CN217655872U

CN217655872U - Diode pin lead frame

Info

Publication number: CN217655872U
Application number: CN202221649602.6U
Authority: CN
Inventors: 刘永兴; 刘永东
Original assignee: Guangdong Juxin Semiconductor Technology Co ltd
Current assignee: Guangdong Juxin Semiconductor Technology Co ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-10-25
Anticipated expiration: 2032-06-28

Abstract

The utility model provides a diode participates in lead frame, including at least one body spare, body spare one side is equipped with the installation department that is used for placing the chip, the installation department is kept away from body spare one side is equipped with the pin, be equipped with the weld part on the pin, the weld part is along the perpendicular to the length of pin direction is 4-5 millimeters, the weld part is along being on a parallel with the length of pin direction is 2-3 millimeters. The diode of this structure participates in the lead frame, and the weld part is along perpendicular or being on a parallel with the length of pin direction has all obtained the increase, consequently the area in pressure welding district has increased, for prior art, this practicality can satisfy the many thick aluminium wire demands of welding.

Description

Diode pin lead frame

Technical Field

The utility model relates to a semiconductor manufacturing field, concretely relates to diode participate in lead frame.

Background

A diode is an electronic device made of semiconductor material. It has one-way conducting performance, that is, when positive voltage is applied to the anode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off. Therefore, turning on and off the diode corresponds to turning on and off the switch.

In the process of packaging the semiconductor device by adopting the TO220 packaging lead frame in the prior art, a chip packaged in the semiconductor device needs TO be electrically connected with a pin of the TO220 packaging lead frame by using a wire, at present, a welding part is usually arranged at one end of the pin of the TO220 packaging lead frame, and then two ends of the wire are respectively welded on the chip and the welding part, so that the chip is electrically connected with the pin of the TO220 packaging lead frame.

However, when a chip with larger power needs TO be packaged, because the welding area of the welding part on the TO220 packaging lead frame is smaller, more aluminum wires are needed, and the aluminum wires cannot be completely welded at the welding part during welding.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model aims TO solve the technical problem that when needing TO encapsulate great powerful chip among the prior art, because the area of can welding of welding part is less on the TO220 encapsulation lead frame, required aluminium wire is more, can't weld aluminium wire in the welding part completely when leading TO the welding.

Therefore, in order to solve the technical problem, the utility model provides a diode participates in lead frame, including at least one body spare, body spare one side is equipped with the installation department that is used for placing the chip, the installation department is kept away from body spare one side is equipped with the pin, be equipped with the weld part on the pin, the weld part is along the perpendicular to the length of pin direction is 4-5 millimeters, the weld part is along being on a parallel with the length of pin direction is 2-3 millimeters.

Optionally, the length of the soldering portion in the direction perpendicular to the lead is 4.5mm, and the length of the soldering portion in the direction parallel to the lead is 2.5mm.

Optionally, the welding part has a rectangular structure.

Optionally, the weld is welded with two aluminum wires with a diameter of 500 microns.

Optionally, the weld is welded with three aluminum wires having a diameter of 380 microns.

Optionally, the mounting part further comprises a middle pin, and the middle pin is connected with the mounting part through a connecting piece.

Optionally, the included angle between the plane where the connecting piece is located and the pin and the mounting portion is 120 °.

Optionally, the heat dissipation device further comprises a heat dissipation part connected to the mounting part.

Optionally, the pin further comprises a first connecting rib and a second connecting rib, the top of the pin is connected through the first connecting rib, and the bottom of the pin is connected through the second connecting rib.

The utility model discloses following beneficial effect has:

the utility model provides a diode participates in lead frame, including at least one body spare, body spare one side is equipped with the installation department that is used for placing the chip, the installation department is kept away from body spare one side is equipped with the pin, be equipped with the weld part on the pin, the weld part is along the perpendicular to the length of pin direction is 4-5 millimeters, the weld part is along being on a parallel with the length of pin direction is 2-3 millimeters.

The diode of this structure participates in the lead frame, and the weld part is along perpendicular or being on a parallel with the length of pin direction has all obtained the increase, consequently the area in pressure welding district has increased, for prior art, this practicality can satisfy many thicker aluminium wire demands of welding.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of a diode pin lead frame according to the present invention;

fig. 2 is a front view of the body member, the mounting portion, the welding portion and the lead pin of the diode pin lead frame of the present invention;

fig. 3 is a side view of fig. 2.

Description of reference numerals:

1-a body member; 2-an installation part; 3-a pin; 4-a weld; 5-middle pin; 6-a connecting piece; 7-a heat-dissipating section; 81-first connecting ribs; 82-second connecting rib.

Detailed Description

The technical solutions of the present invention will be described more clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, the technical features mentioned in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

As shown in fig. 1 to 3, the diode pin lead frame according to the present embodiment includes a plurality of body members 1, and each body member 1 includes two pins 3, a mounting portion 2, a heat dissipation portion 7, a first connection rib 81, a second connection rib 82, a third connection rib 83, and a middle pin 5. The heat dissipation portion 7 is connected to the mounting portion 2.

As shown in fig. 2, the leads 3 are provided with the soldering portions 4, the length of the soldering portions 4 in the direction perpendicular to the leads 3 is 4 mm, and the length of the soldering portions 4 in the direction parallel to the leads 3 is 2 mm. In actual production, two aluminum wires with a diameter of 500 micrometers are welded on the welding portion 4, or three aluminum wires with a diameter of 380 micrometers or aluminum wires with other sizes are welded on the welding portion 4, and those skilled in the art can select an appropriate aluminum wire according to requirements. Weld part 4 has all obtained the increase along the length of perpendicular or being on a parallel with 3 directions of pin, and consequently the area in pressure welding district has increased, for prior art, this practicality can satisfy many thicker aluminium wire demands of welding.

As another embodiment of this embodiment, the length of the soldering portion 4 in the direction perpendicular to the leads 3 is 5mm, and the length of the soldering portion 4 in the direction parallel to the leads 3 is 3 mm.

As shown in fig. 1 and 2, the middle pin 5 is connected to the mounting portion 2 through the connecting member 6, and the included angle between the plane of the connecting member 6 and the pin 3 and the mounting portion 2 is 120 °.

As shown in fig. 2, the tops of the pins 3 are connected by the first connecting rib 81, the bottoms of the pins 3 are connected by the second connecting rib 82, and the plurality of pins 3 can be connected as a whole by the first connecting rib 81 and the second connecting rib 82.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. The utility model provides a diode participates in lead frame which characterized in that, includes at least one body spare, body spare one side is equipped with the installation department that is used for placing the chip, the installation department is kept away from body spare one side is equipped with the pin, be equipped with the welding part on the pin, the welding part is along the perpendicular to the length of pin direction is 4-5 millimeters, the welding part is along being on a parallel with the length of pin direction is 2-3 millimeters.

2. The diode pin lead frame according to claim 1, wherein the length of the soldering portion in a direction perpendicular to the lead direction is 4.5mm, and the length of the soldering portion in a direction parallel to the lead direction is 2.5mm.

3. The diode pin lead frame according to claim 2, wherein the soldering portion has a rectangular configuration.

4. The diode pin lead frame according to claim 2 or 3, wherein the soldering portion is soldered with two aluminum wires having a diameter of 500 μm.

5. The diode pin lead frame according to claim 2 or 3, wherein the solder portion is soldered with three aluminum wires having a diameter of 380 μm.

6. The diode pin lead frame according to any one of claims 1 to 3, further comprising a middle pin connected to the mounting portion by a connector.

7. The diode pin lead frame according to claim 6, wherein the plane of the connector is at 120 ° to the pin and mounting portion.

8. The diode pin lead frame according to claim 6, further comprising a heat sink portion connected to the mounting portion.

9. The diode pin lead frame according to claim 8, further comprising a first connecting rib and a second connecting rib, wherein the top portions of the pins are connected by the first connecting rib, and the bottom portions of the pins are connected by the second connecting rib.