CN217597502U - Device for bonding crystal bars - Google Patents
Device for bonding crystal bars Download PDFInfo
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- CN217597502U CN217597502U CN202221521345.8U CN202221521345U CN217597502U CN 217597502 U CN217597502 U CN 217597502U CN 202221521345 U CN202221521345 U CN 202221521345U CN 217597502 U CN217597502 U CN 217597502U
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Abstract
The utility model discloses a device for bonding crystal bar, the device includes: the bonding plate is used for bonding the crystal bar; a support table supported on the bottom surface of the bonding plate; a rotating shaft for driving the supporting table to rotate in a horizontal plane; the two rollers are arranged in parallel, and the crystal bar is supported on the two rollers in a parallel mode and rotates around the longitudinal axis of the crystal bar relative to the bonding plate by means of the rotation of the two rollers; and the sensor unit is used for acquiring the actual geometric axis of the crystal bar and compensating the bonding deviation of the crystal bar caused by the geometric shape difference of the crystal bar based on the actual geometric axis. The position of the actual geometric axis of the crystal bar is obtained through the inductor unit, the crystal orientation of the crystal bar is adjusted according to the position, and bonding deviation caused by the difference of the geometric shape of the crystal bar is compensated.
Description
Technical Field
The utility model relates to a wafer processing field especially relates to a device for bonding crystal bar.
Background
In general, it is necessary to realize slicing with a fixed crystal orientation in processing a single crystal silicon wafer. In order to realize the cutting of the fixed crystal orientation, firstly, the deviation between the crystal orientation and the geometric axis of the crystal bar is measured, the crystal bar is bonded to the workpiece plate after the corresponding crystal bar orientation is adjusted according to the deviation value, and the linear cutting equipment cuts the crystal bar which is subjected to crystal orientation adjustment through clamping the workpiece plate, so that the silicon wafer cutting of the fixed crystal orientation is realized.
In the prior art, when the deviation between the crystal orientation and the geometric axis of the crystal bar is measured, the bonding equipment sets the geometric axis position of the crystal bar to be a fixed position, but the geometric appearance of the crystal bar manufactured by a czochralski method in actual production is different, so that the position of the geometric axis is not unique, the actual crystal orientation of the crystal bar is not accurately adjusted in the process of measuring the deviation between the crystal orientation and the geometric axis of the crystal bar, the crystal orientation adjustment effect of the crystal bar cannot be effectively judged and adjusted before the bonding of the crystal bar and a workpiece plate is completed, the crystal orientation of the bonded crystal bar is not accurate, the treatment process of the bonded crystal bar is complicated, the capacity of the equipment is seriously influenced, and the quality of the crystal bar is reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem, an embodiment of the present invention is expected to provide a device for bonding a crystal bar, which obtains the position of the actual geometric axis of the crystal bar through a sensor unit, and adjusts the crystal orientation of the crystal bar according to the position to compensate the bonding deviation caused by the geometric shape difference of the crystal bar.
The technical scheme of the utility model is realized like this:
the embodiment of the utility model provides a device for bonding crystal bar, the device includes: the bonding plate is used for bonding the crystal bar; a support table supported on the bottom surface of the bonding plate; a rotating shaft for driving the support table to rotate in a horizontal plane; the two rollers are arranged in parallel, and the crystal bar is supported on the two rollers in a parallel mode and rotates around the longitudinal axis of the crystal bar relative to the bonding plate by means of the rotation of the two rollers; and the sensor unit is used for acquiring the actual geometric axis of the crystal bar and compensating the bonding deviation of the crystal bar caused by the geometric shape difference of the crystal bar based on the actual geometric axis.
The embodiment of the utility model provides a device for bonding crystal bar, it removes the crystal orientation that realizes the X position to the crystal bar through the regulation drive bonding board to the brace table, rotate for the bonding board through the self longitudinal axis around self longitudinal axis and realize the crystal bar for the Y position crystal orientation of bonding board adjustment crystal bar, acquire the actual geometry axle center of crystal bar based on the inductor unit simultaneously, the deviation that the compensation arouses because of the crystal bar geometry difference when acquiring the X position crystal orientation deviation and the Y position crystal orientation deviation of crystal bar, improve the accuracy of crystal bar crystal orientation adjustment with this, promote crystal bar bonding quality and yield.
Drawings
Fig. 1 is a schematic view of an apparatus for bonding a boule according to an embodiment of the present invention;
FIG. 2 is a schematic view of crystal orientation adjustment using the apparatus shown in FIG. 1;
fig. 3 is another schematic view of an apparatus for bonding a boule according to an embodiment of the present invention;
fig. 4 is a schematic view of crystal orientation adjustment using the apparatus shown in fig. 3.
Detailed Description
In order to illustrate embodiments of the present invention or technical solutions in the prior art more clearly, the following description will be made in conjunction with the accompanying drawings in embodiments of the present invention to describe the technical solutions in the embodiments of the present invention clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides an apparatus 10 for bonding a boule, including: the bonding plate B is used for receiving the crystal bar A and fixing the crystal bar A on the top surface of the bonding plate B in an adhesive mode, and preferably, the bonding plate B is made of a resin material; the supporting table 018 is supported on the bottom surface of the bonding plate B, and the bonding plate B is detachably fixed on the top surface of the supporting table 018 through gluing or other methods, so that the bonding plate B can be replaced for next cutting after the crystal bar is cut; the lifting table 017 is used for driving the bonding plate B to lift to receive the crystal bar A, the lifting table 017 can lift in the vertical direction through the driving of a motor, the supporting table 018 is coaxially and fixedly installed on the top surface of the lifting table 017, and the lifting table 017 drives the bonding plate B to approach to and receive the crystal bar A in the vertical direction through driving the supporting table 018 to lift; a rotating shaft 016 disposed between the lifting table 017 and the supporting table 018, wherein the rotating shaft 016 can rotate around the central axis thereof by being driven by a motor, so as to drive the supporting table 018 and the bonding board B disposed on the supporting table 018 to rotate in the horizontal plane relative to the ingot a, the rotating shaft 016 moves along with the supporting table 018 when the lifting table 018 is driven by the lifting table 017 to lift, and preferably, the rotating shaft 016 and the supporting table 018 are coaxially disposed so as to precisely adjust the X-direction crystal orientation of the ingot. Through the components, the lifting table 017 drives the supporting table 018 to drive the bonding plate B to be close to the crystal ingot A so as to receive and fix the crystal ingot A in a bonding mode, and simultaneously drives the supporting table 018 to rotate in the horizontal plane through the rotating shaft 016 to drive the bonding plate B to rotate in the horizontal plane, so that the crystal orientation angle of the crystal ingot A fixed on the bonding plate B in the X direction is adjusted, and the X direction crystal orientation adjustment of the crystal ingot A is realized.
In the preferred embodiment, the device 10 further comprises a clamping block 015 and a clamping driving cylinder 014, the clamping block 015 and the bonding plate B are together arranged on the top surface of the supporting table 018, the clamping block 015 comprises two movable clamping blocks arranged on two sides of the bonding plate B, the clamping driving cylinder 014 drives the clamping block 015 to be close to or far away from the top surface of the supporting table 018 on two sides of the bonding plate B, when the clamping block 015 is close to and clamps the two sides of the bonding plate B, the bonding plate B can be fixed, and therefore the bonding precision and stability of the crystal bar a are guaranteed.
Referring to fig. 1, in order to realize the adjustment of the Y-direction crystal orientation of the ingot a, the apparatus 10 further comprises: the two rollers 006, 007 are arranged in parallel, the two rollers 006, 007 are arranged above the bonding plate B, the crystal bar a is supported on the two rollers 006, 007 in a manner of being parallel to the two rollers 006, 007, and the two rollers 006, 007 can rotate around the longitudinal axis thereof to drive the crystal bar a to rotate relative to the bonding plate B; two supports 004, 005 and two support bodies 012, 013 symmetrically arranged at both sides of the ingot a, wherein the two rollers 006, 007 are respectively arranged on the two supports 004, 005, and each support is supported by the corresponding support body; the translation mechanism of setting between every support and corresponding support body, translation mechanism is including the support slider 008, 009 of support and be used for the guide respectively the linear guide 010, 011 that support slider 008, 009 removed, translation mechanism sets up the top surface of support body, support slider supporting and fixed drive simultaneously of support the support moves on the linear guide to the drive two support translations are in order to drive corresponding roller bearing and remove, so that two roller bearings are close to or are kept away from for each other. Through the above components, the translation mechanism drives the support to approach each other, drives the two rollers 006 and 007 to approach each other to receive the crystal bar a, and the two rollers 006 and 007 rotate around the longitudinal axis of the rollers to drive the crystal bar a to rotate relative to the bonding plate B, so that the Y-direction crystal orientation adjustment of the crystal bar a is realized.
In order to obtain the deviation of the crystal bar A in the X-direction crystal direction and the Y-direction crystal direction, the device 10 further comprises: a measuring unit 001 for measuring an X-direction crystal orientation and a Y-direction crystal orientation of the ingot a supported by the two rollers; a processing unit including an X-ray emitter 002 for emitting X-rays toward the ingot a and an X-ray receiver 003 for receiving the X-rays reflected by the ingot a. The processing unit is used for acquiring the X-direction crystal orientation deviation of the crystal bar A according to the difference between the X-direction crystal orientation measured by the measuring unit 001 and the target crystal orientation and acquiring the Y-direction crystal orientation deviation of the crystal bar A according to the difference between the Y-direction crystal orientation measured by the measuring unit 001 and the target crystal orientation.
Referring to fig. 2, when the bonding of the ingot a is performed by the apparatus 10 and the crystal orientation of the ingot a is adjusted, the adjustment process may be expressed as determining the theoretical geometric axis position of the ingot a as the coordinate C1 (0, 0), the crystal orientation of the ingot a as the coordinate C2 (X, Y) with respect to the theoretical geometric axis, the plane parameter of the target crystal orientation as (Tx, ty), and the angle adjustment amount and the target swing angle amount of the ingot a in the X-direction and the Y-direction as (Δ Tx, Δ Ty), where Δ Tx = Tx- (X-0) and Δ Ty = Ty- (Y-0), from the two-dimensional plane view. Specifically, the adjustment process includes firstly conveying the ingot a to a chamber of the ingot bonding apparatus 10 through the transfer apparatus, driving the two supports 004 and 005 to approach each other by the translation mechanism to drive the two rollers 006 and 007 to approach the ingot a, thereby realizing the fixing of the ingot a in the Y direction, calculating a swing angle Δ Ty of the ingot a in the Y direction to be adjusted based on a difference between a crystal direction of the ingot a in the Y direction measured by the measurement unit 001 and a target crystal direction, calculating a swing angle Δ Tx of the ingot a in the X direction to be adjusted based on a difference between a crystal direction of the ingot a in the X direction measured by the measurement unit 001 and the target crystal direction, driving the supporting table 017 to ascend so that the bonding plate B receives and fixes the ingot a, thereby realizing the fixing of the ingot a in the X direction, and driving the supporting table 018 to rotate in the horizontal plane to realize the adjustment of the ingot a in the X direction.
However, in the above-mentioned adjustment process, the central coordinate of the whole adjustment system is the theoretical geometric axis position C1 of the ingot a, but the theoretical geometric axis position and the actual axis position of the ingot a in actual production are not at the same position, that is, the actual axis position of the ingot a is not at the C1 (0, 0) position in the above-mentioned adjustment coordinate system, so as to cause the calculation error of the target swing angle, the swing angle is wrong, and the target crystal orientation cannot be reached after bondingAnd the problem of glue release and re-bonding exists. In view of this, referring to fig. 3, the apparatus 10 further includes a sensor unit for acquiring an actual geometric axis of the ingot a, wherein the sensor unit detects a surface of the ingot a, fits a 3D structure of the ingot a according to the acquired surface position, and determines an actual axis position C3 of the ingot a. Referring to FIG. 4, in the coordinate system established based on the theoretical geometric center, the actual center position of the ingot A is C3 (x) 0 ,y 0 ) At this time, the actual target swing angle should be Δ Tx = Tx- (X-X) 0 )，ΔTy＝Ty-(Y-y 0 ). After the actual target swing angle is calculated, the crystal orientation of the crystal bar A in the Y direction is adjusted through the two rolling shafts 006 and 007, then the crystal orientation of the crystal bar A in the X direction is adjusted through the rotating shaft 016, and finally accurate bonding is achieved.
In a preferred embodiment, referring to fig. 3, the sensor unit comprises two groups of laser detectors, each group of laser detectors preferably comprises 4 laser detectors, namely a first group of laser detectors (101, 103, 105, 107) and a second group of laser detectors (102, 104, 106, 108), the two groups of laser detectors are distributed along the axial direction of the crystal bar a, and each group of laser detectors is uniformly distributed along the circumferential direction of the crystal bar a.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. An apparatus for bonding a boule, the apparatus comprising:
the bonding plate is used for bonding the crystal bar;
a support table supported on the bottom surface of the bonding plate;
a rotating shaft for driving the support table to rotate in a horizontal plane;
the two rollers are arranged in parallel, and the crystal bar is supported on the two rollers in a parallel mode and rotates around the longitudinal axis of the crystal bar relative to the bonding plate by means of the rotation of the two rollers;
and the sensor unit is used for acquiring the actual geometric axis of the crystal bar and compensating the bonding deviation of the crystal bar caused by the geometric shape difference of the crystal bar based on the actual geometric axis.
2. The apparatus of claim 1, further comprising an elevating table for driving the bonding plate to ascend and descend to receive the ingot, the elevating table being disposed on a bottom surface of the supporting table, wherein the rotation axis is disposed between the elevating table and the supporting table coaxially with the elevating table.
3. The apparatus according to claim 1, further comprising a clamping block disposed on the surface of the support table and a clamping driving cylinder for driving the clamping block to approach both sides of the adhesive sheet to clamp the adhesive sheet.
4. The apparatus of claim 1, wherein the sensor unit comprises two sets of laser detectors distributed along an axial direction of the ingot, each set of laser detectors being uniformly distributed along a circumferential direction of the ingot.
5. The apparatus of claim 4, wherein each set of laser detectors comprises 4 laser detectors.
6. The device of claim 1, further comprising two brackets and two bracket bodies, wherein the two rollers are respectively disposed on the two brackets.
7. The device of claim 6, wherein the bracket bodies comprise a translation mechanism disposed on each bracket body, the translation mechanism configured to drive the two brackets to translate to move the corresponding roller so as to move the two rollers toward or away from each other.
8. The apparatus of claim 7, wherein the translation mechanism comprises a carriage slide for supporting the carriage and a linear guide for guiding movement of the carriage slide.
9. The apparatus of any one of claims 1 to 8, further comprising:
the measuring unit is used for measuring the X-direction crystal orientation and the Y-direction crystal orientation of the crystal bar loaded on the two rollers;
a processing unit, configured to obtain an X-direction crystal orientation deviation of the ingot according to the X-direction crystal orientation measured by the measuring unit and the position of the actual geometric axis, and obtain a Y-direction crystal orientation deviation of the ingot according to the Y-direction crystal orientation measured by the measuring unit and the position of the actual geometric axis,
wherein the measuring unit comprises an X-ray emitter for emitting X-rays towards the crystal bar and an X-ray receiver for receiving the X-rays reflected by the crystal bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221521345.8U CN217597502U (en) | 2022-06-16 | 2022-06-16 | Device for bonding crystal bars |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221521345.8U CN217597502U (en) | 2022-06-16 | 2022-06-16 | Device for bonding crystal bars |
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| Publication Number | Publication Date |
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| CN217597502U true CN217597502U (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221521345.8U Active CN217597502U (en) | 2022-06-16 | 2022-06-16 | Device for bonding crystal bars |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116118021A (en) * | 2023-01-17 | 2023-05-16 | 丹东新东方晶体仪器有限公司 | Automatic bonding equipment for crystal bars |
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2022
- 2022-06-16 CN CN202221521345.8U patent/CN217597502U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116118021A (en) * | 2023-01-17 | 2023-05-16 | 丹东新东方晶体仪器有限公司 | Automatic bonding equipment for crystal bars |
| CN116118021B (en) * | 2023-01-17 | 2023-10-17 | 丹东新东方晶体仪器有限公司 | Automatic bonding equipment for crystal bars |
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Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710100 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |