CN217506157U

CN217506157U - Position monitoring device and detection equipment

Info

Publication number: CN217506157U
Application number: CN202220780843.8U
Authority: CN
Inventors: 范铎; 孙世宏; 张鹏斌; 陈鲁; 张嵩
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-09-27
Anticipated expiration: 2032-04-02

Abstract

The utility model discloses a position monitoring device and check out test set, monitoring device includes rotatable carrier plate and at least one along with the synchronous pivoted sensor of carrier plate, carrier plate includes the loading end, the loading end is used for bearing the determinand, at least one sensor is used for detecting whether the determinand exists in the loading end and/or detects the determinand and the relative position of loading end, in the footpath of carrier plate, at least one sensor is located the outside of loading end; bear in the axial of dish, at least one sensor with the loading end interval has the distance, the utility model discloses can the real-time supervision determinand the state in place, when determinand position deviation, can calculate the concrete positional deviation of determinand moreover, judge for follow-up process flow and provide accurate position data.

Description

Position monitoring device and detection equipment

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a position monitoring device and check out test set.

Background

During the processing and manufacturing process of semiconductor wafers, various processes are performed from grinding, polishing, photolithography to the subsequent inspection and packaging, and the transfer and process completion are required in various inspection machines. During each process flow, it is necessary to provide sufficient protection to the wafer to prevent it from being damaged and damaged.

For example, for the PM cavity, when the wafer picking and placing operation is to be performed, it is first determined whether there is a wafer on the susceptor, and if there is no wafer, the wafer can be loaded for the subsequent process, and if there is a wafer, the wafer is loaded after the wafer is cleaned. In order to perform the above determination, a reflective sensor fixed at the position of the PM end pick-and-place is often used in the industry, and whether the wafer exists on the carrier tray is determined according to the reflective feedback of the reflective sensor. In addition, the sensor is far away from the wafer, so that inaccurate feedback is easily caused when a film or a frosted wafer is pasted on some surfaces.

Disclosure of Invention

In view of this, a position monitoring device and a detection apparatus using the same are provided, which can monitor the in-situ state and the position accuracy of the object to be detected in real time.

In a first aspect, an embodiment of the present application provides a position monitoring device, including a rotatable carrier plate and at least one sensor that rotates synchronously with the carrier plate, where the carrier plate includes a bearing surface, the bearing surface is used to bear an object to be measured, the at least one sensor is used to detect whether the object to be measured exists on the bearing surface and/or detect a relative position between the object to be measured and the bearing surface, and in a radial direction of the carrier plate, the at least one sensor is located outside the bearing surface; in the axial direction of the bearing disc, the at least one sensor is spaced from the bearing surface by a distance.

In an embodiment, the position monitoring device further includes a height adjusting portion, the height adjusting portion is connected to the sensor, and the height adjusting portion is configured to adjust a relative position between the sensor and the object to be detected, so as to place the object to be detected on an optimal detection surface of the sensor.

In one embodiment, the sensor and the height adjusting part are both disposed on a supporting plate, and the supporting plate is connected to the carrying tray.

In one embodiment, the height adjusting portion is screwed with the supporting plate to adjust a distance between the sensor and the object to be measured in the axial direction of the carrier tray.

In one embodiment, the supporting plate is movably provided with a top rod.

In an embodiment, the sensor is an optical fiber sensor with an adjustable threshold, and the object to be measured is a wafer.

In an embodiment, the sensor is an optical sensor, and includes a light emitter and a light receiver, the light emitter emits a light beam toward the surface of the object to be measured along an axial direction, the light receiver receives the light beam reflected by the surface of the object to be measured, and when the center of the object to be measured is directly opposite to the center of the bearing surface of the bearing plate, a part of the light beam emitted by the light emitter is located within a shielding range of the object to be measured, and a part of the light beam is located outside the shielding range of the object to be measured.

In an embodiment, when the center of the object to be measured directly faces the center of the carrying surface of the carrying tray, the center of the light beam emitted by the light emitter is located on the edge line of the object to be measured.

In one embodiment, the number of the sensors is at least 3, and the sensors are evenly distributed around the bearing plate at intervals.

In a second aspect, an embodiment of the present application further provides a detection apparatus, including the wafer position monitoring device provided in any of the above embodiments, and a controller connected to a sensor of the position monitoring device.

Compared with the prior art, the sensor of the position monitoring device can synchronously rotate along with the bearing plate, so that the on-site state of the wafer can be monitored in real time; when the position of the wafer deviates, the threshold values of the sensors are changed differently, so that the specific position deviation of the wafer can be calculated, and accurate position data can be provided for the subsequent process flow judgment.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the position monitoring device of the present invention.

Fig. 2 is a top view of the position monitoring device shown in fig. 1.

Fig. 3 is a schematic diagram of the position monitoring device with the object to be measured at an ideal position.

Fig. 4 is a schematic diagram of the position monitoring device with the object to be measured in a non-ideal position.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. One or more embodiments of the present invention are illustrated in the accompanying drawings to provide a more accurate and thorough understanding of the disclosed embodiments. It should be understood, however, that the present invention may be embodied in many different forms and is not limited to the embodiments described below.

The same or similar reference numerals in the drawings of the utility model correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.

The utility model provides a check out test set and position monitoring device thereof is preferably applied to the optical detection and surveys type board, carries out real-time position detection and adjustment to the object of processing on the board, like wafer, glass, paster etc..

Fig. 1-2 illustrate an embodiment of a position monitoring device 100 of the present invention, which includes a carrier plate 20 and a plurality of sensors 40 distributed around the carrier plate 20. When the position monitoring apparatus 100 is in use, an object to be measured, such as a wafer 200, is transferred onto the carrying surface of the carrying plate 20, wherein the carrying plate 20 and the wafer 200 are both circular structures, and the outer diameter of the wafer 200 is slightly larger than that of the carrying plate 20. Ideally, the wafer 200 and the susceptor 20 are coaxially disposed, and the outer edge of the wafer 200 protrudes outward relative to the susceptor 20, thereby facilitating processing. The sensor 40 is preferably an optical sensor that generates a signal based on the difference between the emitted light and the reflected light to monitor in real time whether the wafer 200 is present on the carrying surface of the susceptor 20 and/or to detect the relative position of the wafer 200 and the carrying surface of the susceptor 20. In the illustrated embodiment, three sensors 40 are provided and are evenly spaced around the carrier platter 20. In the radial direction of the bearing disc 20, the sensor 40 is located outside the bearing surface of the bearing disc 20 and has a certain distance with the outer peripheral surface of the bearing disc 20; the sensor 40 is spaced from the bearing surface of the carrier plate 20 in the axial direction of the carrier plate 20. When the wafer 200 is placed on the susceptor 20, the sensor 40 is axially below and spaced apart from the wafer 200. The sensor 40 includes a light emitting end and a light receiving end, wherein the light emitting end emits a light beam toward the lower surface of the wafer 200 along the axial direction, the light receiving end receives the light beam reflected by the lower surface of the wafer 200, the light beams reflected by the wafer 200 at different positions are different, and the threshold values of the sensor 40 are different, so that the position of the wafer 200 can be determined.

Preferably, the sensor 40 is a high-precision threshold-adjustable optical fiber sensor, and when the light current of the light receiving end is decreased due to the decrease of the light emitting efficiency of the light emitting end and the responsivity of the light receiving end, the threshold can be automatically adjusted to achieve the purpose of accurate detection. Specifically, the sensor 40 is in an initial state: when the object to be measured (wafer 200) is not present, the photocurrent of the light receiving end is I1; when the object to be measured exists, the photocurrent of the light receiving end is I2; the initial threshold was (I1+ I2)/2. When the sensor 40 is in a certain state in the using process and no object to be measured exists, if the photocurrent of the light receiving end is reduced to I3, comparing I3 with I1, and if I3 exceeds a preset range, updating the threshold value to (I3+ I2)/2; if the I3 does not exceed the preset range, the threshold value is unchanged, and the next sampling node is entered to achieve the purpose of dynamically adjusting the threshold value.

In the illustrated embodiment, the sensor 40 is disposed corresponding to the edge line of the wafer 200, and the light beam emitted by the sensor 40 is partially within the shielding range of the wafer 200 and partially beyond the shielding range of the wafer 200, so that only the shielded light can be reflected back to the sensor 40 by the wafer 200. Preferably, the center of the light beam emitted by each sensor 40 is equidistant from the center of the susceptor 20, and the center of the light beam emitted by each sensor 40 is shown to be located exactly on the edge line of the wafer 200. the initial threshold of each sensor 40 of the wafer 200 in the ideal state (i.e., coaxial with the susceptor 20) can be obtained by the initial calibration. In one embodiment, the sensors 40 are connected to a controller that determines the position of the wafer 200 by comparing the threshold of each sensor 40 or comparing the pattern of the reflected beam received by each sensor 40.

As shown in fig. 3, ideally, the center of the wafer 200 is aligned with the center of the susceptor 20, and both are coaxially disposed. The wafer 200 has the same half-shielding effect on the light beam of each sensor 40, the reflected light beams received by each sensor 40 have the same pattern and the same threshold, and the controller can accordingly determine that the wafer 200 is in the absolute central position and generate a corresponding control signal to start the subsequent process flow.

As shown in fig. 4, in a non-ideal state, the center of the wafer 200 is offset from the center of the susceptor 20, the wafer 200 generates different shielding effects on the light beams of the sensors 40, in fig. 4, the wafer 200 forms a half-shielding effect on the light beams of the sensors 40 above, and the reflected light beam has a half-shielding effect of the emitted light beam; the wafer 200 has no shielding effect on the light beam of the sensor 40 at the lower left, i.e., no reflected light beam; the wafer 200 forms a full-shielding effect on the light beam of the sensor 40 at the lower right, and the pattern of the reflected light beam is the same as the pattern of the emitted light beam, so that the reflected light beams received by the sensors 40 have different patterns and different thresholds, and the controller can calculate the specific offset of the wafer 200 according to the difference between the threshold of each sensor 40 and the initial threshold.

In this embodiment, each sensor 40 is disposed on a supporting plate 42, the supporting plate 42 is fixedly connected to the carrier plate 20 through other elements of the machine or both are directly connected to each other, so that the supporting plate 42 can drive the sensor 40 to rotate synchronously with the carrier plate 20, and thus the relative positions of the sensor 40 and the carrier plate 20 and the wafer 200 on the carrier plate 20 can be kept unchanged, so that the sensor 40 can monitor whether there is a wafer 200 on the carrier plate 20 in real time. Preferably, a top rod 44 is movably disposed on the supporting plate 42, and the top rod 44 can move up and down relative to the supporting plate 42. After the wafer 200 is processed on the susceptor 20, the lift pins 44 lift the wafer 200 to a certain height to separate the wafer from the susceptor 20, so that the wafer 200 can be conveniently taken away for entering the next process.

In the illustrated embodiment, the height adjustment portion 46 is connected to the sensor 40, the height adjustment portion 46 is threadedly coupled to the support plate 42, and the height adjustment portion 46 is rotated to allow the sensor 40 to move up and down relative to the support plate 42, so as to adjust the axial distance between the sensor 40 and the carrying surface of the susceptor 20, such that the wafer 200 is within the optimal detection range of the sensor 40 when being transferred onto the carrying surface of the susceptor 20. Of course, the sensor 40 and the support plate 42 may be connected in other ways as long as the adjustment position can be moved relatively. In addition, the sensor 40 is disposed below the wafer 200 in the above embodiment, and it should be understood that the sensor 40 may be disposed above the wafer 200, as long as the distance between the two is small and can be easily adjusted on both sides of the wafer 200 in the axial direction, so that the wafer 200 is located at the optimal detection position of the sensor 40.

The utility model discloses set up sensor 40 in the axial direction of bearing dish 20, in the technological process of wafer, bearing dish 20 rotates at a high speed, and sensor 40 can rotate along with bearing dish 20 is synchronous, real-time supervision wafer 200 is in situ state; the plurality of sensors 40 are arranged around the bearing disc 20, when the position of the wafer 200 deviates, the threshold value of each sensor 40 changes differently, the controller can calculate the specific position deviation of the wafer 200 according to the different threshold values, the position of the wafer 20 can be corrected or the operation parameters of relevant components can be modified according to the deviation, the compatibility and the inclusion of the wafer 200 are high, and the frosting and film sticking effect is good. In a word, the utility model discloses can judge the status in position and the accurate deviation of determinand in real time, judge for follow-up process flow and provide accurate position data.

It should be noted that the present invention is not limited to the above embodiments, and other changes can be made by those skilled in the art according to the spirit of the present invention, and all the changes made according to the spirit of the present invention should be included in the scope of the present invention.

Claims

1. A position monitoring device is characterized by comprising a rotatable bearing disc and at least one sensor which synchronously rotates along with the bearing disc, wherein the bearing disc comprises a bearing surface, the bearing surface is used for bearing an object to be detected, the at least one sensor is used for detecting whether the object to be detected exists on the bearing surface and/or detecting the relative position of the object to be detected and the bearing surface, and the at least one sensor is positioned on the outer side of the bearing surface in the radial direction of the bearing disc; the at least one sensor is spaced from the bearing surface in an axial direction of the bearing disk.

2. The position monitoring device according to claim 1, further comprising a height adjusting portion connected to the sensor, the height adjusting portion being configured to adjust a relative position of the sensor and the object to be measured, so as to place the object to be measured on an optimal detection surface of the sensor.

3. The position monitoring device according to claim 2, wherein the sensor and the height adjusting portion are provided on a support plate, and the support plate is connected to the carrier tray.

4. The position monitoring device according to claim 3, wherein the height adjusting portion is screw-coupled to the support plate to adjust a distance separating the sensor and the object in an axial direction of the carrier tray.

5. The position monitoring device of claim 3, wherein a ram is movably disposed on the support plate.

6. The position monitoring device of claim 1, wherein the sensor is a threshold adjustable fiber optic sensor and the object is a wafer.

7. The position monitoring device according to claim 1, wherein the sensor is an optical sensor including a light emitter and a light receiver, the light emitter emits a light beam toward the surface of the object to be measured in the axial direction, the light receiver receives the light beam reflected by the surface of the object to be measured, and when the center of the object to be measured is directly opposite to the center of the bearing surface of the bearing plate, the light beam emitted by the light emitter is partially within the range of the object to be measured and partially outside the range of the object to be measured.

8. The position monitoring device as claimed in claim 7, wherein the center of the light beam emitted from the light emitter is located on an edge line of the object to be measured when the center of the object to be measured is aligned with the center of the carrying surface of the carrying tray.

9. A position monitoring device according to any one of claims 1 to 8, wherein there are at least 3 said sensors evenly spaced around said carrier plate.

10. A detection apparatus comprising a position monitoring device according to any one of claims 1 to 9 and a controller connected to the sensors of the position monitoring device.