CN114799403A

CN114799403A - Eutectic bonding table with accurate temperature control chip

Info

Publication number: CN114799403A
Application number: CN202111048048.6A
Authority: CN
Inventors: 詹静; 孔大军; 李典
Original assignee: Miaide Intelligent Technology Suzhou Co ltd
Current assignee: Miaide Intelligent Technology Suzhou Co ltd
Priority date: 2021-09-08
Filing date: 2021-09-08
Publication date: 2022-07-29

Abstract

The invention discloses a eutectic bonding table with a precise temperature control chip, which comprises a bottom plate, a heating table base, a heating table cavity and a cache table base, wherein a support frame is installed at the top of the bottom plate, a U-shaped protection plate is installed at the top of the bottom plate and is positioned on the back surface of the support frame, the heating table base is installed at the bottom of the support frame, the heating table cavity is installed at the top of the heating table base, the cache table base is installed at the top of the bottom plate and is positioned inside the protection plate, and a heating table top cover is installed at the top of the heating table cavity. The eutectic bonding table has the advantages of compact structure, accurate temperature control, rapid temperature rise and small overall size. The eutectic bonding table is composed of 1 heating table and 4 chip buffer tables, the maximum heating temperature of the heating table can reach 600 ℃, the stable controllable temperature is 25-550 ℃, the temperature control precision is less than +/-2 ℃, the temperature rise is 40 ℃/s, and the temperature overshoot is less than 5 ℃, so that the temperature can be accurately controlled.

Description

Eutectic bonding table with accurate temperature control chip

Technical Field

The invention relates to the technical field of chip bonding, in particular to a eutectic bonding table with a chip with accurate temperature control.

Background

The accurate temperature control chip eutectic bonding table is used for eutectic welding needing accurate temperature control. The eutectic bonding table has the characteristics of compact structure, accurate temperature control, high temperature rise speed and the like.

The existing chip bonding table has the following defects:

1. the reference CN103367208B discloses a chip bonder and a heating plate thereof, and the right of protection "relates to semiconductor testing process. The heating plate of the existing chip bonding machine table can be used for devices with different specifications only by rotating and turning over, and is inconvenient to use. The heating plate of the chip bonding machine table is longitudinally provided with three heating areas for fixing a device and heating the device to different degrees, the device is provided with two rows of parallel pins, the surface of the heating plate is longitudinally provided with a plurality of parallel clamping grooves, and each clamping groove is also provided with at least one vacuumizing hole. The invention also provides a chip bonding machine. The heating plate can be used for bonding chips of devices with various specifications without rotating the heating surface, and can simultaneously operate a plurality of devices for devices with small specification sizes, and the device recycling efficiency can be further improved by using the anti-static pipe clamp in a matched manner, so that the device pin is prevented from being bent and the device is prevented from being damaged by human static electricity, but the device cannot accurately control the temperature, and the quality of the chips is poor;

2. the existing chip bonding table has no anti-shake device, thereby affecting the quality of the chip.

Disclosure of Invention

The invention aims to provide a eutectic bonding table with a precise temperature control chip, which aims to solve the problems of precise temperature control and anti-shake function in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a chip eutectic bonding platform with accurate accuse temperature, includes bottom plate, warm table base, warm table cavity and buffer station base, the support frame is installed at the top of bottom plate, U type guard plate is installed at the top of bottom plate, and the guard plate is located the back of support frame, the warm table base is installed to the bottom of support frame, the warm table cavity is installed at the top of warm table base, buffer station base is installed at the top of bottom plate, and buffer station base is located the inside of guard plate, the warm table top cap is installed at the top of warm table cavity.

Preferably, the back mounted of warm table base has the vacuum gas circuit pipe, and the back mounted of warm table base has nitrogen gas filling district top air inlet, and the back mounted of warm table base has warm table cavity cooling air to connect the export, and the back mounted of warm table base has nitrogen gas air knife air inlet, and the back mounted of warm table base has nitrogen gas filling district lower part air inlet, and the back mounted of warm table base has the clean gas circuit air inlet of suction nozzle, and the back mounted of warm table base has warm table cavity cooling air to insert the mouth.

Preferably, the vacuum gas circuit access mouth is all installed to the both sides outer wall of buffer station base, and buffer station installation piece is installed at the top of buffer station base, and the top of buffer station installation piece is equipped with four groups of screw through-holes, and the top of buffer station installation piece is equipped with two sets of hexagon socket head cap screw holes, and the buffer station is installed at the top of buffer station installation piece.

Preferably, the top of warm table cavity is equipped with nitrogen gas and fills the district, and ceramic heating plate is installed to the inside diapire in nitrogen gas filling district, and the heating member is installed at ceramic heating plate's top, and the copper billet is installed at the top of heating member, and the top of heating member is equipped with at the vacuum hole, and first warm table positioning mechanism is installed at the top of warm table cavity, and second warm table positioning mechanism is installed at the top of warm table cavity.

Preferably, a top air knife is mounted on the top of the heating table top cover.

Compared with the prior art, the invention has the beneficial effects that:

1. the eutectic bonding table has the advantages of compact structure, accurate temperature control, rapid temperature rise and small overall size. The eutectic bonding table consists of 1 heating table and 4 chip cache tables, the highest heating temperature of the heating table can reach 600 ℃, the stable controllable temperature is 25-550 ℃, the temperature control precision is less than +/-2 ℃, the temperature rise is 40 ℃/s, and the temperature overshoot is less than 5 ℃;

2. according to the invention, one chip can be placed on each chip cache table, and the eutectic welding of 5 types of chips can be realized at most by calculating the chip substrate placed in the heating table, the setting of the eutectic heating temperature is very convenient, and the eutectic welding of 5 sections of temperature curves can be set at most in one eutectic welding process, so that the multi-chip multi-level eutectic welding can be realized. The warm table gas circuit control is very nimble, the warm table has 3 way nitrogen gas access interfaces, 1 way vacuum interface, 1 way compressed air cooling structure, and every way gas circuit all is the independent control, can set for the combination of multiple gas circuit switching and realize chip nitrogen protection, chip nitrogen gas cooling, chip top air knife sweeps at eutectic welded in-process, prevent to cause the air shake because of heating high temperature when the camera is shot, cause multiple functions such as shooting distortion, chip absorption, eutectic platform cooling.

Drawings

FIG. 1 is a schematic view of the external structure of the present invention;

FIG. 2 is a schematic top view of a heating chamber according to the present invention;

FIG. 3 is a schematic cross-sectional view of a portion of the heating chamber of the present invention;

FIG. 4 is a schematic view of a base portion of the heating stage of the present invention;

FIG. 5 is a schematic diagram of a base portion of a buffer stage according to the present invention.

In the figure: 1. a base plate; 101. a support frame; 102. a protection plate; 2. a heating table base; 201. a vacuum gas circuit pipe; 202. a top gas inlet of the nitrogen filling area; 203. a heating table cavity cooling air outlet; 204. a nitrogen gas air knife inlet; 205. a gas inlet at the lower part of the nitrogen filling area; 206. cleaning an air inlet of an air path by using a suction nozzle; 207. a cooling air inlet of the heating table cavity; 3. a heating table top cover; 301. a top air knife; 4. a cache table base; 401. a vacuum gas circuit access port; 402. a cache table mounting block; 403. a threaded through hole; 404. an inner hexagonal screw hole; 405. a cache station; 5. a heating table cavity; 501. a nitrogen gas filling area; 502. a ceramic heating plate; 503. a heating body; 504. a copper block; 505. a vacuum hole; 506. a first heating stage positioning mechanism; 507. and a second heating table positioning mechanism.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1: please refer to fig. 1-4, a eutectic bonding table with a precise temperature control chip comprises a bottom plate 1, a heating table base 2, a heating table cavity 5 and a buffer table base 4, wherein a support frame 101 is installed at the top of the bottom plate 1, a U-shaped protection plate 102 is installed at the top of the bottom plate 1, the protection plate 102 is located at the back of the support frame 101, the heating table base 2 is installed at the bottom of the support frame 101, the heating table cavity 5 is installed at the top of the heating table base 2, the buffer table base 4 is installed at the top of the bottom plate 1, the buffer table base 4 is located inside the protection plate 102, and a heating table top cover 3 is installed at the top of the heating table cavity 5.

Example 1: referring to fig. 1 to 4, a vacuum air path pipe 201 is installed on the back surface of the heating table base 2, a top air inlet 202 of a nitrogen filling area is installed on the back surface of the heating table base 2, a cooling air outlet 203 of a heating table cavity is installed on the back surface of the heating table base 2, a nitrogen air knife air inlet 204 is installed on the back surface of the heating table base 2, a lower air inlet 205 of the nitrogen filling area is installed on the back surface of the heating table base 2, a nozzle cleaning air path air inlet 206 is installed on the back surface of the heating table base 2, and a cooling air inlet 207 of the heating table cavity is installed on the back surface of the heating table base 2.

Example 1: referring to fig. 1-4, vacuum gas circuit inlets 401 are mounted on the outer walls of two sides of the cache table base 4, a cache table mounting block 402 is mounted on the top of the cache table base 4, four sets of threaded through holes 403 are disposed on the top of the cache table mounting block 402, two sets of hexagon socket screw holes 404 are disposed on the top of the cache table mounting block 402, and a cache table 405 is mounted on the top of the cache table mounting block 402.

Example 1: referring to fig. 1-4, a nitrogen filling region 501 is disposed on the top of the heating stage cavity 5, a ceramic heating sheet 502 is mounted on the bottom wall of the nitrogen filling region 501, a heating body 503 is mounted on the top of the ceramic heating sheet 502, a copper block 504 is mounted on the top of the heating body 503, a vacuum hole 505 is disposed on the top of the heating body 503, a first heating stage positioning mechanism 506 is mounted on the top of the heating stage cavity 5, and a second heating stage positioning mechanism 507 is mounted on the top of the heating stage cavity 5.

Example 1: referring to fig. 1-4, a top air knife 301 is mounted on the top of the heating table top cover 3.

Theory of operation, warm table base: for use throughout the heating station, heating station cavity: is an important part on the heating table and is used for supporting the heating body. Processing has nitrogen gas to fill the cavity, forms the anaerobic environment, and inside has many nitrogen gas and compressed air passageway, realizes that nitrogen gas fills the cavity top and blows nitrogen gas, forms nitrogen gas and fills the environment, isolated oxygen, and nitrogen gas fills cavity bottom and blows nitrogen gas, and quick cooling heating member and chip self let in compressed air, rapid cooling function, warm table heating member: the heating member part comprises potsherd and copper billet, and the potsherd is used for heating the copper billet, and the copper billet is used for bearing the chip, and the copper billet processing has vacuum hole and vacuum gas circuit, holds the chip from the bottom, and the warm table top cap: the top cover covers the heating table cavity, and the top cover and the nitrogen filling cavity in the heating table cavity form a cavity with a small opening and a large bottom, so that the contact area of the chip and oxygen during eutectic welding is reduced. The top air knife is equipped with on the top cap, can prevent the formation of image distortion that arouses because of the air shake that the heating high temperature caused when the camera is shot and is fixed a position, warm table positioning mechanism: pressing and clamping the heating body of the heating table. The thermal expansion factor of every part of heating stage in the eutectic heating process is fully considered to positioning mechanism, can effectively push down and press from both sides tight heating stage heating member in heating stage operating temperature range, and heating stage cavity cooling air inserts and the contact opening: be used for in the cooling stage to the cold rapid cooling of warm table cavity, nitrogen gas filling area top air inlet: after the nitrogen is introduced into the nitrogen filling area, the nitrogen can return back through the gas path and enter the nitrogen filling area from the periphery of the top of the nitrogen filling area. Generally used in the eutectic heating phase, oxygen is isolated from entering the nitrogen filled region, the bottom inlet of the nitrogen filled region: after the nitrogen is introduced, the nitrogen enters the nitrogen filling area from the bottom of the nitrogen filling area through the air passage and is opposite to the bottom of the ceramic heating plate. Normally used for eutectic heating to begin venting air from the nitrogen-filled region; the flow rate can be reduced and oxygen can be isolated from entering a nitrogen filling area in the eutectic welding process according to the process requirements; after the eutectic welding is finished, blowing in nitrogen gas to cool the heating body and the chip quickly, wherein an air inlet of the nitrogen gas air knife is as follows: after nitrogen is introduced into the air inlet, the nitrogen can be blown out from the air outlet of the top air knife of the top cover. The imaging distortion caused by air shake caused by high temperature heating is prevented when the camera is positioned for taking a picture. In addition, the process can also be adjusted, nitrogen blown by the air knife is directly used for replacing the nitrogen introduced from the top air inlet of the nitrogen filling area, and the air inlet of the air path is cleaned by the suction nozzle: this gas circuit can blow cleanly to the suction nozzle when having clean requirement through warm table direct connection to top cap, buffer memory platform base: a be used for bearing buffering platform installation piece, its inside processing has vacuum gas circuit, buffering platform installation piece: for carrying 4 cache stations. The installation piece is connected with the base through two hexagon socket head cap screws, and the screw hole installation holding screw at 4 angles carries out the leveling, eliminates the processing error and the assembly error of buffer memory platform between for the warm table, buffer memory platform: the plastics material has the through-hole to connect vacuum negative pressure in the middle of, can absorb the chip and can guarantee in eutectic bonding platform motion process that the chip can not take place relative displacement with the buffer memory platform, and the vacuum gas circuit inserts the mouth: each cache table corresponds to one access port and is used for accessing the negative pressure suction chip.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a chip eutectic bonding platform with accurate accuse temperature, includes bottom plate (1), warm table base (2), warm table cavity (5) and buffer table base (4), its characterized in that: support frame (101) are installed at the top of bottom plate (1), U type guard plate (102) are installed at the top of bottom plate (1), and guard plate (102) are located the back of support frame (101), warm table base (2) are installed to the bottom of support frame (101), warm table cavity (5) are installed at the top of warm table base (2), buffer table base (4) are installed at the top of bottom plate (1), and buffer table base (4) are located the inside of guard plate (102), warm table top cap (3) are installed at the top of warm table cavity (5).

2. The eutectic bonding station with the precise temperature control chip of claim 1, wherein: the back mounted of warm table base (2) has vacuum gas circuit pipe (201), the back mounted of warm table base (2) has nitrogen gas filling district top air inlet (202), the back mounted of warm table base (2) has warm table cavity cooling air to connect export (203), the back mounted of warm table base (2) has nitrogen gas air knife air inlet (204), the back mounted of warm table base (2) has nitrogen gas filling district lower part air inlet (205), the back mounted of warm table base (2) has clean gas circuit air inlet (206) of suction nozzle, the back mounted of warm table base (2) has warm table cavity cooling air access mouth (207).

3. The eutectic bonding station with the precise temperature control chip of claim 1, wherein: the vacuum gas circuit access port (401) is all installed to the both sides outer wall of buffer table base (4), and buffer table installation piece (402) is installed at the top of buffer table base (4), and the top of buffer table installation piece (402) is equipped with four sets of screw through-holes (403), and the top of buffer table installation piece (402) is equipped with two sets of hexagon socket head cap screw holes (404), and buffer table (405) is installed at the top of buffer table installation piece (402).

4. The eutectic bonding station with the precise temperature control chip of claim 1, wherein: the top of warm table cavity (5) is equipped with nitrogen gas filling area (501), ceramic heating piece (502) are installed to the inside diapire in nitrogen gas filling area (501), heating member (503) are installed at the top of ceramic heating piece (502), copper billet (504) are installed at the top of heating member (503), the top of heating member (503) is equipped with at vacuum hole (505), first warm table positioning mechanism (506) are installed at the top of warm table cavity (5), second warm table positioning mechanism (507) are installed at the top of warm table cavity (5).

5. The eutectic bonding station with the precise temperature control chip of claim 1, wherein: and a top air knife (301) is arranged at the top of the heating table top cover (3).