CN217606806U - Power module and vehicle - Google Patents
Power module and vehicle Download PDFInfo
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- CN217606806U CN217606806U CN202123278182.3U CN202123278182U CN217606806U CN 217606806 U CN217606806 U CN 217606806U CN 202123278182 U CN202123278182 U CN 202123278182U CN 217606806 U CN217606806 U CN 217606806U
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Abstract
The application relates to a power module and a vehicle, wherein the power module comprises a shell and an electric module arranged in the shell, the electric module comprises a first conductive plate, a second conductive plate and a packaging body, a cooling liquid flow channel is arranged in the shell, and the packaging body is connected between the first conductive plate and the second conductive plate in a heat conduction way; a terminal is led out of the packaging body, and the outer end of the terminal penetrates out of the shell; the cooling fluid flow passage surrounds the electrical module, and heat of the package body is transferred to the insulating cooling fluid flowing through the cooling fluid flow passage through the first conductive plate and the second conductive plate. The power module of this application, through regard as the fin with first current conducting plate, second current conducting plate to use, simplified the structure, strengthened the radiating effect.
Description
Technical Field
The application belongs to the technical field of semiconductors, and relates to a power module and a vehicle.
Background
With the deep development of new energy vehicles, electric vehicles are increasingly popularized in daily life of people, a power module is a core component inside a driving motor controller of the electric vehicle, the safe and reliable work of the power module is the key for the normal work of the whole electric vehicle, and the power module inside the traditional motor controller is usually controlled by a switch device, such as an IGBT (insulated gate bipolar transistor), an MOS (metal oxide semiconductor) and the like. The reliability of the power module is closely related to the temperature, the higher the temperature is, the lower the reliability is, when the junction temperature exceeds the allowed highest junction temperature, the power module can be irreversibly damaged, the highest junction temperature of the power module is related to the material characteristics, the process, the structure and the like of the power chip, and the difficulty in greatly improving in a short time is high.
The existing cooling structure for the power module is characterized in that the heat of a chip is transferred to a heat dissipation bottom plate step by step through multiple layers of materials, the heat capacity at the position close to the chip is small through convection heat exchange of cooling liquid, the thermal resistance of a system is large, the power density is difficult to continuously improve, the structure is complex, and the heat dissipation effect is poor. The existing cooling structure for the power module has the defects that a chip is welded on a plane metal substrate or is directly immersed, the area of contacting cooling liquid is small, and the heat exchange effect is poor.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application will solve is: the power module and the vehicle are provided aiming at the problems of poor heat dissipation effect of the existing cooling structure for the power module.
To solve the above technical problems, in one aspect, the present application provides a power module,
the electric module comprises a first conductive plate, a second conductive plate and a packaging body, wherein the first conductive plate, the second conductive plate and the packaging body are arranged in the shell, a cooling liquid flow channel is arranged in the shell, and the packaging body is connected between the first conductive plate and the second conductive plate in a heat conduction manner; a terminal is led out of the packaging body, and the outer end of the terminal penetrates out of the shell;
the cooling fluid flow passage surrounds the electrical module, and heat of the package body is transferred to the insulating cooling fluid flowing through the cooling fluid flow passage through the first conductive plate and the second conductive plate.
Optionally, the housing is made of an insulating material, and a liquid inlet and a liquid outlet which are communicated with the cooling liquid flow channel are arranged on the housing.
Optionally, the package body includes a conductive block, a power chip and a package material, and the conductive block and the power chip are packaged in the package material, so that the conductive block and the power chip are isolated from the cooling liquid channel;
one side surface of the power chip is electrically connected with one contact of the first conductive plate and the second conductive plate, and the conductive block contact is electrically connected between the other side surface of the power chip and the other one of the first conductive plate and the second conductive plate;
the heat of the power chip is conducted to at least one of the first conductive plate and the second conductive plate through the conductive block and is carried away by the insulating cooling liquid flowing through the cooling liquid flow passage.
Optionally, the terminal is led out from at least one of the first conductive plate, the second conductive plate and the conductive block;
one side surface of the conductive block facing the first conductive plate is electrically connected with the first conductive plate in direct contact or electrically connected through the power chip; one side surface of the conductive block facing the second conductive plate is in direct contact electrical connection with the second conductive plate or is electrically connected through the power chip.
Optionally, the number of the conductive blocks is multiple, and the number of the power chips is multiple;
part of the power chip contact is electrically connected between the first conductive plate and the conductive block, and part of the power chip contact is electrically connected between the second conductive plate and the conductive block.
Optionally, a surface of one side of the first conductive plate, which faces the second conductive plate, is a plane, and a surface of one side of the first conductive plate, which faces away from the second conductive plate, is provided with a plurality of first heat dissipation posts;
the orientation of second current conducting plate one side surface of first current conducting plate is the plane, the second current conducting plate deviate from be provided with a plurality of second heat dissipation posts on one side surface of first current conducting plate.
Optionally, a clamping groove is formed in the inner wall of the shell, and the electrical module is clamped in the clamping groove.
Optionally, the electrical module is fixed in the housing in a plastic package manner.
Optionally, the number of the conductive blocks is multiple, and the number of the power chips is multiple;
part of the power chip is electrically connected between the first conductive plate and the conductive block, and part of the power chip is electrically connected between the second conductive plate and the conductive block.
Optionally, the terminals include a signal terminal, an electrode terminal, and a temperature detection terminal.
Optionally, the electrode terminals include an AC terminal led out from the first conductive plate, and a DC first negative terminal, a DC positive terminal and a DC second negative terminal led out from the second conductive plate, the DC positive terminal being located between the DC first negative terminal and the DC second negative terminal.
Optionally, the signal terminal and the temperature detection terminal are led out from the conductive block.
According to the power module of this application embodiment, the packaging body is connected between first current conducting plate and second current conducting plate heat-conductibly, the cooling fluid runner surrounds the electric module, the heat of packaging body passes through first current conducting plate and second current conducting plate and transmits to the insulating cooling fluid that flows through the cooling fluid runner. Compared with the existing power module, the power module saves insulating and pressure-resistant components such as a metal ceramic substrate and the like, the insulating cooling liquid is completely filled in the shell, the electric module is completely immersed in the insulating cooling liquid, and the insulating cooling liquid is a cooling working medium and an electric isolation material. The heat of the package (such as the heat generated by the power chip during operation) is convected and exchanged with the insulating cooling liquid through the first conductive plate and the second conductive plate. The power module of this application, through regard as the fin with first current conducting plate, second current conducting plate to use, simplified the structure, strengthened the radiating effect. The thermal resistance of the power module is reduced, and the junction temperature control difficulty of the power module is reduced. The power demand of the whole vehicle under a severe working condition can be met under the condition that the volume of the power module is not increased.
When the power module is applied to the motor controller, the requirement of the motor controller for higher and higher power density can be met.
On the other hand, the embodiment of the application also provides a vehicle, which comprises the power module.
Drawings
FIG. 1 is a schematic diagram of a power module provided in an embodiment of the present application;
FIG. 2 is an exploded view of a power module provided in an embodiment of the present application;
FIG. 3 is a diagram illustrating an internal structure of a power module according to an embodiment of the present application;
fig. 4 is a perspective view of an electrical module of a power module provided in an embodiment of the present application;
fig. 5 is an exploded view of an electrical module of a power module provided in an embodiment of the present application;
fig. 6 is a cross-sectional view of a power module provided in an embodiment of the present application.
The reference numerals in the specification are as follows:
1. a housing; 11. a coolant flow passage; 12. a liquid inlet; 13. a liquid outlet; 14. a via hole; 15. a card slot; 2. an electrical module; 21. a first conductive plate; 22. a second conductive plate; 23. a conductive block; 24. a power chip; 25. packaging the materials; 26. a terminal; 261. a signal terminal; 2611. a G1 signal terminal; 2612. s1, a signal terminal; 2613. a D signal terminal; 2614. a G2 signal terminal; 2615. s2, a signal terminal; 262. an electrode terminal; 2621. an AC terminal; 2622. a DC first negative terminal; 2623. a DC positive terminal; 2624. a DC second negative terminal; 263. a temperature detection terminal; 27. a first heat-dissipating stud; 28. a second heat-dissipating stud.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
Referring to fig. 1 to 6, a power module provided in an embodiment of the present application includes a housing 1 and an electrical module 2 disposed in the housing 1, where the electrical module 2 includes a first conductive plate 21, a second conductive plate 22 and a package, a cooling liquid flow channel 11 is disposed in the housing 1, a liquid inlet 12 and a liquid outlet 13 communicated with the cooling liquid flow channel 11 are disposed on the housing 1, and the package is thermally connected between the first conductive plate 21 and the second conductive plate 22. The package body is led with a terminal 26, and the outer end of the terminal 26 penetrates out of the shell 1. The cooling fluid channel 11 surrounds the electric module 2, and the heat of the package is transferred to the insulating cooling fluid flowing through the cooling fluid channel 11 through the first and second conductive plates 21 and 22.
In an embodiment, the package body includes a conductive block 23, a power chip 24 and a package material 25, and the conductive block 23 and the power chip 24 are packaged in the package material 25, so that the conductive block 23 and the power chip 24 are isolated from the cooling liquid channel 11. The terminal 26 is led out from at least one of the first conductive plate 21, the second conductive plate 22, and the conductive block 23.
One side surface of the power chip 24 is electrically connected to one of the contacts of the first and second conductive plates 21 and 22, and the contact of the conductive block 23 is electrically connected between the other side of the power chip 24 and the other of the first and second conductive plates 21 and 22. That is, when one side surface of the power chip 24 is electrically connected to the first conductive plate 21 in contact, the conductive bump 23 is electrically connected between the other side of the power chip 24 and the second conductive plate 22 in contact. When one side surface of the power chip 24 is electrically connected to the second conductive plate 22 in a contact manner, the conductive block 23 is electrically connected between the other side surface of the power chip 24 and the first conductive plate 21 in a contact manner.
A side surface of the conductive block 23 facing the first conductive plate 21 is electrically connected to the first conductive plate 21 in direct contact or electrically connected through the power chip 24; a side surface of the conductive block 23 facing the second conductive plate 22 is electrically connected to the second conductive plate 22 in direct contact or electrically connected through the power chip 24; the heat of the power chip 24 is conducted to the first conductive plate 21 and the second conductive plate 22 through the conductive block 23 and is carried away by the insulating coolant flowing through the coolant flow channel 11.
In one embodiment, referring to fig. 1, a through hole 14 is formed in a side wall of the housing 1, the terminal 26 passes through the through hole 14 and is exposed out of the housing 1, and the terminal 26 is sealed with a hole wall of the through hole 14, for example, by a molding compound, or by a sealing ring.
In an embodiment, referring to fig. 4 to 6, a side surface of the first conductive plate 21 facing the second conductive plate 22 is a plane, and a side surface of the first conductive plate 21 facing away from the second conductive plate 22 is provided with a plurality of first heat dissipation studs 27; the surface of one side of the second conductive plate 22 facing the first conductive plate 21 is a plane, and a plurality of second heat dissipation studs 28 are disposed on the surface of one side of the second conductive plate 22 facing away from the first conductive plate 21.
In one embodiment, the first heat-dissipating stud 27 and the second heat-dissipating stud 28 are cylindrical. However, in other alternatives, a circular truncated cone column, a circular cone column, a triangular column, a square column, and the like are also possible.
The plurality of first heat dissipation posts 27 are regularly arranged on the first conductive plate 21 in a matrix arrangement, a ring array arrangement, or other irregular arrangements. The second heat-dissipating studs 28 are regularly arranged on the first conductive plate 22 in a matrix, a ring array, or other irregular arrangement.
The plurality of first heat-dissipating studs 27 increase the heat exchange area and heat exchange efficiency of the first heat-conducting plate 21, and the plurality of second heat-dissipating studs 28 increase the heat exchange area and heat exchange efficiency of the second heat-conducting plate 22. The plurality of first and second heat-dissipating studs 27 and 28 second can increase the heat capacity near the power chip and enhance the flow of the insulating coolant.
In an embodiment, the molding compound 25 is formed by a molding process (i.e., the conductive bumps 23 and the power chip 24 are molded by using a molding compound).
In an embodiment, referring to fig. 3, a clamping groove 15 is formed on an inner wall of the housing 1, the electrical module 2 is clamped in the clamping groove 15, and the terminal surface is sealed by plastic package. Specifically, the edges of the first conductive plate 21, the second conductive plate 22 and the encapsulant 25 are clamped in the card slot 15.
In another embodiment, the electrical module 2 may also be fixed in the housing 1 by plastic sealing. For example, the electrical module 2 is placed in the middle of the box body forming device, the plastic package material is directly formed integrally to complete the forming and sealing of the shell, the insulating cooling liquid is in full contact with the cooling structure (the first heat conduction plate 21 and the second heat conduction plate 22) of the power module 2 in the shell to exchange heat, and the normal work of the power module 2 is ensured.
In one embodiment, referring to fig. 6, the conductive bumps 23 are provided in plurality, and the power chip 24 is provided in plurality. Part of the power chip 24 is electrically connected between the first conductive plate 21 and the conductive block 23, and part of the power chip 24 is electrically connected between the second conductive plate 22 and the conductive block 23.
In one embodiment, referring to fig. 5, the terminals 26 include a signal terminal 261, an electrode terminal 262, and a temperature detection terminal 263.
In one embodiment, referring to fig. 5, the electrode terminals 262 include an AC terminal 2621 extending from the first electrically conductive plate 21, and a DC first negative terminal 2622, a DC positive terminal 2623 and a DC second negative terminal 2624 extending from the second electrically conductive plate 22, the DC positive terminal 2623 being located between the DC first negative terminal 2622 and the DC second negative terminal 2624.
In one embodiment, referring to fig. 5, the signal terminal 261 and the temperature detecting terminal 263 are led out from the conductive block 23. The signal terminal 261, the electrode terminal 262 and the temperature detection terminal 263 are extended to the same side for easy connection. The temperature detection terminals 263 are provided in two in parallel.
In one embodiment, referring to fig. 5, the signal terminals 261 include a G1 signal terminal 2611, a S1 signal terminal 2612, a D signal terminal 2613, a G2 signal terminal 2614 and a S2 signal terminal 2615 arranged side by side.
A through hole 14 is provided in the housing 1 corresponding to each terminal 26, and the shape and size of the through hole match the shape and size of the terminal 26 passing through the through hole.
The electrical module 2 is a half-bridge module, a combined full-bridge module, or a module with other topologies, such as a three-phase full-bridge module, an H-bridge module, and so on.
The housing 1 is closely matched with the electrical module 2 in size, and the housing 1 is an insulating housing, that is, the housing 1 is made of an insulating material, for example, carbon fiber, glass fiber, ceramic, glass, plastic, etc.
The power chip 24 and the conductive block 23 are connected by welding or low temperature sintering. The conductive block 23 connects the power chip 24 with the first conductive plate 21 and the second conductive plate 22, so that the loop is conductive and instantaneous heat can be conducted quickly. The conductive block 23 is connected to the first conductive plate 21 and the second conductive plate 22 by welding or low-temperature sintering.
The first conductive plate 21, the second conductive plate 22, and the conductive block 23 may be made of a metal material having excellent thermal conductivity, such as copper, aluminum, silver, or a new material or a composite material capable of realizing thermal conductivity.
The insulating cooling liquid can be selected from methyl silicone oil, mineral oil, fluoride, non-conductive pure water and the like.
Compared with the existing power module, the power module provided by the embodiment of the application saves insulating and pressure-resistant parts such as a metal ceramic substrate, the insulating cooling liquid is completely filled in the shell, the electrical module is completely immersed in the insulating cooling liquid, and the insulating cooling liquid is a cooling working medium and an electrical isolation material. The heat generated when the power chip works is mainly transferred to the first current-conducting plate and the second current-conducting plate through the current-conducting blocks, and then is subjected to heat convection with the insulating cooling liquid through the first current-conducting plate and the second current-conducting plate, so that the junction temperature of the power chip is controlled. According to the power module, the first conductive plate and the second conductive plate are used as the radiating fins, so that the structure is simplified, the radiating effect is enhanced, the heat capacity close to the power chip is increased, the heat resistance of the power module is reduced, and the junction temperature control difficulty of the power module is reduced. The power demand of the whole vehicle under the severe working condition can be met under the condition that the volume of the power module is not increased.
When the power module is applied to the motor controller, the requirement of the motor controller for higher and higher power density can be met.
On the other hand, the embodiment of the application also provides a vehicle, which comprises the power module of the embodiment.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (12)
1. A power module is characterized by comprising a shell and an electric module arranged in the shell, wherein the electric module comprises a first conductive plate, a second conductive plate and a packaging body, a cooling liquid flow passage is arranged in the shell, and the packaging body is connected between the first conductive plate and the second conductive plate in a heat-conducting manner; a terminal is led out of the packaging body, and the outer end of the terminal penetrates out of the shell;
the cooling liquid flow passage surrounds the electric module, and heat of the packaging body is transferred to the insulating cooling liquid flowing through the cooling liquid flow passage through the first conductive plate and the second conductive plate.
2. The power module of claim 1, wherein the housing is made of an insulating material, and the housing is provided with a liquid inlet and a liquid outlet which are communicated with the cooling liquid flow passage.
3. The power module of claim 1, wherein the package comprises a conductive block, a power chip and a packaging material, the conductive block and the power chip are packaged in the packaging material, so that the conductive block and the power chip are isolated from the cooling liquid channel;
one side surface of the power chip is electrically connected with one contact of the first conductive plate and the second conductive plate, and the conductive block contact is electrically connected between the other side surface of the power chip and the other one of the first conductive plate and the second conductive plate;
the heat of the power chip is conducted to at least one of the first conductive plate and the second conductive plate through the conductive block and is taken away by the insulating cooling liquid flowing through the cooling liquid flow passage.
4. The power module of claim 3, wherein the terminal leads from at least one of the first conductive plate, the second conductive plate, and the conductive block;
one side surface of the conductive block facing the first conductive plate is electrically connected with the first conductive plate in direct contact or electrically connected through the power chip; one side surface of the conductive block facing the second conductive plate is in direct contact electrical connection with the second conductive plate or is electrically connected through the power chip.
5. The power module according to claim 3, wherein the conductive block is provided in plurality, and the power chip is provided in plurality;
part of the power chip contact is electrically connected between the first conductive plate and the conductive block, and part of the power chip contact is electrically connected between the second conductive plate and the conductive block.
6. The power module of claim 1, wherein a side surface of the first conductive plate facing the second conductive plate is planar, and a plurality of first heat-dissipating studs are disposed on a side surface of the first conductive plate facing away from the second conductive plate;
the orientation of second current conducting plate one side surface of first current conducting plate is the plane, deviating from of second current conducting plate be provided with a plurality of second heat dissipation posts on one side surface of first current conducting plate.
7. The power module of claim 1, wherein a slot is disposed on an inner wall of the housing, and the electrical module is snapped into the slot.
8. The power module of claim 1, wherein the electrical module is secured within the housing by plastic molding.
9. The power module of claim 3, wherein the terminals include a signal terminal, an electrode terminal, and a temperature detection terminal.
10. The power module of claim 9 wherein the electrode terminals include an AC terminal extending from the first electrically conductive plate, and a DC first negative terminal, a DC positive terminal and a DC second negative terminal extending from the second electrically conductive plate, the DC positive terminal being located between the DC first negative terminal and the DC second negative terminal.
11. The power module of claim 9 wherein the signal and temperature sensing terminals are routed from the conductive block.
12. A vehicle comprising a power module according to any one of claims 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123278182.3U CN217606806U (en) | 2021-12-23 | 2021-12-23 | Power module and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123278182.3U CN217606806U (en) | 2021-12-23 | 2021-12-23 | Power module and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217606806U true CN217606806U (en) | 2022-10-18 |
Family
ID=83560858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123278182.3U Active CN217606806U (en) | 2021-12-23 | 2021-12-23 | Power module and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217606806U (en) |
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2021
- 2021-12-23 CN CN202123278182.3U patent/CN217606806U/en active Active
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