CN217639186U - Chip platform for electric displacement test board - Google Patents
Chip platform for electric displacement test board Download PDFInfo
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- CN217639186U CN217639186U CN202221110376.4U CN202221110376U CN217639186U CN 217639186 U CN217639186 U CN 217639186U CN 202221110376 U CN202221110376 U CN 202221110376U CN 217639186 U CN217639186 U CN 217639186U
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Abstract
The utility model relates to an electronic displacement is chip platform for testboard, including heat conduction locating piece, semiconductor refrigeration piece, heat conduction locating piece upper end is equipped with the chip location mesa that is used for advancing line location to the chip, the upper end at the semiconductor refrigeration piece is fixed to the heat conduction locating piece, the semiconductor refrigeration piece is fixed on the support, the support is fixed on moving mechanism, the lower extreme of semiconductor refrigeration piece is fixed with the heat dissipation module. The utility model discloses an electronic displacement is chip platform for testboard can carry out position adjustment to the chip and realize controlling the chip temperature simultaneously.
Description
Technical Field
The utility model relates to a silicon optical chip coupling technical field, concretely relates to electronic displacement is chip platform for testboard.
Background
When the silicon optical chip works, certain energy consumption is generated, so that the temperature of the chip is increased, the control and transmission quality of optical signals are influenced, and the coupling success rate and the test result are influenced. In the prior art, an electric displacement test bench is usually adopted for coupling test of a silicon optical chip, but the influence of the temperature of the chip on the coupling success rate and the test result is not considered at all in the conventional electric displacement test bench, and a device for controlling the temperature of the silicon optical chip is not arranged in the conventional chip bench at all.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's defect, provide an electronic displacement is chip bench for testboard, it can be controlled the temperature of silicon optical chip when carrying out the coupling test.
The technical scheme of the utility model is realized like this: the utility model discloses an electronic displacement is chip platform for testboard, including heat conduction locating piece, semiconductor refrigeration piece, heat conduction locating piece upper end is equipped with and is used for carrying out the chip location mesa of fixing a position to the chip, the upper end at the semiconductor refrigeration piece is fixed to the heat conduction locating piece, the semiconductor refrigeration piece is fixed on the support.
Furthermore, a heat dissipation module is arranged at the lower end of the semiconductor refrigeration piece; the heat dissipation module is fixed on the support.
Furthermore, the support comprises a bottom plate and a refrigerating sheet fixing seat, and the refrigerating sheet fixing seat is fixedly supported on the bottom plate through an upright post; the semiconductor refrigerating sheet is fixed on the refrigerating sheet fixing seat, and the heat dissipation module is positioned between the refrigerating sheet fixing seat and the bottom plate; the bottom plate is fixed on the moving mechanism.
Furthermore, the upper end surface of the refrigerating sheet fixing seat is provided with a hollow part, and the heat-conducting positioning block is fixed on the upper end surface of the semiconductor refrigerating sheet, so that the heat-conducting positioning block is directly attached to the upper end surface of the semiconductor refrigerating sheet; the lower terminal surface of refrigeration piece fixing base is equipped with the fretwork, makes the lower terminal surface and the heat dissipation module laminating of semiconductor refrigeration piece.
Further, the utility model discloses an electronic displacement is chip platform for testboard still includes temperature controller and is used for detecting the temperature-detecting device of heat conduction locating piece temperature, temperature-detecting device is connected with temperature controller's input electricity, and temperature controller's output and semiconductor refrigeration piece electricity are connected.
Furthermore, the temperature detection device is arranged in the heat conduction positioning block, the temperature detection device is electrically connected with one end of the outgoing line, and the other end of the outgoing line extends out of the heat conduction positioning block.
Further, the temperature detection device employs a thermistor.
Furthermore, the chip positioning table-board is provided with an adsorption hole for carrying out vacuum adsorption on the silicon optical chip.
Further, the support is fixed on a moving mechanism for driving the support to move.
Furthermore, the support is fixed on a moving mechanism which is used for driving the support to translate along the directions of an X axis, a Y axis and a Z axis and rotate along the direction of the Z axis.
The utility model discloses following beneficial effect has at least: the chip platform for the electric displacement test platform comprises a heat-conducting positioning block and a semiconductor refrigerating piece, wherein the semiconductor refrigerating piece is fixed on a support, the support is fixed on a moving mechanism, the heat-conducting positioning block is fixed at the upper end of the semiconductor refrigerating piece, and a chip positioning platform surface used for positioning a chip is arranged at the upper end of the heat-conducting positioning block. Adopt above-mentioned structure to make the utility model discloses an electronic displacement is chip platform for testboard can carry out position adjustment to the chip and realize controlling chip temperature simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of a chip stage for an electric displacement test table according to an embodiment of the present invention;
fig. 2 is a schematic view of the temperature control principle of the chip table for the electric displacement test table provided by the embodiment of the utility model.
In the attached drawing, 1 is a moving mechanism, 11 is an X-axis translation module, 12 is a Y-axis translation module, 13 is a Z-axis translation module, 14 is a Z-axis rotation module, 2 is a support, 3 is a heat dissipation module, 4 is a heat conduction positioning block, and 41 is a chip positioning table top.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, the meaning of "a plurality" or "a plurality" is two or more unless otherwise stated.
Referring to fig. 1, the embodiment of the utility model provides an electronic displacement is chip platform for testboard, including heat conduction locating piece 4, semiconductor refrigeration piece, 4 upper ends of heat conduction locating piece are equipped with and are used for carrying out the chip location mesa 41 of fixing a position to the chip, heat conduction locating piece 4 is fixed in the upper end of semiconductor refrigeration piece, the semiconductor refrigeration piece is fixed on support 2. The chip positioning table 41 is provided with a chip placing area.
Further, the support 2 is fixed to a moving mechanism 1 for moving the support (translating or/and rotating as required).
Furthermore, the lower end of the semiconductor refrigeration piece is provided with a heat dissipation module 3. The heat dissipation module 3 is fixed on the support 2.
Further, the support 2 comprises a bottom plate and a refrigerating sheet fixing seat, the refrigerating sheet fixing seat is fixedly supported on the bottom plate through an upright post, the semiconductor refrigerating sheet is fixed on the refrigerating sheet fixing seat, and the heat dissipation module is located between the refrigerating sheet fixing seat and the bottom plate; the bottom plate is fixed on the moving mechanism 1.
The up end of the chilling plate fixing base of this embodiment is provided with a hollow or an opening, and the heat-conducting locating block is fixed on the up end of the semiconductor chilling plate, so that the up end of the semiconductor chilling plate is directly attached to the down end of the heat-conducting locating block 4. For example, the heat-conducting positioning block can be fixed on the upper end face of the semiconductor refrigeration piece in an adhesion mode, and of course, other fixing modes can also be adopted. The lower terminal surface of refrigeration piece fixing base is equipped with fretwork or opening, and the lower terminal surface and the thermal module contact laminating of semiconductor refrigeration piece.
The refrigerating sheet fixing seat is made of an insulating material.
Of course, the present invention is not limited to the above embodiments, and the present invention can be adjusted according to the need. If the utility model discloses can also fix heat conduction locating piece 4 snap-on in the one side of semiconductor refrigeration piece, the another side of semiconductor refrigeration piece is fixed on the refrigeration piece fixed plate.
Further, refer to fig. 2, the utility model discloses an electronic displacement is chip platform for testboard still includes temperature controller and is used for detecting the temperature-detecting device of 4 temperatures of heat conduction locating piece, temperature-detecting device is connected with temperature controller's input electricity, and temperature controller's output and semiconductor refrigeration piece electricity are connected.
Furthermore, the temperature detection device is arranged in the heat conduction positioning block 4, the temperature detection device is electrically connected with one end of the outgoing line, and the other end of the outgoing line extends out of the heat conduction positioning block 4. The outgoing line is wrapped by an insulating outer sleeve.
Further, the temperature detection device adopts a thermistor.
The utility model discloses can adopt vacuum adsorption's mode to fix a position silicon optical chip, be equipped with on the chip location mesa 41 and be used for carrying out vacuum adsorption's absorption hole to silicon optical chip, the absorption hole communicates with the absorption passageway (if the absorption passageway that sets up in the heat conduction locating piece) one end, and the other end and the evacuation pipeline intercommunication of absorption passageway. Of course, the utility model discloses also can adopt other structures to fix a position silicon optical chip as required.
Further, the moving mechanism 1 is used for driving the support 2 to translate along the X-axis, Y-axis, Z-axis directions and rotate along the Z-axis direction, i.e. to move in four-dimensional directions (Y-axis, X-axis, Z-axis, θ Z-axis). The moving mechanism 1 comprises an X-axis translation module 11, a Y-axis translation module 12, a Z-axis translation module 13 and a Z-axis rotation module 14, the X-axis translation module 11 is fixed on the Y-axis translation module 12, the Y-axis translation module 12 drives the X-axis translation module 11 to translate along the Y-axis direction (namely the front-back direction), the Z-axis translation module 13 is fixed on the X-axis translation module 11, the X-axis translation module 11 drives the Z-axis translation module 13 to translate along the X-axis direction (namely the left-right direction), the Z-axis rotation module 14 is fixed on the Z-axis translation module 13, the Z-axis translation module 13 drives the Z-axis rotation module 14 to translate along the Z-axis direction (namely the up-down direction), the support 2 is fixed on the Z-axis rotation module 14, and the Z-axis rotation module 14 drives the support 2 to rotate around the Z-axis (namely the theta Z-axis).
Of course, the moving mechanism 1 of the present invention is not limited to the above-mentioned embodiment, and can be adjusted accordingly as needed. The moving mechanism 1 may be automatically controlled, manually controlled, or a combination of automatic control and manual control, for example, the Y-axis translation module 12 is automatically controlled, and the X-axis translation module 11 and the Z-axis translation module 13 are manually controlled.
The utility model discloses an electronic displacement is chip platform for testboard can carry out position adjustment to the chip and realize controlling chip temperature simultaneously. The utility model discloses a thermistor measures the temperature of heat conduction locating piece 4, and the TEC controller is adjusted the power of TEC according to measured temperature, reaches the target temperature until heat conduction locating piece 4 temperature to control silicon optical chip operating temperature.
The above description is only for the preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an electronic displacement is chip platform for testboard which characterized in that: the chip positioning device comprises a heat conduction positioning block and a semiconductor refrigeration piece, wherein a chip positioning table top used for positioning a chip is arranged at the upper end of the heat conduction positioning block, the heat conduction positioning block is fixed at the upper end of the semiconductor refrigeration piece, and the semiconductor refrigeration piece is fixed on a support.
2. The die table for an electric displacement test stand according to claim 1, wherein: the lower end of the semiconductor refrigerating sheet is provided with a heat dissipation module; the heat dissipation module is fixed on the support.
3. The die table for an electric displacement test bed of claim 2, wherein: the support comprises a bottom plate and a refrigerating sheet fixing seat, and the refrigerating sheet fixing seat is fixedly supported on the bottom plate through an upright post; the semiconductor refrigerating sheet is fixed on the refrigerating sheet fixing seat, and the heat dissipation module is positioned between the refrigerating sheet fixing seat and the bottom plate; the bottom plate is fixed on the moving mechanism.
4. The chip stage for an electromotive displacement test bed according to claim 3, wherein: the upper end surface of the refrigerating piece fixing seat is provided with a hollow part, and the heat-conducting positioning block is fixed on the upper end surface of the semiconductor refrigerating piece, so that the heat-conducting positioning block is directly attached to the upper end surface of the semiconductor refrigerating piece; the lower terminal surface of refrigeration piece fixing base is equipped with the fretwork, makes the lower terminal surface and the thermal module laminating of semiconductor refrigeration piece.
5. The chip stage for an electromotive displacement test bed according to claim 1, wherein: the temperature detection device is electrically connected with the input end of the temperature controller, and the output end of the temperature controller is electrically connected with the semiconductor refrigeration piece.
6. The chip stage for an electromotive displacement test bed according to claim 5, wherein: the temperature detection device is arranged in the heat conduction positioning block and is electrically connected with one end of the outgoing line, and the other end of the outgoing line extends out of the heat conduction positioning block.
7. The chip stage for an electromotive displacement test bed according to claim 5 or 6, wherein: the temperature detection device adopts a thermistor.
8. The chip stage for an electromotive displacement test bed according to claim 1, wherein: the chip positioning table-board is provided with an adsorption hole for carrying out vacuum adsorption on the silicon optical chip.
9. The chip stage for an electromotive displacement test bed according to claim 1, wherein: the support is fixed on a moving mechanism for driving the support to move.
10. The chip stage for an electromotive displacement test bed according to claim 9, wherein: the support is fixed on a moving mechanism which is used for driving the support to translate along the X-axis direction, the Y-axis direction and the Z-axis direction and rotate along the Z-axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221110376.4U CN217639186U (en) | 2022-05-10 | 2022-05-10 | Chip platform for electric displacement test board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221110376.4U CN217639186U (en) | 2022-05-10 | 2022-05-10 | Chip platform for electric displacement test board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217639186U true CN217639186U (en) | 2022-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221110376.4U Active CN217639186U (en) | 2022-05-10 | 2022-05-10 | Chip platform for electric displacement test board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217639186U (en) |
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2022
- 2022-05-10 CN CN202221110376.4U patent/CN217639186U/en active Active
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