CN217546522U

CN217546522U - DC/DC power supply heat dissipation device

Info

Publication number: CN217546522U
Application number: CN202221589672.7U
Authority: CN
Inventors: 杜玉章; 薛海印
Original assignee: Xi'an Rutong Electronic Technology Co ltd
Current assignee: Xi'an Rutong Electronic Technology Co ltd
Priority date: 2022-06-24
Filing date: 2022-06-24
Publication date: 2022-10-04
Anticipated expiration: 2032-06-24

Abstract

The utility model discloses a DC/DC power supply heat dissipation device, which adopts the technical proposal that the device comprises a bottom plate, a heat dissipation unit and a fixing unit; a bottom plate: the front side of the upper surface is provided with a single chip microcomputer, the left sides of the upper surface and the lower surface of the bottom plate are both fixed with frames, three heat dissipation fans are arranged in the two frames, and the heat dissipation fans are electrically connected with the single chip microcomputer; a heat dissipation unit: including wet return, copper, water tank, water pump and inlet tube, the middle part at the bottom plate upper surface is fixed to the copper, the inside of copper is cavity, the middle part at the bottom plate lower surface is fixed to the water tank, this DC/DC power heat abstractor, accessible forced air cooling and water-cooling dispel the heat to the power simultaneously, can effectual improvement heat abstractor's radiating effect, stability when increasing power long-term use to can compress tightly not unidimensional power on the copper, make heat abstractor can be applicable to not unidimensional power, improve heat abstractor's commonality.

Description

DC/DC power supply heat dissipation device

Technical Field

The utility model relates to a power heat dissipation technical field specifically is a DC/DC power heat abstractor.

Background

The power supply is a device for providing power for electronic equipment, also called a power supply, and provides electric energy required by all components in a computer, the magnitude of the power supply power, whether the current and the voltage are stable or not, and the working performance and the service life of the computer are directly influenced. Through the retrieval, chinese patent discloses a power heat abstractor, publication number CN 210610113U, the patent has a simple structure, the rotating electrical machines operate to drive the swinging rods to swing, the swinging rods swing to drive the adjusting rods to move left and right, the swinging rods swing to drive the adjusting rods to move up and down, thereby enabling the heat dissipation fans to move left and right and also move up and down, the increased blowing range of the heat dissipation fans, the heat dissipation effect is improved, and the use is convenient.

SUMMERY OF THE UTILITY MODEL

In view of the problems existing in the prior art, the utility model discloses a DC/DC power supply heat dissipation device, which adopts the technical proposal that the device comprises a bottom plate, a heat dissipation unit and a fixing unit;

a bottom plate: the front side of the upper surface is provided with a single chip microcomputer, the left sides of the upper surface and the lower surface of the bottom plate are both fixed with frames, three heat dissipation fans are arranged in the two frames, and the heat dissipation fans are electrically connected with the single chip microcomputer;

a heat dissipation unit: the water-cooling type heat dissipation device comprises a water return pipe, a copper plate, a water tank, a water pump and a water inlet pipe, wherein the copper plate is fixed in the middle of the upper surface of a bottom plate, the inside of the copper plate is hollow, the water tank is fixed in the middle of the lower surface of the bottom plate, a water outlet of the rear side surface of the water tank is connected with a water inlet of the rear side surface of the copper plate through a water inlet pipe, the water pump is installed on the water inlet pipe and is fixed on the side surface of the water tank, the water inlet of the right side surface of the water tank is connected with a water outlet of the right side surface of the copper plate through a water return pipe, the water pump is electrically connected with a single chip microcomputer, and a heat dissipation unit is arranged to quickly dissipate heat of a power supply installation surface and simultaneously dissipate heat of a power supply through air cooling and water cooling, so that the heat dissipation effect of the heat dissipation device can be effectively improved, and the stability of the power supply during long-time use is improved; a fixing unit: the two fixing units are arranged on the front side and the rear side of the upper surface of the base plate respectively, each fixing unit comprises a pressing rod, a pressing ring, a screw rod, a moving block and a fixing nut, the fixing nut is fixed on the front side of the upper surface of the base plate, the lower end of the screw rod is in threaded connection with the fixing nut, the moving block is sleeved on the outer side of the screw rod, the pressing ring is fixed on the side face of the upper end of the screw rod, the pressing ring is located on the upper side of the moving block, the pressing rods are L-shaped, the front ends of the pressing rods penetrate through sliding holes in the right side of the rear side face of the moving block, and the fixing units are arranged to press different sizes of power supplies onto the copper plate possibly, so that the heat dissipation device can be suitable for different sizes of power supplies, and the universality of the heat dissipation device is improved.

As a preferred technical scheme of the utility model, still include the hand wheel, the hand wheel is equipped with four, the middle part of four hand wheel lower surfaces respectively with the upper end fixed connection of four screw rods, the hand wheel of setting can make people can convenient rotation screw rod, the compressing tightly of the power of being convenient for is fixed.

As a preferred technical scheme of the utility model, still include the rubber pad, the rubber pad is equipped with four, and the upper surface of four rubber pads is connected with the lower fixed surface of the inboard one end of four depression bars respectively, and the rubber pad of setting can protect the depression bar, prevents that the depression bar from causing the damage to the power.

As a preferred technical scheme of the utility model, still include fixed plate and fixed orifices, the fixed plate is the L type, and the fixed plate is equipped with four, and four corners at the bottom plate lower surface are fixed respectively to four fixed plates, and the fixed orifices has all been seted up to the upper surface of four fixed plate lower extremes, and the fixed orifices on the fixed plate of setting can fix the bottom plate in the position of using, and the heat abstractor's of being convenient for is fixed.

As an optimal technical scheme of the utility model, still include the fin, the lower surface at the water tank is fixed to the fin, twenty are no less than to the quantity of fin, and the surface area of the multiplicable water tank of fin of setting improves the radiating effect of water tank.

As a preferred technical scheme of the utility model, the downside is three the heat dissipation fan is located the left side of fin, and the heat dissipation fan of setting can be bloied power and fin simultaneously, makes the quick cooling of surface energy of power and fin.

As an optimal technical scheme of the utility model, still include heat conduction silica gel pad, heat conduction silica gel pad fixes the upper surface at the copper, and the hot silica gel pad of setting can make the copper can carry the efficiency of heat conduction with the inseparable contact of installation face of power.

The utility model has the advantages that: the utility model can compress the moving block and the pressure rod along with the downward movement of the screw rod through the pressure ring on the screw rod, so that the moving block and the pressure rod can compress the power supply on the copper plate, and the pressure rod can move on the moving block, so that the power supplies with different sizes can be compressed on the copper plate, the heat dissipation device can be suitable for the power supplies with different sizes, the universality of the heat dissipation device is improved, the air on the surface of the power supply can be circulated through the heat dissipation fan, the power supply is dissipated, meanwhile, the heat in the working process of the power supply can be transferred to the copper plate, the cold water in the water tank can be transferred to the copper plate through the water inlet pipe through the water pump, and the water in the copper plate absorbs the heat water and is transferred to the water return tank through the water return pipe, so that the copper plate is kept at a lower temperature, the heat on the power supply can be rapidly transferred to the copper plate, and the cold water is recycled, with the quick giving off of power installation face's heat, dispel the heat to the power simultaneously through forced air cooling and water-cooling, can effectual improvement heat abstractor's radiating effect, stability when increasing power long time use, can make people can convenient rotation screw rod through the hand wheel, it is fixed to be convenient for compressing tightly of power, can protect the depression bar through the rubber pad, prevent that the depression bar from causing the damage to the power, can fix the bottom plate in the position of using through the fixed orifices on the fixed plate, heat abstractor's the fixing of being convenient for, surface area through fin multiplicable water tank, improve the radiating effect of water tank, can blow power and fin simultaneously through the heat dissipation fan, make the quick cooling of surface energy of power and fin, can make the copper can with the inseparable contact of installation face of power through the heat conduction silica gel pad, carry the efficiency of heat conduction.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the back structure of the present invention;

fig. 3 is a schematic side view of the present invention.

In the figure: the heat dissipation device comprises a base plate 1, a single chip microcomputer 2, a heat dissipation unit 3, a water return pipe 31, a copper plate 32, a water tank 33, a water pump 34, a water inlet pipe 35, a fixing unit 4, a pressure rod 41, a pressure ring 42, a screw rod 43, a movable block 44, a fixing nut 45, a hand wheel 5, a rubber pad 6, a fixing plate 7, a fixing hole 8, a heat dissipation fin 9, a frame 10, a heat dissipation fan 11 and a heat conduction silica gel pad 12.

Detailed Description

Example 1

As shown in fig. 1 to fig. 3, the utility model discloses a DC/DC power supply heat dissipation device, which adopts the technical scheme that the device comprises a bottom plate 1, a heat dissipation unit 3 and a fixing unit 4;

bottom plate 1: the front side of the upper surface is provided with a singlechip 2, the left sides of the upper surface and the lower surface of the bottom plate 1 are both fixed with frames 10, three heat dissipation fans 11 are respectively arranged in the two frames 10, and the heat dissipation fans 11 are electrically connected with the singlechip 2;

the heat dissipation unit 3: the heat dissipation device comprises a water return pipe 31, a copper plate 32, a water tank 33, a water pump 34 and a water inlet pipe 35, wherein the copper plate 32 is fixed in the middle of the upper surface of a bottom plate 1, the copper plate 32 is hollow, the water tank 33 is fixed in the middle of the lower surface of the bottom plate 1, a water outlet on the rear side surface of the water tank 33 is connected with a water inlet on the rear side surface of the copper plate 32 through the water inlet pipe 35, the water pump 34 is installed on the water inlet pipe 35 and fixed on the side surface of the water tank 33, a water inlet on the right side surface of the water tank 33 is connected with a water outlet on the right side surface of the copper plate 32 through the water return pipe 31, the water pump 34 is electrically connected with a single chip microcomputer 2, heat generated when a power supply works can be transferred to the copper plate 32, cold water in the water tank 33 can be transferred to the copper plate 32 through the water inlet pipe 35 through the water return pipe 31, the copper plate 32 is kept at a lower temperature, the heat on the power supply can be transferred to the copper plate 32, the heat on the power supply installation surface can be rapidly dissipated through rapid circulation of the cold water, and the heat dissipation can be simultaneously dissipated through wind cooling, so that the heat dissipation effect of the heat dissipation device can be effectively improved, and the stability of the power supply during long-time use is increased;

the fixing unit 4: the two fixing units 4 are respectively arranged on the front side and the rear side of the upper surface of the base plate 1, each fixing unit 4 comprises a pressing rod 41, a pressing ring 42, a screw 43, a moving block 44 and a fixing nut 45, the fixing nut 45 is fixed on the front side of the upper surface of the base plate 1, the lower end of the screw 43 is in threaded connection with the fixing nut 45, the moving block 44 is sleeved on the outer side of the screw 43, the pressing ring 42 is fixed on the side face of the upper end of the screw 43, the pressing ring 42 is located on the upper side of the moving block 44, the pressing rod 41 is L-shaped, the front end of the pressing rod 41 penetrates through a sliding hole in the right side of the rear side face of the moving block 44, the moving block 44 and the pressing rod 41 can be pressed tightly along with downward movement of the screw 43 through the pressing ring 42 on the screw 43, the moving block 44 and the pressing rod 41 tightly press the power supply on the copper plate 32, the pressing rod 41 can move on the moving block 44, power supplies with different sizes can be tightly pressed on the copper plate 32, the heat dissipation device can be suitable for power supplies with different sizes, and the universality of the heat dissipation device is improved.

As an optimal technical scheme of the utility model, still include hand wheel 5, hand wheel 5 is equipped with four, the middle part of four 5 lower surfaces of hand wheel respectively with four screw rod 43's upper end fixed connection, can make people can be convenient rotation screw rod 43 through hand wheel 5, the power of being convenient for compresses tightly fixedly.

As the utility model discloses an optimal technical scheme still includes rubber pad 6, and rubber pad 6 is equipped with four, and four rubber pad 6's upper surface respectively with the lower fixed surface of four depression bar 41 inboard one ends be connected, can protect depression bar 41 through rubber pad 6, prevent that depression bar 41 from causing the damage to the power.

As the utility model discloses an optimal technical scheme still includes fixed plate 7 and fixed orifices 8, and fixed plate 7 is the L type, and fixed plate 7 is equipped with four, and four fixed plates 7 are fixed respectively in four corners of 1 lower surface of bottom plate, and the fixed orifices 8 have all been seted up to the upper surface of four fixed plates 7 lower extremes, can fix bottom plate 1 in the position of using, the heat abstractor's of being convenient for fixed through fixed orifices 8 on fixed plate 7.

As an optimal technical scheme of the utility model, still include fin 9, fin 9 fixes the lower surface at water tank 33, and twenty are no less than to the quantity of fin 9, through the surface area of the multiplicable water tank 33 of fin 9, improve water tank 33's radiating effect.

As a preferred technical scheme of the utility model, the three heat dissipation fan 11 of downside is located the left side of fin 9, can blow power and fin 9 simultaneously through heat dissipation fan 11, makes the quick cooling of surface energy of power and fin 9.

As an optimal technical scheme of the utility model, still including heat conduction silica gel pad 12, heat conduction silica gel pad 12 is fixed at the upper surface of copper 32, can make copper 32 can and the inseparable contact of installation face of power through heat conduction silica gel pad 12, carries the efficiency of heat conduction.

The utility model discloses a theory of operation: fixing the bottom plate 1 at a using position through a fixing hole 8 on a fixing plate 7, placing a power supply on a copper plate 32, pulling a pressure rod 31, wherein one end of the inner side of the pressure rod 31 is positioned at the upper side of the power supply, holding a hand wheel 5 and rotating to enable the hand wheel 5 to drive a screw 43 to rotate, enabling the screw 43 to be screwed on a fixing nut 45, driving a pressing ring 42 to move downwards in the downward movement process of the screw 43, enabling the pressing ring 42 to be in contact with a moving block 44, enabling the pressing ring 42 to process the moving block 44 and the pressure rod 41 to be pressed tightly along with the downward movement of the screw 43, enabling the pressure rod 41 to tightly press and fix the power supply on the copper plate 32, repeating the steps for four times to tightly and fix the power supply, enabling a gap between the copper plate 32 and the power supply to be filled by a soft heat-conducting silica gel pad 12 after being pressed, enabling the mounting surface of the power supply to be fully in contact with the copper plate 32, connecting an external power supply, and when the power supply works, the six heat dissipation fans 11 can be controlled by the single chip microcomputer 2 to work, so that the three heat dissipation fans 11 on the upper side blow the surface of the power supply, air on the surface and inside of the power supply circulates, heat on the power supply is quickly dissipated, meanwhile, the heat on the power supply installation surface can be transferred to the copper plate 32 through the heat conduction silica gel pad 12, the single chip microcomputer 2 controls the water pump 34 to work, cold water in the water tank 33 is conveyed into the copper plate 32 through the water inlet pipe 35, the temperature of the cold water is lower than that of the copper plate 32 at the moment, the heat on the copper plate 32 can be quickly transferred into the cold water, along with the work of the water pump 34, the water absorbing heat by the copper plate 32 can flow back into the water tank 33 through the water return pipe 31, along with the circulation of the water, the heat transferred to the copper plate 32 by the power supply can be continuously taken away, and when the water circulates, the temperature of the cold water in the water tank 33 can rise, and the temperature of the water tank 33 is lower than that of the cold water inside, the heat in the inside cold water can be rapidly transferred to the water tank 33, the surface area of the water tank 33 can be increased by the radiating fins 9 on the water tank 33, so that the heat on the water tank 33 can be dissipated, and along with the work of the radiating fan 11 on the lower side, the air among the radiating fins 9 can be circulated, so that the heat on the radiating fins 9 and the water tank 33 can be rapidly dissipated.

The utility model relates to a circuit connection is the conventional means that technical staff adopted in this field, and accessible limited number of tests obtains the technological inspiration, belongs to the widely used prior art.

Components not described in detail herein are prior art.

Although the present invention has been described in detail with reference to the specific embodiments, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge range of those skilled in the art, and modifications or variations without creative efforts are still within the scope of the present invention.

Claims

1. A DC/DC power supply heat dissipation device is characterized by comprising a bottom plate (1), a heat dissipation unit (3) and a fixing unit (4);

base plate (1): the front side of the upper surface is provided with the single chip microcomputer (2), the left sides of the upper surface and the lower surface of the bottom plate (1) are respectively fixed with a frame (10), three heat dissipation fans (11) are respectively arranged in the two frames (10), and the heat dissipation fans (11) are electrically connected with the single chip microcomputer (2);

heat dissipation unit (3): the water-saving device is characterized by comprising a water return pipe (31), a copper plate (32), a water tank (33), a water pump (34) and a water inlet pipe (35), wherein the copper plate (32) is fixed at the middle of the upper surface of a bottom plate (1), the inside of the copper plate (32) is hollow, the water tank (33) is fixed at the middle of the lower surface of the bottom plate (1), a water outlet of the rear side surface of the water tank (33) is connected with a water inlet of the rear side surface of the copper plate (32) through the water inlet pipe (35), the water pump (34) is installed on the water inlet pipe (35), the water pump (34) is fixed on the side surface of the water tank (33), the water inlet of the right side surface of the water tank (33) is connected with the water outlet of the right side surface of the copper plate (32) through the water return pipe (31), and the water pump (34) is electrically connected with a single chip microcomputer (2);

fixing unit (4): the two fixing units (4) are respectively arranged on the front side and the rear side of the upper surface of the base plate (1), each fixing unit (4) comprises a pressing rod (41), a pressing ring (42), a screw rod (43), a moving block (44) and a fixing nut (45), the fixing nut (45) is fixed on the front side of the upper surface of the base plate (1), the lower end of the screw rod (43) is in threaded connection with the fixing nut (45), the moving block (44) is sleeved on the outer side of the screw rod (43), the pressing ring (42) is fixed on the side face of the upper end of the screw rod (43), the pressing ring (42) is located on the upper side of the moving block (44), the pressing rods (41) are L-shaped, and the front ends of the pressing rods (41) penetrate through sliding holes in the right side face of the rear side face of the moving block (44).

2. The DC/DC power supply heat sink of claim 1, wherein: still include hand wheel (5), hand wheel (5) are equipped with four, the middle part of four hand wheel (5) lower surfaces respectively with the upper end fixed connection of four screw rods (43).

3. The DC/DC power supply heat sink of claim 1, wherein: the four rubber pads (6) are arranged, and the upper surfaces of the four rubber pads (6) are fixedly connected with the lower surface of one end of the inner side of each of the four pressing rods (41).

4. The DC/DC power supply heat sink of claim 1, wherein: still include fixed plate (7) and fixed orifices (8), fixed plate (7) are the L type, and fixed plate (7) are equipped with four, and four corners at bottom plate (1) lower surface are fixed respectively in four fixed plate (7), and fixed orifices (8) have all been seted up to the upper surface of four fixed plate (7) lower extremes.

5. The DC/DC power supply heat sink of claim 1, wherein: still include fin (9), fin (9) are fixed on the lower surface of water tank (33), the quantity of fin (9) is no less than twenty.

6. The DC/DC power supply heat sink of claim 5, wherein: the three heat dissipation fans (11) on the lower side are positioned on the left side of the heat dissipation fin (9).

7. The DC/DC power supply heat sink of claim 1, wherein: the heat-conducting silicon rubber pad is characterized by further comprising a heat-conducting silicon rubber pad (12), wherein the heat-conducting silicon rubber pad (12) is fixed on the upper surface of the copper plate (32).