CN115250143A

CN115250143A - Test system and test method for optical communication device

Info

Publication number: CN115250143A
Application number: CN202211159331.0A
Authority: CN
Inventors: 兴孝林; 侯炳泽; 张亮; 梁斌
Original assignee: Dalian Youxun Technology Co ltd; Wuhan Qianxi Technology Co ltd
Current assignee: Dalian Youxinguang Technology Co ltd; Wuhan Qianxi Technology Co ltd
Priority date: 2022-09-22
Filing date: 2022-09-22
Publication date: 2022-10-28
Anticipated expiration: 2042-09-22
Also published as: CN115250143B

Abstract

The present disclosure relates to a test system and a test method for an optical communication device. The test system (100) comprises: a test platform (10); a test circuit board (30); a moving assembly (50) comprising a movable mass (40), the mass (40) configured to move between a first position and a second position; and a temperature modulation system comprising a semiconductor chilling plate (70) capable of establishing a heat transfer path with the package of the optical communication device, the semiconductor chilling plate (70) configured to generate or absorb heat based on the applied voltage to regulate a temperature experienced by the package of the optical communication device. Thereby, the performance test of the optical communication device can be performed at low cost.

Description

Test system and test method for optical communication device

Technical Field

The present disclosure generally relates to the field of optical fiber communication, and more particularly, to a test system and a test method for an optical communication device.

Background

The development of optical communication technology is changing day by day, and with the arrival of the 5G communication era, the Internet of things will be developed rapidly, and the optical fiber communication technology will be more and more important. Optical communication devices such as BOSA, ROSA, TOSA, etc. include various precision optical devices that require performance testing after optical path coupling within the optical communication device is complete and before shipment to ensure that the optical communication device is able to function properly.

An important item in these performance tests is the temperature performance test. The optics within an optical communication device are very temperature sensitive and small temperature fluctuations may be sufficient to cause laser wavelength drift and affect the optical coupling power and thus the stability of the communication signal of the optical communication network. When an optical communication device is used in a communication network, the optical communication device is generally applied in various environmental scenarios, and the ambient temperature has an influence on the operation of the optical communication device. Therefore, environmental testing of the performance of the optical communication device is required before shipment to ensure good operation of the optical communication device.

In a conventional optical communication device performance test, an optical communication device is placed in an oven or a refrigerator to simulate an ambient temperature, and the oven or the refrigerator is alternately operated to change the temperature, thereby testing the performance of the optical communication device under a corresponding temperature condition. In order to achieve nondestructive electrical connection of the optical communication device and the test system in an oven and a refrigerator and ensure temperature insulation, the conventional test system has a complex structure and is time-consuming and labor-consuming to operate. There is a need for further improvements in test systems for conventional optical communication devices.

Disclosure of Invention

According to an example embodiment of the present disclosure, a test system and a test method for an optical communication device are proposed, which solve, or at least partially solve, one or more of the above-mentioned problems.

In a first aspect of the present disclosure, a test system for an optical communication device is provided. The test system comprises: a test platform including a jig that detachably holds the optical communication device, the optical communication device including a flexible circuit board and being fixed to the jig in a predetermined orientation; a test circuit board fixed to the test platform and disposed opposite the flexible circuit board of the optical communication device; a movement assembly including a movable press block configured to move between a first position at which the press block presses the connection between the flexible circuit board and the test circuit board and a second position at which the press block is away from the test platform to release the connection between the flexible circuit board and the test circuit board; and a temperature modulation system comprising a semiconductor chilling plate mounted on the briquetting, wherein the semiconductor chilling plate is configured to generate or absorb heat based on the applied voltage to regulate a temperature to which the optical communication device is subjected.

According to the test system of the embodiment of the present disclosure, the ambient temperature to which the optical communication device is subjected can be simulated and performance test can be performed in a low-cost and simple manner.

In some embodiments, the semiconductor chilling plate may be mounted to the press block such that the semiconductor chilling plate establishes a heat transfer path with the package of the optical communication device in a state where the test circuit board and the flexible circuit board are electrically connected.

In some embodiments, the briquetting may include: a pressing portion that presses a connection between the flexible circuit board and the test circuit board at the first position; and a temperature conducting section adapted to mount the semiconductor chilling plate, the temperature conducting section being at least partially in contact with the case of the optical communication device at the first position to heat or chill the case of the optical communication device via at least thermal conduction; wherein the temperature conducting portion is made of a thermally conductive material.

In some embodiments, the pressing part may further include a flexible block configured to press the connection between the flexible circuit board and the test circuit board.

In some embodiments, the flexible block may be configured to be disposed in thermal insulation from the temperature conducting portion.

In some embodiments, the briquetting may further include: an insulation block mounted on the pressing part; and a flexible block mounted on the heat insulating block, the flexible block pressing a connection between the flexible circuit board and the test circuit board, the heat insulating block being made of a heat insulating material having a heat conductivity lower than that of the heat conductive material so that the flexible block is thermally insulated from the temperature conductive part.

In some embodiments, the temperature conducting part may include a receiving groove for receiving the semiconductor chilling plate at a side near the testing platform.

In some embodiments, the dimensions of the receiving slot may be configured to: in a state in which the semiconductor chilling plate is received therein, the semiconductor chilling plate is adjacent to and does not contact with the package of the optical communication device.

In some embodiments, the temperature modulation system may further include a temperature sensor configured to be contactable with the package surface of the optical communication device to sense a temperature of the package surface of the optical communication device.

In some embodiments, the jig may further include a mounting groove disposed at a side or bottom of the jig, the temperature sensor being mounted in the mounting groove.

In some embodiments, in a case that the optical communication device may include a pair of flexible circuit boards, the test system further includes a holder for holding the test circuit board, the holder being open at a bottom side and a top side so that the test circuit board can be connected to the pair of flexible circuit boards at the top side and the bottom side, respectively, wherein the pressing block is configured to press a signal circuit board of the pair of flexible circuit boards, the test circuit board including a slot for receiving a power supply circuit board of the pair of flexible circuit boards.

In some embodiments, the test system may further include a support beam to which the movement assembly is mounted, the movement assembly being a pneumatic actuator including a push rod to which the press block is attached to move in accordance with actuation of the pneumatic actuator.

According to a second aspect of the present disclosure, a test method for an optical communication device is provided. The optical communication device includes a flexible circuit board. The test method comprises the following steps: holding the optical communication device with a jig; providing a test circuit board; pressing the connection between the flexible circuit board and the test circuit board by using a pressing block; controlling a voltage applied to a semiconductor chilling plate mounted on the pressing block to heat or chill an optical communication device so that the optical communication device is at a predetermined temperature; and testing the operating performance of the optical communication device at the predetermined temperature.

In some embodiments, the testing method may further comprise: forming a thermal conduction path from the semiconductor chilling plate to the optical communication device with the briquetting while the pressing is performed.

In some embodiments, the testing method may further include providing the compact with a heat insulating block such that a portion of the compact that suppresses the connection between the flexible circuit board and the test circuit board is thermally insulated from the semiconductor chilling plate via the heat insulating block.

It should be understood that the statements herein reciting aspects are not intended to limit the critical or essential features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of embodiments of the present disclosure will become more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements.

Fig. 1 shows a perspective schematic view of a test system for optical communication devices according to an embodiment of the present disclosure.

Fig. 2 shows a schematic structural diagram of a fixture in which an optical communication device is fixed according to an embodiment of the present disclosure.

Fig. 3 shows a top view of a clamp according to an embodiment of the present disclosure.

Fig. 4 shows a schematic structural view of a fixture with an optical communication device removed from the fixture according to an embodiment of the present disclosure.

FIG. 5 illustrates a bottom view of a press block according to an embodiment of the present disclosure.

FIG. 6 shows an exploded view of a briquette according to an embodiment of the present disclosure.

Fig. 7 shows a schematic diagram before a compact presses a test circuit board according to an embodiment of the disclosure.

Fig. 8 shows a flow chart of a testing method for an optical communication device according to an embodiment of the present disclosure.

Fig. 9 shows a schematic diagram of an operating state of a test platform according to an embodiment of the present disclosure, in which a pressing portion of a press block is in contact with a test circuit board, and a temperature conducting portion of the press block is in contact with an optical communication device.

Fig. 10 shows a cross-sectional view of the state shown in fig. 9.

Fig. 11 shows a top view of the state shown in fig. 9.

Detailed Description

Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.

In describing embodiments of the present disclosure, the terms "include" and its derivatives should be interpreted as being inclusive, i.e., "including but not limited to. The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first," "second," and the like may refer to different or the same object. Other explicit and implicit definitions are also possible below.

In order to perform a performance test of an optical communication device, it is generally necessary to perform the performance test by placing the optical communication device in a temperature environment of, for example, from-40 ℃ to 85 ℃. However, in order to satisfy the temperature condition of-40 ℃, it is generally required to arrange the optical communication device in a refrigerator, which poses a great challenge to the arrangement of a test system for the optical communication device in consideration of the environment in which the refrigerator operates. Similarly, to achieve a temperature condition of 85 ℃, it is generally necessary to arrange the optical communication device in an oven, which poses a great challenge to the arrangement of a test system of the optical communication device. This is because the test system not only needs to supply power to the optical communication device, but also connects the optical communication device to the optical fiber to enable propagation and detection of the optical signal. Therefore, the electrical and communication terminals of the optical communication device cannot be damaged when the performance test is performed. Furthermore, considering that the environment of a refrigerator cannot provide an environment of an oven, in order to alternately perform performance tests of a low temperature (e.g., -40 ℃), a normal temperature (e.g., -25 ℃) or a high temperature (e.g., 85 ℃) on the optical communication device, it is also necessary to frequently perform connection and conversion of a power supply line and an optical signal, which further complicates a test system and consumes considerable effort and time.

In view of the above technical problems, embodiments according to the present disclosure provide a test system and a test method for an optical communication device, which can implement a performance test of the optical communication device in a simplified manner with low cost, and have a simple structure, are easy to implement, and have high efficiency. The following describes in detail a test system and a test method according to an embodiment of the present disclosure with reference to the drawings. In the illustrated embodiment, the inventive concept according to an embodiment of the present disclosure is illustrated with an optical receiver assembly ROSA as an example of an optical communication device. It should be understood that this is merely exemplary and the inventive concepts according to embodiments of the present disclosure may be applied to any other type of optical communication device.

Fig. 1 shows a perspective schematic view of a test system 100 for an optical communication device 60 according to an embodiment of the present disclosure. As shown in fig. 1, the test system 100 includes a test platform 10, a test circuit board 30, a moving assembly 50, and a temperature modulation system.

The test platform 10 includes a fixture 20 for removably holding an optical communication device. The fixture 20 may be implemented in any suitable form as long as physical retention of the optical communication device is achieved. Fig. 2-4 show schematic structural views of a clamp according to an embodiment of the present disclosure. In the state shown in fig. 2 and 3, the optical communication device 60 is placed in the jig 20; in the state shown in fig. 4, the optical communication device 60 is removed from the jig 20.

In some embodiments, as shown in fig. 2-4, the clamp 20 may include an open-top clamp slot 27. The clip groove 27 is sized to fit with the shape of the package of the optical communication device 60. Thereby, positioning and holding of the optical communication device 60 can be achieved. The fixture 20 may also include an open-top pin receptacle 28, and an adapter for an optical fiber may be disposed in the pin receptacle 28 to couple with an optical signal coupling pin of the optical communication device 60.

In some embodiments, as shown in fig. 2-3, the flexible circuit board 62 of the optical communication device 60 may extend protrudingly from one side of the clamp such that the flexible circuit board 62 is in a suspended arrangement. With this arrangement, connection of the flexible circuit board 62 to other electrical components can be facilitated. In some embodiments, the double flexible circuit board 62 is a single flexible circuit board with both the electrical and signal circuits arranged in a single flexible circuit board. In some embodiments, as shown in fig. 2, the optical communication device 60 includes dual

flex circuit boards

62a, 62b, the dual flex circuit boards 62 being used for signal coupling and power coupling, respectively. In particular, electrical signal coupling may be provided through the first flexible circuit board 62a located at the upper side. In the case where the optical communication device 60 is a light receiving component, after converting light into an electrical signal via the photosensor, it may be coupled with a signal receiving terminal via the first flexible circuit board 62 a. The second flexible circuit board 62b may be electrically connected with the optical communication device 60 to supply power to the optical communication device 60.

The test circuit board 30 is fixed to the test platform 10 and is disposed opposite to the flexible circuit board 60 of the optical communication device. The test circuit board 30 is configured to provide electrical coupling with the optical communication device. For example, in the case where the optical communication device is a light receiving module, in order to make the light receiving module operate, power may be supplied to the flexible circuit board 62 of the optical communication device 60 via the test circuit board 30. In addition, signals conducted into the optical communication device 60 via the optical fiber may be output to the test circuit board 30 via the flexible circuit board 62 for signal reception and/or display. Similarly, in the case where the optical communication device is a light emitting assembly, in order to make the light emitting assembly operate, power may be supplied to the flexible circuit board 62 of the optical communication device 60 via the test circuit board 30; in addition, a light source signal is also provided to the optical communication device 60 to control the laser to emit light, and the light source signal may be output to the flexible circuit board 62 via the test circuit board 30 for signal emission control.

The moving assembly 50 includes a movable mass 40 and an actuator for driving the mass. The pressing block 40 is configured to move toward or away from the optical communication device. At a first position where the press block 40 is close to the optical communication device 60, the press block 40 presses the connection between the flexible circuit board 60 and the test circuit board 30. At a second position where the press block 40 is remote from the optical communication device 60, the press block 40 is remote from the test platform 10 to release the connection between the flexible circuit board 60 and the test circuit board 30. Thereby, during the operation of the optical communication device 60, by releasing or pressing the connection between the flexible circuit board 60 and the test circuit board 30, the conduction of the electrical signals of the flexible circuit board 60 and the test circuit board 30 can be achieved. In this case, it is not necessary to solder the flexible circuit board 60 and the test circuit board 30 to enable releasable electrical connection between the flexible circuit board 60 and the test circuit board 30.

The actuator may include various implementations. In some embodiments, as shown in FIG. 1, the actuator is a pneumatic actuator and may include a cylinder 50 and a push rod 52, the cylinder being operable to move the push rod 52 by inflation or deflation. The push rod can be fixed with the pressing block. Thereby, the movement of the pressure piece between the first position and the second position may be achieved by the actuator. It should be understood that the actuator may be implemented as a drive mechanism other than a pneumatic actuator, such as a servo motor or the like.

In some embodiments, as shown in fig. 1, the actuator may be mounted to a support beam 55, and the support beam 55 may also be secured to the test platform by a pair of clearance brackets 57. As shown in fig. 1, the support beam 55 may include a first mounting hole, the clearance bracket 57 may include a second mounting hole, and the test platform 10 may include a third mounting hole, and the first mounting hole, the second mounting hole, and the third mounting hole may be aligned and mounted together by a fastener such as a screw. Thus, a moving space of the actuator can be conveniently provided by the clearance bracket 57. It will be appreciated that the illustrated construction is exemplary only and that the support beam 55 may be mounted in any other suitable manner, such as by way of a cantilever beam.

The temperature modulation system includes a semiconductor chilling plate 70. As is well known in the art, the semiconductor chilling plates 70 absorb heat and emit heat using the peltier effect of the semiconductor material. According to the test system of the embodiment of the present disclosure, the generated heat can be conducted to the package of the optical communication device by creating a heat transfer path between the semiconductor cooling sheet 70 and the package of the optical communication device and using the semiconductor cooling sheet 70 as a heat source. Thus, the semiconductor chilling plate 70 can be conveniently used to simulate the ambient temperature to which the optical communication device is subjected. Without having to repeatedly place the optical communication device in a refrigerator or an oven.

In some embodiments, as shown in fig. 1, semiconductor chilling plates 70 may be mounted to the briquetting 40. In this case, the establishment of the heat transfer path between the semiconductor cooling chip 70 and the package of the optical communication device 60 is synchronized with the electrical connection of the test circuit board 30 and the flexible circuit board 60. This can ensure that a heat transfer path is created between the semiconductor chilling plate 70 and the package of the optical communication device 60 only in the case of electrical connection between the test circuit board 30 and the flexible circuit board 60.

In some embodiments, as shown in FIG. 4, the temperature modulation system may also include a temperature sensor 73. The temperature sensor 73 may be configured to be able to contact the package surface of the optical communication device. Thus, a measure of the package surface temperature of the optical communication device may be provided by the temperature sensor 73. The temperature sensor 73 may thus provide feedback of the heat provided by the semiconductor chilling plates 70. The user may set the voltage of the semiconductor chilling plate 70 based on the reading of the temperature sensor 73 to thereby ensure that the semiconductor chilling plate 70 maintains the set test temperature in a desired manner.

The temperature sensor 73 may be mounted to any suitable location of the fixture. In some embodiments, as shown in FIG. 4, the fixture 20 further includes a mounting slot 25 for a temperature sensor 73. The temperature sensor 73 is installed in the mounting groove 25 and such that the temperature sensor 73 is in surface contact with the package of the optical communication device 60 in a state where the optical communication device 60 is held by the jig. Thereby, the temperature sensor 73 can reliably detect the temperature of the package surface of the optical communication device 60. In the embodiment shown in fig. 4, the mounting slot 25 is disposed at the bottom of the fixture 20. The mounting groove 25 may, for example, comprise a bottom groove, the shape of which may be shape-coupled with the temperature sensor 73 to ensure that the temperature sensor 73 does not fall off. It should be understood that this is merely exemplary, and that the mounting slots 25 may be disposed in any other suitable portion of the clamp 20, e.g., the mounting slots 25 may be disposed on the sides of the clamp. In some embodiments, as shown in FIG. 1, the fixture 20 may include a bottom opening 17 to facilitate routing and installation of the temperature sensor 73.

In some embodiments, the clamp 20 may include one or more mounting holes 23. The jig 20 may be fixed to the test platform 10 through the mounting hole 23.

Fig. 5 and 6 show block diagrams of compacts according to embodiments of the present disclosure. In some embodiments, as shown in fig. 5 and 6, the compact 40 may include a compact 42 and a temperature-conducting portion 44. The pressing portion 42 is a component that contacts the flexible circuit board 60 and/or the test circuit board 30. The pressing portion 42 may selectively abut against or move away from the flexible circuit board 60 and/or the test circuit board 30 to press or release the connection between the flexible circuit board 60 and the test circuit board 30.

The temperature conduction section 44 is a member for carrying the semiconductor cooling chip 70 and for making contact at the case of the semiconductor cooling chip 70 and the optical communication device 60. In a state where the pressed portion 42 abuts against the flexible circuit board 60 and/or the test circuit board 30, the temperature conduction portion 44 is at least partially in contact with the case of the optical communication device. Thereby, it is possible to transfer or suck heat of the semiconductor cooling fins 70 to or from the package of the optical communication device. In some embodiments, temperature conducting portion 44 is made of a thermally conductive material. The term "thermally conductive material" herein refers to a material having good thermal conductivity. This enables good heat conduction through the temperature conduction section 44 of the compact.

The semiconductor chilling plates 70 may be mounted to the compact in various ways. In some embodiments, as shown in fig. 5 and 6, the temperature conducting portion 44 may include a receiving slot 45 for receiving the semiconductor chilling plate 70 at a side near the testing platform 10. Semiconductor chilling plates 70 may be mounted in receiving slots 45 and in direct thermal contact with the compact. Thereby, the cooling or heating of the semiconductor cooling fins 70 can be transferred to the compact and conducted to the case of the optical communication device 60 via the compact. It should be appreciated that this is merely exemplary and that the semiconductor chilling plates 70 may be mounted to the briquetting 40 in any other suitable manner.

In some embodiments, the dimensions of the receiving slot 45 are configured to: in a state in which the semiconductor chilling plate 70 is received therein, the semiconductor chilling plate 70 is adjacent to and does not contact with the package of the optical communication device. In this case, the package of the optical communication device can be uniformly heated or cooled, so that the semiconductor cooling fin 70 can be prevented from locally overheating or cooling the package of the optical communication device to cause damage to the optical communication device.

In some embodiments, as shown in FIG. 5, the compact 40 may also include a body portion 43. The pressing part 42 and the temperature conductive part 44 may protrudingly extend from one side of the body part 43. A recess may be formed between the pressed portion 42 and the temperature-transmitting portion 44. In some embodiments, the pressed portion 42 and the temperature conductive portion 44 are a unitary member. In other embodiments, the pressed portion 42 and the temperature conductive portion 44 may be formed as separate members and may be assembled together.

In some embodiments, the press 42 may also include a flexible block 46. The term "flexible block" refers to a structure that has some flexibility. The flexible block 46 is configured to press the connection between the flexible circuit board 60 and the test circuit board 30. In the case where the flexible block has some flexibility, the pressing of the pressing portion can be prevented from damaging the electrical contact between the pressed flexible circuit board 60 and the test circuit board 30. In some embodiments, the flexible block may comprise an insulating flexible material such as silicone.

In some embodiments, flexible block 46 is configured to be disposed in thermal isolation from temperature conducting portion 44. By this insulating arrangement, a heat conduction path from the semiconductor cooling plate 70 to the connection between the flexible circuit board 60 and the test circuit board 30 can be blocked. Thereby, it is possible to prevent the electrical contacts of the flexible circuit board 60 and the test circuit board 30 from being damaged in the case of an excessively high temperature of the semiconductor chilling plate 70.

The pressed portion 42 may include various heat conduction path blocking structures. In some embodiments, as shown in fig. 5 and 6, the briquetting 40 may include an adiabatic block 48 mounted on the press section 42. The flexible block 46 may be thermally isolated from the mounting block 42 by an insulating block 48. The flexible block 46 presses the connection between the flexible circuit board 60 and the test circuit board 30, and the heat insulating block 48 is made of a heat insulating material having a lower heat conductivity than the heat conductive material to thermally insulate the flexible block 46 from the temperature conductive part 44. Thus, the heat insulating block 48 may be formed as a heat conduction path blocking structure. In some embodiments, the insulator block 48 may be made of ceramic.

In some embodiments, as shown in fig. 5 and 6, the body portion 42 may include a mounting hole 49. The insulation block 48 may comprise a protrusion adapted to be mounted in the mounting hole 49 and an insulation body, the protrusion may be mounted in the mounting hole 49, the insulation body may have an area greater than or equal to the area of the flexible block 46 and be arranged such that the flexible block 46 is completely thermally isolated from the main body portion 42. The thermal insulation block 48 may be fastened to the main body portion 42 using fasteners such as screws 49.

The flexible block 46 may be mounted to the insulating block 48 using various means. In some embodiments, as shown in fig. 5 and 6, the insulating block 48 may further include a mounting slot 47 and the flexible block may be embedded in the flexible block 46. By way of example, the flexible block 46 may snap into engagement with the insulating block. Additionally or alternatively, the flexible block 46 may be affixed to the insulating block by gluing or the like.

In some embodiments, as shown in FIG. 7, the test system 100 further includes a fixture 32 for holding the test circuit board 30. The holder 32 is open at the bottom side and the top side. This enables the test circuit board 30 to be connected to the flexible circuit board at the top side and the bottom side, respectively. This is particularly advantageous where the optical communication device includes a pair of flexible circuit boards 60. As shown in fig. 7 (refer also to fig. 9), the pressing block 40 is configured to press the signal circuit boards 62a of the pair of flexible circuit boards 60 near the top side without pressing the power supply circuit board 62b. This method of line compaction is advantageous, in particular, in that it reduces signal interference due to compaction, thereby reducing test performance. In some embodiments, the test circuit board 30 includes a slot for receiving the power supply circuit board 62b. The supply circuit board 62b on the bottom side can thus be plugged directly into the test circuit board 30.

In some embodiments, as shown in FIG. 7, the fixture 32 may include one or more mounting holes 37. Thus, the fixture 32 may be secured to the test platform 10 using fasteners such as screws. It will be appreciated that this is merely exemplary and that the securing of the mount may be achieved in any other suitable manner. In some embodiments, as shown in FIG. 7, the test circuit board 30 may include one or more mounting holes 33. Thus, the test circuit board 30 may be fixed to the holder 32 using fasteners such as screws. It should be appreciated that this is merely exemplary and that the securing of the test circuit board 30 may be accomplished in any other suitable manner.

There is also provided a test method 200 for an optical communication device according to an embodiment of the present disclosure. As shown in fig. 8, at block 202, an optical communication device is held with a clamp. At block 204, a test circuit board is provided. At block 206, the connection between the flexible circuit board and the test circuit board is pressed with a press block. At block 208, a voltage applied to a semiconductor chilling plate mounted on the compact is controlled to heat or cool the optical communication device such that the optical communication device is at a predetermined temperature. In some cases, the package temperature of the optical communication device may be determined by sensing the temperature of the package surface of the optical communication device. The voltage applied to the semiconductor chilling plate mounted on the pressure block may be controlled based on the sensed temperature of the package surface of the optical communication device to bring the optical communication device to a predetermined temperature. At block 210, the optical communication device is tested for operational performance at a predetermined temperature. In some embodiments, recording the operational performance of the optical communication device may be further included, and determining whether the optical communication device satisfies a predetermined design performance by the recorded operational performance.

According to the method and system of the embodiment of the present disclosure, it is not necessary to repeatedly transfer the optical communication device between the oven and the refrigerator and make an associated connection, whereby a performance test of the optical communication device can be performed at low cost.

In some embodiments, the method may further comprise: the thermal conduction path from the semiconductor chilling plate 70 to the optical communication device is formed by the press block 40 while the connection between the flexible circuit board and the test circuit board is pressed by the press block.

In some embodiments, the method further comprises providing the press block 40 with a thermal insulation block 48 such that a portion of the connection between the press flexible circuit board 60 and the test circuit board 30 of the press block 40 is thermally insulated from the semiconductor chilling plates 70 via the thermal insulation block 48. In this case, the heat from the semiconductor chilling plates 70 can be prevented from damaging the circuit board.

9-11 show schematic diagrams of test platform operating states according to embodiments of the present disclosure. As shown in fig. 9-11, the holder 20 holds the optical communication device 60. Test circuit board 30 is secured to the test platform, and in some embodiments may be secured to the test platform via a fixture 32. The pressing block 40 is movably disposed above the optical communication device 60. In the state shown in fig. 9 to 11, the pressing portion (the flexible block 46 in the illustrated embodiment) of the press block 30 presses the connection between the flexible circuit board 60 and the test circuit board 30. In the case where the flexible circuit board 60 includes a pair of circuit boards, i.e., a signal circuit board 62a and a power supply circuit board 62b, the power supply circuit board 62b may be plugged in a socket of the test circuit board 30, for example, and the pressed portion of the press block 30 presses only the connection between the signal circuit board 62a and the test circuit board 30. Thereby, power supply and signal transmission of the optical communication device 60 can be realized.

The semiconductor chilling plates 70 are mounted to the pressurization block 40. The optical communication device 60 may be heated or cooled by controlling the voltage applied to the semiconductor cooling plate 70. Thereby, the optical communication device can be brought into a predetermined temperature condition for simulating an ambient temperature. In the embodiment shown in fig. 9, the temperature sensor 73 may be in contact with the package surface of the optical communication device 60 to detect the temperature of the package surface of the optical communication device 60. Based on the temperature sensed by the temperature sensor 73, it can be used to control the voltage applied to the semiconductor chilling plates 70. With the package of the optical communication device 60 at a predetermined temperature, a test is performed on the optical communication device to test the operational performance of the optical communication device at the predetermined temperature.

Further, while operations are depicted in a particular order, this should be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. Under certain circumstances, multitasking and parallel processing may be advantageous. Likewise, while several specific implementation details are included in the above discussion, these should not be construed as limitations on the scope of the disclosure. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable subcombination.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Claims

1. A test system (100) for an optical communication device, comprising:

a test platform (10) comprising a fixture (20) to detachably hold the optical communication device, the optical communication device comprising a flexible circuit board (60) and being fixed to the fixture (20) in a predetermined orientation;

a test circuit board (30) fixed to the test platform (10) and arranged opposite to the flexible circuit board (60) of the optical communication device;

a moving assembly (50) including a movable press block (40), the press block (40) being configured to move between a first position in which the press block (40) presses the connection between the flexible circuit board (60) and the test circuit board (30) and a second position in which the press block (40) is away from the test platform (10) to release the connection between the flexible circuit board (60) and the test circuit board (30); and

a temperature modulation system comprising a semiconductor chilling plate (70) capable of establishing a heat transfer path with a package of the optical communication device, the semiconductor chilling plate (70) configured to generate or absorb heat based on an applied voltage to regulate a temperature experienced by the package of the optical communication device.

2. The test system (100) of claim 1, wherein the semiconductor chilling plate (70) is mounted to the press block (40) such that the semiconductor chilling plate (70) establishes a heat transfer path with a case of the optical communication device in a state where the test circuit board (30) and the flexible circuit board (60) are electrically connected.

3. The test system (100) of claim 2, wherein the compact (40) comprises:

a pressing portion (42) that presses a connection between the flexible circuit board (60) and the test circuit board (30) at the first position; and

a temperature conducting section (44) adapted to mount the semiconductor chilling plate (70), the temperature conducting section (44) being at least partially in contact with the cartridge of the optical communication device in the first position to heat or cool the cartridge of the optical communication device via at least thermal conduction;

wherein the temperature conducting portion (44) is made of a thermally conductive material.

4. The test system (100) of claim 3, wherein the press (42) further comprises a flexible block (46), the flexible block (46) being configured to press the connection between the flexible circuit board (60) and the test circuit board (30).

5. The test system (100) of claim 4, wherein the flexible block (46) is configured to be disposed in thermal isolation from the temperature conducting portion (44).

6. The test system (100) of claim 3, wherein the compact (40) further comprises:

an adiabatic block (48) installed on the pressing part (42); and

a flexible block (46) mounted on the heat insulating block, the flexible block (46) pressing a connection between the flexible circuit board (60) and the test circuit board (30), the heat insulating block (48) being made of a heat insulating material having a heat conductivity lower than that of the heat conductive material to thermally insulate the flexible block (46) from the temperature conductive part (44).

7. The test system (100) according to any one of claims 2-6, wherein the temperature conductive portion (44) comprises a receiving slot (45) for receiving the semiconductor chilling plate (70) at a side close to the test platform (10).

8. The test system (100) of claim 7, wherein the dimensions of the receiving slot (45) are configured to: in a state in which the semiconductor cooling fin (70) is received therein, the semiconductor cooling fin (70) is adjacent to and does not contact the package of the optical communication device.

9. The test system (100) of any one of claims 1-6 and 8, wherein the temperature modulation system further comprises a temperature sensor (73), the temperature sensor (73) being configured to be contactable with a surface of the optical communication device to sense a temperature of the surface of the optical communication device;

wherein the jig (20) further comprises a mounting groove (25) disposed at a side or bottom of the jig (20), the temperature sensor (73) being mounted within the mounting groove (25).

10. The test system (100) according to any one of claims 1-6, 8, wherein in case the optical communication device comprises a pair of flexible circuit boards (60), the test system (100) further comprises a fixture for fixing the test circuit board (30), the fixture being open at a bottom side and a top side, such that the test circuit board (30) can be connected to the pair of flexible circuit boards (60) at the top side and the bottom side, respectively, wherein the press block (40) is configured to press a signal circuit board of the pair of flexible circuit boards (60), the test circuit board (30) comprising a slot for receiving a power supply circuit board of the pair of flexible circuit boards (60).

11. The testing system (100) of any of claims 1-6, 8, wherein the testing system (100) further comprises a support beam (55), the moving assembly (50) being mounted to the support beam (55), the moving assembly (50) being a pneumatic actuator comprising a push rod (52), the press block (40) being attached to the push rod (52) to move in accordance with actuation of the pneumatic actuator.

12. A testing method for an optical communication device, the optical communication device comprising a flexible circuit board (60), comprising:

holding the optical communication device with a jig (20);

providing a test circuit board (30);

-pressing the connection between the flexible circuit board (60) and the test circuit board (30) with a press block (40);

controlling a voltage applied to a semiconductor cooling plate (70) mounted on the compact (40) to heat or cool an optical communication device such that the optical communication device is at a predetermined temperature; and

and testing the operation performance of the optical communication device at the preset temperature.

13. The testing method of claim 12, further comprising: forming a thermal conduction path from the semiconductor chilling plate (70) to the optical communication device with the briquetting (40) simultaneously with the pressing;

the testing method further comprises providing the press block (40) with a heat insulating block (48) such that a portion of the press block (40) pressing the connection between the flexible circuit board (60) and the test circuit board (30) is thermally insulated from the semiconductor chilling plate (70) via the heat insulating block (48).