CN218976776U

CN218976776U - Support frame convenient to switch heat dissipation

Info

Publication number: CN218976776U
Application number: CN202222719942.8U
Authority: CN
Inventors: 许桓龙
Original assignee: Yunnan Heguang Tongchen Information Technology Co ltd
Current assignee: Yunnan Heguang Tongchen Information Technology Co ltd
Priority date: 2022-10-17
Filing date: 2022-10-17
Publication date: 2023-05-05
Anticipated expiration: 2032-10-17

Abstract

The utility model belongs to the technical field of switches, and particularly relates to a support frame convenient for heat dissipation of a switch, which comprises a shell, wherein a semiconductor refrigerating device is arranged on the side surface of the shell, a motor is arranged in the shell, an output end of the motor is connected with a fan blade, a first exhaust hole is formed in the top surface of the shell, a second exhaust hole is formed in the inner side of the side surface of the shell, an air inlet hole is formed in the bottom of the shell, and a cooling liquid tank is arranged in the shell. Through placing the switch on the casing, can effectually prevent the switch landing through the rubber piece, the better places the switch on the casing, simultaneously through semiconductor refrigerating plant work, make semiconductor refrigerating plant's refrigeration end produce air conditioning, make the temperature of cooling liquid tank reduce, make colder liquid flow in the casing through the pipe, make the better cold air that spreads over of casing, drive the flabellum through the motor simultaneously and rotate, blow to blow away colder liquid sporadic air conditioning.

Description

Support frame convenient to switch heat dissipation

Technical Field

The utility model belongs to the technical field of switches, and particularly relates to a support frame convenient for heat dissipation of a switch.

Background

A switch means a "switch" is a network device used for electrical (optical) signal forwarding. It can provide an unshared electrical signal path for any two network nodes of the access switch. The most common switch is an ethernet switch. Other common are voice over phone switches, fiber optic switches, etc.

However, after the switch is used for a long time, a large amount of heat is generated and normally placed on a table, so that the heat dissipation is not facilitated, the service life of the switch is influenced, the service efficiency of the switch is influenced, and the service efficiency is low.

Disclosure of Invention

To solve the problems set forth in the background art. The utility model provides a support frame convenient for heat dissipation of a switch, which solves the problem of low efficiency.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a support frame convenient to switch heat dissipation, includes the casing, the side of casing is provided with semiconductor refrigerating plant, the inside of casing is provided with the motor, the output of motor is connected with the flabellum, first exhaust hole has been seted up to the top surface of casing, the second exhaust hole has been seted up to the side inboard of casing, the inlet port has been seted up to the bottom of casing, the casing obtains inside cooling liquid case that is provided with, the side of cooling liquid case is connected with the pipe, the front of casing is connected with the hinge, the side back of hinge is connected with the frame, the bottom fixedly connected with fixture block of casing, the inside swing joint of fixture block has the bracing piece, the top surface of casing is provided with the rubber piece.

Preferably, the heat generating end of the semiconductor refrigeration device is located at the outer side of the shell, the refrigeration end of the semiconductor refrigeration device is located at the inner side of the shell, and the refrigeration end of the semiconductor refrigeration device is connected with the cooling liquid tank.

Preferably, the semiconductor refrigerating devices are arranged in four ways, and the four semiconductor refrigerating devices are respectively positioned at two sides of the shell and are symmetrical to each other.

Preferably, the cooling liquid tanks are arranged in two, the two cooling liquid tanks are positioned on two sides of the shell, the guide pipe is arranged in a plurality, and two ends of the guide pipe are respectively connected to the two cooling liquid tanks.

Preferably, the first exhaust holes and the air inlet holes are arranged in a plurality, and the first exhaust holes and the air inlet holes are arranged in a linear array.

Preferably, the motors are six, the six motors are uniformly distributed in the shell, and the motors are positioned below the guide pipe.

Compared with the prior art, the utility model has the beneficial effects that:

through placing the switch on the casing, can effectually prevent the switch landing through the rubber block, the better places the switch on the casing, work through semiconductor refrigerating plant simultaneously, make semiconductor refrigerating plant's refrigeration end produce air conditioning, make the temperature of cooling liquid tank reduce, make colder liquid flow in the casing through the pipe, make the better cold air that spreads over of casing, simultaneously drive the flabellum through the motor and rotate, blow, thereby blow away colder liquid sporadic air conditioning, blow into in the switch through first exhaust hole, thereby cool down in to the switch, improve switch life, the availability factor is higher, simultaneously blow the heat dissipation through the second exhaust hole to the side, prop up the casing through frame and bracing piece is better and play certain angle, more do benefit to the heat dissipation.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic diagram of the complete structure of the present utility model;

FIG. 2 is a view of the bottom view of the present utility model;

FIG. 3 is an internal block diagram of the present utility model;

fig. 4 is a cross-sectional structural view of the present utility model.

In the figure: 1, a shell; 2 a semiconductor refrigeration device; 3, a hinge; 4, rubber blocks; 5 a first exhaust hole; 6, a second exhaust hole; 7, a frame; 8, an air inlet hole; 9 clamping blocks; 10, supporting a rod; 11 a cooling liquid tank; 12 catheters; 13, a motor; 14 fan blades.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a support frame convenient to switch heat dissipation, which comprises a housin 1, the side of casing 1 is provided with semiconductor refrigerating plant 2, the inside of casing 1 is provided with motor 13, motor 13's output is connected with flabellum 14, first exhaust hole 5 has been seted up to the top surface of casing 1, the second exhaust hole 6 has been seted up to the side inboard of casing 1, inlet port 8 has been seted up to the bottom of casing 1, casing 1 obtains inside cooling liquid case 11 that is provided with, cooling liquid case 11's side is connected with pipe 12, casing 1's front is connected with hinge 3, hinge 3's side back is connected with frame 7, casing 1's bottom fixedly connected with fixture block 9, fixture block 9's inside swing joint has bracing piece 10, casing 1's top surface is provided with rubber piece 4.

The heat generating end of the semiconductor refrigeration device 2 is located on the outer side of the shell 1, the refrigeration end of the semiconductor refrigeration device 2 is located on the inner side of the shell 1, and the refrigeration end of the semiconductor refrigeration device 2 is connected with the cooling liquid tank 11, so that heat dissipation is better conducted.

The semiconductor refrigerating devices 2 are arranged in four, and the four semiconductor refrigerating devices 2 are respectively arranged on two sides of the shell 1 and are symmetrical to each other, so that the heat dissipation efficiency is higher.

The cooling liquid tank 11 is provided with two, and two cooling liquid tanks 11 are located casing 1 both sides, and pipe 12 is provided with a plurality of, and the both ends of pipe 12 are connected respectively on two cooling liquid tanks 11, better heat dissipation that advances.

The first exhaust holes 5 and the air inlet holes 8 are all provided with a plurality of, and the plurality of first exhaust holes 5 and the air inlet holes 8 are arranged in a linear array, so that heat dissipation is better carried out.

The motors 13 are six, and six motors 13 are uniformly distributed in the shell 1, and the motors 13 are positioned below the guide pipe 12, so that the heat dissipation efficiency is improved.

The working principle and the using flow of the utility model are as follows: after the utility model is installed, when in use, the exchanger is placed on the shell 1, the exchanger can be effectively prevented from sliding down through the rubber block 4, the exchanger is better placed on the shell 1, meanwhile, the semiconductor refrigeration device 2 works, the refrigeration end of the semiconductor refrigeration device 2 generates cold air, the temperature of the cooling liquid tank 11 is reduced, colder liquid flows in the shell 1 through the guide pipe 12, the shell 1 better spreads cold air, meanwhile, the fan blades 14 are driven to rotate through the motor 13 to blow air, thus the colder cold air is blown away, and the air is blown into the exchanger through the first exhaust hole 5, so that the temperature in the exchanger is reduced, the service life of the exchanger is prolonged, the service efficiency is higher, meanwhile, the side face of the exchanger is better blown and radiated through the second exhaust hole 6, the shell 1 is better supported by a certain angle through the frame 7 and the support rod 10, and the heat radiation is more beneficial, and the input ends of electric equipment in the equipment are electrically connected with an external power supply.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. Support frame convenient to switch heat dissipation, including casing (1), its characterized in that: the semiconductor refrigeration device is characterized in that a semiconductor refrigeration device (2) is arranged on the side face of the shell (1), a motor (13) is arranged in the shell (1), a fan blade (14) is connected to the output end of the motor (13), a first exhaust hole (5) is formed in the top face of the shell (1), a second exhaust hole (6) is formed in the inner side of the side face of the shell (1), an air inlet hole (8) is formed in the bottom of the shell (1), a cooling liquid tank (11) is arranged in the shell (1), a guide pipe (12) is connected to the side face of the cooling liquid tank (11), a hinge (3) is connected to the front face of the shell (1), a frame (7) is connected to the side face of the hinge (3), a clamping block (9) is fixedly connected to the bottom of the shell (1), a supporting rod (10) is movably connected to the inside of the clamping block (9), and a rubber block (4) is arranged on the top face of the shell (1).

2. The support frame for facilitating heat dissipation of a switch of claim 1, wherein: the heat generating end of the semiconductor refrigerating device (2) is located on the outer side of the shell (1), the refrigerating end of the semiconductor refrigerating device (2) is located on the inner side of the shell (1), and the refrigerating end of the semiconductor refrigerating device (2) is connected with the cooling liquid tank (11).

3. The support frame for facilitating heat dissipation of a switch of claim 1, wherein: the semiconductor refrigerating devices (2) are arranged in four, and the four semiconductor refrigerating devices (2) are respectively arranged on two sides of the shell (1) and are symmetrical to each other.

4. The support frame for facilitating heat dissipation of a switch of claim 1, wherein: the cooling liquid boxes (11) are arranged in two, the two cooling liquid boxes (11) are located on two sides of the shell (1), the guide pipes (12) are arranged in a plurality, and two ends of the guide pipes (12) are respectively connected to the two cooling liquid boxes (11).

5. The support frame for facilitating heat dissipation of a switch of claim 1, wherein: the first exhaust holes (5) and the air inlet holes (8) are all provided with a plurality of air inlets, and the plurality of first exhaust holes (5) and the air inlet holes (8) are arranged in a linear array.

6. The support frame for facilitating heat dissipation of a switch of claim 1, wherein: six motors (13) are arranged, the six motors (13) are uniformly distributed in the shell (1), and the motors (13) are located below the guide pipe (12).