CN216718754U - Optical module - Google Patents

Abstract

The application provides an optical module, including: the circuit board, the emission of light secondary module, upper cover and drain pan, the circuit board is equipped with the through-hole, the emission of light secondary module includes emission of light subassembly and heat-conducting plate, the heat-conducting plate is equipped with installation face and heat-conducting surface, the emission of light subassembly laminating constitutes emission of light secondary module in the installation face, the upper cover is equipped with the heat conduction platform, emission of light secondary module passes the through-hole of circuit board, install in the heat conduction platform under heat-conducting surface and the laminating of heat conduction platform, the upper cover adopts the screw connection assembly to form the optical module cavity and holds fixed circuit board and emission of light secondary module with the drain pan. In the embodiment of the application, through the opening of the circuit board, heat generated by the transmitter optical subassembly can be directly conducted to the heat conducting platform, further conducted to the cavity of the optical module, and finally conducted to the radiator and dissipated to the atmosphere, so that the heat generated by the transmitter optical subassembly can be timely and effectively dissipated, the normal work of the optical module is ensured, and the problem that the high-power high-speed optical module influences the normal work due to overhigh working temperature is solved.

Description

Optical module

Technical Field

The utility model relates to the technical field of optical communication, in particular to an optical module.

Background

The steady development of the global telecommunication industry and the steady growth of broadband users lay a solid foundation for the development of the optical communication industry. With the continuous improvement of global bandwidth demand and the expansion of data centers and application fields of security monitoring optical communication industries, optical fiber broadband access has become a mainstream communication mode. Under the promotion of popularization of terminals such as smart phones and the like and applications such as video and cloud computing and the like, telecom operators continuously invest in building and upgrading mobile broadband and optical fiber broadband networks, and the investment scale of optical communication equipment is further expanded.

The rapid development of the optical communication industry drives the updating of the optical module. Under the market competition environment where optical communication is increasingly intense at present, the demand of communication equipment for reducing the size of the equipment and increasing the interface density is also increasing. To meet this demand, optical modules are also being developed in a small package with high integration. For example, the QSFP (Small Form-factor Pluggable optical module), the QSFP +, the CFP/CFP2/CFP4, the QSFP28, the QSFP-DD and the like are all optical modules with Small-sized Pluggable high-density interfaces, at present, the QSFP28 optical module has four electric channels, the operating speed of each channel is 10Gbps or 25Gbps, 40G and 100G Ethernet application is supported, the number of the channels of a brand-new product FP-DD (Pluggable dual density) optical module is increased to 8, the operating speed of each channel is up to 25Gbps through MRZ modulation or is up to 50Gbps through PAM4 modulation, and therefore 200Gbps or 400Gbps is supported. The QSFP-DD optical module can meet or exceed the requirements of high-speed enterprise, telecommunication and data network equipment on the density of Ethernet, optical fiber channels and InfiniBand ports, thereby meeting the continuously improved requirements on 200Gbps and 400Gbps network solutions. However, when these high-power high-speed optical modules work, if the heat generated by the tosa is not timely and effectively dissipated, the work of the tosa can be affected, the current technology generally pastes the tosa directly on the circuit board, so that other components in the tosa and the circuit board are convenient for gold wire connection, but the circuit board material is generally not a heat-conducting material, the heat generated by the tosa cannot be timely and effectively dissipated, so as to affect the work of the tosa, and therefore an optical module is needed, which can effectively and timely dissipate the heat of the tosa, and ensure the normal work of the tosa.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model aims to provide an optical module to solve the problem of heat dissipation of a transmitter optical subassembly of a high-speed high-power optical module.

In order to achieve the above object, an embodiment of the present invention provides an optical module including: the circuit board, the light emission secondary module, the upper cover and the bottom shell;

the circuit board is provided with a through hole for penetrating and accommodating the light emission sub-module;

the light emission secondary module comprises a light emission component and a heat conduction plate, the heat conduction plate is provided with a mounting surface and a heat conduction surface, and the light emission component is mounted and stuck on the mounting surface;

the upper cover is provided with a heat conduction platform, the heat conduction surface is tightly attached to the heat conduction platform, so that the heat conduction plate is arranged on the heat conduction platform, and the light emission secondary module passes through the through hole and is arranged on the heat conduction platform;

the bottom shell is provided with a radiating surface, the bottom shell and the upper cover are tightly assembled together by screws to form an optical module cavity for accommodating the circuit board and the transmitter optical subassembly, and the radiating surface is tightly contacted with a radiator on a cage in the communication equipment, so that the heat of the optical module cavity is well conducted on the radiator.

In the optical module, the bottom case is further provided with a locking surface, and after the optical module is inserted into the cage, the locking plate of the cage is blocked by the locking surface, so that the optical module is locked in the cage, and the heat dissipation surface is in good, stable and close contact with the heat sink locked on the cage, thereby achieving the purpose of good heat transfer.

The optical module further comprises a zipper, wherein the zipper is provided with an unlocking block and a handle, and when the handle is pulled, the unlocking block jacks up the locking plate to be separated from the locking surface, so that the optical module is unlocked in the cage and pulled out of the cage.

In the embodiment of the application, through the opening of the circuit board, heat generated by the transmitter optical subassembly can be directly conducted to the heat conducting platform, further conducted to the cavity of the optical module, and finally conducted to the radiator and dissipated to the atmosphere, so that the heat generated by the transmitter optical subassembly can be timely and effectively dissipated, the normal work of the optical module is ensured, and the problem that the high-power high-speed optical module influences the normal work due to overhigh working temperature is solved.

Drawings

FIG. 1 is an exploded view of an embodiment of an optical module according to the present application;

FIG. 2 is an exploded view of an embodiment of a circuit board, a TOSA and a ROSA of an optical module according to the present invention;

FIG. 3 is a schematic diagram illustrating an assembly of an embodiment of a circuit board, an OEM, and an OEM of an optical module according to the present disclosure;

FIG. 4 is an assembly diagram of an optical module according to an embodiment of the present application with an upper cover removed;

FIG. 5 is an assembly diagram of an optical module according to an embodiment of the present application with a bottom shell and a zipper removed;

FIG. 6 is a circuit board diagram of an optical module according to an embodiment of the present disclosure;

fig. 7 is a first schematic diagram of a heat conducting plate of an optical module according to the present application:

FIG. 8 is a second diagram of a thermal conductive plate of an optical module according to the present application;

FIG. 9 is a first assembly diagram of an optical module according to an embodiment of the present disclosure;

FIG. 10 is a second assembly diagram of an optical module according to an embodiment of the present application;

FIG. 11 is a schematic diagram of an upper cover of an optical module according to an embodiment of the present disclosure;

FIG. 12 is a bottom view of an optical module according to an embodiment of the present disclosure;

FIG. 13 is a schematic view of a cage, heat sink and latch of an embodiment of a light module of the present application mated together;

fig. 14 is a schematic diagram of a zipper of an optical module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 to 10, an embodiment of the present invention provides an optical module, including: the circuit board 110, the tosa 120, the upper cover 300 and the bottom case 200;

as shown in fig. 2 and 6, the circuit board 110 is provided with a through hole 111 for passing and receiving the tosa 120;

as shown in fig. 2, 3, 7 and 8, the tosa 120 includes a light emitting element 122 and a heat conducting plate 121, the heat conducting plate 121 has a mounting surface 1211 and a heat conducting surface 1212, and the light emitting element 122 is mounted on the mounting surface 1211 to form the tosa 120;

as shown in fig. 11, the upper cover 300 is provided with a heat conduction platform 310, the heat conduction surface 1212 is closely attached to the heat conduction platform 310, so that the heat conduction plate 121 is mounted on the heat conduction platform 310, and the tosa 120 is mounted on the heat conduction platform 310 through the through hole 111;

as shown in fig. 12, the bottom chassis 200 is provided with a heat dissipating surface 210, the bottom chassis 200 and the top cover 300 are tightly assembled together by screws 810 to form an optical module cavity for accommodating the fixed circuit board 110, the tosa 120 and the rosa 130, and the heat dissipating surface 210 is tightly contacted with a heat sink 910 fastened on the cage 900 of the communication device, so that the heat of the optical module cavity is well conducted to the heat sink 910.

As shown in fig. 12, the bottom housing 200 further has a locking surface 220, and after the optical module is inserted into the cage 900, the locking plate 930 of the cage 900 is locked to the locking surface 220, so that the optical module is locked in the cage 900, and the heat dissipation surface 210 and the heat sink 910 clamped on the cage 900 are in good, stable and close contact, thereby achieving the purpose of good heat transfer.

As shown in fig. 14, the optical module further includes a zipper 400, the zipper 400 is provided with an unlocking block 410 and a handle 420, when the optical module unlocks and exits the cage 900, the handle 420 is pulled by hand, the zipper 400 moves against the acting force of the spring 820, the unlocking block 410 jacks up the locking plate 930 to separate from the locking surface 220, so that the optical module unlocks and exits the cage 900 in the cage 900, after the optical module exits the cage 900, the external force applied to the handle 420 disappears, and the zipper 400 returns to the original position under the acting force of the spring 820.

As shown in fig. 13, the cage assembled in cooperation with the present embodiment is provided with a latch 920, and the latch 920 is used to lock the heat sink 910 to the cage 900, so that the heat sink 910 is in good close contact with the heat dissipation surface 210, and the heat of the optical module cavity is well conducted to the heat sink 910.

As shown in fig. 2 and fig. 3, the optical module of this embodiment further includes a light-receiving sub-module 130, and since the heat generated by the light-receiving sub-module 130 is small, the light-receiving sub-module can be directly attached to the circuit board 110 and connected to other devices on the circuit board 110.

As shown in fig. 2 and fig. 3, the optical module provided in this embodiment further includes a protective cover 123 and a protective cover 133, after the tosa 120 and the rosa 130 are coupled to the circuit board 110 and mounted in the optical module cavity formed by the upper cover 300 and the bottom case 200, the protective cover 123 and the protective cover 133 are respectively adhered and fixed in the space above the tosa 120 and the rosa 130, so as to protect the tosa 120 and the rosa 130 from being damaged in the optical module cavity.

As shown in fig. 7 and 8, the heat conducting plate 121 is made of a material having good heat conductivity and insulation.

In the embodiment of the present application, through the opening 111 of the circuit board 110, the heat generated by the tosa 120 can be directly conducted to the heat conduction platform 310, and then conducted to the optical module cavity, and finally conducted to the heat sink 910 and dissipated into the atmosphere, so that the heat generated by the tosa 120 can be effectively dissipated in time, thereby ensuring the normal operation of the tosa 120, and solving the problem that the tosa 120 is directly coupled and assembled on the circuit board 110 to be connected with other devices in the prior art, and the heat generated during the operation cannot be dissipated through the tosa or the circuit board 110, thereby solving the problem that the high-power high-speed optical module affects the normal operation due to the overhigh temperature during the operation.

The foregoing is considered as illustrative and exemplary only and is not intended to be limiting of the utility model, and it is to be understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims (3)

1. A light module, comprising: the circuit board, the light emission secondary module, the upper cover and the bottom shell;

the circuit board is provided with a through hole for penetrating and accommodating the light emission sub-module;

the light emission secondary module comprises a light emission component and a heat conduction plate, the heat conduction plate is provided with a mounting surface and a heat conduction surface, and the light emission component is mounted and stuck on the mounting surface;

the upper cover is provided with a heat conduction platform, the heat conduction surface is tightly attached to the heat conduction platform, so that the heat conduction plate is arranged on the heat conduction platform, and the light emission secondary module passes through the through hole and is arranged on the heat conduction platform;

the bottom shell is provided with a radiating surface, the bottom shell and the upper cover are tightly assembled together by screws to form an optical module cavity for accommodating and fixing the circuit board and the transmitter optical subassembly, and the radiating surface is tightly contacted with a radiator on a cage in the communication equipment so that heat of the optical module cavity is well conducted on the radiator.

2. The light module of claim 1, wherein the bottom housing further comprises a locking surface, and after the light module is inserted into the cage, the locking plate of the cage is blocked by the locking surface, so that the light module is locked in the cage.

3. The optical module according to claim 2, further comprising a zipper having an unlocking block and a handle, wherein when the handle is pulled, the unlocking block pushes the locking plate to disengage from the locking surface, so that the optical module is unlocked in the cage and pulled out of the cage.

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