CN217606808U

CN217606808U - Electronic chip with heat radiation plate structure

Info

Publication number: CN217606808U
Application number: CN202121951470.8U
Authority: CN
Inventors: 汪相臣
Original assignee: Hangzhou Xinli Electronic Technology Co ltd
Current assignee: Hangzhou Xinli Electronic Technology Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-10-18
Anticipated expiration: 2031-08-19

Abstract

The utility model belongs to the technical field of electronic chips, in particular to an electronic chip with a heat dissipation plate structure, which comprises a base, a shell and a chip body, wherein a mounting hole is formed in the base, a cooling mechanism is fixed above the base, a heat dissipation aluminum sheet is arranged at the front end of the shell, the shell is positioned on the right side of the cooling mechanism, a positioning block is fixed above the chip body, the chip body is positioned in the shell, an extension block is fixed above the cooling mechanism, a protective shell is arranged in the extension block, a motor is arranged in the protective shell, a turntable is connected above the motor, fan blades are fixed on the right side of the turntable, and a blocking net is arranged above the fan blades; the utility model discloses a setting of heat dissipation aluminum sheet, heat dissipation aluminum sheet can be with the heat effluvium that chip body during operation produced through the mode of heat transfer, and setting up of a plurality of heat dissipation aluminum sheets has promoted its area of contact with the air, further promotion electronic chip's radiating efficiency.

Description

Electronic chip with heat radiation plate structure

Technical Field

The utility model relates to an electronic chip technical field specifically is an electronic chip with heat radiation plate structure.

Background

Chips, which are a way of miniaturizing circuits and are often fabricated on the surface of a semiconductor wafer, are formed on a silicon substrate with circuits having at least one output pad or input pad, and a stationary seal ring is formed on the silicon substrate and surrounds the circuits and the output pad or input pad.

However, the existing electronic chip has poor heat dissipation performance, and cannot quickly dissipate heat generated during the operation of the chip, so that the normal operation capacity of the chip is affected.

Therefore, an electronic chip having a heat dissipation plate structure is proposed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to compensate prior art's not enough, it is relatively poor to solve current electronic chip heat dispersion, and the unable quick heat effluvium that produces the chip during operation leads to the normal work of chip to hold the problem that receives the influence, the utility model provides an electronic chip with heating panel structure.

The utility model provides a technical scheme that its technical problem adopted is: an electronic chip with heating panel structure, including base, shell and chip body, the inside of base is provided with the mounting hole, and the top of base is fixed with cooling body, the front end of shell is provided with heat dissipation aluminum sheet, and the shell is located cooling body's right side, chip body's top is fixed with the locating piece, and chip body is located the inside of shell, cooling body's top is fixed with the extension piece, and extends the inside arrangement of piece and have the protective housing, the internally mounted of protective housing has the motor, and the top of motor is connected with the carousel, the right side of carousel is fixed with the flabellum, and the top of flabellum is provided with the fender net.

Preferably, the mounting holes are rectangular, penetrate through the base, and are distributed in a matrix manner along the horizontal direction of the base.

Preferably, the cooling mechanism comprises a first water tank, a guide pipe, a top plate and a second water tank, the guide pipe is connected to the right side of the first water tank, the top plate is fixed to the outside of the guide pipe, and the second water tank is arranged on the right side of the guide pipe.

Preferably, the first water tank and the second water tank are symmetrical with respect to a vertical center line of the top plate, the guide pipe is distributed in the top plate in a curved structure, and the first water tank and the second water tank form a circulating flow structure through the guide pipe.

Preferably, the heat dissipation aluminum sheets are perpendicular to the shell, the heat dissipation aluminum sheets are distributed at equal intervals in the horizontal direction of the shell, and the heat dissipation aluminum sheets are symmetrical relative to the horizontal center line of the chip body.

Preferably, the extension block forms hollow out construction through keeping off the net, and the protective housing coincides mutually with the vertical center line between the extension block to the flabellum passes through the cooperation between carousel and the motor and constitutes revolution mechanic with the extension block.

The utility model discloses an useful part lies in:

1. the utility model can fix the base on the mainboard with different screw positions through the rectangular mounting hole and the proper bolt through the arrangement of the mounting hole and the base, thereby improving the application range of the electronic chip and facilitating the installation of the electronic chip;

2. the utility model discloses a cooling body's setting, all be provided with the water pump in first water tank and the second water tank, send the cold water in first water tank or the second water tank into the pipe through the work of water pump, the pipe is equipped with two symmetric distributions in the inside of roof, can make cold water take away the heat that the chip body produced when working through the flow of cold water in the pipe, promoted the heat dispersion of electronic chip, make the cold water in first water tank and the second water tank can circulate through two symmetric distributions's pipe simultaneously;

3. the utility model discloses a setting of heat dissipation aluminum sheet and flabellum, the heat effluvium that the mode of heat dissipation aluminum sheet through the heat transfer can produce the chip body during operation, the area of contact of its with the air has been promoted in the setting of a plurality of heat dissipation aluminum sheets, further promotion electronic chip's radiating efficiency, the work of motor can drive carousel and flabellum and rotate, the heat that the rotation of flabellum can be with heat dissipation aluminum sheet effluvium discharges, further promotion electronic chip's heat dispersion, the setting up of extension piece and fender net makes the rotation of flabellum can not receive the influence of outside effort or outside medium, the stability of flabellum during operation has been promoted.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic front view of the first embodiment;

fig. 2 is a schematic view of the front top plate opening and closing structure in the first embodiment;

fig. 3 is a schematic side sectional structure diagram of the first embodiment.

In the figure: 1. a base; 2. mounting holes; 3. a cooling mechanism; 301. a first water tank; 302. a conduit; 303. a top plate; 304. a second water tank; 4. a housing; 5. radiating aluminum sheets; 6. a chip body; 7. positioning blocks; 8. an extension block; 9. a protective shell; 10. a motor; 11. a turntable; 12. a fan blade; 13. and (6) blocking the net.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Example one

Referring to fig. 1-3, an electronic chip with a heat dissipation plate structure includes a base 1, a housing 4 and a chip body 6, a mounting hole 2 is formed in the base 1, a cooling mechanism 3 is fixed above the base 1, a heat dissipation aluminum sheet 5 is arranged at the front end of the housing 4, the housing 4 is located on the right side of the cooling mechanism 3, a positioning block 7 is fixed above the chip body 6, the chip body 6 is located inside the housing 4, an extension block 8 is fixed above the cooling mechanism 3, a protection housing 9 is arranged inside the extension block 8, a motor 10 is installed inside the protection housing 9, a turntable 11 is connected above the motor 10, fan blades 12 are fixed on the right side of the turntable 11, and a blocking net 13 is arranged above the fan blades 12.

Mounting hole 2 is the rectangle structure, and mounting hole 2 runs through in base 1 to along base 1's horizontal direction matrix distribution between the mounting hole 2, mounting hole 2 through the rectangle can be fixed base 1 on the mainboard that the screw position is different with suitable bolt, has promoted electronic chip's application scope, and the electronic chip of being convenient for installs.

Between heat dissipation aluminum sheet 5 and the shell 4 mutually perpendicular, and along the horizontal direction equidistance distribution of shell 4 between the heat dissipation aluminum sheet 5 to about the horizontal center line of chip body 6 symmetrical between the heat dissipation aluminum sheet 5, heat dissipation aluminum sheet 5 can be with the heat effluvium that chip body 6 during operation produced through the mode of heat transfer, and the area of contact of its with the air has been promoted in the setting of a plurality of heat dissipation aluminum sheets 5, has promoted electronic chip's radiating efficiency.

Extension piece 8 constitutes hollow out construction through keeping off net 13, and protective housing 9 and the vertical central line between the extension piece 8 coincide mutually, and flabellum 12 passes through the cooperation between carousel 11 and the motor 10 and constitutes revolution mechanic with extension piece 8, motor 10's work can drive carousel 11 and flabellum 12 and rotate, flabellum 12's rotation can be with the heat discharge of heat dissipation aluminum sheet 5 effluvium, further promotion electronic chip's heat dispersion, extension piece 8 and the influence that the setting up of keeping off net 13 made flabellum 12's rotation can not receive external acting force or external medium, the stability of flabellum 12 during operation has been promoted.

Example two

Referring to fig. 1-3, in a first comparative example, as an extended embodiment of the present invention, a cooling mechanism 3 includes a first water tank 301, a conduit 302, a top plate 303 and a second water tank 304, wherein the conduit 302 is connected to the right side of the first water tank 301, the top plate 303 is fixed to the outside of the conduit 302, and the second water tank 304 is disposed on the right side of the conduit 302.

The first water tank 301 and the second water tank 304 are symmetrical about a vertical center line of the top plate 303, the guide pipes 302 are distributed in the top plate 303 in a curved structure, the first water tank 301 and the second water tank 304 form a circulating structure through the guide pipes 302, water pumps are arranged in the first water tank 301 and the second water tank 304, cold water in the first water tank 301 or the second water tank 304 is sent into the guide pipes 302 through the work of the water pumps, the guide pipes 302 are symmetrically distributed in the top plate 303, heat generated when the chip body 6 works can be taken away by the cold water through the flowing of the cold water in the guide pipes 302, the heat dissipation performance of the electronic chip is improved, and meanwhile, the cold water in the first water tank 301 and the second water tank 304 can circulate through the two symmetrically distributed guide pipes 302.

The theory of operation, at first, connect electronic chip group, then mounting hole 2 through the rectangle can be fixed base 1 on the mainboard that the screw position is different with suitable bolt, electronic chip's application scope has been promoted, be convenient for electronic chip installs, heat dissipation aluminum sheet 5 can be with the heat effluvium that chip body 6 during operation produced through the mode of heat transfer, the area of contact of its with the air has been promoted in a plurality of heat dissipation aluminum sheet 5's setting, further the radiating efficiency of electronic chip has been promoted, motor 10's work can drive carousel 11 and flabellum 12 and rotate, the heat of radiating aluminum sheet 5 effluvium can be discharged in the rotation of flabellum 12, further the heat dispersion of electronic chip has been promoted, extension piece 8 can not receive the influence of external force or external medium with the setting up of fender net 13, the stability of flabellum 12 during operation has been promoted.

The water pumps are arranged in the first water tank 301 and the second water tank 304, cold water in the first water tank 301 or the second water tank 304 is sent into the guide pipe 302 through the work of the water pumps, the guide pipe 302 is provided with two pipes which are symmetrically distributed inside the top plate 303, heat generated when the chip body 6 works can be taken away by the cold water through the flowing of the cold water in the guide pipe 302, the heat dissipation performance of the electronic chip is improved, and meanwhile, the cold water in the first water tank 301 and the second water tank 304 can circulate through the two pipes 302 which are symmetrically distributed.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing shows and describes the basic principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims

1. An electronic chip with a heat dissipation plate structure is characterized in that: including base (1), shell (4) and chip body (6), the inside of base (1) is provided with mounting hole (2), and the top of base (1) is fixed with cooling body (3), the front end of shell (4) is provided with heat dissipation aluminum sheet (5), and shell (4) are located the right side of cooling body (3), the top of chip body (6) is fixed with locating piece (7), and chip body (6) are located the inside of shell (4), the top of cooling body (3) is fixed with extension piece (8), and the inside arrangement of extension piece (8) has protective housing (9), the internally mounted of protective housing (9) has motor (10), and the top of motor (10) is connected with carousel (11), the right side of carousel (11) is fixed with flabellum (12), and the top of flabellum (12) is provided with and keeps off net (13).

2. An electronic chip having a heat-dissipating plate structure as claimed in claim 1, wherein: the mounting holes (2) are of rectangular structures, the mounting holes (2) penetrate through the base (1), and the mounting holes (2) are distributed in a matrix mode in the horizontal direction of the base (1).

3. An electronic chip having a heat-dissipating plate structure as claimed in claim 1, wherein: the cooling mechanism (3) comprises a first water tank (301), a guide pipe (302), a top plate (303) and a second water tank (304), the guide pipe (302) is connected to the right side of the first water tank (301), the top plate (303) is fixed to the outer portion of the guide pipe (302), and the second water tank (304) is arranged on the right side of the guide pipe (302).

4. An electronic chip having a heat-dissipating plate structure as claimed in claim 3, wherein: the first water tank (301) and the second water tank (304) are symmetrical with respect to a vertical center line of the top plate (303), the guide pipe (302) is distributed in a curved structure inside the top plate (303), and the first water tank (301) and the second water tank (304) form a circulating flow structure through the guide pipe (302).

5. An electronic chip having a heat-dissipating plate structure as claimed in claim 1, wherein: between heat dissipation aluminum sheet (5) and shell (4) mutually perpendicular, and along the horizontal direction equidistance distribution of shell (4) between heat dissipation aluminum sheet (5) to the horizontal central line about chip body (6) is symmetrical between heat dissipation aluminum sheet (5).

6. An electronic chip having a heat-dissipating plate structure as claimed in claim 1, wherein: extend piece (8) and constitute hollow out construction through keeping off net (13), and protective housing (9) and the vertical central line between the extension piece (8) coincide mutually to flabellum (12) constitute rotating-structure through cooperation between carousel (11) and motor (10) and extension piece (8).