217656794U CN 202123388684 U CN202123388684 U CN 202123388684U CN 217656794 U CN217656794 U CN 217656794U
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- circuit board
- circuit
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- printed wiring
- fin
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Abstract
The utility model belongs to the technical field of the circuit board technique and specifically relates to a high-accuracy metallization half-hole circuit board, it includes insulating resin layer, circuit panel and circuit bottom plate, be provided with a plurality of printed wiring piece on the circuit panel, the front and back end of printed wiring piece all is provided with a plurality of metal half-holes, the front and back end between the adjacent printed wiring piece all is provided with fixed connecting strip, the front and back end between the adjacent printed wiring piece and the inboard that is located fixed connecting strip are connected with first fin and second fin respectively, the welding has the heat dissipation net between first fin and the second fin; the utility model discloses be provided with half hole of sufficient metal in the limited area of circuit board, and can additionally not occupy the area of circuit board, ensure the result of use, in addition, also can make full use of circuit board remaining place, the structure is comparatively compact, when additionally not occupying the circuit board area, increases radiating function, effectively reduces the fault rate.
Description
Technical Field
The utility model belongs to the technical field of the circuit board technique and specifically relates to a high-accuracy metallization half-hole circuit board.
Background
Conductive patterns formed by making printed circuits, printed components, or a combination of both, on an insulating material in a predetermined design are commonly referred to as printed circuits. And a conductive pattern on the insulating substrate that provides electrical connection between the components is called a printed wiring. The finished board of the printed circuit or printed circuit is then referred to as a printed circuit board, also known as a printed circuit board or printed circuit board.
The existing metallized semi-hole circuit board mainly has the following problems: (1) For a circuit board applied to high-precision equipment, the circuit board needs to have more functions in a limited area, so that the design of a metal half hole becomes particularly important, the metal half hole of the existing circuit board is generally designed with holes at the unilateral edge, if the number of the half holes is insufficient, the metal half hole is designed in the circuit board, but in this way, the area of the circuit board occupied by the metal half hole is inevitably increased, and the use effect is further reduced; (2) Similarly, the circuit board is in limited area, if add and establish the heat dissipation function, also can increase the area of circuit board, if do not add and establish the heat dissipation function, will reduce the radiating effect of circuit board, last high temperature, probably burn off the circuit board, cause the trouble.
Disclosure of Invention
Not enough to prior art, the utility model provides a high-accuracy metallization half-hole circuit board, this circuit board is through improving the back, can effectively solve the problem that proposes among the above-mentioned background art.
The technical scheme of the utility model is that:
a high-precision metallized semi-hole circuit board is characterized in that: it includes insulating resin layer, circuit board and circuit board, insulating resin layer's top surface is provided with circuit board, insulating resin layer's bottom surface is provided with circuit board, insulating resin layer, circuit board and circuit board's the outside is connected with the frame jointly, be provided with a plurality of printed wiring piece on the circuit board, the front and back end of printed wiring piece all is provided with half hole of a plurality of metal, front and back end between the adjacent printed wiring piece all is provided with the fixed connection strip, front and back end between the adjacent printed wiring piece and the inboard that is located the fixed connection strip are connected with first fin and second fin respectively, the welding has the radiator-grid between first fin and the second fin.
Further, the metal half-hole is communicated with the insulating resin layer and extends to the circuit bottom plate.
Furthermore, the insulating resin layer and the fixed connecting strip are made of epoxy resin.
Furthermore, the circuit panel and the circuit bottom plate are correspondingly arranged.
Furthermore, gaps are arranged between the front ends and the rear ends of the circuit panel and the circuit bottom plate and the frame.
Furthermore, the left side surface and the right side surface of the printed circuit block are coated with insulating ink layers.
The utility model has the advantages that: the utility model discloses an all be provided with half hole of a plurality of metal at the front and back end of printed wiring piece, be provided with half hole of sufficient metal in the limited area of circuit board, and can additionally not occupy the area of circuit board, ensure the result of use, in addition, through connect fin and radiator-grid between adjacent printed wiring piece, also can make full use of circuit board remaining place, the structure is comparatively compact, when additionally not occupying the circuit board area, increase radiating function, make the radiating effect of circuit board obtain further improvement, effectively reduce the fault rate.
Drawings
FIG. 1 is a schematic diagram of the hierarchical structure of the present invention;
fig. 2 is a top view of the present invention.
In the figure, 1, an insulating resin layer; 2. a circuit panel; 3. a circuit substrate; 4. a frame; 5. a printed wiring block; 6. a metal half-hole; 7. fixing the connecting strip; 8. a first heat sink; 9. a second heat sink; 10. a heat-dissipating web; 11. a gap; 12. and an insulating ink layer.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings:
as shown in fig. 1-2, a high-precision metallization half-hole circuit board, it includes insulating resin layer 1, circuit panel 2 and circuit bottom plate 3, the top surface of insulating resin layer 1 is provided with circuit panel 2, the bottom surface of insulating resin layer 1 is provided with circuit bottom plate 3, the outside of insulating resin layer 1, circuit panel 2 and circuit bottom plate 3 is connected with frame 4 jointly, be provided with a plurality of printed wiring piece 5 on the circuit panel 2, the front and back end of printed wiring piece 5 all is provided with a plurality of metal half-hole 6, the front and back end between the adjacent printed wiring piece 5 all is provided with fixed connection strip 7, the front and back end between the adjacent printed wiring piece 5 and the inboard that is located fixed connection strip 7 are connected with first fin 8 and second fin 9 respectively, the welding has heat dissipation net 10 between first fin 8 and the second fin 9.
The metal half-hole 6 is communicated with the insulating resin layer 1 and extends to the circuit bottom plate 3.
The insulating resin layer 1 and the fixed connecting strip 7 are both made of epoxy resin.
The circuit panel 2 and the circuit bottom plate 3 are correspondingly arranged.
The left side and the right side of the printed circuit block 5 are coated with insulating ink layers 12.
The utility model discloses in, the structure is comparatively compact, and the maximize utilizes the area of circuit board for the circuit board not only realizes functions such as heat dissipation in limited area, and in addition, half hole 6 of sufficient metal is favorable to the weldment work of high-accuracy multi-functional circuit board, uses comparatively extensively, improves practicality.
The foregoing embodiments and description have been provided to illustrate the principles and preferred embodiments of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed.
Claims (6)
1. A high-precision metallized semi-hole circuit board is characterized in that: it includes insulating resin layer (1), circuit panel (2) and circuit bottom plate (3), the top surface of insulating resin layer (1) is provided with circuit panel (2), the bottom surface of insulating resin layer (1) is provided with circuit bottom plate (3), the outside of insulating resin layer (1), circuit panel (2) and circuit bottom plate (3) is connected with frame (4) jointly, be provided with a plurality of printed wiring piece (5) on circuit panel (2), the front and back end of printed wiring piece (5) all is provided with a plurality of metal half-hole (6), front and back end between adjacent printed wiring piece (5) all is provided with fixed connection strip (7), the front and back end between adjacent printed wiring piece (5) and the inboard that is located fixed connection strip (7) are connected with first fin (8) and second fin (9) respectively, the welding has radiator-grid (10) between first fin (8) and second fin (9).
2. A high-precision metallized semi-hole circuit board according to claim 1, characterized in that: the metal half-hole (6) is communicated with the insulating resin layer (1) and extends to the circuit bottom plate (3).
3. A high precision metallized half hole circuit board as claimed in claim 2, wherein: the insulating resin layer (1) and the fixed connecting strips (7) are made of epoxy resin.
4. A high-precision metallized semi-hole circuit board according to claim 3, wherein: the circuit panel (2) and the circuit bottom plate (3) are correspondingly arranged.
5. A high precision metallized half-hole circuit board as claimed in claim 4, wherein: gaps (11) are arranged between the front ends and the rear ends of the circuit panel (2) and the circuit bottom plate (3) and the frame (4).
6. A high precision metallized half hole circuit board as claimed in claim 5, wherein: and insulating ink layers (12) are coated on the left side surface and the right side surface of the printed circuit block (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123388684.1U CN217656794U (en) | 2021-12-29 | 2021-12-29 | High-precision metallized semi-hole circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123388684.1U CN217656794U (en) | 2021-12-29 | 2021-12-29 | High-precision metallized semi-hole circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217656794U true CN217656794U (en) | 2022-10-25 |
Family
ID=83659283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123388684.1U Active CN217656794U (en) | 2021-12-29 | 2021-12-29 | High-precision metallized semi-hole circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217656794U (en) |
-
2021
- 2021-12-29 CN CN202123388684.1U patent/CN217656794U/en active Active
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