CN217561786U - Optical module - Google Patents

Abstract

The application provides an optical module, including: the upper cover and the bottom shell are assembled through screws to form an optical module cavity for containing and fixing the light emission secondary module, the light receiving secondary module, the circuit board, the light emission adapter and the light receiving adapter, the upper cover is provided with an upper cover light emission cover and an upper cover adapter groove, the bottom shell is provided with a bottom shell light emission cover, a bottom shell light receiving cover and a bottom shell adapter groove, a sealed light emission cavity and a sealed light receiving cavity can be formed after the upper cover and the bottom shell are assembled, and the light emission secondary module and the light receiving secondary module are packaged respectively. In the embodiment of the application, the optical transmitter sub-module and the optical receiver sub-module are sealed and isolated through the sealed optical transmitter cavity and the sealed optical receiver cavity, so that the phenomenon that two sub-modules radiate electromagnetic waves outwards to generate crosstalk to affect each other is avoided, and the performance of the two sub-modules and the normal work of the optical module are ensured.

Description

Optical module

Technical Field

The utility model relates to an optical communication technical field especially relates to an optical module.

Background

The steady development of the global telecommunication industry and the steady growth of broadband users lay a solid foundation for the development of the optical communication industry. With the continuous improvement of the global bandwidth demand and the expansion of data centers and the application fields of the security monitoring optical communication industry, the optical fiber broadband access has become a mainstream communication mode. Under the promotion of popularization of terminals such as smart phones and the like and applications such as video and cloud computing and the like, telecom operators continuously invest in building and upgrading mobile broadband and optical fiber broadband networks, and the investment scale of optical communication equipment is further expanded.

The rapid development of the optical communication industry drives the updating of the optical module. Under the market competition environment where the current optical communication is increasingly intense, the demand of communication equipment for reducing the size of the equipment and increasing the interface density is also increasing. To meet this demand, optical modules are also being developed in a small package with high integration. For example, QSFP (Small Form-factor Pluggable optical module), QSFP +, CFP/CFP2/CFP4, QSFP28, QSFP-DD and the like are all optical modules with Small-sized Pluggable high-density interfaces, at present, QSFP28 optical modules have four electrical channels, the operating rate of each channel is 10Gbps or 25Gbps, 40G and 100G ethernet applications are supported, the number of the channels is increased to 8 by a brand-new product QSFP-DD (Pluggable dual density) optical module, the operating rate of each channel is increased to 25Gbps by MRZ modulation or 50Gbps by PAM4 modulation, and thus 200Gbps or 400Gbps is supported. The QSFP-DD optical module can meet or exceed the requirements of high-speed enterprise, telecommunication and data network equipment on the density of Ethernet, optical fiber channels and InfiniBand ports, thereby meeting the continuously improved requirements on 200Gbps and 400Gbps network solutions. The optical module with high speed and high power consists of a light emission secondary module, a light receiving secondary module and a circuit board and is packaged in an optical module cavity, when the optical module works, the light emission secondary module and the light receiving secondary module both radiate electromagnetic waves outwards, and because the light emission secondary module and the light receiving secondary module are packaged in the same optical module cavity, the light receiving secondary module and the light emission secondary module are interfered with each other, and the performance of the light emission secondary module and the light receiving secondary module and the normal work of the whole optical module are influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an embodiment aims at providing an optical module to solve the optical module at the during operation, the problem of light receiving submodule and emission of light submodule mutual interference.

In order to achieve the above object, an embodiment of the present invention provides two optical modules, including: an upper cover and a bottom shell.

The upper cover and the bottom shell are assembled by adopting a screw to form an optical module cavity for accommodating and fixing the optical transmitter-receiver sub-module, the optical receiver sub-module, the circuit board, the optical transmitter-receiver adapter and the optical receiver adapter, and the upper cover is provided with an upper cover optical transmitter cover and an upper cover adapter groove;

the bottom shell is provided with a bottom shell light emitting cover, a bottom shell light receiving cover and a bottom shell adapter groove, the upper cover light emitting cover and the bottom shell light emitting cover are buckled on the circuit board after the upper cover and the bottom shell are assembled, and a closed light emitting cavity is formed to package the light emitting secondary module after the upper cover adapter groove and the bottom shell adapter groove are assembled and clamped with the light emitting adapter; meanwhile, the bottom shell light receiving cover is buckled on part of raised strips of the circuit board and the upper cover light emitting cover, the upper cover adapter groove and the bottom shell adapter groove are assembled and clamped, and a closed light receiving cavity is formed to encapsulate the light receiving secondary module after the light receiving adapter is assembled and clamped.

In the above optical module, the upper cover light emission cover is formed by combining a plurality of protruding strips at the inner bottom of the upper cover with the side wall of the upper cover; the bottom shell light emission cover is formed by combining a plurality of raised lines at the inner bottom of the bottom shell and the side wall of the bottom shell; the bottom shell light receiving cover is formed by combining a plurality of raised strips at the inner bottom of the bottom shell and the side wall of the bottom shell.

In the optical module, the circuit board is provided with a through hole, and the through hole is used for accommodating and passing through the tosa.

In the optical module, the optical transmitter sub-module and the optical receiver sub-module are connected with the circuit board by welding with gold wires.

In the optical module, the bottom shell is further provided with a locking surface, and after the optical module is inserted into the cage, the locking surface blocks the locking plate of the cage, so that the optical module is locked in the cage in an inserting manner.

In the optical module, the optical module further includes a zipper, the zipper is provided with an unlocking block and a handle, when the optical module exits the cage, the handle is pulled by a hand, the handle drives the unlocking block to jack up the locking plate to be separated from the locking surface, and the optical module is unlocked and pulled out of the cage.

The advantage of this application embodiment is, hold the chamber through confined light emission, and confined light reception holds the chamber, makes emission of light submodule and light reception submodule seal and keep apart, has avoided emission of light submodule and emission of light submodule outside radiation electromagnetic wave to produce the phenomenon of crosstalking and influence each other, and then guarantees the normal work of the performance of two kinds of submodules and optical module.

Drawings

FIG. 1 is an exploded view of an embodiment of an optical module according to the present application;

fig. 2 is a first schematic diagram of an upper cover of an optical module according to an embodiment of the present disclosure;

fig. 3 is a second schematic diagram of an upper cover of an optical module embodiment of the present application;

fig. 4 is a first schematic diagram of a bottom chassis of an optical module according to an embodiment of the present application;

fig. 5 is a second schematic view of a bottom shell of an optical module according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a circuit board of an embodiment of an optical module according to the present application;

FIG. 7 is a schematic diagram illustrating an assembly of a circuit board, a TOSA, a ROSA, a TOA, and a ROSA according to an embodiment of the present invention;

fig. 8 is a first assembly schematic diagram (after the upper cover is removed) of an optical module embodiment according to the present application;

FIG. 9 is a second assembly diagram of an optical module according to an embodiment of the present application (after removing the bottom shell and the zipper);

fig. 10 is a third assembly schematic diagram of an optical module embodiment of the present application;

fig. 11 is a fourth assembly schematic diagram of an optical module embodiment of the present application;

FIG. 12 is a diagram illustrating a zipper of an optical module according to an embodiment of the present application;

fig. 13 is a schematic diagram of a cage, a heat sink and a latch assembled together according to an embodiment of the optical module of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 11, an embodiment of the present invention provides an optical module, including: upper cover 100, bottom case 200.

As shown in fig. 1, 9 and 10, the upper cover 100 and the bottom case 200 are assembled by screws 810 to form an optical module cavity for accommodating and fixing the light-emitting sub-module 310, the light-receiving sub-module 320, the circuit board 330, the light-emitting adapter 410 and the light-receiving adapter 420.

As shown in fig. 2 and 3, the upper cover 100 is provided with an upper cover light emission cover 110 and an upper cover adapter groove 120.

As shown in fig. 4 and 5, the bottom chassis 200 is provided with a bottom chassis light emitting cover 210, a bottom chassis light receiving cover 220 and a bottom chassis adapter slot 230, the upper cover light emitting cover 110 and the bottom chassis light emitting cover 210 are fastened on the circuit board 330 after the upper cover 100 and the bottom chassis 200 are assembled, and the upper cover adapter slot 120 and the bottom chassis adapter slot 230 are assembled with the card pressure light transmitting adapter 410 to form a closed light emitting cavity packaged light emitting sub-module 310; meanwhile, the bottom light receiving cover 220 is fastened on the circuit board 330 and on part of the ribs 111 of the top light emitting cover 110, and after the card pressing light receiving adapter 420 is assembled on the top adapter slot 120 and the bottom adapter slot 230, a closed light receiving cavity packaging light receiving sub-module 320 is formed.

As shown in fig. 2 and fig. 3, the light-emitting cover 110 is formed by combining a plurality of protruding strips 111 at the bottom of the upper cover 100 with the side wall 101 of the upper cover 100;

as shown in fig. 4 and 5, the bottom light emitting cover 210 is formed by combining a plurality of protruding strips 211 at the bottom of the bottom case 200 with the side walls 201 of the bottom case 200; similarly, the bottom case light receiving cover 220 is formed by combining a plurality of protruding strips 211 at the inner bottom of the bottom case 200 with the side walls 201 of the bottom case.

As shown in fig. 6, the circuit board 330 is provided with a through hole 331, and the through hole 331 is used for accommodating the tosa 310, thereby facilitating the installation and heat dissipation of the tosa 310 in the light emitting cavity.

As shown in fig. 7, the tosa 310 and the rosa 320 are connected to the circuit board 330 by soldering using gold wires 311.

As shown in fig. 4, 5, and 13, the bottom chassis 200 further includes a locking surface 240, and after the optical module is inserted into the cage 900, the locking surface 240 blocks the locking plate 930 of the cage 900, so that the optical module is inserted into the cage 900. The latch 920 presses the heat sink 910 onto the cage 900 and tightly contacts the heat dissipation surface of the optical module to conduct heat conduction and dissipate heat of the optical module.

As shown in fig. 12 and 13, the optical module further includes a zipper 500, the zipper 500 is provided with an unlocking block 510 and a pull handle 520, when the optical module exits the cage 900, the pull handle 520 is pulled by a hand, the pull handle 520 drives the unlocking block 510 to jack up the locking plate 930 to separate from the locking surface 240, and the optical module is unlocked and pulled out of the cage 900. When the pulling force applied to the pull 520 is removed, the zipper 500 is returned to its original position by the force of the return spring 820.

The embodiment of the application has the advantages that the tosa 310 and the tosa 320 are sealed and isolated through the sealed light emitting cavity and the sealed light receiving cavity, so that the phenomenon that the tosa 310 and the tosa 320 radiate electromagnetic waves outwards to generate crosstalk and affect each other is avoided, and the performance of the two kinds of submodules and the normal work of the optical module are ensured.

The present invention has been described in relation to the preferred embodiments, and not limitations, it is to be understood that the terminology which has been used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalence of such metes and bounds are therefore intended to be embraced by the appended claims.

Claims (6)

1. A light module, comprising: an upper cover and a bottom shell, which are characterized in that,

the upper cover and the bottom shell are assembled by adopting a screw to form an optical module cavity for accommodating and fixing the optical transmitter-receiver sub-module, the optical receiver sub-module, the circuit board, the optical transmitter-receiver adapter and the optical receiver adapter, and the upper cover is provided with an upper cover optical transmitter cover and an upper cover adapter groove;

the bottom shell is provided with a bottom shell light emitting cover, a bottom shell light receiving cover and a bottom shell adapter groove, the upper cover light emitting cover and the bottom shell light emitting cover are buckled on the circuit board after the upper cover and the bottom shell are assembled, and a closed light emitting cavity is formed to package the light emitting secondary module after the upper cover adapter groove and the bottom shell adapter groove are assembled and clamped on the light emitting adapter; meanwhile, the bottom shell light receiving cover is buckled on part of raised strips of the circuit board and the upper cover light emitting cover, the upper cover adapter groove and the bottom shell adapter groove are assembled and clamped, and a closed light receiving cavity is formed to encapsulate the light receiving secondary module after the light receiving adapter is assembled and clamped.

2. A light module as claimed in claim 1,

the upper cover light emission cover is formed by combining a plurality of convex strips at the inner bottom of the upper cover and the side wall of the upper cover;

the bottom shell light emission cover is formed by combining a plurality of raised lines at the inner bottom of the bottom shell and the side wall of the bottom shell;

the bottom shell light receiving cover is formed by combining a plurality of raised strips at the inner bottom of the bottom shell and the side wall of the bottom shell.

3. A light module as claimed in claim 1, characterized in that the circuit board is provided with through holes for receiving through the tosa.

4. The optical module of claim 1, wherein the tosa and the rosa are soldered to the circuit board using gold wires.

5. The optical module of claim 1, wherein the bottom housing further comprises a locking surface, and the locking surface is configured to engage with a locking tab of the cage after the optical module is inserted into the cage, so that the optical module is locked in the cage.

6. The optical module according to claim 5, further comprising a zipper, wherein the zipper is provided with an unlocking block and a pull handle, when the optical module is withdrawn from the cage, the pull handle is pulled by a hand, the pull handle drives the unlocking block to jack up the locking plate to be separated from the locking surface, and the optical module is unlocked and is pulled out of the cage.

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