CN216564214U - External heat radiation structure of high-low voltage switch cabinet - Google Patents

External heat radiation structure of high-low voltage switch cabinet Download PDF

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Publication number
CN216564214U
CN216564214U CN202123274854.3U CN202123274854U CN216564214U CN 216564214 U CN216564214 U CN 216564214U CN 202123274854 U CN202123274854 U CN 202123274854U CN 216564214 U CN216564214 U CN 216564214U
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low voltage
switch cabinet
voltage switch
external heat
heat dissipation
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杨明
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Henan Hongxing Electrical Equipment Co ltd
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Henan Hongxing Electrical Equipment Co ltd
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Abstract

The utility model discloses an external heat dissipation structure of a high-low voltage switch cabinet, which comprises a bottom plate, wherein a high-low voltage switch cabinet group is arranged above the bottom plate, a plurality of external heat dissipation pieces are arranged on the upper end surface of the bottom plate, mounting holes are arranged on the left side and the right side of the bottom plate in a penetrating manner, the external heat dissipation pieces comprise rectangular frames, and cooling pipes are arranged in the rectangular frames. The high-low voltage switch cabinet is simple in structure, clear and understandable in structure, and comprises the external heat radiating piece, wherein the external heat radiating piece and the high-low voltage switch cabinet group are arranged independently, so that the high-low voltage switch cabinet is convenient to install, disassemble and maintain; after heat exchange is carried out between the cooling pipe and the high-low voltage switch cabinet group, the semiconductor cooling fin carries out heat exchange with the cooling pipe and is used for cooling the coolant in the cooling pipe, so that the coolant is ensured to have a continuous heat dissipation effect, and the practicability is high; high-low voltage switch cabinet group and the rectangle frame joint that corresponds, the cooling tube behind the joint is sealed setting, and external heat dissipation piece can be installed according to the quantity of cubical switchboard in the high-low voltage switch cabinet group, and is functional strong, is worth using widely.

Description

External heat radiation structure of high-low voltage switch cabinet
Technical Field
The utility model relates to the technical field of high-low voltage switch cabinets, in particular to an external heat dissipation structure of a high-low voltage switch cabinet.
Background
The high-low voltage switch cabinet is a device for connecting high-voltage or low-voltage cables as the name implies, a high-voltage cabinet is used by a common power supply station and a substation, the high-voltage cabinet is subjected to voltage reduction by a transformer and then enters a low-voltage cabinet, the low-voltage cabinet enters each power distribution box, and protective devices such as switch breakers and the like are assembled into an integrated electrical device without the inside. High-low voltage switch cabinet among the prior art leads to high temperature in the high-low voltage switch cabinet because the operation of self leakproofness and inside power device, causes the damage of electrical apparatus original paper in the switch cabinet easily.
Through the retrieval, chinese patent No. CN 210628782U discloses a ventilation and heat dissipation structure of high-low voltage switch cabinet, through setting up first filter plate and second filter plate, first filter plate is used for ventilating, when the air discharge fan carries out high-speed rotation under the drive of motor output shaft, can derive the internal high-temperature gas of cabinet, and make the inside of the cabinet body form the negative pressure, the external bottom air of cabinet just can enter into the cabinet body through first filter plate, and the air can filter the air at the in-process first filter plate that gets into the internal portion of cabinet, reduce dust volume in the air, and the second filter plate is used for preventing that the air discharge fan is when the stop work, outside air enters into the cabinet body through the gas vent and carries the dust.
However, it is internal that above-mentioned heat radiation structure can not guarantee that the steam in the air gets into the cabinet, and steam can cause more serious consequence to the internal circuit of cabinet to, this kind of heat radiation mode needs regular cleaning to the filter, and the filter can not guarantee completely that dust impurity gets into the cabinet internally, and the practicality is not strong, consequently, needs the external heat radiation structure of a high-low voltage switch cabinet.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides an external heat dissipation structure of a high-low voltage switch cabinet.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides an external heat radiation structure of high-low voltage switch cabinet, includes the bottom plate, the bottom plate top is provided with high-low voltage switch cabinet group, a plurality of external heat dissipation pieces are installed to the bottom plate up end, the mounting hole is worn to be equipped with by the bottom plate left and right sides, external heat dissipation piece includes the rectangle frame, install the cooling tube in the rectangle frame, high-low voltage switch cabinet group bottom face is provided with the rectangular channel, rectangle frame and rectangular channel joint are connected with the connecting pipe between the cooling tube in the adjacent rectangle frame, the circulating pump is installed in bottom plate up end left side, circulating pump input and output respectively with the bottom plate on the cooling tube on leftmost side and rightmost side between be connected with the hose.
Furthermore, a compression spring is connected between the bottom end face of the rectangular frame and the upper end face of the bottom plate.
Furthermore, the corners all around of the rectangular frame are provided with positioning grooves, the bottom end face of the high-low voltage switch cabinet group is connected with supporting columns all around, and the supporting columns and the positioning grooves are correspondingly clamped.
Furthermore, the high-low voltage switch cabinet group and the external heat dissipation piece below the high-low voltage switch cabinet group are provided with five groups.
Furthermore, a semiconductor cooling fin is arranged below the cooling pipe in the rectangular frame.
Compared with the prior art, the utility model has the beneficial effects that:
1. the heat dissipation structure is used for heat dissipation of a high-low voltage switch cabinet group, and is simple in structure, clear and understandable in structure, and comprises an external heat dissipation piece, wherein the external heat dissipation piece is installed above a bottom plate and comprises a rectangular frame, a cooling pipe is installed in the rectangular frame, a coolant is filled in the cooling pipe, a circulating pump can push the coolant in the cooling pipe to circularly flow, the high-low voltage switch cabinet group is erected above the bottom plate, the rectangular frame and the cooling pipe in the rectangular frame are clamped in a rectangular groove, the bottom plate is installed through an installation hole, the cooling pipe is abutted against the top side wall in the rectangular groove on the high-low voltage switch cabinet group, so that heat in the high-low voltage switch cabinet group can be taken away, the heat dissipation effect is excellent, the external heat dissipation piece and the high-low voltage switch cabinet group are arranged independently, the installation is convenient, and the disassembly and maintenance are convenient;
2. according to the utility model, the semiconductor cooling fin is arranged below the cooling pipe in the rectangular frame, and after heat exchange is carried out between the cooling pipe and the high-low voltage switch cabinet group, the semiconductor cooling fin and the cooling pipe carry out heat exchange for cooling the coolant in the cooling pipe, so that the coolant is ensured to have a continuous heat dissipation effect, and the practicability is strong;
3. the high-low voltage switch cabinet group is clamped with the corresponding rectangular frame, the clamped cooling pipe is arranged in a sealing mode, the external heat dissipation piece can be installed according to the number of the switch cabinets in the high-low voltage switch cabinet group, and the adaptability is high.
In conclusion, the high-low voltage switch cabinet has the advantages of simple structure, clear and understandable structure, convenient installation and convenient disassembly and maintenance, and comprises the external heat dissipation part which is mutually independent from the high-low voltage switch cabinet group; after heat exchange is carried out between the cooling pipe and the high-low voltage switch cabinet group, the semiconductor cooling fin carries out heat exchange with the cooling pipe and is used for cooling the coolant in the cooling pipe, so that the coolant is ensured to have a continuous heat dissipation effect, and the practicability is high; high-low voltage switch cabinet group and the rectangle frame joint that corresponds, the cooling tube behind the joint is sealed setting, and external heat dissipation piece can be installed according to the quantity of cubical switchboard in the high-low voltage switch cabinet group, and is functional strong, is worth using widely.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model.
Fig. 1 is a schematic perspective view of an external heat dissipation structure of a high-low voltage switch cabinet according to the present invention;
fig. 2 is a schematic rear view perspective structure diagram of an external heat dissipation structure of a high-low voltage switch cabinet according to the present invention;
fig. 3 is a schematic view of a bottom perspective structure of an external heat dissipation structure of a high-low voltage switch cabinet according to the present invention;
fig. 4 is a schematic diagram of an external heat sink structure of a high-low voltage switch cabinet according to the present invention.
In the figure: 1-high-low voltage switch cabinet group, 2-support column, 3-mounting hole, 4-bottom plate, 5-external heat sink, 6-rectangular frame, 7-positioning groove, 8-semiconductor cooling plate, 9-compression spring, 10-cooling pipe, 11-circulating pump, 12-hose, 13-connecting pipe, 14-rectangular groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-4, an external heat radiation structure of high-low voltage switch cabinet, including bottom plate 4, 4 tops of bottom plate are provided with high-low voltage switch cabinet group 1, a plurality of external heat dissipation spare 5 are installed to 4 up end of bottom plate, mounting hole 3 is worn to be equipped with by 4 left and right sides of bottom plate, external heat dissipation spare 5 includes rectangle frame 6, install cooling tube 10 in the rectangle frame 6, 1 bottom face of high-low voltage switch cabinet group is provided with rectangular channel 14, rectangle frame 6 and rectangular channel 14 joint are connected with connecting pipe 13 between the cooling tube 10 in the adjacent rectangle frame 6, circulating pump 11 is installed in bottom plate 4 up end left side, circulating pump 11 input and output respectively with be connected with hose 12 between the cooling tube 10 on bottom plate 4 leftmost side and rightmost side.
The utility model relates to heat dissipation for a high-low voltage switch cabinet set 1, which comprises an external heat dissipation piece 5, wherein the external heat dissipation piece 5 is installed above a bottom plate 4, the external heat dissipation piece 5 comprises a rectangular frame 6, a cooling pipe 10 is installed in the rectangular frame 6, a coolant is filled in the cooling pipe 10, a circulating pump 11 can push the coolant in the cooling pipe 10 to circularly flow, the high-low voltage switch cabinet set 1 stands above the bottom plate 4, the rectangular frame 6 and the cooling pipe 10 in the rectangular frame 6 are clamped in a rectangular groove 14, the bottom plate 4 is installed through a mounting hole 3, the cooling pipe 10 is abutted against the top side wall in the rectangular groove 14 on the high-low voltage switch cabinet set 1, heat in the high-low voltage switch cabinet set 1 can be taken away, the heat dissipation effect is excellent, the external heat dissipation piece 5 and the high-low voltage switch cabinet set are mutually independent, the installation is convenient, and the disassembly and the assembly are convenient to maintain.
Be connected with compression spring 9 between 6 bottom end faces of rectangle frame and the 4 up end of bottom plate, high-low voltage switch cabinet group 1 stands in external heat sink 5 top, and the compression spring 9 of 6 bottoms of rectangle frame is compressed for rectangle frame 6 stably clamps in rectangular channel 14, makes cooling tube 10 and the 14 interior top lateral wall butt of rectangular channel, and the radiating effect is good.
Rectangular frame 6 corner all around is provided with constant head tank 7, 1 bottom face of high-low voltage switch cabinet group is connected with support column 2 all around, support column 2 and constant head tank 7 correspond the joint.
High low-voltage switch cabinet group 1 is upright in 6 tops of rectangle frame, and at this moment, support column 2 and constant head tank 7 correspond the joint, guarantee rectangle frame 6 and 14 stable connections of rectangular channel, and the practicality is strong.
The high-low voltage switch cabinet group 1 and the external heat sink 5 below the high-low voltage switch cabinet group are provided with five groups.
The external heat radiating piece 5 and the high-low voltage switch cabinet group 1 above the external heat radiating piece are installed in a superposition mode, the external heat radiating piece 5 can be increased according to the number of switch cabinets in the high-low voltage switch cabinet group 1, and the adaptability is high.
Semiconductor cooling fin 8 is installed to cooling tube 10 below in the rectangle frame 6, carries out the heat exchange back between cooling tube 10 and the high-low voltage switch cabinet group 1, and semiconductor cooling fin 8 carries out the heat exchange with cooling tube 10 for coolant cooling in cooling tube 10 guarantees that the coolant has continuous radiating effect, and the practicality is strong.
The working principle and the using process of the utility model are as follows: the heat dissipation device is used for heat dissipation of a high-low voltage switch cabinet group 1 and comprises an external heat dissipation piece 5, the external heat dissipation piece 5 is installed above a bottom plate 4, the external heat dissipation piece 5 comprises a rectangular frame 6, a cooling pipe 10 is installed in the rectangular frame 6, a coolant is filled in the cooling pipe 10, a circulating pump 11 can push the coolant in the cooling pipe 10 to circularly flow, the high-low voltage switch cabinet group 1 stands above the bottom plate 4, the rectangular frame 6 and the cooling pipe 10 in the rectangular frame 6 are clamped in a rectangular groove 14, the bottom plate 4 is installed through a mounting hole 3, the cooling pipe 10 is abutted to the top side wall in the rectangular groove 14 on the high-low voltage switch cabinet group 1, heat in the high-low voltage switch cabinet group 1 can be taken away, the heat dissipation effect is excellent, the external heat dissipation piece 5 and the high-low voltage switch cabinet group are arranged independently, the installation is convenient, and the disassembly and the assembly are convenient to maintain;
semiconductor cooling fin 8 is installed to cooling tube 10 below in the rectangle frame 6, carries out the heat exchange back between cooling tube 10 and the high-low voltage switch cabinet group 1, and semiconductor cooling fin 8 carries out the heat exchange with cooling tube 10 for coolant cooling in cooling tube 10 guarantees that the coolant has continuous radiating effect, and the practicality is strong.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims (5)

1. An external heat dissipation structure of a high-low voltage switch cabinet, which comprises a bottom plate (4) and is characterized in that, a high-low voltage switch cabinet group (1) is arranged above the bottom plate (4), a plurality of external heat dissipation pieces (5) are arranged on the upper end surface of the bottom plate (4), the left side and the right side of the bottom plate (4) are provided with mounting holes (3) in a penetrating way, the external heat radiation piece (5) comprises a rectangular frame (6), a cooling pipe (10) is arranged in the rectangular frame (6), a rectangular groove (14) is arranged on the bottom end surface of the high-low voltage switch cabinet group (1), the rectangular frames (6) are clamped with the rectangular grooves (14), connecting pipes (13) are connected between the cooling pipes (10) in the adjacent rectangular frames (6), circulating pump (11) are installed on bottom plate (4) up end left side, circulating pump (11) input and output respectively with bottom plate (4) on the leftmost side and be connected with hose (12) between cooling tube (10) on the rightmost side.
2. The external heat dissipation structure of high-low voltage switch cabinet according to claim 1, wherein a compression spring (9) is connected between the bottom end surface of the rectangular frame (6) and the upper end surface of the bottom plate (4).
3. The external heat dissipation structure of the high-low voltage switch cabinet as claimed in claim 2, wherein positioning grooves (7) are formed at the corners of the periphery of the rectangular frame (6), supporting columns (2) are connected to the periphery of the bottom end face of the high-low voltage switch cabinet set (1), and the supporting columns (2) are correspondingly clamped with the positioning grooves (7).
4. The external heat dissipation structure of high-low voltage switch cabinet according to claim 3, wherein the high-low voltage switch cabinet group (1) and the external heat dissipation member (5) therebelow are provided with five groups.
5. The external heat dissipation structure of the high-low voltage switch cabinet according to claim 4, wherein a semiconductor cooling fin (8) is installed below the cooling pipe (10) in the rectangular frame (6).
CN202123274854.3U 2021-12-23 2021-12-23 External heat radiation structure of high-low voltage switch cabinet Active CN216564214U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123274854.3U CN216564214U (en) 2021-12-23 2021-12-23 External heat radiation structure of high-low voltage switch cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123274854.3U CN216564214U (en) 2021-12-23 2021-12-23 External heat radiation structure of high-low voltage switch cabinet

Publications (1)

Publication Number Publication Date
CN216564214U true CN216564214U (en) 2022-05-17

Family

ID=81557263

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123274854.3U Active CN216564214U (en) 2021-12-23 2021-12-23 External heat radiation structure of high-low voltage switch cabinet

Country Status (1)

Country Link
CN (1) CN216564214U (en)

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