SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an optical device testing arrangement can test optical device under different ambient temperature, and need not weld optical device and survey test panel.
The utility model discloses a following technical scheme realizes: the optical device testing device comprises a positioning seat for positioning an optical device, a testing plate for connecting the optical device to test the optical device, an optical fiber connector, a temperature control assembly for controlling the testing temperature of the optical device, a positioning assembly for adjusting the position of the testing plate, and a jacking assembly for pressing a flexible circuit board of the optical device and the testing plate; the positioning seat is arranged on the temperature control assembly, and the test board is arranged on the position adjusting assembly.
As a further improvement of the above technical solution, the positioning seat includes a base, a cover plate connected to the base, an optical device positioning block disposed on the base, and a temperature control mounting block disposed on the base.
As a further improvement of the above technical solution, two positioning protrusions for positioning the flexible circuit board of the optical device are disposed on the optical device positioning block.
As a further improvement of the technical scheme, the temperature control assembly comprises a temperature sensor, a refrigerator, a radiating block and a radiating fan, the refrigerator is arranged on the radiating block, and the radiating fan is arranged below the radiating block.
As a further improvement of the above technical solution, the temperature sensor includes a thermistor.
As a further improvement of the technical scheme, the refrigerator is a semiconductor refrigerator.
As a further improvement of the technical scheme, the positioning component comprises an XY displacement table, a supporting block arranged on the XY displacement table and a mounting seat arranged on the supporting block, and the test board is arranged on the mounting seat.
As the further improvement of the technical scheme, the jacking assembly comprises a jacking cylinder, a jacking rod connected with the jacking cylinder, a jacking block connected with the jacking rod and a jacking fixing block arranged on the jacking block.
As a further improvement of the above technical solution, the optical device testing apparatus further comprises a pneumatic control valve, and a manual switch is arranged on the pneumatic control valve; and the pneumatic control valve is used for controlling the starting and stopping of the jacking assembly.
The beneficial effects of the utility model include at least: in the optical device testing device of the utility model, the optical device is positioned by the positioning seat, the position of the testing board is adjusted by the positioning component, the flexible circuit board of the optical device is pressed with the testing board by the jacking component, and the testing temperature of the optical device is adjusted by the temperature control component; the optical device can be tested at different environmental temperatures, and the optical device and the test board are not required to be welded, so that the test efficiency is improved.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 2, the optical device testing apparatus includes a positioning seat 1 for positioning an optical device 10, a testing board 20 for connecting the optical device 10 to test the optical device 10, an optical fiber connector 30, a temperature control assembly 2 for controlling a testing temperature of the optical device 10, a positioning assembly 3 for adjusting a position of the testing board 20, and a jacking assembly 4 for stitching a flexible circuit board of the optical device 10 and the testing board 20; the positioning seat 1 is arranged on the temperature control assembly 2, and the test board 20 is arranged on the positioning assembly 3. The optical device 10 refers to a transmitter sub-module or a receiver sub-module.
As shown in fig. 3, the positioning seat 1 includes a base 11, a cover plate 12 connected to the base 11, an optical device positioning block 13 disposed on the base 11, and a temperature control mounting block 14 disposed on the base 11. The positioning socket 1 is pneumatically controlled to open and close the cover plate 12. During testing, the optical device 10 is located between the base 11 and the cover plate 12, and after the flexible circuit board of the optical device 10 is located by the optical device locating block 13, the end of the flexible circuit board extends to the testing board 20.
The temperature control mounting block 14 is provided with a mounting hole for installing a temperature sensor and a wire hole for passing through a refrigerator wire. The middle of the base 11 is hollowed, and the refrigerator is located in the hollowed area in the middle of the base 11. The temperature sensor passes through the mounting hole on the temperature control mounting block 14 and extends into the hollow area in the middle of the base 11.
As shown in fig. 4, two positioning protrusions 131 are disposed on the optical device positioning block 13, and the two positioning protrusions 131 cooperate with the positioning holes on the flexible circuit board of the optical device 10 to position the optical device 10 and the flexible circuit board of the optical device 10.
As shown in fig. 5, the temperature control assembly 2 includes a temperature sensor 21, a refrigerator 22, a heat dissipation block 23, and a heat dissipation fan 24, wherein the refrigerator 22 is disposed on the heat dissipation block 23, and the heat dissipation fan 24 is disposed below the heat dissipation block 23. The temperature control assembly 2 obtains the ambient temperature of the optical device 10 during testing through the temperature sensor 21, the refrigerator 22 heats or refrigerates according to the ambient temperature and the preset temperature, the heat convection of the outer surface of the refrigerator 22 is increased through the heat radiation fan 24 and the heat radiation block 23, the refrigeration and heating effects of the refrigerator 22 are improved, the range of the ambient temperature is expanded, and the testing temperature range during testing is improved.
The temperature sensor 21 includes a thermistor. The refrigerator 22 is a semiconductor refrigerator, which determines whether to cool or heat, and the rate of cooling and heating, according to the direction and magnitude of the current through the refrigerator 22. The semiconductor refrigerator includes a plurality of P-type and N-type pairs (sets) connected together by electrodes and sandwiched between two ceramic electrodes; when current flows through the semiconductor cooler, the heat generated by the current is transferred from one side of the semiconductor cooler to the other, creating a "hot" side and a "cold" side on the semiconductor cooler.
The temperature control assembly 2, the refrigerator 22 adjusts the testing temperature of the optical device 10, and the temperature adjusting range of the refrigerator 22 is increased by the cooperation of the heat dissipation block 23 and the heat dissipation fan 24. When the preset test environment temperature is subzero temperature, the cold surface of the refrigerator 22 establishes heat circulation with the optical device 10, and the heat radiation fan 24 increases heat convection of the hot surface and reduces the temperature of the hot surface, thereby reducing the temperature of the cold surface and improving the refrigeration effect of the semiconductor refrigerator. When the preset test environment temperature is 70 ℃/85 ℃, the current direction is changed, the hot surface of the semiconductor refrigerator and the optical device 10 establish heat circulation, the heat radiation fan 24 increases the heat convection of the cold surface, and the temperature of the cold surface is increased, so that the temperature of the hot surface is increased, and the heating effect of the semiconductor refrigerator is improved. The "hot side" and the "cold side" refer to the "side with increased temperature" and the "side with decreased temperature" that are displayed on the semiconductor cooler, when current flows from the semiconductor cooler, the heat generated by the current is transferred from one side of the semiconductor cooler to the other side. In the present embodiment, the "hot side" and the "cold side" are switched between being close to the upper surface of the optical device 10 and being close to the lower surface of the heat dissipation block 23.
As shown in fig. 6, the positioning assembly 3 includes an XY stage 31, a supporting block 32 disposed on the XY stage 31, and a mounting seat 33 disposed on the supporting block 32, and the testing board 20 is disposed on the mounting seat 33. XY displacement stage 31 is a manual displacement stage having X-axis and Y-axis displacement adjustment functions, test board 20 is mounted below mounting seat 33, and mounting seat 33 and test board 20 can be connected by means of screws or bolts. The position of the test board 20 is adjusted by adjusting the XY stage 31 so that the pads of the flexible circuit board of the optical device 10 can correspond to the corresponding pad positions on the test board 20.
As shown in fig. 7, the jacking assembly 4 includes a jacking cylinder 41, a jacking rod 42 connected to the jacking cylinder 41, a jacking block 43 connected to the jacking rod 42, and a jacking fixing block 44 disposed on the jacking block 43. The jacking fixing block 44 is used for fixing the flexible circuit board on the optical device 10 and the test circuit board in a jacking mode, so that the bonding pad on the flexible circuit board is tightly connected with the bonding pad on the test circuit board, the test process is ensured to be smoothly carried out, and in order to prevent the jacking fixing block 44 from influencing the test result, the jacking fixing block 44 can be made of plastic, for example. The side of the jacking block 43 is provided with a sliding block 45 and a sliding rail 46, wherein the sliding rail 46 is arranged on the supporting block 32 of the positioning component 3, the sliding block 45 is connected with the jacking block 43, and the stability of the jacking component 4 during jacking is improved through the sliding block 45 and the sliding rail 46.
Referring to fig. 1 and 2, the optical device testing apparatus further includes a pneumatic control valve 5, and the pneumatic control valve 5 is used for connecting an air source, a jacking cylinder 41 and the positioning seat 1. The pneumatic control valve 5 is a manual control valve, a manual switch is arranged on the pneumatic control valve 5, and the jacking of the jacking cylinder 41 and the opening and closing of the positioning seat 1 are controlled by controlling the opening and closing of the pneumatic control valve 5.
The beneficial effects of the utility model include at least: in the optical device testing device of the utility model, the optical device 10 is positioned by the positioning seat 1, the position of the testing board 20 is adjusted by the positioning component 3, the flexible circuit board of the optical device 10 is pressed against the testing board 20 by the jacking component 4, and the testing temperature of the optical device 10 is adjusted by the temperature control component 2; the optical device 10 can be tested at different environmental temperatures without welding the optical device 10 and the test board 20, thereby improving the test efficiency.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the embodiments of the present invention.
In the description of the present specification, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.