CN217656658U - Circuit board module, camera and electronic equipment - Google Patents
Circuit board module, camera and electronic equipment Download PDFInfo
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- CN217656658U CN217656658U CN202220721209.7U CN202220721209U CN217656658U CN 217656658 U CN217656658 U CN 217656658U CN 202220721209 U CN202220721209 U CN 202220721209U CN 217656658 U CN217656658 U CN 217656658U
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- circuit board
- photosensitive chip
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Abstract
The present disclosure relates to the technical field of optical imaging devices, and in particular, to a circuit board module, a camera and an electronic device. The circuit board module provided by the disclosure comprises a circuit board, a photosensitive chip and protective glass; a concave part is arranged in the circuit board; the photosensitive chip is embedded in the concave part and is electrically connected with the circuit board; wherein, one side of the circuit board is also provided with protective glass corresponding to the photosensitive chip. The circuit board module can increase the distance between the photosensitive chip and the protective glass on the premise of not changing the thickness of the circuit board or the photosensitive chip, and has the beneficial effect of being beneficial to eliminating the influence of dust particles and stray light on the imaging quality of the photosensitive chip.
Description
Technical Field
The present disclosure relates to the technical field of optical imaging devices, and in particular, to a circuit board module, a camera and an electronic device.
Background
The camera, as a common optical imaging device, plays an indispensable role in the fields of mobile phones, computers, unmanned aerial vehicles, smart homes, security, automobiles and the like. A conventional camera generally includes a lens, a lens holder, a photo sensor chip, and a circuit Board, wherein the photo sensor chip is mounted on the circuit Board in a COB (chip on Board) package, and then mounted inside the lens holder.
The sensing chip passes through on-board sensing chip encapsulation electricity to be connected and sets up in the top of circuit board in current camera, and bellied sensing chip and sensing chip top cover glass's distance can corresponding shrink on the circuit board, is unfavorable for eliminating the influence of dust and miscellaneous light to sensing chip image quality.
Therefore, the photosensitive chip mounting mode of the camera in the prior art has the problems of small distance with the protective glass and being not beneficial to eliminating the influence of dust particles and stray light on the imaging quality of the photosensitive chip.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem or at least partially solve the above technical problem, the present disclosure provides a circuit board module, which includes a circuit board, a photosensitive chip, a heat dissipation member, and a mounting bracket;
the circuit board is provided with a concave part;
the photosensitive chip is embedded in the concave part and is electrically connected with the circuit board;
and one side of the circuit board is also provided with protective glass corresponding to the photosensitive chip.
In one possible design, a convex mounting rack is further arranged on one side, provided with the protective glass, of the circuit board;
the cover glass is arranged on the mounting frame.
In one possible design, the protective glass is sealed to the mounting frame;
the mounting frame is sealed and closed on the circuit board.
In one possible design, the recess is a hollowed-out portion penetrating through the circuit board;
the circuit board module further comprises a heat dissipation piece arranged on the other side of the circuit board.
In one possible design, one side of the photosensitive chip is bonded with the heat dissipation piece through heat conduction glue;
the other side of the photosensitive chip is flush with the board surface of the circuit board.
In a possible design, the heat sink further has a bearing part corresponding to the photosensitive chip;
the bearing part is a boss protruding towards the photosensitive chip or a groove recessed away from the photosensitive chip.
In a possible design, the heat dissipation piece is a metal plate layer and is bonded with the circuit board in a sealing mode through heat-conducting glue, wherein the heat-conducting glue is far away from one side of the board surface of the protective glass.
In one possible design, the circuit board comprises a flexible board layer and hard board layers attached to two sides of the flexible board layer;
the flexible plate layer and the hard plate layer are respectively and correspondingly provided with hollow parts for embedding the photosensitive chips;
the hollow parts together form the concave part.
In addition, the present disclosure also provides a camera, which includes the above circuit board module and the housing;
the inside of casing has the appearance chamber, just circuit board module set is fixed set up in the appearance chamber.
In addition, the present disclosure also provides an electronic device, which includes a device body and the camera.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:
the circuit board module provided by the embodiment of the disclosure comprises a circuit board, a photosensitive chip and a heat dissipation piece; a concave part is arranged in the circuit board; the photosensitive chip is embedded in the concave part and is electrically connected with the circuit board; the heat dissipation part is arranged on one side plate surface of the circuit board; wherein, one side of the circuit board is also provided with protective glass corresponding to the photosensitive chip.
This circuit board module is owing to set up the depressed part in the circuit board, and inlay the sensitization chip and adorn in the depressed part and be connected with the circuit board electricity, has increased the distance of sensitization face and circuit board top protective glass in the sensitization chip to reduce the influence of dirt particle and miscellaneous light to sensitization chip imaging quality, can increase sensitization chip and protective glass's distance under the prerequisite that does not change circuit board or sensitization chip thickness, have the beneficial effect that does benefit to and eliminates dirt particle and miscellaneous light to sensitization chip imaging quality influence.
In addition, this disclosure still provides a camera and an electronic equipment, and this camera and this electronic equipment include foretell circuit board module, all can realize its all beneficial effects, and no longer give consideration to here.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a circuit board module according to an embodiment of the disclosure;
fig. 2 is an exploded view of a circuit board module according to an embodiment of the present disclosure;
fig. 3 is a vertical cross-sectional view of a camera provided by an embodiment of the present disclosure;
fig. 4 is a perspective structural view of a camera provided in the embodiment of the present disclosure.
Reference numerals: 1. a circuit board; 11. a flexible sheet layer; 12. a hard plate layer; 13. a recessed portion; 2. a photosensitive chip; 3. a heat sink; 31. a bearing part; 4. a mounting frame; 41. protecting glass; 5. a housing; 51. and (4) radiating fins.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced otherwise than as described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
Referring to fig. 1, a circuit board module according to an embodiment of the present disclosure includes a circuit board 1 and a photosensitive chip 2; a hollow part is arranged in the circuit board 1; the photosensitive chip 2 is embedded in the hollow part and is electrically connected with the circuit board 1; wherein, one side of the circuit board 1 is also provided with a protective glass 41 corresponding to the photosensitive chip 2.
This circuit board module is owing to set up the depressed part in circuit board 1, inlays the sensitization chip 2 moreover and adorns in the depressed part and be connected with circuit board 1 electricity, has increased the distance of sensitization face and protection glass 41 in the 1 top mounting bracket 4 of circuit board in the sensitization chip 2 to reduce the influence of dust particle and miscellaneous light to sensitization chip 2 imaging quality.
In conclusion, this circuit board module is through inlaying sensitization chip 2 dress and setting up in circuit board 1, can increase sensitization chip 2 and protective glass 41's distance under the prerequisite that does not change circuit board 1 or sensitization chip 2 thickness, has the beneficial effect that does benefit to and eliminates dust particle and veiling glare and to sensitization chip 2 imaging quality influence.
In some specific embodiments, the side of the circuit board 1 where the protective glass 41 is arranged is also provided with a raised mounting rack 4; the cover glass 41 is provided to the mount 4.
Specifically, as shown in fig. 1, the distance between the photosensitive chip 2 and the protective glass 41 can be further increased by providing the mounting frame 4, and the mounting frame 4 can be set as high as possible within the allowable height range of the mounting station of the circuit board module.
In some embodiments, the cover glass 41 is hermetically sealed to the mounting frame 4; the mounting rack 4 is sealed and covered on the circuit board 1.
Specifically, as shown in fig. 1, the protective glass 41 may be sealed and covered on the mounting frame 4 by an adhesive, and the mounting frame 4 may also be sealed and covered on the circuit board 1 by an adhesive, so that the protective glass 41 and the mounting frame 4 completely seal the photosensitive surface side of the photosensitive chip 2, and dust particles outside the protective glass 41 are prevented from entering therein to affect the imaging quality of the photosensitive chip 2. It should be noted that the fixing of the cover glass 41 may be performed directly by a glue of a certain height without using a separate mounting bracket.
The material of the mounting frame 4 may be plastic, metal or composite material, and it is only necessary that the material itself has sufficient air tightness.
In some specific embodiments, the recess 13 is a hollow-out portion penetrating through the circuit board 1; the circuit board module further comprises a heat dissipation member 3 arranged on the other side of the circuit board 1.
Specifically, as shown in fig. 1, the recess 13 is specifically set to a hollow portion penetrating through the circuit board 1, and the heat dissipation member 3 is additionally disposed on the other side of the circuit board 1, so that the heat dissipation member 3 can directly contact with the photosensitive chip 2 for heat dissipation, thereby improving the heat dissipation and cooling effects on the photosensitive chip 2, and on the other hand, the heat dissipation member 3 can also support and bear the photosensitive chip 2 to a certain extent. In addition, through the fretwork design, make sensitization chip 2 bury completely in circuit board 1, the upper and lower both ends of sensitization chip 2 can be completely with the upper and lower both sides face parallel and level of circuit board 1 like this, improved circuit board 1's whole roughness on the one hand, on the other hand has increased sensitization face in sensitization chip 2 and circuit board 1 top mounting bracket 4 in the distance of protecting glass 41 more to reduce the influence of dust particle and parasitic light to sensitization chip 2 imaging quality.
In some embodiments, one side of the photosensitive chip 2 is bonded to the heat sink 3 by a thermally conductive adhesive; the other side of the photosensitive chip 2 is flush with the surface of the circuit board 1.
Specifically, as shown in fig. 1, the non-photosensitive side of the photosensitive chip 2 is bonded with the heat dissipation member 3 through the heat conductive adhesive, so that the heat dissipation member 3 can also directly dissipate heat and cool the photosensitive chip 2 while dissipating heat and cooling the circuit board 1, thereby further improving the heat dissipation effect of the heat dissipation member 3 on the circuit board module.
In addition, it should be noted that when other types of chips are additionally disposed in the circuit board 1, an additional heat dissipation portion may be correspondingly disposed in the heat dissipation member 3, so that each chip can have one heat dissipation portion corresponding to the chip to perform cooling.
In some specific embodiments, the heat sink 3 further has a carrier 31 corresponding to the photosensitive chip 2; the bearing portion 31 is a boss protruding toward the photosensitive chip 2 or a groove recessed away from the photosensitive chip 2.
Specifically, as shown in fig. 2, when the thickness of the photosensitive chip 2 is greater than that of the circuit board 1, the bearing portion 31 may be disposed to be away from the recessed groove of the photosensitive chip 2, and the photosensitive chip 2 is further accommodated by the recessed bearing portion 31, so that the photosensitive surface of the photosensitive chip 2 may be flush with the other side board surface of the circuit board 1; when the thickness of sensitization chip 2 is less than the thickness of circuit board 1, bearing part 31 alright set to towards the bellied boss of sensitization chip 2, further hold the top through bellied bearing part 31 and hold in the palm sensitization chip 2, can make the sensitization face of sensitization chip 2 can with the opposite side face parallel and level of circuit board 1 equally.
The mounting position of the hollow part of the photosensitive chip 2 in the circuit board 1 can be flexibly adjusted by arranging the bearing part 31, so that the photosensitive chips 2 with different thicknesses can be properly mounted in the circuit board 1.
In some specific embodiments, the heat sink 3 is a metal plate layer, and is hermetically bonded to a side surface of the circuit board 1 facing away from the protective glass 41 by a heat conducting adhesive.
Specifically, as shown in fig. 1, the heat dissipation member 3 is preferably but not limited to be a copper metal plate layer, copper metal has excellent heat conduction and heat dissipation performance, and also has excellent structural strength, the copper heat dissipation member 3 is sealed and bonded with one side of the circuit board 1 away from the protective glass 41 through heat conduction glue, that is, the excellent heat dissipation performance of the circuit board module can be ensured, the non-photosensitive side of the photosensitive chip 2 can be sealed, and dust particles on the bottom side of the circuit board 1 can be prevented from entering the photosensitive side of the photosensitive chip 2 through the hollow portion to affect the imaging quality of the photosensitive chip 2.
In some specific embodiments, the circuit board 1 includes a flexible board layer 11 and a hard board layer 12 attached to both sides of the flexible board layer 11; wherein, the flexible board layer 11 and the hard board layer 12 are respectively and correspondingly provided with a hollow part for embedding the photosensitive chip 2; the hollow parts together form the concave part.
Specifically, as shown in fig. 1, the flexible board layer 11 may be, but not limited to, a polyimide or polyester film, which can ensure that the flexible board layer 11 has better flexibility and excellent bending property, and the rigid board layer 12 only needs to be made of a material having excellent thermal conductivity and certain hardness and plasticity. The circuit board 1 is provided with the soft and hard composite board body formed by combining the flexible board layer 11 and the hard board layer 12, so that the circuit board 1 can have better material performance and can be suitable for more use and installation working conditions.
Moreover, the flexible board layer 11 and the hard board layer 12 are respectively and correspondingly provided with a hollow part for embedding the photosensitive chip 2, so that the photosensitive chip 2 can be embedded in the flexible board layer 11 and the hard board layer 12, and even if the heat dissipation part 3 is arranged at the bottom side of the hard board layer 12 below the flexible board layer 11, one side of the photosensitive chip 2 can be adhered to the heat dissipation part in the heat dissipation part 3 through heat conduction glue.
In addition, the embodiment of the present disclosure further provides a camera, which includes the above circuit board module and the housing 5; the inside of casing 5 has the appearance chamber, and the circuit board module is fixed to be set up in holding the chamber.
Specifically, as shown in fig. 3, the camera includes the circuit board module, so that all the beneficial effects of the circuit board module can be achieved, and further description is omitted here.
In some specific embodiments, the heat sink 3 further includes a connection portion for connecting with a wall of the housing 5; and the connecting part is bonded with the wall of the shell 5 through heat-conducting glue.
Specifically, as shown in fig. 3, the heat generated by the heat dissipating member 3 through the heat conducting glue and the wall of the housing 5 can be transferred to the wall of the housing 5 in the camera through the heat dissipating member 3 by using the heat generated by the circuit board module inside the housing 5, and the housing 5, the lens barrel and the lens in the camera can be heated up to a certain extent, so that the camera can dissipate heat more efficiently and reduce the problem of fogging of lens frost.
Moreover, the casing 5 may further include a metal shell plate at a position corresponding to the connection portion of the heat sink 3, and the metal shell plate may more efficiently dissipate heat transferred from the heat sink 3 to each wall of the casing 5.
In some specific embodiments, the housing wall of the housing 5 is further provided with heat dissipating fins 51.
Specifically, as shown in fig. 4, the heat radiation fins 51 are specifically provided in a plurality of thin plates which are spaced from each other and extend vertically upward, and the plurality of heat radiation fins 51 are provided in an annular array with respect to the optical axis of the lens. The radiating fins 51 with the structure directly increase the heat exchange area of the outer wall of the shell 5 contacted with air, and a radiating gap is formed between every two adjacent radiating fins 51, so that the air can smoothly rise and diffuse upwards along the radiating gap after being heated in the radiating gap.
The heat dissipating fin 51 may have a straight plate shape as shown in fig. 3, an arc shape, an S-shape, or some other irregular shape.
In some embodiments, the heat dissipating fins 51 are integrally formed with the housing 5.
The heat radiating fins 51 and the shell 5 are also integrally formed, so that the heat radiating fins 51 and the shell 5 can be directly machined and formed through an injection molding process, the camera structure is simplified, meanwhile, the assembling procedure of the heat radiating fins 51 and the shell 5 is omitted, and the problem of assembling errors of the heat radiating fins 51 and the shell 5 is avoided.
In addition, the embodiment of the disclosure also provides an electronic device, which comprises a device body and the camera.
The electronic equipment also comprises the circuit board module, so that all the beneficial effects of the circuit board module can be realized, and the description is omitted.
In addition, the electronic device may be, but is not limited to, a camera, a mobile phone, a computer, an unmanned aerial vehicle, a smart home camera device, a security camera device, a vehicle-mounted camera device, and the like, which are not listed in detail herein.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A circuit board module, comprising:
the circuit board is provided with a concave part;
the photosensitive chip is embedded in the concave part and is electrically connected with the circuit board;
and one side of the circuit board is also provided with protective glass corresponding to the photosensitive chip.
2. The circuit board module according to claim 1, wherein a raised mounting frame is further arranged on one side of the circuit board, which is provided with the protective glass;
the cover glass is arranged on the mounting frame.
3. The circuit board module as claimed in claim 2, wherein the cover glass is hermetically sealed to the mounting frame;
the mounting frame is sealed and closed on the circuit board.
4. The circuit board module according to claim 1, wherein the recessed portion is a hollowed-out portion penetrating through the circuit board;
the circuit board module further comprises a heat dissipation piece arranged on the other side of the circuit board.
5. The circuit board module as claimed in claim 4, wherein one side of the photosensitive chip is bonded to the heat sink by a thermal conductive adhesive;
the other side of the photosensitive chip is flush with the board surface of the circuit board.
6. The circuit board module as claimed in claim 5, wherein the heat sink further has a carrier corresponding to the light sensing chip;
the bearing part is a boss protruding towards the photosensitive chip or a groove recessed away from the photosensitive chip.
7. The circuit board module according to claim 4, wherein the heat sink is a metal plate layer, and is hermetically bonded to a side of the circuit board facing away from the cover glass by a thermal conductive adhesive.
8. The circuit board module according to any one of claims 1 to 7, wherein the circuit board comprises a flexible board layer and hard board layers attached to two sides of the flexible board layer;
the flexible plate layer and the hard plate layer are respectively and correspondingly provided with a hollow part for embedding the photosensitive chip;
the hollow parts together form the concave part.
9. A camera comprising the circuit board module according to any one of claims 1 to 8, wherein the camera further comprises a housing;
the inside of casing has the appearance chamber, just circuit board module set is fixed set up in the appearance chamber.
10. An electronic apparatus comprising an apparatus body and the camera of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220721209.7U CN217656658U (en) | 2022-03-29 | 2022-03-29 | Circuit board module, camera and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220721209.7U CN217656658U (en) | 2022-03-29 | 2022-03-29 | Circuit board module, camera and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217656658U true CN217656658U (en) | 2022-10-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220721209.7U Active CN217656658U (en) | 2022-03-29 | 2022-03-29 | Circuit board module, camera and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217656658U (en) |
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2022
- 2022-03-29 CN CN202220721209.7U patent/CN217656658U/en active Active
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