CN217641774U - Antenna device - Google Patents
Antenna device Download PDFInfo
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- CN217641774U CN217641774U CN202222070902.5U CN202222070902U CN217641774U CN 217641774 U CN217641774 U CN 217641774U CN 202222070902 U CN202222070902 U CN 202222070902U CN 217641774 U CN217641774 U CN 217641774U
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Abstract
According to the antenna pattern structure, the first electrode layer and the second electrode layer which are insulated from each other are formed on the same surface of the PCB substrate, the first electrode layer and the second electrode layer are surrounded to form a non-closed rectangle, so that the first electrode layer and the second electrode layer can generate a multi-frequency oscillation mechanism to carry out multi-frequency signal transmission, and the first electrode layer and the second electrode layer are arranged on the same surface of the substrate, so that the antenna pattern structure of the embodiment of the application is simple, and multi-frequency signal transmission can be carried out.
Description
Technical Field
The utility model relates to the field of communication technology, in particular to antenna device.
Background
With the continuous development of wireless communication technology, antennas for transmitting and receiving signals become particularly important. Planar Inverted F Antennas (PIFAs) are reduced in size and compact because a standard microstrip patch is partially or completely disposed over a ground plane.
In order to realize multi-frequency signal transmission, the conventional PIFA antenna usually adopts a complex pattern structure and/or a double-sided electrode structure, which puts higher requirements on the processing and manufacturing precision of the antenna, and has high manufacturing difficulty and high cost.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, the present application provides an antenna device with a simple pattern structure and capable of performing multi-frequency transmission, which adopts the following technical solution:
Included
the antenna pattern layer is provided with a first electrode layer and a second electrode layer which are insulated from each other, and the first electrode layer and the second electrode layer form an unclosed rectangle in a surrounding mode; the first electrode layer is in a transverse L shape, and the second electrode layer is in a transverse L shape corresponding to the first electrode layer;
the antenna pattern layer is arranged on the upper surface of the PCB substrate and is electrically connected with the antenna pattern layer;
the bottom welding disc is arranged on the lower surface of the PCB substrate and is electrically connected with the PCB substrate;
the bottom pad includes a ground portion for grounding, the ground portion being electrically connected to one of the first electrode layer and the second electrode layer; and
the signal feed-in part is used for feeding in signals and is electrically connected with the other one of the first electrode layer and the second electrode layer.
Furthermore, the sum of the areas of the grounding part of the bottom welding disc and the signal feed-in part covering the lower surface of the PCB substrate accounts for more than 60% of the total area of the lower surface of the PCB substrate.
Further, the sum of areas of the first electrode layer and the second electrode layer covering the first surface of the base occupies 60% or more of the total area of the first surface.
Further, the projection of the first electrode layer on the bonding pad is at least partially overlapped with the grounding part;
the projection of the second electrode layer on the bonding pad is at least partially overlapped with the signal feed-in part.
Furthermore, two sides of the antenna pattern layer, the PCB substrate and the bottom welding disc are respectively provided with an electric connection layer, and the antenna pattern layer, the PCB substrate and the bottom welding disc are electrically connected through the electric connection layers.
Furthermore, the surfaces of the two transverse sides of the antenna pattern layer, the PCB substrate and the bottom pad are respectively sunken inwards to form a through groove penetrating through the antenna pattern layer, the PCB substrate and the bottom pad, and the electric connection layer is formed on the groove wall of the through groove sunken inwards.
According to the antenna pattern structure, the first electrode layer and the second electrode layer are formed on the same surface of the PCB substrate and are insulated from each other, the first electrode layer and the second electrode layer are surrounded to form a non-closed rectangle, so that the first electrode layer and the second electrode layer can generate a multi-frequency oscillation mechanism to perform multi-frequency signal transmission, and the first electrode layer and the second electrode layer are arranged on the same surface of the substrate, so that the antenna pattern structure of the antenna pattern structure is simple, and multi-frequency signal transmission can be performed. The sum of the areas of the grounding part and the signal feed-in part of the bottom bonding pad covering the lower surface of the PCB substrate accounts for more than 60% of the total area of the lower surface of the PCB substrate, so that the bonding pad is enlarged, and the circuit access is facilitated.
Drawings
Other objects and advantages of the present invention will become apparent from the following description of the invention, which is made with reference to the accompanying drawings, and can help to provide a thorough understanding of the present invention.
Fig. 1 is a schematic structural diagram of an antenna device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an antenna device according to another embodiment of the present invention.
It is noted that the drawings are not necessarily to scale and are merely illustrative in nature and not intended to obscure the reader.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the drawings of the embodiments of the present invention will be combined below to clearly and completely describe the technical solutions of the present invention. It is to be understood that the described embodiment is one embodiment of the invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive work based on the described embodiments of the present invention, belong to the protection scope of the present invention.
It should be noted that unless otherwise defined, technical terms or scientific terms used herein should have the ordinary meaning as understood by those having ordinary skill in the art to which the present invention belongs.
Example 1
Referring to fig. 1, an antenna device according to an embodiment of the present invention includes an antenna pattern layer 1 having a first electrode layer 10 and a second electrode layer 11 insulated from each other, and the first electrode layer 10 and the second electrode layer 11 form an unclosed rectangle around the layers; the first electrode layer 10 is in a transverse L shape, and the second electrode layer 11 is in a transverse L shape corresponding to the first electrode layer 10;
the antenna pattern layer 1 is arranged on the upper surface of the PCB substrate 2 and is electrically connected with the antenna pattern layer 1;
the bottom welding disc 3 is arranged on the lower surface of the PCB substrate 2, and is electrically connected with the PCB substrate 2;
the bottom pad 3 includes a ground portion for grounding, the ground portion being electrically connected to one of the first electrode layer 10 and the second electrode layer 11; and
a signal feeding part for feeding a signal, wherein the signal feeding part is electrically connected with the other one of the first electrode layer 10 and the second electrode layer 11.
Further, the sum of the areas of the grounding part of the bottom pad 3 and the signal feed-in part covering the lower surface of the PCB substrate 2 accounts for more than 60% of the total area of the lower surface of the PCB substrate 2.
The sum of the areas of the first electrode layer 10 and the second electrode layer 11 covering the first surface of the substrate accounts for 60% or more of the total area of the first surface.
The projection of the first electrode layer 10 on the bonding pad is at least partially overlapped with the grounding part;
the projection of the second electrode layer 11 on the bonding pad is at least partially overlapped with the signal feed-in part.
And two sides of the antenna pattern layer 1, the PCB substrate 2 and the bottom pad 3 are respectively provided with an electric connection layer, and the antenna pattern layer 1, the PCB substrate 2 and the bottom pad 3 are electrically connected through the electric connection layers.
According to the antenna pattern structure, the first electrode layer 10 and the second electrode layer 11 which are insulated from each other are formed on the same surface of the PCB substrate 2, and the first electrode layer 10 and the second electrode layer 11 surround to form a non-closed rectangle, so that the first electrode layer 10 and the second electrode layer 11 can generate a multi-frequency oscillation mechanism to perform multi-frequency signal transmission.
Example 2
Referring to fig. 2, the antenna device according to the embodiment of the present invention includes an antenna pattern layer 1 having a first electrode layer 10 and a second electrode layer 11 insulated from each other, and the first electrode layer 10 and the second electrode layer 11 form an unclosed rectangle around the layers; the first electrode layer 10 is in a transverse L shape, and the second electrode layer 11 is in a transverse L shape corresponding to the first electrode layer 10;
the antenna pattern layer 1 is arranged on the upper surface of the PCB substrate 2 and is electrically connected with the antenna pattern layer 1;
the bottom welding disc 3 is arranged on the lower surface of the PCB substrate 2, and is electrically connected with the PCB substrate 2;
the bottom pad 3 includes a ground portion for grounding, the ground portion being electrically connected to one of the first electrode layer 10 and the second electrode layer 11; and
a signal feeding part for feeding a signal, wherein the signal feeding part is electrically connected with the other one of the first electrode layer 10 and the second electrode layer 11.
Further, the sum of the areas of the grounding part of the bottom pad 3 and the signal feed-in part covering the lower surface of the PCB substrate 2 accounts for more than 60% of the total area of the lower surface of the PCB substrate 2.
The sum of the areas of the first electrode layer 10 and the second electrode layer 11 covering the first surface of the substrate accounts for 60% or more of the total area of the first surface.
The projection of the first electrode layer 10 on the bonding pad is at least partially overlapped with the grounding part;
the projection of the second electrode layer 11 on the bonding pad is at least partially overlapped with the signal feed-in part.
And two sides of the antenna pattern layer 1, the PCB substrate 2 and the bottom pad 3 are respectively provided with an electric connection layer, and the antenna pattern layer 1, the PCB substrate 2 and the bottom pad 3 are electrically connected through the electric connection layers.
The surfaces of the two transverse sides of the antenna pattern layer 1, the PCB substrate 2 and the bottom pad 3 are respectively sunken inwards to form a through groove penetrating through the antenna pattern layer 1, the PCB substrate 2 and the bottom pad 3, and the electric connection layer is formed on the groove wall of the through groove sunken inwards.
According to the antenna pattern structure, the first electrode layer 10 and the second electrode layer 11 which are insulated from each other are formed on the same surface of the PCB substrate 2, and the first electrode layer 10 and the second electrode layer 11 surround to form a non-closed rectangle, so that the first electrode layer 10 and the second electrode layer 11 can generate a multi-frequency oscillation mechanism to perform multi-frequency signal transmission.
For the embodiments of the present invention, it should be further explained that, under the condition of no conflict, the features in the embodiments and embodiments of the present invention can be combined with each other to obtain a new embodiment.
The above embodiments of the present invention are only examples, but the scope of the present invention is not limited thereto, and the scope of the present invention shall be subject to the scope of the claims.
Claims (6)
1. An antenna device, comprising
The antenna pattern layer is provided with a first electrode layer and a second electrode layer which are insulated from each other, and the first electrode layer and the second electrode layer form an unclosed rectangle in a surrounding mode; the first electrode layer is in a transverse L shape, and the second electrode layer is in a transverse L shape corresponding to the first electrode layer;
the antenna pattern layer is arranged on the upper surface of the PCB substrate and is electrically connected with the antenna pattern layer;
the bottom welding disc is arranged on the lower surface of the PCB substrate and is electrically connected with the PCB substrate;
the bottom pad includes a ground portion for grounding, the ground portion being electrically connected to one of the first electrode layer and the second electrode layer; and
the signal feed-in part is used for feeding in signals, and the signal feed-in part is electrically connected with the other one of the first electrode layer and the second electrode layer.
2. The antenna device as claimed in claim 1, wherein the sum of the areas of the ground portion and the signal feed portion of the bottom land covering the lower surface of the PCB substrate accounts for more than 60% of the total area of the lower surface of the PCB substrate.
3. The antenna device according to claim 1, wherein a sum of areas of the first electrode layer and the second electrode layer covering the first surface of the substrate accounts for 60% or more of a total area of the first surface.
4. The antenna device according to claim 1, wherein a projection of the first electrode layer on the bonding pad at least partially overlaps the ground portion;
the projection of the second electrode layer on the bonding pad is at least partially overlapped with the signal feed-in part.
5. The antenna device according to claim 1, wherein the antenna pattern layer, the PCB substrate and the bottom pad are respectively provided with an electrical connection layer at two sides, and the antenna pattern layer, the PCB substrate and the bottom pad are electrically connected through the electrical connection layers.
6. The antenna device according to claim 1, wherein the surfaces of the antenna pattern layer, the PCB substrate, and the bottom land on both lateral sides thereof are recessed inward to form a through groove penetrating the antenna pattern layer, the PCB substrate, and the bottom land, respectively, and the electrical connection layer is formed on the groove wall of the through groove recessed inward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222070902.5U CN217641774U (en) | 2022-08-08 | 2022-08-08 | Antenna device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222070902.5U CN217641774U (en) | 2022-08-08 | 2022-08-08 | Antenna device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217641774U true CN217641774U (en) | 2022-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222070902.5U Active CN217641774U (en) | 2022-08-08 | 2022-08-08 | Antenna device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217641774U (en) |
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2022
- 2022-08-08 CN CN202222070902.5U patent/CN217641774U/en active Active
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