CN217507265U - Processing equipment for semiconductor packaging - Google Patents
Processing equipment for semiconductor packaging Download PDFInfo
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- CN217507265U CN217507265U CN202220013033.XU CN202220013033U CN217507265U CN 217507265 U CN217507265 U CN 217507265U CN 202220013033 U CN202220013033 U CN 202220013033U CN 217507265 U CN217507265 U CN 217507265U
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- support plate
- cylinder
- stepping motor
- box
- rubber
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Abstract
The utility model discloses a processing device for semiconductor packaging, which is provided with a material seat under each of a glue outlet cylinder and a glue suction cylinder, a material seat is arranged between 2 material seats under the glue outlet cylinder and the glue suction cylinder, the front end of the material seat under the glue outlet cylinder and the rear end of the material seat under the glue suction cylinder are respectively provided with a material seat, one end of any one transmission rod passes through a left support plate or a right support plate and is provided with a batch wheel, a first step motor arranged on the left support plate or the right support plate is arranged under the batch wheel, the output shaft of the first step motor is fixed with a rotating rod, one end of the rotating rod far away from the first step motor is fixed with a slide block matched with the batch wheel, a first frame comprises a vertical part connected with the right support plate and a horizontal part extending to the upper part of a support box, the outer wall of the vertical part is provided with a suction pump communicated with the glue box through a communicating pipe, a second stepping motor is arranged above the horizontal part. The utility model discloses be convenient for treat processing and the transportation of processing product, improve machining efficiency.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to a processing equipment for semiconductor package.
Background
Packaging is a technique for packaging integrated circuits with an insulating plastic or ceramic material. Taking a CPU as an example, the volume and appearance actually seen are not the size and appearance of a real CPU core, but are the products of packaged components such as the CPU core. Packaging techniques are necessary and critical for the chip. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport.
The quality of the packaging technology is also of great importance since it directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) to which it is connected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a processing equipment for semiconductor package, this processing equipment for semiconductor package can realize treating the multiple operation processing and the transportation of processing product simultaneously, improves machining efficiency.
In order to achieve the purpose, the utility model adopts the technical proposal that: a processing apparatus for semiconductor packaging, comprising: the device comprises a left support plate, a right support plate and a top support plate, wherein the left support plate and the right support plate are arranged in parallel at intervals, the top support plate stretches over the left support plate and the right support plate, support boxes are arranged between the left support plate and the right support plate and are positioned under the top support plate at intervals, a plurality of material seats capable of intermittently moving around the support boxes are arranged on each support box at intervals, the surface of each material seat back to the support box is provided with a material groove for placing a chip, a second frame and a first frame are arranged on the right support plate at intervals along the advancing direction of the material seats, the lower ends of the second frame and the first frame are connected with the right support plate, the upper ends of the second frame and the first frame extend to the upper part of the support box close to the right support plate and are correspondingly provided with a rubber outlet cylinder and a rubber suction cylinder, the material seat is arranged under each rubber outlet cylinder and the rubber suction cylinder, and a material seat is arranged between 2 material seats under the rubber outlet cylinder and the rubber suction cylinder, the front end of the material seat positioned right below the rubber outlet cylinder and the rear end of the material seat positioned right below the rubber suction cylinder are respectively provided with a material seat;
one end of any one of the transmission rods penetrates through the left support plate or the right support plate and is provided with an intermittent wheel, a first stepping motor arranged on the left support plate or the right support plate is arranged below the intermittent wheel, a rotating rod is fixed to an output shaft of the first stepping motor, and a sliding block matched with the intermittent wheel is fixed to one end, away from the first stepping motor, of the rotating rod;
the first frame comprises a vertical part connected with the right support plate and a horizontal part extending to the upper part of the support box, a suction pump communicated with the rubber box through a communicating pipe is installed on the outer wall of the vertical part, a second stepping motor is installed above the horizontal part, a rotatable second electric telescopic rod is installed on an output shaft of the second stepping motor and positioned below the horizontal part, one end of a follow-up frame is sleeved on a piston cylinder of the second electric telescopic rod, and the other end of the follow-up frame is provided with a rubber suction cylinder communicated with the suction pump;
a telescopic cylinder is fixed at the telescopic end of the second electric telescopic rod, a pressing plate is fixed at the telescopic end of the telescopic cylinder, a pressing spring sleeved on the telescopic cylinder is arranged between the pressing plate and the telescopic end of the second electric telescopic rod, and a limiting ring which protrudes outwards along the radial direction and is positioned in the pressing spring is arranged at the bottom of the telescopic end of the telescopic cylinder.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the fixing rods with two ends respectively connected with the left support plate and the right support plate penetrate through the support box, and the support box is installed between the left support plate and the right support plate.
2. In the scheme, 2 fixing rods are parallelly arranged in the middle area of the supporting box at intervals.
3. In the above scheme, the first stepping motor is fixed on the right support plate through a mounting seat.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses processing equipment for semiconductor package, it is through the intermittent type removal to placing the material seat of treating the processing product, realizes treating the multiple operation processing and the transportation of processing product simultaneously, improves machining efficiency, can also not receive the bonding strength that improves the chip when damaging at the protection chip to with unnecessary glue suction recycle, improved the reliability to chip processing.
Drawings
Fig. 1 is a schematic view of the overall structure of the semiconductor package processing apparatus of the present invention;
FIG. 2 is an enlarged view of detail A of FIG. 1 of the present invention;
fig. 3 is an enlarged detail view of the point B of fig. 2 of the present invention.
In the drawings above: 1. a left support plate; 2. a right support plate; 3. fixing the rod; 4. a support box; 5. a first frame; 51. a vertical portion; 52. a horizontal portion; 6. a second frame; 7. discharging the rubber cylinder; 8. a rubber suction cylinder; 9. a material seat; 10. a transmission rod; 11. a intermittent wheel; 12. a first stepper motor; 13. rotating the rod; 14. a slider; 15. a communicating pipe; 16. a glue box; 17. a suction pump; 18. a second stepping motor; 19. a second electric telescopic rod; 20. a follow-up frame; 21. a telescopic cylinder; 22. a compression plate; 23. a compression spring; 24. a limit ring.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a processing apparatus for semiconductor packaging, comprising: the support box comprises a left support plate 1 and a right support plate 2 which are arranged in parallel at intervals, and a top support plate 3 stretching over the left support plate 1 and the right support plate 2, wherein support boxes 4 are arranged between the left support plate 1 and the right support plate 2 and under the top support plate 3 at intervals, a plurality of material seats 9 capable of intermittently moving around the support boxes 4 are arranged on each support box 4 at equal intervals, a material groove for placing a chip is formed in the surface, back to the support box 4, of each material seat 9, a second frame 6 and a first frame 5 are arranged on the right support plate 2 at intervals along the advancing direction of the material seats 9, the respective lower ends of the second frame 6 and the first frame 5 are connected with the right support plate 2, the respective upper ends of the second frame 6 and the first frame extend to the position above the support box 4 close to the right support plate 2 and are correspondingly provided with a rubber outlet cylinder 7 and a rubber suction cylinder 8, the respective material seats 9 are arranged under the rubber outlet cylinder 7 and the rubber suction cylinder 8, a material seat 9 is arranged between 2 material seats 9 which are positioned right below the glue outlet cylinder 7 and the glue suction cylinder 8, and the front end of the material seat 9 which is positioned right below the glue outlet cylinder 7 and the rear end of the material seat 9 which is positioned right below the glue suction cylinder 8 are respectively provided with one material seat 9;
one end of any one of the transmission rods 10 penetrates through the left support plate 1 or the right support plate 2 and is provided with an intermittent wheel 11, a first stepping motor 12 arranged on the left support plate 1 or the right support plate 2 is arranged below the intermittent wheel 11, a rotating rod 13 is fixed on an output shaft of the first stepping motor 12, and a sliding block 14 matched with the intermittent wheel 11 is fixed at one end, far away from the first stepping motor 12, of the rotating rod 13;
the first frame 5 comprises a vertical part 51 connected with the right support plate 2 and a horizontal part 52 extending to the upper part of the support box 4, a suction pump 17 communicated with the rubber box 16 through a communication pipe 15 is installed on the outer wall of the vertical part 51, a second stepping motor 18 is installed above the horizontal part 52, a rotatable second electric telescopic rod 19 is installed on an output shaft of the second stepping motor 18 and below the horizontal part 52, one end of a follow-up frame 20 is sleeved on a piston cylinder of the second electric telescopic rod 19, and the other end of the follow-up frame 20 is provided with the rubber suction cylinder 8 communicated with the suction pump 17;
a telescopic cylinder 21 is fixed on the telescopic end of the second electric telescopic rod 19, a pressure plate 22 is fixed on the telescopic end of the telescopic cylinder 21, a pressure spring 23 sleeved on the telescopic cylinder 21 is arranged between the pressure plate 22 and the telescopic end of the second electric telescopic rod 19, and a limit ring 24 which protrudes outwards in the radial direction and is positioned in the pressure spring 23 is arranged at the bottom of the telescopic end of the telescopic cylinder 21.
The fixing rods 3 with two ends respectively connected with the left support plate 1 and the right support plate 2 penetrate through the support box 4, and the support box 4 is installed between the left support plate 1 and the right support plate 2.
The first stepping motor 12 is fixed to the right support plate 2 through a mount.
Example 2: a processing apparatus for semiconductor packaging, comprising: the device comprises left supporting plates 1 and right supporting plates 2 which are arranged in parallel at intervals and top supporting plates 3 stretching over the left supporting plates 1 and the right supporting plates 2, wherein supporting boxes 4 are arranged between the left supporting plates 1 and the right supporting plates 2 and under the top supporting plates 3 at intervals, a plurality of material seats 9 which can intermittently move around the supporting boxes 4 are arranged on each supporting box 4 at equal intervals, a material groove for placing a chip is formed in the surface of each material seat 9, which is back to the supporting box 4, a second frame 6 and a first frame 5 are arranged on the right supporting plate 2 at intervals along the advancing direction of the material seats 9, the respective lower ends of the second frame 6 and the first frame 5 are connected with the right supporting plates 2, the respective upper ends of the second frame 6 and the first frame 5 extend to the positions above the supporting boxes 4 close to the right supporting plates 2 and are correspondingly provided with a rubber outlet cylinder 7 and a rubber suction cylinder 8, and the respective material seats 9 are arranged under the rubber outlet cylinder 7 and the rubber suction cylinder 8, a material seat 9 is arranged between 2 material seats 9 positioned right below the glue outlet cylinder 7 and the glue absorbing cylinder 8, and the front end of the material seat 9 positioned right below the glue outlet cylinder 7 and the rear end of the material seat 9 positioned right below the glue absorbing cylinder 8 are respectively provided with one material seat 9;
one end of any one of the transmission rods 10 penetrates through the left support plate 1 or the right support plate 2 and is provided with a pause wheel 11, a first stepping motor 12 arranged on the left support plate 1 or the right support plate 2 is arranged below the pause wheel 11, a rotating rod 13 is fixed on an output shaft of the first stepping motor 12, and a sliding block 14 matched with the pause wheel 11 is fixed at one end, far away from the first stepping motor 12, of the rotating rod 13;
the first frame 5 comprises a vertical part 51 connected with the right support plate 2 and a horizontal part 52 extending to the upper part of the support box 4, the outer wall of the vertical part 51 is provided with a suction pump 17 communicated with the rubber box 16 through a communicating pipe 15, a second stepping motor 18 is arranged above the horizontal part 52, a rotatable second electric telescopic rod 19 is arranged on the output shaft of the second stepping motor 18 and below the horizontal part 52, one end of a follow-up frame 20 is sleeved on the piston cylinder of the second electric telescopic rod 19, and the other end of the follow-up frame 20 is provided with the rubber suction cylinder 8 communicated with the suction pump 17;
a telescopic cylinder 21 is fixed on the telescopic end of the second electric telescopic rod 19, a pressure plate 22 is fixed on the telescopic end of the telescopic cylinder 21, a pressure spring 23 sleeved on the telescopic cylinder 21 is arranged between the pressure plate 22 and the telescopic end of the second electric telescopic rod 19, and a limit ring 24 which protrudes outwards in the radial direction and is positioned in the pressure spring 23 is arranged at the bottom of the telescopic end of the telescopic cylinder 21.
The fixing rods 3 with two ends respectively connected with the left support plate 1 and the right support plate 2 penetrate through the support box 4, and the support box 4 is installed between the left support plate 1 and the right support plate 2.
2 fixed rods 3 are arranged in the middle area of the supporting box 4 at intervals in parallel.
When the processing equipment for semiconductor packaging is adopted, one end of any one transmission rod penetrates through the left support plate or the right support plate and is provided with the intermittent wheel, the first stepping motor arranged on the left support plate or the right support plate is arranged below the intermittent wheel, the output shaft of the first stepping motor is fixedly provided with the rotating rod, one end of the rotating rod, far away from the first stepping motor, is fixedly provided with the sliding block matched with the intermittent wheel, and through intermittent movement of the material seat for placing a product to be processed, multi-process processing and transportation of the product to be processed are realized at the same time, so that the processing efficiency is improved;
furthermore, a second stepping motor is installed above the horizontal portion of the first frame, a rotatable second electric telescopic rod is installed on an output shaft of the second stepping motor and located below the horizontal portion, one end of a follow-up frame is sleeved on a piston cylinder of the second electric telescopic rod, the other end of the follow-up frame is provided with a rubber suction cylinder communicated with a suction pump, a telescopic cylinder is fixed on a telescopic end of the second electric telescopic rod, a pressing plate is fixed at the telescopic end of the telescopic cylinder, and a pressing spring sleeved on the telescopic cylinder is arranged between the pressing plate and the telescopic end of the second electric telescopic rod.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (4)
1. A processing apparatus for semiconductor packaging, comprising: left branch fagging (1), right branch fagging (2) that parallel interval set up and set up in supporting box (4) between left branch fagging (1), right branch fagging (2), a material seat (9) are opened on the surface of supporting box (4) mutually in the confession and are placed the silo of chip, its characterized in that: second frames (6) and first frames (5) are arranged on the right supporting plate (2) at intervals along the advancing direction of the material seats (9), the lower ends of the second frames (6) and the first frames (5) are connected with the right supporting plate (2), the upper ends of the second frames and the first frames extend to the upper part of the supporting box (4) close to the right supporting plate (2) and are correspondingly provided with a rubber outlet cylinder (7) and a rubber suction cylinder (8), the material seats (9) are respectively arranged under the rubber outlet cylinder (7) and the rubber suction cylinder (8), the material seats (9) are arranged between the 2 material seats (9) under the rubber outlet cylinder (7) and the rubber suction cylinder (8), and the material seats (9) are respectively arranged at the front end of the material seat (9) under the rubber outlet cylinder (7) and the rear end of the material seat (9) under the rubber suction cylinder (8);
one end of a transmission rod (10) penetrates through the left support plate (1) or the right support plate (2) and is provided with an intermittent wheel (11), a first stepping motor (12) arranged on the left support plate (1) or the right support plate (2) is arranged below the intermittent wheel (11), an output shaft of the first stepping motor (12) is fixedly provided with a rotating rod (13), and one end, far away from the first stepping motor (12), of the rotating rod (13) is fixedly provided with a sliding block (14) matched with the intermittent wheel (11);
the first frame (5) comprises a vertical part (51) connected with the right supporting plate (2) and a horizontal part (52) extending to the upper part of the supporting box (4), a suction pump (17) communicated with the rubber box (16) through a communicating pipe (15) is installed on the outer wall of the vertical part (51), a second stepping motor (18) is installed above the horizontal part (52), a rotatable second electric telescopic rod (19) is installed on an output shaft of the second stepping motor (18) and located below the horizontal part (52), one end of a follow-up frame (20) is sleeved on a piston cylinder of the second electric telescopic rod (19), and the other end of the follow-up frame (20) is provided with a rubber suction cylinder (8) communicated with the suction pump (17);
the telescopic end of the second electric telescopic rod (19) is fixed with a telescopic cylinder (21), the telescopic end of the telescopic cylinder (21) is fixed with a pressing plate (22), a pressing spring (23) sleeved on the telescopic cylinder (21) is arranged between the pressing plate (22) and the telescopic end of the second electric telescopic rod (19), and the bottom of the telescopic end of the telescopic cylinder (21) is provided with a limiting ring (24) which is protruded outwards along the radial direction and is positioned in the pressing spring (23).
2. The processing apparatus for semiconductor packages according to claim 1, wherein: the fixing rods (3) with two ends respectively connected with the left support plate (1) and the right support plate (2) penetrate through the support box (4), and the support box (4) is installed between the left support plate (1) and the right support plate (2).
3. The processing apparatus for semiconductor packaging according to claim 2, wherein: 2 the fixing rods (3) are arranged in the middle area of the supporting box (4) at intervals in parallel.
4. The processing apparatus for semiconductor packaging according to claim 1, wherein: the first stepping motor (12) is fixed on the right support plate (2) through a mounting seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220013033.XU CN217507265U (en) | 2022-01-05 | 2022-01-05 | Processing equipment for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220013033.XU CN217507265U (en) | 2022-01-05 | 2022-01-05 | Processing equipment for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217507265U true CN217507265U (en) | 2022-09-27 |
Family
ID=83342968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220013033.XU Active CN217507265U (en) | 2022-01-05 | 2022-01-05 | Processing equipment for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217507265U (en) |
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2022
- 2022-01-05 CN CN202220013033.XU patent/CN217507265U/en active Active
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