CN217647714U

CN217647714U - Mask manufacturing apparatus

Info

Publication number: CN217647714U
Application number: CN202220723375.0U
Authority: CN
Inventors: 黄圭焕; 金桢国; 金辉; 南刚铉; 朴相河; 李娥凛; 赵恩翡; 晋丞民; 洪宰敏
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2021-08-05
Filing date: 2022-03-30
Publication date: 2022-10-25
Anticipated expiration: 2032-03-30
Also published as: CN115703168A; KR20230022312A

Abstract

The utility model discloses a mask manufacturing installation of an embodiment can include: a stage supporting an object mask, wherein the object mask may include: an object mask sheet comprising a front surface and a back surface; and a mask frame including an upper surface facing the rear surface and a lower surface opposite to the upper surface. The stage may include: a first support unit that supports the target mask sheet: and a second support portion supporting the mask frame, wherein the first support portion and the second support portion have a step difference in a thickness direction.

Description

Mask manufacturing apparatus

Technical Field

The present invention relates to a mask manufacturing apparatus, and more particularly, to a mask manufacturing apparatus using laser.

Background

Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigators, game consoles, and the like may include a display panel for displaying images. The display panel may include a plurality of pixels for displaying an image, and each of the pixels may include a light emitting element generating light and a driving element connected to the light emitting element. As such, the display panel may be formed by stacking various functional layers on a substrate.

The functional layers constituting the display panel may be provided by patterning using a mask having an open region in which a through portion is defined. In this case, in order to improve the deposition quality of the patterned functional layer, it is necessary to develop a method and an apparatus for manufacturing a mask, which are used for precision processing.

SUMMERY OF THE UTILITY MODEL

Problems to be solved

An object of the utility model is to provide a mask manufacturing installation for making the mask that the reliability improves.

An object of the utility model is to provide a mask manufacturing installation for making the mask that can realize accurate deposition processing.

Solving means

An embodiment provides a mask manufacturing apparatus, comprising: a stage supporting an object mask, wherein the object mask includes: an object mask sheet comprising a front surface and a back surface; and a mask frame including an upper surface facing the rear surface and a lower surface opposite to the upper surface, the stage including: a first support portion that supports the subject mask sheet; and a second support portion supporting the mask frame, wherein the first support portion and the second support portion may have a step difference in a thickness direction.

The first support part may include a first surface facing the rear surface or the front surface of the object mask sheet, the second support part may include a second surface facing the lower surface or the upper surface of the mask frame, and the step difference may correspond to a distance between the first surface and the second surface in the thickness direction.

The first support part and the second support part may be formed in one body.

The second support portion may surround the first support portion.

The stage may include a first state in which the first surface faces a front surface of the object mask and a second state in which the first surface faces a rear surface of the object mask, and in the first state, the rear surface of the object mask faces a processing laser, and in the second state, the laser may be irradiated onto the front surface of the object mask.

The stage in the first state may further include a third support portion arranged on the second support portion, wherein each of the first support portion and the third support portion may support the front surface of the subject mask sheet.

The thickness of the third support portion may be the same as the step difference.

The second support portion may have a first position corresponding to the first state and a second position corresponding to the second state, with a height difference therebetween in the thickness direction.

In the first state, the second surface of the second support portion may be flush with the first surface in cross section, and each of the first support portion and the second support portion may support the front surface of the subject mask.

In the second state, the second surface of the second support portion may have the step difference in cross section from the first surface, and the first support portion may support the rear surface of the subject mask sheet, and the second support portion may support the lower surface of the mask frame.

The step difference may be equal to a height difference between the rear surface of the object mask sheet and the lower surface of the mask frame in a thickness direction.

The object mask may have a plurality of preliminary cell opening portions defined therein, and the light irradiation portion may irradiate the laser light on the front surface of the object mask along peripheries of the preliminary cell opening portions.

The first support may include an electrostatic chuck and an insulating layer disposed on the electrostatic chuck.

The insulating layer may contact the object mask sheet.

The first support part may include a magnet and an insulating layer disposed on the magnet.

The laser may include at least one of a femtosecond pulsed laser and a picosecond pulsed laser.

The wavelength of the laser light may include a wavelength range of 300nm or more and 1100nm or less.

An embodiment of the present invention provides a mask manufacturing apparatus, including: a stage supporting an object mask including an object mask sheet and a mask frame coupled to the object mask sheet; and a light irradiation section that is arranged on the stage and irradiates the subject mask with laser light, wherein the subject mask includes a rear surface facing the mask frame and a front surface opposite to the rear surface, the stage includes a first state of supporting the front surface of the subject mask and a second state of supporting the rear surface of the subject mask, in the first state, the stage includes a first portion supporting the front surface of the subject mask and a second portion overlapping the mask frame and supporting the front surface of the subject mask, and in the second state, the first portion and the second portion of the stage have a step difference therebetween.

The step difference may be equal to a height difference between the rear surface of the object mask sheet and the lower surface of the mask frame in cross section.

The first portion may include at least one of an electrostatic chuck and a magnet.

Advantageous effects

According to the present invention, a mask manufacturing apparatus can precisely process an open region of a mask using laser.

According to the present invention, a mask manufacturing apparatus can stably fix a mask in a process of irradiating a laser beam to the mask.

According to an embodiment of the present invention, a mask manufacturing apparatus can process a mask by irradiating laser to both surfaces of the mask, and therefore, reliability and accuracy of the mask manufacturing apparatus can be improved, and a mask in which a shadow area is minimized can be manufactured.

Drawings

Fig. 1a is a plan view of a display panel according to an embodiment of the present invention.

Fig. 1b is a cross-sectional view of a display panel according to an embodiment of the present invention, corresponding to line I-I' of fig. 1 a.

Fig. 2 is an exploded perspective view of a mask according to an embodiment of the present invention.

Fig. 3a and 3b are perspective views of a preliminary mask according to an embodiment of the present invention corresponding to one of the preliminary mask manufacturing steps.

Fig. 4a is a perspective view of a mask fabricating apparatus and an object mask according to an embodiment of the present invention, which corresponds to one of the object mask fabricating steps.

Fig. 4b is a perspective view of an object mask according to an embodiment of the present invention corresponding to one of the object mask manufacturing steps.

Fig. 5a is a perspective view of a mask fabricating apparatus and an object mask according to an embodiment of the present invention corresponding to one of the object mask fabricating steps.

Fig. 5b is a cross-sectional view of a mask fabricating apparatus according to an embodiment of the present invention, corresponding to line II-II' of fig. 5 a.

Fig. 6a to 6c are cross-sectional views of a stage of a mask fabricating apparatus according to an embodiment of the present invention.

Fig. 7a to 7c are sectional views showing one step of forming a preliminary cell opening portion in a subject mask sheet using a mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 8a to 8d are sectional views showing one step of forming a depression in a subject mask sheet using a mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 9 is a sectional view showing one step of forming a preliminary unit opening portion in a subject mask sheet using a mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 10 is a sectional view showing one step of forming a depression in a subject mask sheet using a mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 11a is a cross-sectional view illustrating one step of a deposition process performed using a mask manufactured by a mask manufacturing apparatus according to an embodiment of the present invention.

Fig. 11b is an enlarged sectional view corresponding to an area of fig. 11 a.

Description of reference numerals

MD: mask manufacturing apparatus MK: mask and method for manufacturing the same

MS: mask sheet FR: mask frame

And (3) OPC: cell opening OP: opening part

P-MKa, P-MKb: object masks P-MSa, P-MSb: object mask sheet

OPD: preliminary unit opening portion HFP: concave part

ST: a stage SP1: first supporting part

SP2: second support portion SP3: third support part

LS: light irradiation unit ISL: insulating layer

ESC: electrostatic chuck MGN: magnet body

Detailed Description

The present invention may take various forms and modifications, and specific embodiments thereof will be shown by way of example in the drawings and will herein be described in detail. However, the present invention is not intended to be limited to the particular forms disclosed, and it is to be understood that the present invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention.

In this specification, when a certain constituent element (or a region, a layer, a portion, or the like) is referred to as being "on" or "connected to" or "coupled to" another constituent element, it means that it may be directly arranged on/connected to/coupled to another constituent element or a third constituent element may be arranged therebetween.

Like reference numerals refer to like elements. In addition, in the drawings, the thickness, proportion, and size of the constituent elements are exaggerated to effectively explain the technical contents. "and/or" includes all more than one combination as may be defined by the associated constituent element.

The terms "first", "second", and the like are used to describe various constituent elements, but the above-described constituent elements should not be limited to the above-described terms. The above terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, a first component may be named as a second component, and similarly, a second component may also be named as a first component, without departing from the scope of the present invention. Unless the context clearly dictates otherwise, expressions in the singular include expressions in the plural.

Meanwhile, terms such as "under 8230 \\ 8230;," under 8230;, "" under 823030;, "" under 8230 ";," "under 82303030";, "" under 8230823030; over 8230;, "" under 8230;, "" and "over" are used to describe the relative relationships of the constituent elements shown in the drawings. The above terms are relative concepts and are described with reference to the directions shown in the drawings.

It will be understood that terms such as "including" or "having," and the like, are intended to specify the presence of stated features, integers, steps, actions, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, actions, components, or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Furthermore, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Hereinafter, a mask manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1a is a plan view of a display panel according to an embodiment. FIG. 1b is a cross-sectional view of a display panel according to an embodiment corresponding to line I-I' of FIG. 1 a.

The display panel DP may be a panel that is activated according to an electric signal and displays an image. The display panel DP may be used for various display devices. For example, the display panel DP may be included in large-sized devices such as a television set, an external billboard, and the like, and small-sized devices such as a monitor, a mobile phone, a tablet computer, a navigator, a game machine, and the like.

The display panel DP according to an embodiment may be a light emitting type display panel, and is not particularly limited. For example, the display panel DP may be an organic light emitting display panel, an inorganic light emitting display panel, or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel may include an organic light emitting substance, and the light emitting layer of the inorganic light emitting display panel may include an inorganic light emitting substance. The light emitting layer of the quantum dot light emitting display panel may include quantum dots, quantum rods, and the like. Hereinafter, the display panel DP is described as an organic light emitting display panel.

Fig. 1a schematically shows a plan view of the display panel DP as seen in the third direction DR3. Referring to fig. 1a, the display panel DP may include a plurality of light emitting areas PXA-R, PXA-G, PXA-B and a non-light emitting area NPXA surrounding the plurality of light emitting areas PXA-R, PXA-G, PXA-B.

Further, in the present specification, the third direction DR3 may be defined as a direction crossing a plane defined by the first direction DR1 and the second direction DR 2. The third direction DR3 may substantially perpendicularly intersect a plane defined by the first and second directions DR1 and DR 2.

The front surface (or upper surface) and the rear surface (or lower surface) of each part or unit may be defined based on a surface parallel to each of the first direction DR1 and the second direction DR2 as a reference. The front surface and the rear surface may be opposite to each other in the third direction DR3 (opposing), and a normal direction of each of the front surface and the rear surface may be substantially parallel to the third direction DR3.

In the present specification, the spaced distance between the front and rear surfaces defined along the third direction DR3 may correspond to the thickness of the part (or unit). In the present specification, the expression "on a plane" may be defined as a state observed in the third direction DR3. In the present specification, the expression "in section" may be defined as a state of being observed in the first direction DR1 or the second direction DR 2. Further, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts, and may be converted into different directions.

The plurality of light emitting regions PXA-R, PXA-G, PXA-B may include a first light emitting region PXA-R, a second light emitting region PXA-G, and a third light emitting region PXA-B. The first, second, and third light emitting areas PXA-R, PXA-G, and PXA-B may be areas distinguished from each other on a plane parallel to each of the first and second directions DR1 and DR 2. The non-light emitting area NPXA may be disposed between the first, second, and third light emitting areas PXA-R, PXA-G, and PXA-B adjacent to each other.

In one embodiment, the first light-emitting area PXA-R, the second light-emitting area PXA-G, and the third light-emitting area PXA-B may be distinguished according to the color of light emitted by the light-emitting areas. For example, the first light emitting area PXA-R may be a red light emitting area emitting red light, the second light emitting area PXA-G may be a green light emitting area emitting green light, and the third light emitting area PXA-B may be a blue light emitting area emitting blue light.

FIG. 1a shows an exemplary arrangement of the light emitting areas PXA-R, PXA-G, PXA-B of the display panel DP in a stripe pattern. That is, each of the plurality of first light-emitting areas PXA-R, the plurality of second light-emitting areas PXA-G, and the plurality of third light-emitting areas PXA-B may be arranged along the second direction DR 2. In addition, the first light emitting areas PXA-R, the second light emitting areas PXA-G, and the third light emitting areas PXA-B may be alternately arranged in order along the first direction DR 1.

In addition, the arrangement form of the first, second, and third light emitting areas PXA-R, PXA-G, and PXA-B is not limited to that shown in fig. 1a, and the arrangement order, area, and shape of the first, second, and third light emitting areas PXA-R, PXA-G, and PXA-B may be differently designed according to the characteristics of display quality required for the display panel DP. For example, the first light emitting region PXA-R, the second light emitting region PXA-G, and the third light emitting region PXA-B may be arranged in the form of

The arrangement may be a diamond arrangement, and is not limited to any one.

The display panel DP may include at least one functional layer commonly formed at the plurality of light emitting areas PXA-R, PXA-G, PXA-B and non-light emitting areas NPXA having various arrangement forms. In the present embodiment, the functional layer overlapping with the plurality of light emitting areas PXA-R, PXA-G, PXA-B and non-light emitting area NPXA may be referred to as a common layer. The common layer of the display panel DP may be formed by using a mask described below. The mask used for manufacturing the display panel DP may be manufactured using the mask manufacturing apparatus according to an embodiment of the present invention described below.

Fig. 1B exemplarily shows a cross-section of the display panel DP corresponding to one first light emitting area PXA-R, one second light emitting area PXA-G and one third light emitting area PXA-B.

Referring to fig. 1b, the display panel DP may include a base layer BS, a circuit layer DP-CL, and a display element layer DP-ED. The display element layer DP-ED of the display panel DP may include a plurality of light emitting elements ED-1, ED-2, ED-3.

The base layer BS may provide a base surface for forming the circuit layer DP-CL. The base layer BS may include glass, synthetic resin, organic/inorganic composite material, or the like. The base layer BS may have a single-layer structure or a multi-layer structure. For example, the base layer BS of the multilayer structure may include synthetic resin layers and at least one inorganic layer disposed between the synthetic resin layers.

The circuit layer DP-CL may include a driving element, a signal line, and the like connected to the first, second, and third light emitting elements ED-1, ED-2, and ED-3. The circuit layer DP-CL may include at least one insulating layer, a semiconductor pattern, and a conductive pattern constituting a driving circuit of the pixel. The circuit layer DP-CL may be formed by selectively patterning the semiconductor layer and the conductive layer through a photolithography process after forming the insulating layer, the semiconductor layer, and the conductive layer on the base layer BS through a process of coating, deposition, and the like.

The display element layers DP-ED may be disposed on the circuit layers DP-CL. The display element layer DP-ED may include a plurality of light emitting elements ED-1, ED-2, ED-3, a pixel defining film PDL, and an encapsulation layer TFE. Each of the light emitting elements ED-1, ED-2, and ED-3 may include a first electrode AE, a hole transport region HTR, light emitting layers EML-R, EML-G, EML-B, an electron transport region ETR, and a second electrode CE.

The first electrode AE may be disposed on the circuit layer DP-CL and may be electrically connected to a driving element of the circuit layer DP-CL. The pixel defining film PDL may have a light emitting opening OH exposing a portion of the first electrode AE of the light emitting elements ED-1, ED-2, ED-3 defined therein. A portion of the first electrode AE exposed by the light emitting opening portion OH of the pixel defining film PDL may correspond to the plurality of light emitting regions PXA-R, PXA-G, PXG-B, respectively. The area where the pixel defining film PDL is disposed may correspond to the non-light emitting area NPXA surrounding the plurality of light emitting areas PXA-R, PXA-G, PXG-B.

As shown in FIG. 1B, in one embodiment, light emitting layers EML-R, EML-G, EML-B of the light emitting elements ED-1, ED-2, ED-3 may be respectively disposed in the light emitting opening OH defined in the pixel defining film PDL. The light emitting layers EML-R, EML-G, and EML-B may be provided in a pattern corresponding to the light emitting opening OH. However, it is not limited thereto, and in one embodiment, the light emitting layers EML-R, EML-G, EML-B of the light emitting elements ED-1, ED-2, ED-3 may be provided as a common layer having an integral shape.

The hole transport region HTR, the electron transport region ETR, and the second electrode CE may be disposed as a common layer overlapping the light emitting elements ED-1, ED-2, and ED-3. The hole transport region HTR, the electron transport region ETR, and the second electrode CE may be formed to overlap the plurality of light emitting regions PXA-R, PXA-G, PXG-B, and non-light emitting region NPXA.

Through the transistors of the circuit layer DP-CL, a first voltage may be applied to the first electrode AE, and a common voltage may be applied to the second electrode CE. The holes and electrons injected into the light emitting layers EML-R, EML-G, EML-B combine to form excitons, and the light emitting elements ED-1, ED-2, ED-3 can emit light when the excitons transition to the ground state.

The encapsulation layer TFE may be arranged on the light emitting elements ED-1, ED-2, ED-3. The encapsulation layer TFE can encapsulate the light emitting elements ED-1, ED-2, ED-3. The encapsulation layer TFE may include a plurality of thin films for improving optical efficiency of the light emitting elements ED-1, ED-2, ED-3 or protecting the light emitting elements ED-1, ED-2, ED-3.

The encapsulation layer TFE may include at least one of an inorganic film and an organic film. The inorganic film may protect the light emitting elements ED-1, ED-2, ED-3 from moisture and/or oxygen. The inorganic film may include silicon nitride, silicon oxide, or a compound of a combination thereof. The inorganic film may be formed by Chemical Vapor Deposition (CVD).

The organic film can protect the light emitting elements ED-1, ED-2, ED-3 from impurities such as dust particles. An organic film may be formed on the inorganic film to provide a flat surface. For example, the organic film may cover particles (particles) present in an inorganic film formed under the organic film or be bent. The organic film may buffer stress between layers contacting the organic film. For example, the organic film may include an acrylic series resin, but the substance of the organic film is not limited to the above examples. The organic film may also be formed by a solution process such as spin coating, slit coating, ink jet process.

At least one of the common layers commonly formed in the pixels of the display panel DP may be deposited through a mask of an embodiment described below. For example, in the display panel DP of fig. 1b, at least one of the hole transport region HTR, the electron transport region ETR, and the second electrode CE may be deposited through a mask of an embodiment. Without limitation, and the encapsulation layer TFE of the display panel DP may be deposited through a mask of an embodiment. Hereinafter, a mask according to an embodiment will be described.

FIG. 2 is an exploded perspective view of a mask according to an embodiment. Referring to fig. 2, the mask MK may include a mask sheet MS and a mask frame FR.

As described above, mask MK of fig. 2 may be used to form a common layer on a deposited surface of a target substrate. The Mask MK of an embodiment may correspond to an Open Mask (Open Mask) for forming a functional layer disposed in a thin film manner over the entire area. The open mask may be used to form a plurality of display panels on one object substrate disposed in a large area, and the open mask may be a mask used to deposit a functional layer included in each of the plurality of display panels on the object substrate.

The mask frame FR may support the mask sheet MS. The mask frame FR may have a ring shape in a plane. Therefore, an opening OP penetrating the upper surface FR-U and the lower surface FR-L of the mask frame FR may be defined inside the mask frame FR.

Although fig. 2 shows a quadrangular ring shape as one example of the shape of the mask frame FR, it is not limited thereto. For example, the mask frame FR may have various shapes such as a circular ring, a polygonal ring, and the like. The shape of the mask frame FR may correspond to the shape of the mask sheet MS disposed on the mask frame FR.

The mask frame FR may support an edge portion of the mask sheet MS. The mask frame FR may be disposed at a lower portion of the mask sheet MS. That is, the mask frame FR may support the rear surface MS-R of the mask sheet MS. Not limited thereto, and the mask frame FR may be disposed above and below the edge of the mask sheet MS and support the mask sheet MS.

The mask frame FR may include metal. The mask frame FR may be formed of a metal material including at least one of iron (Fe) and nickel (Ni). For example, the mask frame FR may include an alloy of iron and nickel. The mask frame FR may include stainless steel (SUS) or Invar (Invar).

The mask sheet MS may be disposed on the mask frame FR. The mask sheet MS may include a rear surface MS-R facing the mask frame FR and a front surface MS-F opposite to the rear surface MS-R.

The mask sheet MS may include a plurality of unit opening parts OPC. A plurality of unit opening parts OPC may be formed through the front surface MS-F and the rear surface MS-R of the mask sheet MS. The plurality of unit openings OPC may be arranged along the first direction DR1 and the second direction DR 2. Fig. 2 exemplarily shows that five unit opening parts OPC are disposed apart from each other along the first direction DR1, and two unit opening parts OPC are disposed apart from each other along the second direction DR 2. However, the number and arrangement of the unit opening parts OPC included in the mask sheet MS are not limited thereto. For example, the unit opening parts OPC included in the mask sheet MS may be aligned in any one of the first direction DR1 and the second direction DR 2. The cell openings OPC of the mask sheet MS may overlap the openings OP of the mask frame FR, and a deposition substance may be deposited on the object substrate through the cell openings OPC of the mask sheet MS in the deposition process.

The shape of the cell opening OPC of the mask sheet MS may have a quadrangular shape in plan. However, the shape of the cell opening OPC is not limited thereto, and may have various shapes according to the shape of the functional layer deposited to be formed on the target substrate.

The mask sheet MS may have a plate (plate) shape extending along the first and second directions DR1 and DR 2. The mask sheet MS may include an extended area surrounding the plurality of unit openings OPC such that the plurality of unit openings OPC are connected to each other. As shown in fig. 2, the mask sheet MS of an embodiment may have a quadrangular shape in plan view. However, the shape of the mask sheet MS is not limited thereto, and may have various shapes according to the shape of the object substrate providing the deposited surface.

The mask sheet MS may include a metal. The mask sheet MS may be formed of a metal material including at least one of iron (Fe) and nickel (Ni). For example, the mask sheet MS may include an alloy of iron and nickel. The mask sheet MS may comprise stainless steel (SUS) or Invar (Invar). The mask sheet MS may be formed of the same material as the mask frame FR. However, the embodiments are not limited thereto.

In one embodiment, the mask sheet MS may have a coefficient of thermal expansion of 5 ppm/deg.C or less. In addition, the mask frame FR may also have a similar thermal expansion coefficient to the mask sheet MS. Accordingly, thermal deformation of the mask sheet MS may be minimized in the deposition process, and the deposition quality of the deposition layer formed on the object substrate may be improved.

The mask MK according to an embodiment may be manufactured by a mask manufacturing apparatus according to an embodiment of the present invention described below. The mask MK of an embodiment may be manufactured using a laser to improve the processing accuracy of the cell opening OPC. The mask manufacturing apparatus of an embodiment of the present invention may include a light irradiation portion for laser processing and a stage for stably supporting the mask in the light irradiation step. Hereinafter, a mask manufacturing apparatus for manufacturing a mask and a mask manufacturing process using the manufacturing apparatus according to an embodiment will be described.

Fig. 3a and 3b are perspective views of a preliminary mask according to an embodiment corresponding to one of the preliminary mask manufacturing steps.

The preliminary mask P-MK may be a mask corresponding to a step before being supplied to the mask manufacturing apparatus of the present invention to form the cell opening portions OPC. That is, the object mask provided to the mask manufacturing apparatus may be in a state where the mask sheet and the mask frame are combined, and the preliminary mask P-MK may correspond to the mask sheet and the mask frame before being combined with each other. In this specification, the preliminary mask and the target mask may be used as terms for distinguishing one form of mask corresponding to a manufacturing step of the mask.

Referring to fig. 3a, the preliminary mask P-MK may include a frame FR and a preliminary mask sheet P-MS. The preliminary mask P-MS may be a mask provided in a plate shape before being bonded to the frame FR. The preliminary mask sheet P-MS may be provided on the frame FR. In plan, the size of the preliminary mask sheet P-MS may be smaller than the size of the frame FR. Accordingly, as shown in fig. 3a, the preliminary mask sheet P-MS may be stretched to correspond to the size of the mask frame FR before being bonded to the frame FR.

Referring to fig. 3b, the stretched preliminary mask sheet P-MS may be seated on the mask frame FR. Then, the stretched preliminary mask sheet P-MS may be fixed on the mask frame FR by the bonding member AD. The portion of the rear surface MS-R of the stretched preliminary mask sheet P-MS overlapping the mask frame FR may be bonded to the upper surface FR-U of the mask frame FR.

The mask sheet P-MSa (refer to fig. 4 a) and the mask frame FR, which are bonded to each other by welding, may be supplied to the mask manufacturing apparatus MD (refer to fig. 4 a) to form the cell opening OPC (refer to fig. 2) later. The mask manufacturing apparatus MD (see fig. 4 a) of the present invention can manufacture the mask MK of fig. 2 in which the cell opening OPC (see fig. 2) is formed.

In addition, in this specification, for convenience of explanation, a mask sheet before forming the cell openings, which is bonded to the mask frame, may be referred to as an object mask, and the mask frame and the object mask sheet, which are bonded to each other, may be referred to as an object mask.

Fig. 4a is a perspective view of a mask manufacturing apparatus and a mask according to an embodiment corresponding to one of subject mask manufacturing steps. Fig. 4b is a perspective view of the object mask corresponding to a manufacturing step of the object mask according to an embodiment.

Referring to fig. 4a, a mask fabricating apparatus MD of an embodiment may include a light irradiation part LS and a stage ST.

In order to form the cell openings OPC (refer to fig. 2) in the target mask sheet P-MSa, the target mask P-MKa may be supplied onto the stage ST of the mask manufacturing apparatus MD. In one embodiment, the unit opening portions OPC (refer to FIG. 2) may be formed by irradiating laser light to the front surface MS-F and the rear surface MS-R of the object mask P-MSa, respectively. Therefore, the surface of the subject mask P-MSa irradiated with the laser light may be changed and the supporting surface of the subject mask P-MSa supported by the stage ST may be changed according to the mask manufacturing step.

The object mask P-MKa may include a mask frame FR and an object mask sheet P-MSa coupled to each other. The rear surface MS-R of the target mask P-MSa may define cell opening regions OPD-L corresponding to the formation positions of the cell openings OPC (see fig. 2).

The form of the stage ST of an embodiment may vary according to the manufacturing process of the object mask P-MKa. The supporting surface of the target mask P-MKa supported by the stage ST may be different according to the manufacturing process of the target mask P-MKa, and the form of the stage ST may be deformed corresponding to the supporting surface of the target mask P-MKa supported by the stage ST. The stage ST may include a first state and a second state that are distinguished according to a form that is deformed corresponding to the bearing surface of the object mask P-MKa. However, without being limited thereto, the mask manufacturing apparatus MD of an embodiment may include separate stages respectively provided in different forms according to the manufacturing steps of the object mask P-MKa.

The shape of the stage ST of an embodiment may be changed according to a supporting surface of the subject mask sheet P-MSa supported by the stage ST. The object mask P-MSa may be disposed on the stage ST with the rear surface MS-R of the object mask P-MSa facing upward. Therefore, the lower surface FR-L of the mask frame FR disposed on the rear surface MS-R of the subject mask sheet P-MSa may also face upward.

In this case, the stage ST may support the front surface MS-F of the subject mask sheet P-MSa, and this may correspond to the stage ST in the first state. Fig. 4a exemplarily shows a station ST in a first state according to an embodiment.

The stage ST may include an upper surface supporting the object mask P-MKa so that the object mask P-MKa disposed on the stage ST can be flatly disposed below the light irradiation part LS. The support surface of the object mask P-MKa supported by the stage ST may correspond to the substantially flat front surface MS-F of the object mask sheet P-MSa, and thus, the upper surface of the stage ST in the first state may contact the front surface MS-F of the object mask sheet P-MSa and may include a flat surface without a step difference.

The light irradiation section LS may be disposed on the stage ST. The light irradiation section LS may irradiate the laser light to the target mask sheet P-MSa. The intensity, wavelength, and kind of laser light irradiated from the light irradiation section LS may vary according to the manufacturing steps of the mask, and the laser light irradiated to the rear surface MS-R of the target mask sheet P-MSa is referred to as first laser light L1 for distinction.

The light irradiator LS may irradiate the first laser light L1 on the boundary of the cell opening region OPD-L. The preliminary unit opening portions OPD of fig. 4b penetrating the rear surface MS-R and the front surface MS-F of the subject mask P-MSa can be formed in the subject mask P-MSa by the first laser light L1.

Fig. 4b is a perspective view illustrating the object mask P-MKb where a plurality of preliminary cell openings OPD are formed after the first laser light L1 is irradiated onto the boundaries of the cell opening regions OPD-L. The object mask sheet P-MSb may include a plurality of preliminary unit openings OPD. The preliminary cell opening OPD may correspond to an opening of an intermediate step generated in the process of forming the cell opening OPC of fig. 2. Therefore, the shape and size of the preliminary cell opening OPD may be different from the finally formed cell opening OPC.

The preliminary unit openings OPD may be aligned along the first direction DR1 and the second direction DR 2. Each of the preliminary unit opening portions OPD may be formed corresponding to a position of a unit opening portion OPC to be finally formed.

Fig. 5a is a perspective view of a mask manufacturing apparatus and a mask according to an embodiment corresponding to one of subject mask manufacturing steps. FIG. 5b is a cross-sectional view of a mask manufacturing apparatus according to an embodiment, corresponding to line II-II' of FIG. 5 a.

Referring to fig. 5a, the target mask P-MKb of fig. 4b may be provided into the mask manufacturing apparatus MD to form a recess along the periphery of the preliminary cell opening OPD. Accordingly, the cell opening OPC of fig. 2 may correspond to the preliminary cell opening OPD and the recess formed as one body.

The object mask P-MKb may be disposed on the stage ST such that a front surface MS-F of the object mask P-MKb faces upward. Accordingly, the lower surface FR-L of the mask frame FR disposed on the rear surface MS-R of the subject mask P-MKb may face the stage ST. After the first laser light L1 irradiation step performed by the light irradiation section LS is completed, the target mask P-MKb may be turned over by 180 degrees by another driving device included in the mask manufacturing apparatus MD and supplied onto the stage ST.

In this case, the stage ST may support the rear surface MS-R of the subject mask sheet P-MSb and the lower surface FR-L of the mask frame FR, and this may correspond to the stage ST in the second state. Fig. 5a and 5b show a station ST in a second state according to an embodiment.

The support surface of the subject mask P-MKb supported by the stage ST may correspond to the rear surface MS-R of the subject mask P-MSb and the lower surface FR-L of the mask frame FR, and the rear surface MS-R of the subject mask P-MSb and the lower surface FR-L of the mask frame FR may have a step difference therebetween in the thickness direction (e.g., the third direction DR 3). Therefore, the stage ST in the second state may have a shape having a step corresponding to the support surface of the supported target mask P-MKb. Thus, the stage ST can provide the target mask P-MKb evenly and stably under the light irradiation section LS.

The stage ST may include a first support SP1 and a second support SP2. In this specification, the first support part SP1 may be referred to as a first part of the stage ST, and the second support part SP2 may be referred to as a second part of the stage ST. The first support part SP1 may overlap the subject mask sheet P-MSb, and the second support part SP2 may overlap the mask frame FR.

The first support part SP1 may include a first surface S1-I facing the rear surface MS-R of the subject mask sheet P-MSb. The first support part SP1 may contact the subject mask sheet P-MSb and may support the subject mask sheet P-MSb. The second support part SP2 may include a second surface S2-I facing the lower surface FR-L of the mask frame FR. The second support part SP2 may contact the mask frame FR and may support the mask frame FR.

The shape of the first support part SP1 may be a quadrangular shape on a plane. However, the shape of the first support part SP1 is not limited thereto, and the shape of the first support part SP1 may be deformed differently according to the shape of the supported target mask sheet P-MSb.

The second support part SP2 may be disposed adjacent to the first support part SP1. The second support part SP2 may surround the first support part SP1. Fig. 5a shows the second support part SP2 surrounding four sides of the first support part SP1. However, without being limited thereto, the second support part SP2 may include a plurality of sub-support parts, each of which extends along an edge of the first support part SP1. The shape of the second support part SP2 may be deformed differently corresponding to the shape of the mask frame FR supported by the second support part SP2.

The first and second supporting parts SP1 and SP2 may include the same substance as each other. However, without being limited thereto, the first and second support parts SP1 and SP2 may include substances different from each other.

The first and second support portions SP1 and SP2 may have a step difference in the third direction DR3. This will be described in detail with reference to the cross-sectional view of fig. 5b viewed in the second direction DR 2. Referring to fig. 5b, in cross section, the first surface S1-I of the first support part SP1 and the second surface S2-I of the second support part SP2 may have a distance difference D2. Hereinafter, the above distance difference D2 will be referred to as a step difference D2.

The step difference D2 between the first support part SP1 and the second support part SP2 may correspond to a height difference D1 between the rear surface MS-R of the subject mask sheet P-MSb supported by the first support part SP1 and the lower surface FR-L of the mask frame FR supported by the second support part SP2. The step difference D2 may be substantially the same as the height difference D1 between the rear surface MS-R of the subject mask sheet P-MSb and the lower surface FR-L of the mask frame FR.

Thus, the first support part SP1 and the second support part SP2 can stably support the target mask P-MKb while keeping the front surface MS-F of the target mask P-MSb flat. For example, the flatness of the front surface MS-F of the subject mask sheet P-MSb may be maintained at 0 to 300 μm, preferably, 0 to 100 μm by the first support part SP1 and the second support part SP2. Here, the closer to 0 the flatness means the more the shape parallel to the plane is maintained.

The second support part SP2 may be coupled to the first support part SP1. The second support part SP2 may be coupled to the first support part SP1 and move in the third direction DR3. By moving the second support portion SP2, the position of the second support portion SP2 can be adjusted so that the step difference D2 is equal to the height difference D1 between the rear surface MS-R of the subject mask sheet P-MSb and the lower surface FR-L of the mask frame FR. However, without being limited thereto, the second support part SP2 may be coupled to the first support part SP1 and fixed.

Further, referring to fig. 5b, the target mask P-MKb may include a welding portion WP which is a portion where the target mask sheet P-MSb and the mask frame FR are coupled. The welding part WP may be formed in a portion where the subject mask sheet P-MSb and the mask frame FR contact through a welding step using the welding member AD shown in fig. 3 b. The weld WP may comprise a metal oxide.

Referring again to fig. 5a, a recess region HF-L may be defined on the front surface MS-F of the object mask P-MKb along the periphery of the preliminary cell opening OPD. The recess region HF-L may correspond to a formation position of a recess portion to be formed in a subsequent process.

The light irradiation section LS may irradiate laser light onto the front surface MS-F of the target mask P-MKb, and the laser light is referred to as second laser light L2. The light irradiation section LS may irradiate the second laser light L2 onto the recess region HF-L defined along the periphery of the preliminary unit opening OPD. By the second laser light L2, a recessed portion, which is formed integrally with the preliminary unit opening OPD and a part of which is recessed from the front surface MS-F toward the rear surface MS-R of the subject mask P-MSb, can be formed in the subject mask P-MSb. This will be described in detail below with reference to the accompanying drawings.

The intensity, wavelength range, etc. of the second laser light L2 may be different from the first laser light L1. However, without being limited thereto, the intensity or wavelength range of the second laser light L2 may be the same as the first laser light L1.

The first support part SP1 and the second support part SP2 have a shape corresponding to the support surface of the target mask P-MKb, so that the target mask sheet P-MSb can be flatly supplied below the light irradiation part LS. Thus, the accuracy of laser processing can be improved in irradiating the second laser light L2 onto the front surface MS-F of the target mask sheet P-MSb, and the mask manufacturing apparatus MD of the present invention can manufacture a mask with improved reliability.

Fig. 6a to 6c are cross-sectional views of a stage of a mask fabricating apparatus according to an embodiment. The above description is similarly applied to the respective configurations shown in fig. 6a to 6c, except for the configuration of the stage ST. Hereinafter, the same configuration will be described with a difference as the center, while omitting the overlapping description.

Referring to fig. 6a, the first and second supporting parts SP1 and SP2 may be formed in one body. That is, the first support part SP1 and the second support part SP2 may be integrally connected without a separate combination body combining the first support part SP1 and the second support part SP2. Therefore, the configuration of the stage ST can be simplified.

Referring to fig. 6b, the first support part SP1 may include an electrostatic chuck ESC and an insulation layer ISL. The electrostatic chuck ESC may generate an electrostatic force, and the first support part SP1 may evenly and stably fix the subject mask sheets P-MSb on the first support part SP1 by the electrostatic force.

The electrostatic chuck ESC may include a plurality of first electrodes EL1 and a plurality of second electrodes EL2. The first electrodes EL1 and the second electrodes EL2 may be alternately arranged along one direction. The first electrode EL1 and the second electrode EL2 may receive voltages of different polarities from each other. The first electrode EL1 may be connected to a first terminal of the power supply PS having a positive polarity, and the second electrode EL2 may be connected to a second terminal of the power supply PS having a negative polarity.

When the power source PS is applied to the first electrode EL1 and the second electrode EL2, the first electrode EL1 may have a positive polarity, and the second electrode EL2 may have a negative polarity. However, this is exemplary, and it is also possible that the first electrode EL1 has a negative polarity and the second electrode EL2 has a positive polarity.

By the first electrode EL1 and the second electrode EL2 having different polarities from each other, an electrostatic force may be generated. The subject mask sheets P-MSb may be fixed on the first support SP1 by an electrostatic force generated by the electrostatic chuck ESC. The subject mask P-MSb may be adsorbed and fixed on the upper surface of the insulating layer ISL by an attractive force of the electrostatic force.

The insulating layer ISL may be disposed between the electrostatic chuck ESC and the subject mask sheet P-MSb. The insulating layer ISL may insulate the subject mask sheet P-MSb from the electrostatic chuck ESC. The insulating layer ISL may protect the object mask P-MSb during the process and during the process of separating the object mask P-MKb from the stage ST. In this case, the first surface S1-I of the first support part SP1 described above may be defined as an upper surface of the insulating layer ISL.

Referring to fig. 6c, the first support part SP1 may include a body BO, a magnet MGN, and an insulation layer ISL. The magnet MGN may be disposed on the body BO. Body BO may support magnet MGN. However, it is not limited thereto, and the magnet MGN may be inserted into the inside of the body BO. Fig. 6c schematically shows an integrated magnet MGN. However, it is not limited thereto, and the magnet MGN may be provided in plurality and arranged along one direction.

The magnet MGN may generate a magnetic force, and the target mask sheets P-MSb may be evenly and stably fixed on the first support part SP1 by the magnetic force. The object mask sheet P-MSb may be adsorbed and fixed on the upper surface of the insulating layer ISL by an attractive force of a magnetic force.

An insulating layer ISL may be disposed between the magnet MGN and the object masks P-MSb. The insulating layer ISL may insulate the subject mask sheets P-MSb from the magnet MGN. The insulating layer ISL may prevent the object mask sheet P-MSb from being damaged due to the magnetic force of the magnet MGN during the separation of the object mask P-MKb from the stage ST. In this case, the first surface S1-I of the first support part SP1 described above may be defined as an upper surface of the insulating layer ISL.

Fig. 7a to 7c are sectional views showing one step of forming preliminary unit openings in a subject mask sheet using a mask manufacturing apparatus according to an embodiment. Fig. 8a to 8d are sectional views illustrating one step of forming a recess in a subject mask sheet using a mask manufacturing apparatus according to an embodiment. The above description can be similarly applied to each configuration, and the differences will be mainly described.

The stage ST of an embodiment of the present invention may be deformed corresponding to a supporting surface of a supported object mask, and may include a first state S1 and a second state S2 according to the form of the stage ST. Fig. 7a shows an embodiment of a stage ST transformed from the second state S2 to the first state S1.

Referring to fig. 7a, the second support part SP2 may be moved in the thickness direction, and by moving the second support part SP2, a step D2 between a first surface S1-I of the first support part SP1 and a second surface S2-I of the second support part SP2 may be adjusted. In cross section, the stage ST of the second state S2 may include the second support part SP2 and the first support part SP1 having a step difference D2 from each other. When the stage ST in the second state S2 is deformed to the first state S1, the second support part SP2 may be moved upward along the third direction DR3. Therefore, the step difference D2 between the first support part SP1 and the second support part SP2 can be reduced.

By moving the second support SP2, the stage ST can be changed from the second state S2 of fig. 7a to the first state S1 of fig. 7 b. The target mask P-MSa of the target mask P-MKa supplied onto the stage ST in the first state S1 may be a mask before the formation of the preliminary unit opening OPD described above. To form the preliminary unit opening OPD in the object mask sheet P-MSa, the object mask P-MKa may be provided on the stage ST in the first state S1.

In the stage ST in the first state S1, the first surface S1-I of the first support part SP1 and the second surface S2-I of the second support part SP2 may be flush in cross section. That is, the first surface S1-I of the first support part SP1 and the second surface S2-I of the second support part SP2 may provide surfaces that are flush and flat with each other in cross section.

The object mask P-MKa may be disposed on the stage ST such that the front surface MS-F of the object mask sheet P-MSa faces the first surface S1-I of the first support part SP1 and the second surface S2-I of the second support part SP2. Therefore, the rear surface MS-R of the object mask sheet P-MSa may face the light irradiation section LS and may be processed by the light irradiation section LS.

The stage ST in the first state S1 may provide the first and second support portions SP1 and SP2 in which the first and second surfaces S1-I and S2-I are flush in cross section, thereby stably supporting the front surface MS-F of the object mask sheet P-MSa. The stage ST in the first state S1 may keep the subject mask sheet P-MSa flat without being inclined during the laser processing performed by the light irradiation section LS. Therefore, the precision and accuracy of laser processing performed by the light irradiation section LS can be improved.

To form the preliminary unit opening OPD, the light irradiation section LS may irradiate the first laser light L1 to the rear surface MS-R of the subject mask sheet P-MSa. The first laser light L1 may be provided as a pulse laser light. The first laser light L1 may have a femtosecond (10) ^-15 ) To picosecond (10) ^-12 ) The pulse width of (2). The wavelength of the first laser light L1 may be included in the wavelength ranges of ultraviolet rays, visible rays, and infrared rays. For example, the wavelength of the first laser light L1 may include a wavelength range of 300nm or more and 1100nm or less. However, the numerical range of the wavelength of the first laser light L1 is not limited to the above example.

Fig. 7c schematically shows a cross section of the target mask P-MKa in one step of forming the preliminary cell opening OPD. Referring to fig. 7c, the preliminary unit openings OPD penetrating the front surface MS-F and the rear surface MS-R of the subject mask P-MSa may be formed in the subject mask P-MSa by the first laser light L1. A plurality of preliminary cell openings OPD may be formed in one object mask P-MSa in accordance with the area irradiated with the first laser light L1.

In cross section, the preliminary unit opening portion OPD may have a trapezoidal shape. The width of the preliminary unit opening OPD may increase as the rear surface MS-R directly irradiated with the first laser light L1 approaches the object mask P-MSa. Therefore, the width of the preliminary unit opening OPD may be reduced as approaching the front surface MS-F from the rear surface MS-R of the object mask sheet P-MSa. However, the cross-sectional shape of the preliminary unit opening portion OPD may vary depending on the laser processing conditions, and is not limited to that shown in the drawings.

Fig. 8a schematically shows cross sections of the target mask P-MKb and the stage ST in one step for forming the recess HFP (see fig. 8 c) after forming the preliminary unit opening OPD by the first laser light L1. Referring to fig. 8a, after the preliminary cell opening OPD is formed, the target mask P-MKb may be separated from the stage ST in the first state S1.

The stage ST in the first state S1 can be deformed into the stage ST in the second state S2 by moving the second support SP2. The second support part SP2 may move downward to form a step D2 between the first surface S1-I of the first support part SP1 and the second surface S2-I of the second support part SP2 (refer to fig. 7 a). The second support part SP2 may be moved downward such that a step difference D2 (fig. 7 a) between the first surface S1-I and the second surface S2-I is substantially the same as a height difference between the rear surface MS-R of the subject mask sheet P-MSb to be supported by the stage ST and the lower surface FR-L of the mask frame FR.

Fig. 8b schematically shows a cross section in one step in which the target mask P-MKb is set on the stage ST in the second state S2 to perform laser processing by the light irradiation section LS. The object mask P-MKb of fig. 8a may be rotated so that the rear surface MS-R of the object mask P-MSb faces the stage ST. Then, as shown in fig. 8b, the object mask P-MKb may be disposed on the stage ST of the second state S2. However, not limited thereto, the object mask P-MKb may be provided on the separate stage ST of the second state S2 by the moving means.

The stage ST in the second state S2 may include a first support part SP1 supporting the target mask sheet P-MSb and a second support part SP2 supporting the mask frame FR. The first surface S1-I of the first support part SP1 may face and support the rear surface MS-R of the subject mask sheet P-MSb. The second surface S2-I of the second support part SP2 may face and support the lower surface FR-L of the mask frame FR. Therefore, the front surface MS-F of the object mask sheet P-MSb may face the light irradiation section LS and may be processed by the light irradiation section LS.

The step difference between the first surface S1-I of the first support part SP1 and the second surface S2-I of the second support part SP2 may be substantially the same as the height difference between the rear surface MS-R of the subject mask sheet P-MSb to be supported by the first support part SP1 and the lower surface FR-L of the mask frame FR to be supported by the second support part SP2. Thereby, the stage ST of the second state S2 can stably support the subject mask P-MKb while keeping the front surface MS-F of the subject mask P-MSb flat.

The stage ST of the second state S2 can keep the subject mask sheet P-MSb and the mask frame FR flat without being inclined during the laser processing performed by the light irradiation section LS. Therefore, the precision and accuracy of the laser processing performed by the light irradiation section LS can be improved.

To form the recess HFP (refer to fig. 8 c), the light irradiation section LS may irradiate the second laser light L2 to the front surface MS-F of the subject mask P-MSb. The second laser light L2 may be provided as a pulsed laser light. The second laser L2 may have a femtosecond (10) ^-15 ) To picosecond (10) ^-12 ) The pulse width of (2). The wavelength of the second laser light L2 may be included in the wavelength ranges of ultraviolet rays, visible rays, and infrared rays. For example, the wavelength of the second laser light L2 may include a wavelength range of 300nm or more and 1100nm or less. However, the numerical range of the wavelength of the second laser light L2 is not limited to the above example.

The second laser light L2 may be a laser light having a condition such as intensity, wavelength, or pulse width different from that of the first laser light L1. The formation condition of the preliminary unit opening portion OPD formed by the first laser light L1 and the formation condition of the recess HFP formed by the second laser light L2 may be different from each other, and therefore, the intensity, wavelength, or pulse width of the second laser light L2 may be different from that of the first laser light L1. However, without being limited thereto, the second laser light L2 may be the same laser light as the first laser light L1.

Fig. 8c schematically shows a cross section of the object mask P-MKb for one step of forming the recess HFP. Referring to fig. 8c, the recess HFP recessed from the front surface MS-F of the subject mask sheet P-MSb may be formed by the second laser light L2. A plurality of recesses HFP may be formed in one object mask P-MSb according to the area irradiated by the second laser light L2.

The light irradiation section LS may irradiate the second laser light L2 along the periphery of the preliminary unit opening OPD to form the recess HFP. The light irradiation section LS may irradiate the second laser light L2 so that the recess HFP and the preliminary unit opening OPD are integrally formed. The recess HFP and the preliminary unit opening OPD formed as one body may be defined as the unit opening OPC described above. That is, the unit opening part OPC may be defined as an integrated opening space formed by combining the recess HFP and the preliminary unit opening part OPD.

Fig. 8d schematically shows a cross section of the mask MK manufactured by the mask manufacturing apparatus of the present invention. The target mask P-MSb that completes the formation of the cell opening OPC may be referred to as a mask MS. The mask MK may include a mask sheet MS formed with the cell opening OPC and a mask frame FR, and this may correspond to the mask MK shown in fig. 2. The mask MK manufactured by using the mask manufacturing apparatus of the present invention may be used in a deposition process for manufacturing the display panel DP.

Referring to FIG. 8d, cell openings OPC may be defined to penetrate from the front surface MS-F to the rear surface MS-R of the mask sheet MS. During the deposition process, the deposition substance may be deposited to the deposited surface through the cell opening OPC. The portion of the mask sheet MS overlapping the recess HFP may be recessed from the front surface MS-F toward the rear surface MS-R of the mask sheet MS. That is, the thickness of the portion of the mask MS overlapping the recess HFP may be smaller than the thickness of the other portion of the mask MS not overlapping the cell opening OPC.

Due to the recesses HFP, the width of the unit openings OPC defined on the front surface MS-F of the mask sheet MS may be greater than the width of the unit openings OPC defined on the rear surface MS-R of the mask sheet MS. However, the shape of the cell opening OPC in the cross section is not necessarily limited to that shown in the drawings, and may vary depending on mask manufacturing process conditions.

The mask manufacturing apparatus according to an embodiment of the present invention can process the cell opening portion by using laser. The forming process of the cell opening portion using the laser can finely adjust the shape, size, and position of the cell opening portion, and can improve the processing accuracy. Therefore, the reliability of the mask manufactured by the mask manufacturing apparatus of an embodiment can be improved.

Further, in the mask MK of an embodiment, since the cell opening portions OPC are formed using laser light, a processing mark by the laser light may occur. For example, the processing mark caused by the laser may exhibit a water wave form or the like. However, the processing trace caused by the laser is not limited thereto, and the trace of the laser can be observed differently from the case where the cell opening portion is processed by wet-etching (wet-etching). Further, an oxide layer may be formed on the side surfaces of the openings of the mask sheet MS exposed by the cell opening portions OPC. That is, an oxide layer of the metal material constituting the mask sheet MS may be formed on the side surfaces of the openings.

Fig. 9 is a sectional view showing one step of forming a preliminary unit opening portion in a subject mask sheet using a mask manufacturing apparatus according to an embodiment. Fig. 10 is a sectional view showing one step of forming a concave portion in a subject mask sheet using a mask manufacturing apparatus according to an embodiment. The steps shown in fig. 9 may correspond to the steps shown in fig. 7b, and the steps shown in fig. 10 may correspond to the steps shown in fig. 8 b.

Fig. 9 and 10 show a cross section of a stage ST according to another embodiment comprising a first state S1 and a second state S2. The above description can be similarly applied to the configurations shown in fig. 9 and 10, and the description will be given centering on the difference.

Referring to fig. 9, the stage ST in the first state S1 may further include a third support SP3. The third support part SP3 may be disposed on the second support part SP2. The third support part SP3 may support a portion of the front surface MS-F of the subject mask sheet P-MSa that overlaps with the third support part SP3.

The third support part SP3 may include a third surface S3-I opposite to the second surface S2-I of the second support part SP2 and facing the front surface MS-F of the subject mask sheet P-MSa. In cross section, the first surface S1-I of the first support portion SP1 may be flush with the third surface S3-I of the third support portion SP3. The thickness of the third support part SP3 may be substantially the same as the step difference between the first surface S1-I and the second surface S2-I.

The third support part SP3 may include the same substance as the second support part SP2. However, without being limited thereto, the third support part SP3 may include a different substance from the second support part SP2.

The second support part SP2 may be fixedly coupled to the first support part SP1. Alternatively, the second support part SP2 may be integrally formed with the first support part SP1. The third support part SP3 may fill a step difference between the second support part SP2 and the first support part SP1, thereby causing the stage ST to provide a flat upper surface to the subject mask P-MKa.

The third support portion SP3 of fig. 9 may be separable from the second support portion SP2. Therefore, referring to fig. 10, the stage ST in the second state S2 may correspond to a state in which the third support part SP3 is separated from the second support part SP2. Thus, the stage ST may have a step so as to correspond to a support surface of the target mask P-MKb supported by the stage ST. The above description of the station ST in the second state S2 can be applied to the station ST of fig. 10 as well.

Fig. 11a is a cross-sectional view schematically illustrating one step of a deposition process performed using a mask manufactured by a mask manufacturing apparatus according to an embodiment. Fig. 11b is an enlarged cross-sectional view corresponding to the area AA of fig. 11 a.

The mask MK manufactured by the mask manufacturing apparatus MD described above may be used for the deposition process. Referring to fig. 11a, an object substrate P-SUB, which is an object of a deposition process, may be disposed on a mask MK. The deposited surface of the subject substrate P-SUB may face the front surface MS-F of mask MS of mask MK. The target substrate P-SUB may be aligned to be arranged such that an area to be deposited on the target substrate P-SUB overlaps with the cell opening OPC of the mask MK.

The deposition source may be disposed under the mask MK. The deposition substance DM evaporated by the deposition source may be evaporated toward the rear surface MS-R of the mask sheet MS, and may be deposited to the deposited surface of the subject substrate P-SUB through the cell opening OPC.

Specifically, referring to fig. 11b, a deposition substance DM may be deposited on a deposited surface of the subject substrate P-SUB to form a deposition pattern DPA. Although fig. 11b illustrates one unit opening OPC, the deposition pattern DPA may be formed as a plurality of deposition patterns DPA corresponding to the unit opening OPC of the mask MK.

As described above, the deposition pattern DPA may correspond to at least one common layer (e.g., the hole transport region HTR, the electron transport region ETR, the second electrode CE, the insulating layer) included in the display panel DP (refer to fig. 1 b). However, without being limited thereto, and may correspond to the deposition pattern DPA according to an embodiment as long as it is a composition provided as a common layer rather than a composition patterned for each individual pixel among the compositions included in the display panel DP (refer to fig. 1 b).

According to an embodiment, one object substrate P-SUB may have a larger area than one display panel DP. A plurality of display panels DP may be manufactured by one object substrate P-SUB. The plurality of deposition patterns DPA formed on one object substrate P-SUB through the mask MK of an embodiment may respectively correspond to a common layer of the plurality of display panels DP. However, it is not limited thereto, and one display panel DP may be manufactured from one object substrate P-SUB according to the size of the display panel DP.

The unit opening part OPC of an embodiment may improve deposition quality while protecting the surface of the object substrate P-SUB. Depending on the shape of the cell opening part OPC, a shadow may be formed at the boundary between the deposition area and the non-deposition area of the target substrate P-SUB. The unit opening part OPC according to an embodiment may minimize the formation of a shadow area in the deposition area by including the preliminary unit opening part OPD defining the deposition area and the recess HFP extending from and opening the preliminary unit opening part OPD. In addition, the area ratio of the deposition region in the mask sheet MS can be increased. Accordingly, defects or dead spaces of the display panel DP manufactured by the mask MK may be reduced.

The mask manufacturing apparatus according to an embodiment may form the cell opening portion in the mask sheet using a laser. The shape of the stage of the mask manufacturing apparatus according to an embodiment may be deformed in correspondence with the support surface of the object mask supported by the stage, and the object mask may be stably and flatly disposed below the light irradiation section during the laser processing. Therefore, the accuracy and precision of laser processing can be improved, and the mask manufacturing apparatus of an embodiment can provide a mask with improved reliability.

While the present invention has been described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the present invention as set forth in the appended claims.

Therefore, the technical scope of the present invention is not limited to the details described in the specification, but should be defined by the claims.

Claims

1. A mask manufacturing apparatus, comprising:

a stage for supporting the target mask,

wherein the object mask includes:

an object mask sheet comprising a front surface and a back surface; and

a mask frame including an upper surface facing the rear surface and a lower surface opposite to the upper surface,

the stage includes:

a first support portion that supports the subject mask sheet; and

a second support portion supporting the mask frame,

wherein the first support portion and the second support portion may have a step difference in a thickness direction.

2. The mask manufacturing apparatus according to claim 1,

the first support part includes a first surface facing the rear surface or the front surface of the object mask sheet,

the second support part includes a second surface facing the lower surface or the upper surface of the mask frame, an

The step difference corresponds to a distance between the first surface and the second surface in the thickness direction.

3. The mask manufacturing apparatus according to claim 1,

the first support portion and the second support portion are formed integrally.

4. The mask manufacturing apparatus according to claim 1,

the second support portion surrounds the first support portion.

5. The mask manufacturing apparatus according to claim 2,

the stage includes a first state in which the first surface faces the front surface of the object mask and a second state in which the first surface faces the back surface of the object mask, an

In the first state, the back surface of the subject mask is directed to a processing laser, and in the second state, the laser is irradiated onto the front surface of the subject mask.

6. The mask manufacturing apparatus according to claim 5,

the table in the first state further comprises a third support portion arranged on the second support portion,

wherein each of the first support part and the third support part supports the front surface of the subject mask sheet, an

The thickness of the third support portion is the same as the step difference.

7. The mask manufacturing apparatus according to claim 5,

the second support portion has a first position corresponding to the first state and a second position corresponding to the second state, and a height difference is provided between the first position and the second position in the thickness direction.

8. The mask manufacturing apparatus according to claim 7,

in the first state, the second surface of the second support part is flush with the first surface in cross section, and each of the first support part and the second support part supports the front surface of the subject mask sheet, an

In the second state, the second surface of the second support portion has the step difference in cross section from the first surface, and the first support portion supports the rear surface of the subject mask sheet, and the second support portion supports the lower surface of the mask frame.

9. The mask manufacturing apparatus according to claim 8,

the step difference is equal to a height difference between the rear surface of the object mask sheet and the lower surface of the mask frame in the thickness direction.

10. The mask manufacturing apparatus according to claim 1,

the first support portion includes at least one of an electrostatic chuck and a magnet.